Wafer chamfering and grinding device

Abstract

The utility model discloses a wafer chamfering and polishing device which comprises a bearing platform, a plurality of polishing devices and a plurality of polishing devices, wherein the bearing platform can bear a plurality of wafers to be polished, wherein the central shafts of the wafers are coaxial and are arranged in parallel; the first driving assembly is fixedly connected with the bearing table and used for driving the wafers to be polished to synchronously rotate with the center shaft as the center; the grinding assembly comprises a grinding disc, a groove structure is arranged on the grinding disc, and the grinding disc is used for grinding the side face of each wafer to be ground to form a chamfer surface shape with the same cross section as the groove structure; the multiple groove structures are sequentially arranged in parallel in the arrangement direction of the wafers to be polished, so that the edges of the wafers to be polished can synchronously make contact with the corresponding groove structures; when the first driving assembly drives the bearing table to drive the to-be-polished wafers to rotate synchronously, the groove structures synchronously polish the to-be-polished wafers making contact with each other. The wafer chamfer grinding device can synchronously grind and chamfer a plurality of wafers to be ground, the wafer chamfer machining efficiency is improved, and then the wafer machining capacity is improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer processing technical field especially relates to a wafer chamfer polishing device. BACKGROUND

[0002] Wafer is the important structure of preparation chip and other semiconductor devices, and the wafer is generally formed by slicing cylindrical crystal bar, and the edge side of wafer after slicing is the neat vertical cylindrical surface, if not processing, the wafer edge is easy to appear fragmentation, thermal stress concentration and other problems in the subsequent processing technology of wafer, influence epitaxial layer of wafer surface growth and the flatness of photoresist coated on wafer surface at wafer edge, therefore need to carry out chamfer processing, the current chamfer processing mode of wafer side edge adopts grinding wheel to polish and process wafer side surface to form chamfer structure, but the processing capacity of this polishing mode needs to be improved. SUMMARY

[0003] The utility model discloses a wafer chamfer polishing device, which can improve the production capacity of wafer chamfering to a certain extent.

[0004] To solve the above technical problems, the utility model provides a wafer chamfer polishing device, which comprises:

[0005] A bearing table for bearing a plurality of to-be-polished wafers arranged coaxially and parallel to each other;

[0006] A first driving assembly fixedly connected with the bearing table, used for driving each to-be-polished wafer to rotate synchronously around the central axis;

[0007] A grinding assembly comprising a grinding disc, wherein the grinding disc is provided with a groove structure for polishing the side surface of each to-be-polished wafer to form a chamfer surface with the same cross section as the groove structure;

[0008] Wherein, the groove structure is arranged in parallel with each other in multiple numbers along the arrangement direction of each to-be-polished wafer, so that the edges of the to-be-polished wafers can synchronously contact the corresponding groove structures;

[0009] When the first driving assembly drives the bearing table to rotate synchronously with each to-be-polished wafer, each groove structure synchronously polishes each to-be-polished wafer in contact with each other.

[0010] In an optional embodiment of the present application, the bearing table comprises a plurality of bearing plates arranged in parallel layer by layer, a plurality of support columns for supporting and connecting each bearing plate, and a plurality of loading plates respectively arranged on each bearing plate;

[0011] The first driving assembly comprises a first driving motor connected to each of the carrier plates and the corresponding carrier disks respectively;

[0012] The first driving motors are synchronous motors.

[0013] Each of the carrier disks is provided with a suction disk capable of adsorbing the wafer to be polished.

[0014] The length of each of the carrier plates is greater than the diameter of the wafer to be polished, and the width of each of the carrier plates is less than the diameter of the wafer to be polished, so that the side edges of each of the wafers to be polished extend from the side of each of the carrier plates.

[0015] In an optional embodiment of the present application, the grinding assembly comprises a rotating shaft and a second driving motor connected to the rotating shaft.

[0016] The grinding disk comprises a plurality of grinding discs arranged in parallel and coaxially on the rotating shaft; and the groove structure is an annular groove arranged on the side of each of the grinding discs.

[0017] When the second driving motor drives the rotating shaft to rotate, each of the grinding discs rotates synchronously with the rotating shaft and takes the straight line where the rotating shaft is located as the center.

[0018] In an optional embodiment of the present application, the carrier table and the first driving assembly are provided with two groups.

[0019] The two groups of carrier tables are symmetrically arranged about the rotating shaft on the two sides of the grinding assembly.

[0020] Each of the grinding discs in the grinding assembly is symmetrically provided with two carrier disks located at the same layer of the two groups of carrier tables, so that each of the grinding discs can synchronously process two wafers to be polished.

[0021] In an optional embodiment of the present application, the cross section of the groove structure is a U-shaped structure or an inverted trapezoidal structure.

[0022] In an optional embodiment of the present application, the grinding disk is a grinding flat plate arranged perpendicularly to the carrier plates.

[0023] The groove structure comprises a plurality of strip-shaped grooves arranged in parallel on the grinding flat plate; and the distance between two adjacent strip-shaped grooves is the same as the distance between the wafers to be polished.

[0024] In an optional embodiment of the present application, the grinding assembly further comprises a translation motor connected to the grinding flat plate, for driving the grinding flat plate to move translationally along the length direction parallel to the strip-shaped grooves.

[0025] In an alternative embodiment of the present application, the slot width of the slot is gradually widened from the middle to the two ends, and the slot width of the middle of the slot is the same as the thickness of the wafer to be polished.

[0026] In an alternative embodiment of the present application, a plurality of groups of the slot are arranged side by side on the grinding plate;

[0027] Wherein, the cross sections of the same group of the slot are the same, and the cross sections of different groups of the slot are different;

[0028] The cross section of the groove structure is at least one of a U-shaped structure or an inverted trapezoidal structure.

[0029] In an alternative embodiment of the present application, two grinding discs are symmetrically arranged on both sides of the support table, so that the two grinding discs can simultaneously polish the wafers to be polished on both sides of the support table.

[0030] The wafer chamfer polishing device provided by the utility model, comprising: a support table capable of bearing a plurality of coaxial and parallelly arranged wafers to be polished; and a first driving assembly fixedly connected with the support table, for driving each wafer to be polished to rotate synchronously around the central axis; a grinding assembly comprising a grinding disc, the grinding disc is provided with a groove structure, for polishing the side surface of each wafer to be polished to form a chamfer surface with the same cross section as the groove structure; wherein, the groove structure is arranged in parallel with each other in sequence along the arrangement direction of each wafer to be polished, so that the edge of the wafer to be polished can synchronously contact the corresponding groove structure; when the first driving assembly drives the support table to drive each wafer to be polished to rotate synchronously, each groove structure synchronously polishes each wafer to be polished in contact with each other.

[0031] In the wafer chamfer polishing device of the present application, a plurality of wafers to be polished can be sequentially stacked on the support table, and a plurality of groove structures are correspondingly arranged on the grinding disc in the grinding assembly, so that the plurality of groove structures on the grinding disc can synchronously polish the plurality of wafers to be polished, and then form a chamfer structure on the side surface of each wafer to be polished, thereby improving the wafer chamfer processing efficiency to a certain extent, and further improving the wafer processing capacity.

[0032] In an alternative embodiment of the present application, a plurality of grinding discs are arranged in sequence on the same rotating shaft in the grinding assembly, and each grinding disc is provided with a groove structure on the side surface, so that each grinding disc can synchronously process the plurality of wafers to be polished to form a chamfer structure one by one with the rotation of the same rotating shaft.

[0033] In still another optional embodiment of the present application, the grinding plate in the grinding assembly is a grinding flat plate, and a plurality of groove structures are arranged in sequence on the grinding flat plate, so that in actual processing, each groove structure can be opposite to the side edge of a wafer to be polished, and the grinding flat plate can synchronously process a plurality of wafers to be polished to form a chamfer structure. BRIEF DESCRIPTION OF DRAWINGS

[0034] In order to more clearly illustrate the technical scheme in the embodiments of the present application or the prior art, the drawings needed in the description of the embodiments or the prior art will be briefly introduced. Obviously, the drawings in the following description are only some embodiments of the present application, and for those skilled in the art, other drawings can also be obtained without creative labor on the basis of these drawings.

[0035] Figure 1 A structural schematic view of a wafer chamfer polishing device provided by the embodiment of the present application;

[0036] Figure 2 A top view schematic view of a bearing table and a grinding plate provided by the embodiment of the present application;

[0037] Figure 3 A structural schematic view of a first driving assembly provided by the embodiment of the present application;

[0038] Figure 4 Another sectional structural schematic view of a wafer chamfer polishing device provided by the embodiment of the present application;

[0039] Figure 5 A structural schematic view of the relative position between a wafer to be polished and a grinding disc provided by the embodiment of the present application;

[0040] Figure 6 Still another sectional structural schematic view of a wafer chamfer polishing device provided by the embodiment of the present application;

[0041] Figure 7 A structural schematic view of the relative position between a wafer to be polished and a grinding flat plate provided by the embodiment of the present application;

[0042] Figure 8 A structural schematic view of a grinding flat plate provided by the embodiment of the present application;

[0043] Figure 9 Still another sectional structural schematic view of a wafer chamfer polishing device provided by the embodiment of the present application;

[0044] Figure 10 A top view schematic view of a bearing table and a grinding flat plate provided by the embodiment of the present application;

[0045] In the drawings: 100 is a wafer to be polished, 2 is a bearing table, 21 is a bearing plate, 22 is a support column, 23 is a tray, 24 is a support plate, 31 is a first drive motor, 32 is a main transmission gear, 33 is a branch transmission gear, 41 is a grinding disc, 411 is an annular groove, 42 is a rotating shaft, 43 is a second drive motor, 44 is a grinding flat plate, and 441 is a strip-shaped groove. DETAILED DESCRIPTION

[0046] In order to make the person skilled in the art better understand the present application, the present application will be further described in detail below in combination with the drawings and specific embodiments. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0047] As shown in Figure 1 and Figure 2 , Figure 1 is a structure schematic view of a wafer chamfer polishing device provided by the embodiments of the present application; Figure 2 is a top view schematic view of a bearing table and a grinding disc provided by the embodiments of the present application.

[0048] In a specific embodiment of the present application, the wafer chamfer polishing device can include:

[0049] a bearing table 2 capable of bearing a plurality of to-be-polished wafers 100 arranged coaxially and parallel to each other;

[0050] a first drive assembly fixedly connected with the bearing table 2, for driving the to-be-polished wafers 100 to rotate synchronously around the central axes;

[0051] a grinding assembly including a grinding disc, the grinding disc being provided with a groove structure for polishing the side surfaces of the to-be-polished wafers 100 to form a chamfer surface with the same cross section as the groove structure;

[0052] wherein the groove structure is provided with a plurality of grooves arranged in parallel to each other along the arrangement direction of the to-be-polished wafers 100, so that the edges of the to-be-polished wafers 100 can synchronously contact the corresponding grooves;

[0053] When the first drive assembly drives the bearing table 2 to drive the to-be-polished wafers 100 to rotate synchronously, the grooves synchronously polish the to-be-polished wafers 100 in contact with each other.

[0054] Referring to Figure 1The wafer chamfer polishing device of the embodiment comprises a bearing table 2 for bearing the wafer 100 to be polished, and a grinding assembly comprising a grinding disc and capable of polishing the wafer 100 to be polished on the bearing table 2. Different from the conventional polishing device, the bearing table 2 in the embodiment can simultaneously bear a plurality of wafers 100 to be polished, and the grinding disc in the corresponding grinding assembly is also provided with a plurality of groove structures for synchronously polishing each wafer 100 to be polished. Thus, when each wafer 100 to be polished is driven to rotate by the first driving assembly, the edge side of each wafer 100 to be polished is also synchronously clamped into the corresponding groove structure, so that synchronous polishing of a plurality of wafers 100 to be polished can be realized.

[0055] In addition, the grinding disc in the embodiment is provided with a plurality of groove structures, which can be provided with a plurality of groove structures on the same grinding disc, or a plurality of grinding discs provided in the grinding assembly, and each grinding disc is provided with one groove structure.

[0056] It can be understood that, for the wafer chamfer polishing device, a water spraying cooling device for cooling the grinding disc, a structure for fixedly installing the bearing table 2 and the grinding assembly, and the like should also be included, which can be set according to the conventional polishing device. Therefore, this application will not be discussed in detail.

[0057] On this basis, the bearing table 2 used in the embodiment can integrate bearing a plurality of wafers 100 to be polished, and at the same time, the grinding disc in the grinding assembly is correspondingly provided with a plurality of groove structures as a whole, so that a set of polishing device can efficiently realize a larger number of wafers 100 to be polished, but the water spraying cooling and other fixed components do not need to be multiplied, thereby greatly improving the efficiency of the polishing device for polishing wafers on the basis of not greatly increasing the complexity of other parts of the polishing device, thereby greatly improving the productivity of wafer chamfer processing.

[0058] Based on the above discussion, referring to Figure 1 and Figure 2 In an alternative embodiment of the present application, the bearing table 2 in the wafer chamfer polishing device can comprise:

[0059] a plurality of bearing plates 21 arranged in parallel layer by layer, support columns 22 for supporting and connecting each bearing plate 21, and a plurality of carriers 23 respectively arranged on each bearing plate 21;

[0060] The first driving assembly comprises a first driving motor 31 connected to each bearing plate 21 and the corresponding carrier 23, respectively;

[0061] Among the first driving motors 31, each first driving motor 31 is a synchronous motor;

[0062] Each carrier plate 23 is provided with a suction cup capable of adsorbing the wafer 100 to be polished;

[0063] The length of each carrier plate 21 is greater than the diameter of the wafer 100 to be polished, and the width is smaller than the diameter of the wafer 100 to be polished, so that the side edge of each wafer 100 to be polished extends from the side of each carrier plate 21 .

[0064] like Figure 1 As shown, the supporting plate 21 and the supporting column 22 in this embodiment jointly form a frame structure with multiple layers of supporting space, and each layer of the supporting plate 21 is provided with a carrier plate 23; the carrier plate 23 is provided with a suction cup capable of adsorbing the wafer 100 to be polished, thereby allowing each wafer 100 to be polished to be arranged parallel to each other layer by layer on each layer of the supporting plate 21.

[0065] It can be understood that in this embodiment, the various wafers 100 to be polished on the same carrier platform 2 should be arranged with a common central axis. To this end, the carrier plates 23 on each layer of the carrier plates 21 should be arranged on the same straight line, and the straight line and each carrier plate 21 should be perpendicular to each other.

[0066] On this basis, in order to ensure that the wafers 100 to be polished on each layer of the carrier plate 21 can rotate around the central axis of the wafer 100 to be polished, it is necessary to further arrange a first drive motor 31 between each carrier 23 and the carrier plate 21 on which it is located; it can be understood that the rotating shaft of each first drive motor 31 and the central axis of each wafer 100 to be polished should be located on the same straight line; thus, when each first drive motor 31 is started synchronously, it can drive each wafer 100 to be polished to rotate synchronously and coaxially.

[0067] In addition, in practical applications, the method for the first drive assembly to synchronously drive the rotation of each wafer to be polished 100 is not limited to providing a first drive motor 31 between each carrier 23 and the carrier plate 21; Figure 3 As shown, only one first drive motor 31 can be set on the outer side of the carrier plate 21, and a main transmission gear 32 can be set on the rotating shaft of the first drive motor 31. The main transmission gear 32 is then connected to each carrier 23 through a plurality of branch transmission gears 33. As the first drive motor 31 rotates, the main transmission gear 32 and the branch transmission gears 33 can synchronously drive each carrier 23 to rotate on the carrier plate 21, thereby making the wafers 100 to be polished on each carrier 23 rotate synchronously and coaxially.

[0068] In addition, each of the carrier plates 21 in the embodiment is substantially rectangular in structure, wherein the length of the carrier plate 21 should be greater than the diameter of each wafer 100 to be polished, and the width should be less than the diameter of the wafer 100 to be polished, so that each support column 22 can be connected to each carrier plate 21 from both ends of the carrier plate 21, and at the same time, the edges of the wafer 100 to be polished on each carrier plate 21 can extend from one side of the carrier plate 21 in the width direction to the outside of the carrier plate 21, so as to be in contact with the groove structure on the polishing disc. As shown in Figure 2 Figure 2 the edges of the wafer 100 to be polished in the embodiment also extend from one side of the polishing disc. In the embodiment, it is also not excluded that the edges of the wafer 100 to be polished extend from the side of the carrier plate 21 on both sides or more sides, as long as the good support of the carrier plate 21 to the wafer 100 to be polished can be ensured, and the carrier plate 21 does not hinder the contact between the wafer 100 to be polished and the groove structure on the polishing disc.

[0069] In addition, in order to further improve the stability of each carrier plate 21, in the embodiment, in addition to supporting and connecting each carrier plate 21 by the support column 22, a support plate 24 can be further provided on one side of each carrier plate 21; as shown in Figure 1 Figure 1 the support plate 24 in the embodiment can be provided at both ends of the carrier plate 21 in the length direction, or not provided, as long as the stability of the overall structure of the carrier plate 21 and the support column 22 can be ensured, and the embodiment will not be described in detail.

[0070] As described above, the plurality of groove structures provided on the polishing disc in the application can be one groove structure provided on each of the plurality of polishing discs, or a plurality of groove structures provided on one polishing disc, which will be described in detail in two different embodiments.

[0071] As shown in Figure 1 in an alternative embodiment of the application, the polishing assembly in the wafer chamfer polishing device further comprises, in addition to the polishing disc:

[0072] a rotating shaft 42 and a second driving motor 43 connected to the rotating shaft 42;

[0073] wherein the polishing disc comprises a plurality of polishing discs 41 arranged in parallel and coaxially on the rotating shaft 42; and the groove structure is an annular groove 411 provided on the side of each polishing disc 41.

[0074] ​​When the second driving motor 43 drives the rotating shaft 42 to rotate, each grinding disc 41 rotates synchronously with the rotating shaft 42 with the straight line where the rotating shaft 42 is located as the center.

[0075] like Figure 1 As shown, in this embodiment, multiple grinding discs 41 are coaxially connected in series on the same rotating shaft 42. The rotating shaft 42 and the central axes of each wafer 100 to be polished on the supporting platform 2 should be parallel to each other. The spacing between two adjacent grinding discs 41 should also be the same as the spacing between two adjacent wafers 100 to be polished on the supporting platform 2. Therefore, each wafer 100 to be polished should be located in the same plane as a grinding disc 41. By properly controlling the relative distance between the rotating shaft 42 and the central axes of each wafer 100 to be polished, the side edges of each wafer 100 to be polished and the groove structure on the grinding disc 41 on the same plane are aligned. The groove structure on each grinding disc 41 is an annular groove 411 arranged around the side of the grinding disc 41. The cross-section of the groove structure can be a U-shaped structure or an inverted trapezoidal structure.

[0076] In addition, because the number of each wafer 100 to be polished carried on the carrier 2 needs to correspond to a groove structure, the number of grinding discs 41 on the same rotating shaft 42 should be no less than the number of wafers 100 to be polished that can be carried on the same carrier 2; Figure 1 In the embodiment shown, the number of wafers 100 to be polished that can be carried on a carrier 2 can be the same as the number of grinding discs 41 set on a rotating shaft 42. Thus, each grinding disc 41 grinds the side of a wafer 100 to be polished to form a chamfer.

[0077] In addition, when the first drive component drives each wafer to be polished 100 to rotate coaxially, the second drive component can also simultaneously drive the rotating shaft 42 to rotate, that is, drive each grinding disc 41 to rotate synchronously; but it should be noted that the rotation direction of the wafer to be polished 100 driven by the first drive component should be the same as the direction of rotation of the grinding disc 41 driven by the second drive component, so that the linear velocity directions between the contact points where the wafer to be polished 100 and the grinding disc 41 contact each other are opposite.

[0078] It can be understood that, as the polishing process proceeds, the side edges of each wafer 100 to be polished need to be gradually fitted into the groove structure on the corresponding grinding disc 41; therefore, the wafer chamfer polishing device should also include a driving structure for adjusting the relative position between the rotating shaft 42 and the carrier table 2, for example, the driving structure can drive the rotating shaft 42 to gradually approach the central axis of each wafer 100 to be polished, of course, the rotating shaft 42 can also be kept stationary, and the carrier table 2 is driven to gradually approach the rotating shaft 42, so that the distance between the central axis of each wafer 100 to be polished and the rotating shaft 42 is reduced, and the technical solution of the present application can also be achieved, which will not be described in detail in the present application.

[0079] Based on the above discussion, referring to Figure 4 and Figure 5 , Figure 4 another cross-sectional structure schematic diagram of the wafer chamfer polishing device provided by the embodiment of the present application; Figure 5 a structure schematic diagram of the relative position between the wafer to be polished and the grinding disc provided by the embodiment of the present application.

[0080] In another optional embodiment of the present application, in order to further improve the processing efficiency of the wafer 100 to be polished, the wafer chamfer polishing device can further include:

[0081] The carrier table 2 and the first driving assembly are each provided with two groups;

[0082] and the two carrier tables 2 are symmetrically arranged on both sides of the grinding assembly about the rotating shaft 42;

[0083] Two carrier discs 23 located in the same layer of the two groups of carrier tables 2 are symmetrically arranged on both sides of each grinding disc 41 in the grinding assembly, so that each grinding disc 41 can synchronously process two wafers 100 to be polished.

[0084] Referring to Figure 4 , in Figure 4 the embodiment, one carrier table 2 is arranged on each side of the rotating shaft 42, and the two carrier tables 2 are symmetric about the rotating shaft 42, so that each wafer 100 to be polished carried on the two carrier tables 2 is also symmetric about the rotating shaft 42 and the grinding disc 41 on the rotating shaft 42.

[0085] As Figure 5As shown, the two wafers 100 to be polished on the two carriers 2 respectively can be symmetrically arranged on two sides of the same grinding disc 41, so that the first driving assembly connected with the two carriers 2 respectively drives the rotation of the wafers 100 carried on the two carriers 2, and the grinding disc 41 and the wafers 100 rotate in the same direction, and each grinding disc 41 can polish two wafers 100 at the same time, so that the processing efficiency of the wafers 100 is doubled.

[0086] The above is an embodiment in which the grinding assembly includes a plurality of grinding discs 41, and each grinding disc is provided with a groove structure. Figure 6 and Figure 7 , Figure 6 FIG. 6 is another cross-sectional structure diagram of a wafer chamfer polishing device provided by an embodiment of the present application; Figure 7 FIG. 7 is a structure diagram of the relative position between a wafer to be polished and a grinding flat plate provided by an embodiment of the present application.

[0087] Figure 6 and Figure 7 FIG. 6 is another cross-sectional structure diagram of a wafer chamfer polishing device provided by an embodiment of the present application;

[0088] The grinding disc is a grinding flat plate 44 arranged perpendicularly to the carrier plate 21.

[0089] The groove structure includes a plurality of strip-shaped grooves 441 arranged in parallel on the grinding flat plate 44; the interval between two adjacent strip-shaped grooves 441 is the same as the interval between the wafers 100 to be polished.

[0090] and the above Figure 1 The difference between the embodiment shown in FIG. 6 and the above embodiment is that the grinding disc in the embodiment is not a disc structure, but a grinding flat plate 44 in a flat plate structure; but a strip-shaped groove 441 is arranged on the flat plate structure for each layer of wafers 100 carried on the carrier 2. Obviously, the grinding flat plate 44 in the embodiment is tangent to each wafer 100 to be polished at the same time, and the position of each strip-shaped groove 441 is the tangent point of the grinding flat plate 44 and each wafer 100 to be polished, and is parallel to each wafer 100 to be polished. Therefore, even if the grinding flat plate 44 remains stationary, the corresponding strip-shaped groove 441 can also polish the side surface of each wafer 100 to be polished synchronously when the first driving assembly drives the rotation of each wafer 100 to be polished, thereby forming a chamfer structure.

[0091] Furthermore, a pushing structure can be provided on the side of the grinding plate 44 away from the wafer 100 to be polished. On the one hand, the distance between the grinding plate 44 and the central axis of each wafer 100 to be polished can be gradually reduced as the wafer 100 to be polished is polished. On the other hand, sufficient mutual friction is ensured between the groove wall of the strip groove 441 and the side surface of each wafer 100 to be polished, thereby ensuring the polishing effect.

[0092] Of course, considering that there is only one position on each strip groove 441 on the grinding plate 44 for grinding the wafer 100 to be ground, severe heat generation is inevitable. For this reason, the grinding assembly in this embodiment can further include a translation motor connected to the grinding plate 44, which is used to drive the grinding plate 44 to translate along the length direction parallel to the strip groove 441.

[0093] like Figure 7 As shown, Figure 7 The direction indicated by the double-arrow line is also the translation direction of the grinding plate 44. Generally, the translation speed of the grinding plate 44 is much smaller than the rotation speed of the side surface of the wafer 100 to be polished.

[0094] Based on the above embodiments, Figure 8 As shown, Figure 8 A schematic structural diagram of a grinding plate provided in an embodiment of the present application; in another optional implementation of this embodiment, it may further include:

[0095] The width of the strip groove 441 gradually increases from the middle to both ends, and the width of the strip groove 441 at the middle position is the same as the thickness of the wafer 100 to be polished.

[0096] It can be understood that for each wafer 100 to be polished, the thickness of the side is the largest when the side is just started to be polished, which is equal to the thickness of the wafer 100 to be polished. At this time, the side of the wafer 100 to be polished is often difficult to be inserted into the strip groove 441. For this reason, in this embodiment, the groove widths at both ends of the strip groove 441 are set to be larger, while the groove width in the middle section is set to be smaller. Therefore, during actual processing, the side of the wafer 100 to be polished can be first inserted from the two end sections of each strip groove 441. As the polishing process proceeds, the side of the wafer 100 to be polished is gradually moved toward the middle section of the strip groove 441, thereby ensuring that the side of the wafer 100 to be polished is stably inserted into the strip groove 441 for polishing.

[0097] In addition, the notch width of the middle section and the two end sections of the strip-shaped groove 441 is different, and the included angle between the corresponding groove walls should also be different, but whether it is the notch width or the included angle between the groove walls, it is gradually and smoothly changed from the two ends to the middle of the strip-shaped groove 441. Therefore, in the actual polishing process of the strip-shaped groove 441 in this embodiment, the size of the side chamfer of the wafer to be polished can also be changed by controlling the position of the wafer to be polished 100 in the strip-shaped groove 441, thereby realizing the diversified requirements of the chamfering of the wafer to be polished 100.

[0098] Further, in another optional implementation manner of the embodiment, the wafer chamfer polishing device can further include:

[0099] The grinding plate 44 is provided with a plurality of groups of strip-shaped grooves 441 side by side;

[0100] Among them, the cross sections of the same group of strip-shaped grooves 441 are the same, and the cross sections of different groups of strip-shaped grooves 441 are different;

[0101] The cross section of the groove structure is at least one of a U-shaped structure or an inverted trapezoidal structure.

[0102] It is further considered in this embodiment that based on different actual needs, the chamfering surface shape requirements of the wafer to be polished 100 are also different. In order to be able to meet different processing requirements, a plurality of different groups of strip-shaped grooves 441 can be provided on the same grinding plate 44, so that in actual application, the corresponding strip-shaped groove 441 can be selected based on the actual processing requirements. For example, in Figure 9 The cross sections of the left group of strip-shaped grooves 441 are all U-shaped structures, and the cross sections of the right group of strip-shaped grooves 441 are all inverted trapezoidal structures; therefore, when the wafer to be polished 100 needs to be processed to form a side with a U-shaped cross section, each wafer to be polished 100 is correspondingly clamped into the left group of strip-shaped grooves 441, and when the wafer to be polished 100 needs to be processed to form a side with an inverted trapezoidal cross section, each wafer to be polished 100 is correspondingly clamped into the right group of strip-shaped grooves 441.

[0103] Based on the above discussion, reference is made to Figure 9 and Figure 10 , Figure 9 for another cross-sectional structure schematic diagram of the wafer chamfer polishing device provided by the embodiment of the present application; Figure 10 for a top view schematic diagram of the bearing table and the grinding plate provided by the embodiment of the present application.

[0104] As shown in Figure 9 and Figure 10 , in another optional implementation manner of the embodiment, the wafer chamfer polishing device can further include:

[0105] The two grinding discs are symmetrically arranged on both sides of the bearing table 2, so that the two grinding discs can grind the two sides of the wafer 100 synchronously.

[0106] With reference to Figure 9 and Figure 10 In the embodiment, the edges of each wafer 100 to be ground can extend from the opposite sides of the bearing plate 21, and two grinding discs are symmetrically arranged on both sides of the wafer 100 extending from the bearing plate 21. Thus, the two grinding plates 44 can simultaneously grind the same wafer 100 synchronously on both sides of the wafer 100. On the one hand, the grinding efficiency of a single wafer 100 is improved, and on the other hand, the balance of the wafer 100 is ensured, which is beneficial to prevent the wafer 100 from tilting due to unbalanced force, and ensures the grinding effect of the wafer.

[0107] In summary, in the wafer chamfer grinding device, a plurality of wafers to be ground can be stacked on the bearing table, and a plurality of groove structures are arranged on the grinding disc of the grinding assembly. Thus, the plurality of groove structures on the grinding disc can grind the plurality of wafers synchronously, and the chamfer structure is formed on the side of each wafer, thereby improving the wafer chamfer processing efficiency and the wafer processing capacity.

[0108] It should be noted that the relational terms herein, such as first and second, are used only to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Moreover, the terms "comprise", "contain" or any other variant thereof are intended to cover non-exclusive inclusion, so that the process, method, article or equipment including a series of elements is inherent. Without more limitations, the element defined by the statement "comprising a" does not exclude the presence of other identical elements in the process, method, article or equipment including the element. In addition, the above technical solutions provided by the embodiments of the present application have not been described in detail, so as not to be too verbose.

[0109] The principle and implementation mode of the present application are described by using specific examples in the present application, and the above examples are only used for helping to understand the method and core idea of the present application. It should be pointed out that, for ordinary skilled persons in the technical field, some improvements and modifications can be made to the present application without departing from the principle of the present application, and these improvements and modifications also fall within the protection scope of the present application.

Claims

1. A wafer chamfering and grinding device, characterized in that: The application relates to a polishing device for polishing a plurality of wafers, comprising: a carrier table for carrying the plurality of wafers to be polished, wherein the plurality of wafers to be polished are arranged coaxially and parallel to each other; a first driving assembly fixedly connected to the carrier table, for driving the plurality of wafers to be polished to rotate synchronously around the central axes; a polishing assembly comprising a polishing disc, wherein the polishing disc is provided with groove structures for polishing the side surfaces of the plurality of wafers to be polished to form chamfered surfaces with the same cross section as the groove structures; wherein the groove structures are arranged in parallel to each other in sequence along the arrangement direction of the plurality of wafers to be polished, so that the edges of the plurality of wafers to be polished can synchronously contact the corresponding groove structures; when the first driving assembly drives the carrier table to drive the plurality of wafers to be polished to rotate synchronously, the groove structures synchronously polish the plurality of wafers to be polished which contact each other.

2. The wafer bevel lapping apparatus of claim 1 wherein, The carrier table comprises a plurality of carrier plates arranged in parallel to each other layer by layer, a plurality of support columns for supporting and connecting the plurality of carrier plates, and a plurality of carriers respectively arranged on the plurality of carrier plates; the first driving assembly comprises a plurality of first driving motors respectively connected to each carrier plate and the corresponding carrier; wherein the plurality of first driving motors are synchronous motors; each carrier is provided with a suction disc for adsorbing the wafer to be polished; the length of each carrier plate is greater than the diameter of the wafer to be polished, and the width of each carrier plate is less than the diameter of the wafer to be polished, so that the side edges of each wafer to be polished extend from the side surface of each carrier plate.

3. The wafer bevel lapping apparatus of claim 2, wherein: The polishing assembly comprises a rotating shaft and a second driving motor connected to the rotating shaft; wherein the polishing disc comprises a plurality of polishing discs arranged in parallel to each other in sequence and coaxially on the rotating shaft; and the groove structures are annular grooves arranged on the side surfaces of each polishing disc; when the second driving motor drives the rotating shaft to rotate, each polishing disc synchronously rotates around the rotating shaft with the straight line on which the rotating shaft is located as the center.

4. The wafer bevel lapping apparatus of claim 3 wherein, The carrier table and the first driving assembly are provided with two groups; and the two groups of carrier tables are symmetrically arranged about the rotating shaft on the two sides of the polishing assembly; each polishing disc in the polishing assembly is symmetrically provided with two carriers on the same layer of the two groups of carrier tables, so that each polishing disc can synchronously process two wafers to be polished.

5. The wafer bevel lapping apparatus of claim 3 wherein, The cross section of the groove structure is a U-shaped structure or an inverted trapezoidal structure.

6. The wafer bevel lapping apparatus of claim 2 wherein, The polishing disc is a polishing flat plate arranged perpendicularly to the carrier plate; the groove structure comprises a plurality of strip-shaped grooves arranged in parallel to each other in sequence on the polishing flat plate; and the spacing between adjacent two strip-shaped grooves is the same as the spacing between the plurality of wafers to be polished.

7. The wafer bevel lapping apparatus of claim 6 wherein, The polishing assembly further comprises a translation motor connected to the polishing flat plate, for driving the polishing flat plate to move in translation along the length direction parallel to the strip-shaped grooves.

8. The wafer bevel lapping apparatus of claim 7 wherein, The slot width of the strip-shaped groove gradually expands from the middle to the two ends, and the slot width of the middle position of the strip-shaped groove is the same as the thickness of the wafer to be polished.

9. The wafer bevel lapping apparatus of claim 7 wherein, The polishing flat plate is provided with a plurality of groups of strip-shaped grooves arranged side by side. The cross sections of the strip-shaped grooves in the same group are the same, and the cross sections of the strip-shaped grooves in different groups are different; The cross section of the groove structure is at least one of a U-shaped structure and an inverted trapezoidal structure.

10. The wafer bevel lapping apparatus of claim 6 wherein, Two grinding discs are symmetrically arranged on both sides of the carrier platform, so that the two grinding discs can synchronously and symmetrically grind the wafers to be polished on both sides of the carrier platform.

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