Semiconductor grinding head convenient to disassemble and assemble

Abstract

The semiconductor grinding head convenient to disassemble and assemble comprises a workbench, a fixing frame is fixedly installed on the top face of the workbench, an electric push rod is fixedly installed on the top face of the fixing frame, a lifting plate is fixedly installed at the output end of the electric push rod, and a first motor is fixedly installed on the top face of the lifting plate. A mounting base is fixedly mounted at the output end of the first motor, a mounting groove is formed in the bottom surface of the mounting base, a mounting block is arranged in the mounting groove, a semiconductor grinding head body is fixedly mounted on the bottom surface of the mounting block, clamping blocks are driven to move through arrangement of a driving assembly, and the two clamping blocks move towards the mounting base; according to the semiconductor grinding head, the mounting base is clamped and fixed, meanwhile, the clamping block enters the clamping groove, the mounting block is fixedly mounted in the mounting base, the semiconductor grinding head body can be fixed, the screw does not need to be repeatedly screwed with the help of other tools, and the semiconductor grinding head body is more convenient to mount and dismount.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor grinding equipment especially, relates to a semiconductor grinding head convenient to dismount. BACKGROUND

[0002] The semiconductor grinding head is a key component in the semiconductor grinding equipment, and is mainly used for pressing a wafer on a grinding pad and driving the wafer to rotate in the CMP process, so that the wafer is finely ground.

[0003] At present, the semiconductor grinding machine needs to replace the grinding head frequently due to long-time wear during use, and the grinding head is usually installed on the grinding equipment in a screw locking mode, so that other tools need to be used to repeatedly screw the screw during installation and dismounting, and the operation process is relatively cumbersome, and therefore the semiconductor grinding head convenient to dismount is provided. UTILITY MODEL CONTENTS

[0004] In view of the defects in the prior art, the utility model provides a semiconductor grinding head convenient to dismount, which solves the problems in the background art.

[0005] In order to achieve the above purpose, the utility model adopts the following technical scheme:

[0006] A semiconductor grinding head convenient to dismount, comprising a workbench, a fixed frame is fixedly installed on the top surface of the workbench, an electric push rod is fixedly installed on the top surface of the fixed frame, an lifting plate is fixedly installed on the output end of the electric push rod, a first motor is fixedly installed on the top surface of the lifting plate, an installation seat is fixedly installed on the output end of the first motor, an installation groove is formed in the bottom surface of the installation seat, an installation block is arranged in the installation groove, a semiconductor grinding head body is fixedly installed on the bottom surface of the installation block, a driving assembly is arranged in the installation block, a threaded rod is rotatably installed in the installation block, a threaded block is screwedly installed on the surface of the threaded rod, a clamping block is fixedly installed on the top surface of the threaded block, and a clamping block is fixedly installed on the surface of the clamping block.

[0007] Preferably, a positioning rod is fixedly installed in the installation groove, and a positioning hole is formed in the top surface of the installation block, and the positioning rod and the positioning hole are correspondingly arranged.

[0008] Preferably, the driving assembly comprises a second motor fixedly installed on the surface of the installation block, a rotating shaft is fixedly installed on the output end of the second motor, and a first bevel gear is fixedly installed on one end of the rotating shaft.

[0009] Preferably, a second bevel gear is fixedly installed on one end of the threaded rod, and the second bevel gear is meshingly arranged with the first bevel gear.

[0010] Preferably, the inside of the mounting block is provided with a gear cavity, and the first bevel gear and the second bevel gear are located inside the gear cavity.

[0011] Preferably, the surface of the mounting block is fixedly provided with a fixing block, the inside of the fixing block is provided with a sliding groove, and the sliding groove is in sliding connection with the threaded block.

[0012] Preferably, the surface of the mounting seat is provided with a clamping groove, and the clamping groove is correspondingly provided with a clamping block.

[0013] Compared with the prior art, the semiconductor grinding head convenient to disassemble has the advantages that: the positioning of the mounting block is realized through the positioning rod and the positioning hole, the driving assembly is arranged to drive the threaded rod to rotate, the threaded block is moved, the clamping blocks are moved, the two groups of clamping blocks are moved to the mounting seat to clamp and fix the mounting seat, the clamping block is arranged in the clamping groove, the mounting block is fixedly arranged in the mounting seat, the semiconductor grinding head body can be fixed, and it is not necessary to repeatedly screw the screw by means of other tools, so that the installation and disassembly of the semiconductor grinding head body are more convenient. BRIEF DESCRIPTION OF DRAWINGS

[0014] Figure 1 It is a structural schematic view of the utility model;

[0015] Figure 2 It is a structural schematic view of the mounting seat of the utility model;

[0016] Figure 3 It is a structural schematic view of the mounting block of the utility model;

[0017] Figure 4 It is a structural schematic view of the utility model sectional view.

[0018] In the drawing: 1, workbench; 2, fixed frame; 3, electric push rod; 4, lifting plate; 5, first motor; 6, mounting seat; 7, mounting groove; 8, positioning rod; 9, clamping groove; 10, mounting block; 11, positioning hole; 12, semiconductor grinding head body; 13, second motor; 14, rotating shaft; 15, first bevel gear; 16, gear cavity; 17, threaded rod; 18, second bevel gear; 19, threaded block; 20, fixing block; 21, sliding groove; 22, clamping block; 23, clamping block. DETAILED DESCRIPTION

[0019] Clearly, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments of the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0020] Embodiment: refer to Figures 1-4 The utility model provides a kind of technical scheme, a semiconductor lapping head convenient to dismount, including workbench 1, the top surface of workbench 1 is fixedly installed with fixed frame 2, the top surface of fixed frame 2 is fixedly installed with electric push rod 3, the output of electric push rod 3 is fixedly installed with lifting plate 4, the top surface of lifting plate 4 is fixedly installed with first motor 5, the output of first motor 5 is fixedly installed with mounting seat 6, the bottom surface of mounting seat 6 is set with installation groove 7, installation groove 7 is provided with mounting block 10 in its inside, fixedly installed with locating rod 8 in the inside of installation groove 7, the top surface of mounting block 10 is set with locating hole 11, and locating rod 8 and locating hole 11 are correspondingly set, by the setting of locating rod 8 and locating hole 11, mounting block 10 can be positioned, the bottom surface of mounting block 10 is fixedly installed with semiconductor lapping head body 12, rotatingly installed with threaded rod 17 in the inside of mounting block 10, threaded rod 17 is screw mounted with threaded block 19 on its surface, the top surface of threaded block 19 is fixedly installed with clamping block 22, the surface of clamping block 22 is fixedly installed with clamping block 23.

[0021] Specific, the inside of the mounting block 10 is provided with a drive assembly, drive assembly includes fixedly installed on the surface of the second motor 13 mounting block 10, the output end of the second motor 13 is fixedly installed with the shaft 14, one end of the shaft 14 is fixedly installed with the first bevel gear 15, one end of the threaded rod 17 is fixedly installed with the second bevel gear 18, and the second bevel gear 18 is engaged with the first bevel gear 15, the inside of the mounting block 10 is provided with a gear cavity 16, and the first bevel gear 15 and the second bevel gear 18 are located in the inside of the gear cavity 16, the surface of the mounting block 10 is fixedly installed with the fixed block 20, the inside of the fixed block 20 is provided with a sliding slot 21, and the sliding slot 21 is slidably connected with the threaded block 19, the surface of the mounting seat 6 is provided with a clamping groove 9, and the clamping groove 9 is correspondingly provided with a clamping block 23, through the setting of the drive assembly, the output end of the second motor 13 rotates, drives the shaft 14 to rotate, so that the first bevel gear 15 rotates, and the first bevel gear 15 is engaged with the second bevel gear 18, so that the second bevel gear 18 rotates, and then drives the threaded rod 17 to rotate, drives the threaded block 19 to slide in the sliding slot 21, so that the clamping block 22 moves, the two sets of clamping blocks 22 move towards the mounting seat 6, and the mounting seat 6 is clamped and fixed, at the same time, the clamping block 23 enters the clamping groove 9, so that the mounting block 10 is fixedly installed in the mounting seat 6, that is, the semiconductor grinding head body 12 can be fixed, when disassembling, the second motor 13 is started, the shaft 14 is reversed, the first bevel gear 15 is rotated, the threaded block 19 is moved, the two sets of clamping blocks 22 are away from each other, the clamping block 23 is moved out of the clamping groove 9, so that the semiconductor grinding head body 12 can be disassembled, without the aid of other tools to repeatedly screw, so that the installation and disassembly of the semiconductor grinding head body 12 is more convenient.

[0022] The electrical components in this article are all connected with the main controller and 220V mains electricity, and the main controller can be a computer or other conventional known device that can be controlled.

[0023] In use: the mounting block 10 is inserted into the mounting groove 7, so that the positioning rod 8 enters the positioning hole 11, through the setting of the positioning rod 8 and the positioning hole 11, the mounting block 10 can be positioned, the second motor 13 is started, the output end of the second motor 13 rotates, drives the shaft 14 to rotate, so that the first bevel gear 15 rotates, and the first bevel gear 15 is engaged with the second bevel gear 18, so that the second bevel gear 18 rotates, and then drives the threaded rod 17 to rotate, drives the threaded block 19 to slide in the sliding slot 21, so that the clamping block 22 moves, the two sets of clamping blocks 22 move towards the mounting seat 6, and the mounting seat 6 is clamped and fixed, at the same time, the clamping block 23 enters the clamping groove 9, so that the mounting block 10 is fixedly installed in the mounting seat 6, that is, the semiconductor grinding head body 12 can be fixed, without the aid of other tools to repeatedly screw, so that the installation and disassembly of the semiconductor grinding head body 12 is more convenient.

[0024] It is to be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Moreover, the terms "comprises", "comprising", or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but can include other elements not expressly listed or inherent to such process, method, article, or apparatus.

[0025] While the embodiments of the present application have been illustrated and described, it will be understood by those skilled in the art that various changes, modifications, substitutions, and alterations can be made therein without departing from the spirit and scope of the application, which is defined by the appended claims and their equivalents.

Claims

1. A semiconductor polishing head which is easy to assemble and disassemble, comprising a table (1), characterized in that, The top surface of the workbench (1) is fixedly installed with a fixing frame (2), the top surface of the fixing frame (2) is fixedly installed with an electric push rod (3), the output end of the electric push rod (3) is fixedly installed with a lifting plate (4), the top surface of the lifting plate (4) is fixedly installed with a first motor (5), the output end of the first motor (5) is fixedly installed with a mounting seat (6), the bottom surface of the mounting seat (6) is provided with a mounting groove (7), the inside of the mounting groove (7) is provided with a mounting block (10), the bottom surface of the mounting block (10) is fixedly installed with a semiconductor grinding head body (12), the inside of the mounting block (10) is provided with a driving assembly, the inside of the mounting block (10) is rotatably installed with a threaded rod (17), the surface of the threaded rod (17) is threadedly installed with a threaded block (19), the top surface of the threaded block (19) is fixedly installed with a clamping block (22), the surface of the clamping block (22) is fixedly installed with a clamping block (23).

2. The semiconductor polishing head of claim 1, wherein, The inside of the mounting groove (7) is fixedly installed with a positioning rod (8), the top surface of the mounting block (10) is provided with a positioning hole (11), and the positioning rod (8) and the positioning hole (11) are correspondingly arranged.

3. The semiconductor polishing head of claim 1, wherein, The driving assembly comprises a second motor (13) fixedly installed on the surface of the mounting block (10), the output end of the second motor (13) is fixedly installed with a rotating shaft (14), one end of the rotating shaft (14) is fixedly installed with a first bevel gear (15).

4. The semiconductor polishing head of claim 3, wherein, One end of the threaded rod (17) is fixedly installed with a second bevel gear (18), and the second bevel gear (18) is arranged in meshing with the first bevel gear (15).

5. The semiconductor polishing head of claim 4, wherein, The inside of the mounting block (10) is provided with a gear cavity (16), and the first bevel gear (15) and the second bevel gear (18) are located in the inside of the gear cavity (16).

6. The semiconductor polishing head of claim 1, wherein, The surface of the mounting block (10) is fixedly installed with a fixed block (20), the inside of the fixed block (20) is provided with a sliding groove (21), and the sliding groove (21) is slidably connected with the threaded block (19).

7. The semiconductor polishing head of claim 1, wherein, The surface of the mounting seat (6) is provided with a clamping groove (9), and the clamping groove (9) is correspondingly arranged with the clamping block (23).

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