Chip coating crucible protection layer

Abstract

The utility model discloses a protective layer of a chip coating crucible, which relates to the technical field of protective layers of chip coating crucibles, and comprises a crucible main body, a protective layer is arranged at the top of the crucible main body, a heat insulation layer is arranged between the crucible main body and the protective layer, and the protective layer comprises a ceramic material and a composite material. The heat insulation layer can effectively insulate high-temperature heat from being transmitted to the crucible body and the surrounding environment, energy consumption is reduced, surrounding equipment is protected from being affected by high temperature, and therefore the chip coating crucible is protected, ceramic materials and composite materials are used in a combined mode, respective advantages of the ceramic materials and the composite materials are brought into full play, and the service life of the chip coating crucible is prolonged. The high temperature resistance, the corrosion resistance and the chip quality protection capability of the crucible can be remarkably improved, meanwhile, the energy consumption is reduced, and the service life is prolonged.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip coating crucible protective layer technical field, concretely is a kind of chip coating crucible protective layer. BACKGROUND

[0002] Chip coating crucible protective layer plays a vital role in chip manufacturing process, it directly influences the quality of coating and the long-term reliability of chip, its refers to in chip coating process, to protect crucible from high temperature, corrosion and other environmental factors damage, while in coating process ensure the purity and uniformity of coating material and design one or more covers, chip coating crucible protective layer has irreplaceable important role in chip manufacturing process.

[0003] The preparation process of chip coating crucible protective layer is different due to material and design, usually includes the following steps: substrate processing, coating preparation, curing treatment and detection and acceptance, with the continuous development of semiconductor technology, the requirement of chip coating crucible protective layer is also higher and higher, so through continuous research and innovation, thus can prepare the protective layer material with more excellent performance, longer service life, better environmental protection, can make greater contribution for the development of semiconductor industry.

[0004] The existing chip coating crucible protective layer in the process of use, due to its material performance single, make it only has certain aspect's excellent performance, and it is difficult to meet the comprehensive requirement of chip coating crucibble to multiple performance, thereby can reduce its service life. UTILITY MODEL CONTENTS

[0005] Based on this, the utility model aims at providing a kind of chip coating crucible protective layer to solve the technical problem that the existing chip coating crucible protective layer in the process of use, due to its material performance single, make it only has certain aspect's excellent performance, and it is difficult to meet the comprehensive requirement of chip coating crucibble to multiple performance, thereby can reduce its service life.

[0006] To achieve the above-mentioned purpose, the utility model provides the following technical scheme: a kind of chip coating crucible protective layer, including crucible main body, the top of the crucible main body is provided with protective layer, the crucible main body and protective layer middle are provided with heat insulation layer, the protective layer includes ceramic material and composite material.

[0007] By adopting the above technical scheme, the heat insulation layer is arranged between the crucible main body and the protective layer, which can effectively insulate the transmission of high-temperature heat to the crucible main body and the surrounding environment, reduce energy consumption and protect the surrounding equipment from high temperature, thereby playing a protective role on the chip coating crucible, and the ceramic material has extremely high high-temperature resistance and can maintain stable structure and performance in a high-temperature environment, effectively preventing deformation or damage caused by high temperature, and the composite material can significantly improve the oxidation resistance of the composite material, thereby maintaining the stability of the composite material at high temperature, so that the protection can guarantee the quality and performance of the chip, reduce the influence of external environment change on the coating process, thereby improving the coating efficiency and consistency and prolonging the service life.

[0008] The utility model further sets up, the crucible main body, heat insulation layer and protective layer all are provided with adhesive layer between, and adhesive layer sets up high temperature resistance inorganic adhesive.

[0009] By adopting the above technical scheme, the high-temperature-resistant inorganic adhesive can maintain stable bonding performance in a high-temperature environment, ensure that the crucible main body, the heat insulation layer and the protective layer are firmly and durably connected, prevent connection failure or falling caused by performance degradation of the adhesive material, and ensure the integrity and functionality of the protective layer, thereby significantly improving the high-temperature stability, chemical stability, safety and environmental protection of the chip coating crucible protective layer.

[0010] The utility model further sets up, the heat insulation layer sets up aerogel material layer.

[0011] By adopting the above technical scheme, the aerogel material layer can effectively insulate the transmission of heat, thereby playing a heat-insulating role, and the aerogel material has extremely low density and high strength and toughness, without significantly increasing the weight of the crucible protective layer, which is conducive to maintaining the overall stability of the equipment.

[0012] The utility model further sets up, the composite material is formed by the even mixing of graphite matrix and inorganic nano antioxidant.

[0013] By adopting the above technical scheme, the addition of the inorganic nano antioxidant can significantly improve the oxidation resistance of the composite material, effectively delay or prevent the oxidation process of the graphite matrix, thereby maintaining the stability of the material and prolonging the service life; the graphite matrix itself has excellent mechanical properties and thermal conductivity, and the addition of the inorganic nano antioxidant can improve the overall strength and toughness of the composite material, and the composite material can still maintain good performance in a high-temperature environment, which can meet the high-temperature stability requirements of the chip coating crucible.

[0014] The utility model further sets up, the adhesive layer and the protective layer set up half-enclosing structure.

[0015] By adopting the above technical solution, the protective layer and the adhesive layer can be concentrated on the top of the chip coating crucible, thereby protecting the chip coating crucible and reducing the probability of delamination between the layers, thereby extending the practical life.

[0016] In summary, the present invention has the following beneficial effects:

[0017] The utility model can effectively isolate the transfer of high-temperature heat to the crucible body and the surrounding environment through the provision of a heat-insulating layer, reduce energy consumption and protect surrounding equipment from the influence of high temperature, thereby protecting the chip-coated crucible. At the same time, the combined use of ceramic materials and composite materials gives full play to the advantages of each, which can significantly improve the high-temperature resistance and corrosion resistance of the crucible and the ability to protect the chip quality, while reducing energy consumption and extending the service life. BRIEF DESCRIPTION OF THE DRAWINGS

[0018] Figure 1 This is a schematic diagram of the chip coating crucible protective layer material of the present invention.

[0019] In the figure: 1. crucible body; 2. thermal insulation layer; 3. bonding layer; 4. protective layer; 401. ceramic material; 402. composite material. DETAILED DESCRIPTION

[0020] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention, and cannot be understood as limiting the present invention.

[0021] The following describes an embodiment of the present invention based on its overall structure.

[0022] A chip coating crucible protective layer, such as Figure 1 As shown, it includes a crucible body 1, a protective layer 4 is provided on the top of the crucible body 1, and the protective layer 4 can protect the crucible body 1. A heat insulation layer 2 is provided between the crucible body 1 and the protective layer 4, and the heat insulation layer 2 is provided as an aerogel material layer. The aerogel material layer can effectively isolate the transfer of high-temperature heat to the crucible body 1 and the surrounding environment, reduce energy consumption and protect surrounding equipment from high temperature, thereby protecting the crucible body 1.

[0023] The protective layer 4 comprises a ceramic material 401 and a composite material 402, the ceramic material 401 has very high high-temperature resistance, can keep stable structure and performance in a high-temperature environment, effectively prevents deformation or damage caused by high temperature, and the composite material 402 is formed by uniformly mixing a graphite matrix and an inorganic nano-antioxidant, and the graphite matrix and the inorganic nano-antioxidant are mixed and used, so that the advantages of the two can be fully utilized and the deficiencies can be mutually made up, thereby increasing the antioxidant performance of the protective layer 4, keeping the stability of the material and prolonging the service life, and also improving the overall strength and toughness of the composite material 402, so that the composite material 402 can still keep good performance in a high-temperature environment, meet the requirement of high-temperature stability of the chip coating crucible, and therefore the protective layer 4 can better protect the crucible body 1, and the service life of the crucible body 1 is prolonged.

[0024] Further, the adhesive layer 3 is arranged between the crucible body 1, the heat insulation layer 2 and the protective layer 4, and the adhesive layer 3 is arranged as a high-temperature-resistant inorganic adhesive, so that the high-temperature-resistant inorganic adhesive can keep stable adhesive performance in a high-temperature environment, ensure that the crucible body 1, the heat insulation layer 2 and the protective layer 4 are firmly and durably connected, prevent connection failure or falling caused by performance degradation of the adhesive material, and ensure the integrity and functionality of the protective layer 4.

[0025] In the embodiment, the adhesive layer 3 and the protective layer 4 are arranged as a semi-enclosing structure, so as to be concentrated on the top of the crucible body 1, facilitate protection, and also reduce the probability of delamination between the crucible body 1, the heat insulation layer 2 and the protective layer 4, and prolong the service life.

[0026] Although the embodiments of the utility model have been shown and described, the specific embodiments are only an explanation of the utility model, and are not a limitation of the utility model, and the specific features, structures, materials or characteristics described can be combined in any one or more embodiments or examples in a suitable manner, and those skilled in the art can make modifications, replacements and variations of the embodiments without creative contribution after reading the specification without departing from the principles and purposes of the utility model, but as long as in the range of the claims of the utility model, it is protected by the patent law.

Claims

1. A protective layer for a wafer coating crucible comprising a crucible body (1), characterized in that: The top of the crucible body (1) is provided with a protective layer (4), and a heat insulation layer (2) is arranged between the crucible body (1) and the protective layer (4), wherein the protective layer (4) comprises a ceramic material (401) and a composite material (402).

2. The wafer-coated crucible protective layer according to claim 1, wherein: An adhesive layer (3) is arranged between the crucible body (1), the heat insulation layer (2) and the protective layer (4), and the adhesive layer (3) is a high-temperature-resistant inorganic adhesive.

3. The wafer-coated crucible protective layer according to claim 1, wherein: The heat insulation layer (2) is an aerogel material layer.

4. The chip-coated crucible protective layer of claim 2, wherein: The adhesive layer (3) and the protective layer (4) are arranged in a semi-enclosed structure.

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