Multi-layer wafer cooling device of rapid annealing furnace

Abstract

The utility model discloses a multilayer wafer cooling device for a rapid annealing furnace, which belongs to the technical field of wafer cooling devices and comprises a bottom plate, blowing plates are fixedly connected to two sides of the top of the bottom plate, and air inlet assemblies are arranged at the tops of the two groups of blowing plates; according to the utility model, through the arrangement of the sliding connection assembly, the plurality of groups of mounting plates can be mounted and fixed on the inner sides of the two groups of blowing plates so as to achieve the purpose of cooling the plurality of groups of wafer bodies at one time, through the arrangement of the supporting assembly, the wafer bodies can be stably supported above the mounting plates, and after the wafer bodies are fixed, the wafer bodies can be cooled. According to the wafer cooling device, cooling air can be introduced into the air blowing plate through the air inlet assembly and is blown to the surface of the wafer body through the air blowing holes so as to cool the wafer body, and through the arrangement of the wafer cooling device, multi-layer wafer cooling work can be carried out at a time; the device is used for solving the problems of low production efficiency, complex structure, high cost, unstable operation and the like in the prior art.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer cooling device technical field, concretely is a kind of multilayer wafer cooling device of rapid annealing furnace. BACKGROUND

[0002] Wafer refers to the silicon wafer used to make silicon semiconductor circuit, and its raw material is silicon. High-purity polysilicon is dissolved and incorporated into silicon crystal seed, then slowly pulled out to form cylindrical monocrystalline silicon. After grinding, polishing and slicing, silicon crystal rod forms silicon wafer, which is wafer. Domestic wafer production line mainly uses 8-inch and 12-inch. At present, cooling of wafer is an important process in wafer production and processing, and cooling device is used during wafer cooling.

[0003] Conventional wafer cooling device is mostly single-layer cooling, and the overall production efficiency is low. At the same time, the structure is relatively complex, and more pneumatic and electrical devices are used, so the cost and operation difficulty are high, and the stability is poor. Therefore, we need to propose a kind of multilayer wafer cooling device of rapid annealing furnace. UTILITY MODEL CONTENT

[0004] The utility model aims at providing a kind of multilayer wafer cooling device of rapid annealing furnace, with the advantages of low production efficiency, complex structure, high cost, unstable operation and other problems in prior art, to solve the problems raised in the above background technology.

[0005] To achieve the above-mentioned purpose, the utility model provides a kind of multilayer wafer cooling device of rapid annealing furnace, including bottom plate, the top of the bottom plate is fixedly connected with the both sides of blowing plate, the top of two groups of blowing plate is provided with air inlet assembly, two groups of air inlet assembly are fixed together by positioning assembly, the inner side of two groups of blowing plate is provided with several groups of mounting plate, the both sides of mounting plate are detachably mounted on the inner side of two groups of blowing plate by sliding connection assembly, the top of mounting plate is provided with wafer body to be cooled, the top of mounting plate and below wafer body are provided with support assembly for supporting wafer body, the top of mounting plate and below wafer body are provided with inductor.

[0006] Preferably, the air inlet assembly includes a connecting shell fixedly installed on the top of the blowing plate, the bottom of the connecting shell is communicated with the top of the blowing plate, and the top of the connecting shell is provided with an air inlet hole.

[0007] Preferably, the positioning assembly comprises connecting plates arranged on the top of the two groups of connecting shells, the bottom of the connecting plates is respectively attached to the top of the two groups of connecting shells, and a positioning rod is arranged at each corner of the top of the connecting plate, and the bottom end of the positioning rod penetrates through the connecting plate and extends below the connecting plate and is screwed to the top of the connecting shell.

[0008] Preferably, the supporting assembly comprises supporting pins fixedly installed on the two sides of the top of the mounting plate, the two groups of supporting pins are located below the wafer body, and the top end of the two groups of supporting pins is attached to the bottom of the wafer body, and a guide assembly for positioning the wafer body is further arranged on the top of the mounting plate and located at the edge of the wafer body.

[0009] Preferably, the guide assembly comprises a plurality of groups of guide pins fixedly installed on the top of the mounting plate, the plurality of groups of guide pins are arranged in an equidistant array with the wafer body as the center, and a tapered guide portion in sliding contact with the edge of the wafer body is arranged at the top end of the guide pin.

[0010] Preferably, the blowing plate is arranged in a cavity, and a blowing hole is formed in the inner side of the two groups of blowing plates, and the blowing hole is at the same horizontal height as the wafer body.

[0011] Preferably, the sliding connection assembly comprises a sliding groove formed in the inner side of the two groups of blowing plates, the two sides of the mounting plate are in sliding connection with the inner wall of the corresponding sliding groove, and a locking assembly for locking and fixing the mounting position of the mounting plate is arranged on the outer side of the two groups of blowing plates and at the corresponding position of the sliding groove.

[0012] Preferably, the locking assembly comprises a locking rod arranged on the outer side of the two groups of blowing plates, one end of the locking rod penetrates through the blowing plate and extends to the inner cavity of the sliding groove and is attached to the surface of the mounting plate, a countersunk hole is formed in the surface of the blowing plate and at the corresponding position of the locking rod, and one end of the locking rod is hidden in the inner cavity of the countersunk hole.

[0013] Compared with the prior art, the utility model has the advantages that:

[0014] Through the arrangement of the sliding connection assembly, a plurality of mounting plates can be mounted and fixed on the inner side of the two groups of blowing plates, so that the wafer body can be cooled at one time, through the arrangement of the supporting assembly, the wafer body can be stably supported above the mounting plate, after the wafer body is fixed, cooling gas can be introduced into the blowing plate through the air inlet assembly, and the wafer body can be cooled through the blowing hole, so that the wafer body can be cooled, through the arrangement of the device, a plurality of wafers can be cooled at one time, so as to solve the problems of low production efficiency, complex structure, high cost and unstable operation of the prior art. BRIEF DESCRIPTION OF DRAWINGS

[0015] Figure 1 It is a structure schematic view of the utility model;

[0016] Figure 2 It is a structure schematic view of the utility model locking assembly;

[0017] Figure 3 It is the utility model Figure 1 The enlarged view of A in the middle;

[0018] Figure 4 It is the utility model Figure 1 The enlarged view of B in the middle.

[0019] In the drawing: 1, bottom plate; 2, blow plate; 3, mounting plate; 4, wafer body; 5, inductor; 6, connecting shell; 7, air inlet hole; 8, connecting plate; 9, positioning rod; 10, support pin; 11, guide pin; 12, conical guide part; 13, blow hole; 14, sliding slot; 15, locking rod; 16, counterbore. DETAILED DESCRIPTION

[0020] The technical scheme in the embodiments of the utility model will be described clearly and completely in conjunction with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0021] Please refer to Figures 1-4 The utility model provides a kind of rapid annealing furnace multilayer wafer cooling device, including bottom plate 1, the top of bottom plate 1 Both sides are fixedly connected with blow plate 2, blow plate 2 is hollowly arranged, the inside of two groups of blow plate 2 is all provided with blow hole 13, and blow hole 13 is at the same horizontal height with wafer body 4, the top of two groups of blow plate 2 is provided with air inlet component, air inlet component includes the connecting shell 6 of fixed installation in the top of blow plate 2, the bottom of connecting shell 6 is communicated with the top of blow plate 2, the top of connecting shell 6 is provided with air inlet hole 7.

[0022] By the cooperation of air inlet component and blow plate 2, after positioning wafer body 4, the user can connect the air outlet pipe of external gas supply equipment with air inlet hole 7, then gas supply equipment is supplied to the inside of connecting shell 6 and blow plate 2, and is blown to outside by blow hole 13, and high-speed flow cooling airflow can be quickly cooled wafer body 4.

[0023] As preferred, the two groups of air inlet assemblies are connected and fixed together through a positioning assembly, the positioning assembly comprises a connecting plate 8 arranged at the top of the two groups of connecting shells 6, the bottom of the connecting plate 8 is attached to the top of the two groups of connecting shells 6 respectively, the four corners of the top of the connecting plate 8 are provided with positioning rods 9, the bottom end of the positioning rods 9 penetrates through the connecting plate 8 and extends below the connecting plate 8 and is screwed to the top of the connecting shell 6.

[0024] Through the arrangement of the positioning assembly, the two groups of connecting shells 6 can be connected and fixed together, so that the bottom plate 1, the two groups of air blowing plates 2, the two groups of connecting shells 6 and the connecting plate 8 jointly constitute the main part of the device. When installing the connecting plate 8, the user can place the connecting plate 8 on the top of the connecting shell 6, and then tighten the positioning rods 9 to fix the connecting plate 8 on the top of the connecting shell 6.

[0025] Among them, the inner side of the two groups of air blowing plates 2 is provided with a plurality of groups of mounting plates 3, the two sides of the mounting plate 3 are detachably mounted on the inner side of the two groups of air blowing plates 2 through a sliding connection assembly, the sliding connection assembly comprises a sliding groove 14 opened on the inner side of the two groups of air blowing plates 2, the two sides of the mounting plate 3 are slidingly connected with the inner wall of the corresponding sliding groove 14, the outer side of the two groups of air blowing plates 2 and located at the corresponding position of the sliding groove 14 is provided with a locking assembly for locking and fixing the mounting position of the mounting plate 3, the locking assembly comprises a locking rod 15 arranged on the outer side of the two groups of air blowing plates 2, one end of the locking rod 15 penetrates through the air blowing plate 2 and extends to the inner cavity of the sliding groove 14 and is attached to the surface of the mounting plate 3, the surface of the air blowing plate 2 and located at the corresponding position of the locking rod 15 is provided with a countersunk hole 16, one end of the locking rod 15 is hidden in the inner cavity of the countersunk hole 16.

[0026] Through the arrangement of the sliding connection assembly, the mounting plate 3 can be detachably mounted on the inner side of the two groups of air blowing plates 2. When assembling the mounting plate 3, the user can align the two sides of the mounting plate 3 with the sliding groove 14 and push the mounting plate 3 backward along the sliding groove 14. After the mounting plate 3 is completely mounted on the inner side of the two groups of air blowing plates 2, the user can tighten the locking rod 15 to lock and fix the mounting position of the mounting plate 3. Through the arrangement of the countersunk hole 16, one end of the locking rod 15 will be hidden in the inner cavity of the countersunk hole 16 when tightened, thereby improving the flatness of the surface of the air blowing plate 2.

[0027] It is worth mentioning that the top of the mounting plate 3 is provided with a wafer body 4 to be cooled, the top of the mounting plate 3 and below the wafer body 4 is provided with a supporting assembly for supporting the wafer body 4, the supporting assembly comprises supporting pins 10 fixedly installed on both sides of the top of the mounting plate 3, both groups of supporting pins 10 are below the wafer body 4, and the top ends of both groups of supporting pins 10 are in contact with the bottom of the wafer body 4, and the top of the mounting plate 3 and at the edge of the wafer body 4 is further provided with a guide assembly cooperating with the supporting pins 10 for positioning the wafer body 4, the guide assembly comprises a plurality of groups of guide pins 11 fixedly installed on the top of the mounting plate 3, the plurality of groups of guide pins 11 are arranged in an equidistant array with the wafer body 4 as the center, and the top end of the guide pin 11 is provided with a tapered guide portion 12 in sliding contact with the edge of the wafer body 4.

[0028] Through the arrangement of the supporting assembly, the wafer body 4 can be stably supported on the top of the mounting plate 3, so that the bottom of the wafer body 4 is not in contact with the top of the mounting plate 3, thereby realizing the purpose of simultaneously blowing and cooling the upper and lower surfaces of the wafer body 4 at one time. When the wafer body 4 is placed on the top of the supporting pin 10, it will first contact the tapered guide portion 12 during the downward movement, and under the guidance of the tapered guide portion 12, the wafer body 4 can accurately and stably fall downward, and when the bottom of the wafer body 4 contacts the top of the supporting pin 10, the inner sides of the plurality of groups of guide pins 11 are in contact with the edges of the wafer body 4 to limit the wafer body 4, preventing the wafer body 4 from moving during the blowing and cooling.

[0029] Further, the top of the mounting plate 3 and below the wafer body 4 is provided with an inductor 5, which in the embodiment can be specifically provided as a proximity sensor, which has two functions, one is to determine whether the wafer body 4 is placed on the supporting assembly, and the other is to determine whether the wafer body 4 is taken out when the wafer body 4 is taken out after cooling, the inductor 5 detects that the wafer body 4 is taken away, sends a no-material signal, and waits for the next wafer body 4 cooling process.

[0030] Although the embodiments of the present application have been shown and described, it can be understood by those skilled in the art that various changes, modifications, replacements and modifications can be made to these embodiments without departing from the principles and spirits of the present application, and the scope of the present application is defined by the appended claims and their equivalents.

Claims

1. A multi-tier wafer cooling apparatus for a rapid thermal annealing furnace comprising a base plate (1), characterized in that: Both sides of the top of the bottom plate (1) are fixedly connected with the air blowing plate (2), the top of the two groups of air blowing plates (2) is provided with the air inlet assembly, the two groups of air inlet assemblies are connected and fixed together through the positioning assembly, the inner side of the two groups of air blowing plates (2) is provided with a plurality of groups of mounting plates (3), both sides of the mounting plate (3) are detachably mounted on the inner side of the two groups of air blowing plates (2) through the sliding connection assembly, the top of the mounting plate (3) is provided with the wafer body (4) to be cooled, the top of the mounting plate (3) and below the wafer body (4) are provided with the supporting assembly for supporting the wafer body (4), and the top of the mounting plate (3) and below the wafer body (4) are provided with the inductor (5).

2. The multi-tier wafer cooling apparatus of a rapid thermal anneal furnace of claim 1, wherein: The air inlet assembly comprises a connecting shell (6) fixedly installed on the top of the air blowing plate (2), the bottom of the connecting shell (6) is communicated with the top of the air blowing plate (2), and the top of the connecting shell (6) is provided with an air inlet hole (7).

3. The multi-tier wafer cooling apparatus of claim 2, wherein: The positioning assembly comprises a connecting plate (8) arranged on the top of the two groups of connecting shells (6), the bottom of the connecting plate (8) is respectively attached to the top of the two groups of connecting shells (6), the top of the connecting plate (8) is provided with a positioning rod (9) at each corner, and the bottom end of the positioning rod (9) penetrates through the connecting plate (8) and extends below the connecting plate (8) and is screwed to the top of the connecting shell (6).

4. The multi-tier wafer cooling apparatus of claim 1, wherein: The supporting assembly comprises supporting pins (10) fixedly installed on both sides of the top of the mounting plate (3), the two groups of supporting pins (10) are located below the wafer body (4), and the top ends of the two groups of supporting pins (10) are attached to the bottom of the wafer body (4), the top of the mounting plate (3) and at the edge of the wafer body (4) is further provided with a guide assembly cooperating with the supporting pin (10) for positioning the wafer body (4).

5. A multi-tier wafer cooling apparatus for a rapid thermal anneal furnace as defined in claim 4, wherein: The guide assembly comprises a plurality of groups of guide pins (11) fixedly installed on the top of the mounting plate (3), and the plurality of groups of guide pins (11) are arranged in an equidistant array with the wafer body (4) as the center, and the top end of the guide pin (11) is provided with a conical guide portion (12) in sliding contact with the edge of the wafer body (4).

6. The multi-tier wafer cooling apparatus of a rapid thermal anneal furnace of claim 1, wherein: The air blowing plate (2) is provided in a cavity, air blowing holes (13) are formed in the inner sides of the two groups of air blowing plates (2), and the air blowing holes (13) are at the same horizontal height as the wafer body (4).

7. The multi-tier wafer cooling apparatus of claim 1, wherein: The sliding connection assembly comprises a sliding groove (14) formed in the inner side of the two groups of air blowing plates (2), and the two sides of the mounting plate (3) are slidably connected with the inner walls of the corresponding sliding grooves (14), and the outer sides of the two groups of air blowing plates (2) and at the corresponding positions of the sliding grooves (14) are provided with a locking assembly for locking and fixing the mounting position of the mounting plate (3).

8. The multi-tier wafer cooling apparatus of claim 7, wherein: The locking assembly comprises locking rods (15) arranged outside the two groups of air blowing plates (2). One end of each locking rod (15) penetrates the air blowing plate (2) and extends to the inner cavity of the sliding groove (14) and is attached to the surface of the mounting plate (3). A counterbore (16) is arranged on the surface of the air blowing plate (2) and corresponds to the position of the locking rod (15). One end of the locking rod (15) is hidden in the inner cavity of the counterbore (16).

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