Metal film non-inductive resistor

Abstract

The utility model discloses a metal film non-inductive resistor which comprises a metal heat dissipation plate and a rectangular substrate arranged on the metal heat dissipation plate, the heat dissipation effect is improved, stress concentration is reduced, resistive films are deposited on the front face and the back face of the rectangular substrate, each resistive film is of a snakelike winding structure, and the inductance of the resistor is reduced. In addition, the rectangular substrate and the metal heat dissipation plate are rectangular and are stacked in the height direction. According to the metal film non-inductive resistor provided by the utility model, a small size is kept while an enough heat dissipation area is provided, and flexibility and space efficiency are favorably provided in circuit design.

Description

TECHNICAL FIELD

[0001] The utility model relates to circuit breaker technical field especially is related to a metal film non -inductive resistance. BACKGROUND

[0002] In today's electronic technology continues to develop, current coil has been widely used in many fields, such as power measurement, industrial control, electronic equipment etc. However, with the increasing demand for device performance, power consumption and precision, the traditional resistance in current coil gradually exposed some problems in the application.

[0003] In the past, the commonly used resistance type often exists high power consumption, which not only increases the overall energy consumption of the system, but also cannot meet the demand in some power consumption strictly limited application scenarios. For example, in portable electronic devices and some systems relying on battery power, high power consumption resistance will significantly shorten the use time of the device.

[0004] At the same time, the inductive characteristic of traditional resistance also brings adverse effects on the performance of current coil. The existence of inductance will cause induced electromotive force when the current changes, thereby affecting the accuracy of measurement and the stability of circuit.

[0005] In addition, in some high-precision current measurement and control applications, the precision and temperature stability of resistance have become a constraint factor. The change of resistance value with temperature and the lack of its own precision may lead to increased error in current measurement and control, which cannot meet the increasingly stringent technical requirements.

[0006] The traditional resistance may have the following problems and shortcomings:

[0007] High power consumption: increases the overall energy consumption of the system, which cannot meet the requirement of long time use in portable electronic devices or battery powered systems with strict power consumption limit.

[0008] Large inductance: in high frequency circuit, inductance will cause signal distortion, poor frequency response and energy loss, etc., affecting the accuracy of measurement and the stability of circuit.

[0009] Insufficient precision and temperature stability: the change of resistance value with temperature and the limitation of its own precision may lead to increased error in current measurement and control, which cannot meet the technical requirements of high-precision current measurement and control.

[0010] Large size: some types of resistance such as wire wound resistance, due to its structural characteristics, the size is large, occupies more space, limits its application in miniaturized electronic products.

[0011] Heavy weight: for example, wire wound resistance is made of metal wire, the weight is relatively large, which is not suitable for some portable devices with light weight requirements.

[0012] Heat dissipation problem: part of the resistance will produce more heat during operation, the need to consider effective heat dissipation measures, otherwise may affect the resistance performance and stability of the circuit.

[0013] High cost: some manufacturing process is complex, the use of special material resistance, its cost is relatively high.

[0014] Frequency response instability: ordinary resistance due to the existence of inductance and capacitance, in high frequency circuit frequency response may be unstable, and then lead to signal distortion and frequency response deterioration.

[0015] Therefore, there is an urgent need for a metal film inductance-free resistance to meet the needs of modern electronic systems for low power consumption, high precision and high stability. The utility model discloses a metal film inductance-free resistance, which solves the problems of large size and poor heat dissipation of traditional resistors.

[0016] The utility model discloses a metal film inductance-free resistance, which solves the problems of large size and poor heat dissipation of traditional resistors.

[0017] In order to solve the above-mentioned utility model purposes, the utility model provides a metal film inductance-free resistance, including metal heat dissipation board and the rectangular substrate of setting on metal heat dissipation board, four corners of metal heat dissipation board are the round angle of 5 ~ 10mm radius, the rectangular substrate front and back face deposit resistance film, the resistance film is the serpentine winding structure, and the resistance film both ends are connected respectively lead-out wire, and the lead-out wire near the end of resistance film is coated with insulating material.

[0018] Optionally, the rectangular substrate is disposed on the metal heat dissipation board by an adhesive.

[0019] Optionally, the material of the metal heat dissipation board includes red copper and aluminum, the length of the metal heat dissipation board is 40-50mm, the width is 15-25mm, and the thickness is 1-3mm.

[0020] Optionally, the material of the lead-out wire includes red copper, tin-plated red copper or aluminum.

[0021] Optionally, the diameter of the lead-out wire is 0.7-0.9mm, and the length is 70-100mm.

[0022] Optionally, the thickness of the resistance film is 0.1-0.3mm, and the width of the resistance film is 0.7-0.9mm.

[0023] Optionally, the material of the resistance film includes one of manganese copper alloy, nickel-chromium alloy, constantan alloy, iron-chromium-aluminum alloy, nickel-copper alloy, titanium alloy or metal glaze.

[0024] Optionally, the resistance film surface is provided with an insulating layer.

[0025] Optionally, the metal heat dissipation plate exceeds the rectangular substrate in length direction.

[0026] Optionally, the metal film non-inductive resistor has a resistance range of 0.5-30 ohms, a resistance precision of ±0.1%, and a temperature coefficient of ±5PPM / ℃.

[0027] Compared with the prior art, the metal film non-inductive resistor provided by the utility model has the advantages that the heat dissipation effect is improved and stress concentration is reduced, the resistance film is deposited on the front and back surfaces of the rectangular substrate, the resistance film has a serpentine winding structure to reduce the inductance of the resistor, in addition, the rectangular substrate and the metal heat dissipation plate are both rectangular and are stacked along the height direction, sufficient heat dissipation area is provided while the volume is kept small, and flexibility and space efficiency are provided in circuit design. BRIEF DESCRIPTION OF DRAWINGS

[0028] Figure 1 is a top view of the metal film non-inductive resistor in the embodiment of the utility model;

[0029] Figure 2 is a front view of the metal film non-inductive resistor in the embodiment of the utility model;

[0030] Figure 3 is a front view of the metal heat dissipation plate in the embodiment of the utility model;

[0031] Figure 4 is a rear view of the metal heat dissipation plate in the embodiment of the utility model;

[0032] Figure 5 is a side view of the metal heat dissipation plate in the embodiment of the utility model.

[0033] In the drawings, 1 is a metal heat dissipation plate; 2 is a rectangular substrate; 21 is a wire slot; and 3 is a lead wire. DETAILED DESCRIPTION

[0034] The utility model scheme will be described below in combination with the schematic diagram, wherein the preferred embodiment of the utility model is represented, and it should be understood that the utility model described herein can be modified by the person skilled in the art, and the advantageous effects of the utility model are still achieved. Therefore, the following description should be understood as extensive knowledge for the person skilled in the art, and not as a limitation on the utility model.

[0035] The serial numbers of components used herein, such as "first", "second", etc., are only used to distinguish the described objects, and have no technical meaning. Unless otherwise specified, the "connection" and "coupling" in the present application include direct and indirect connections (couplings). In the description of the present application, it should be understood that the orientations or positional relationships indicated by the terms "upper", "lower", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. are based on the orientations or positional relationships shown in the drawings, and are only for the convenience of describing the present application and simplifying the description, and therefore cannot be understood as indicating or implying that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as limiting the present application.

[0036] In the present application, unless otherwise specified and limited, the first feature is "on" or "under" the second feature, which can be direct contact between the first and second features, or indirect contact between the first and second features through an intermediate medium. Moreover, the first feature "above", "above" and "above" the second feature can be directly above or obliquely above the first feature, or only indicate that the horizontal height of the first feature is higher than that of the second feature. The first feature "below", "below" and "below" the second feature can be directly below or obliquely below the first feature, or only indicate that the horizontal height of the first feature is less than that of the second feature.

[0037] The present application will be described in more detail in the following paragraphs with reference to the accompanying drawings. The advantages and features of the present application will be more apparent according to the following description. It should be noted that the drawings are very simplified and use non-precise proportions, only for the purpose of facilitating and clarifying the description of the embodiments of the present application.

[0038] The present application provides a metal film non-inductive resistor, please refer to Figure 1 Figure 2 , comprising a metal heat sink 1 and a rectangular substrate 2 arranged on the metal heat sink 1, the four corners of the metal heat sink 1 are round corners with a radius of 5-10mm, the front and back surfaces of the rectangular substrate 2 are deposited with resistance film, the resistance film is a serpentine winding structure, the two ends of the resistance film are respectively connected with lead-out wires 3, and the end of the lead-out wire 3 close to the resistance film is coated with insulating material.

[0039] ​In this embodiment, the metal heat sink 1 helps to improve the thermal management efficiency of the resistor. The rounded corners can reduce mechanical stress, while the metal material provides good thermal conductivity, helping to dissipate heat during resistor operation and maintain stability and reliability of the resistor. The resistor film is deposited on both the front and back surfaces of the resistor film, which is a serpentine winding structure, improving the accuracy and stability of the resistance value. The serpentine winding resistor film provides uniform resistance distribution, reducing the impact of temperature changes and current fluctuations on the resistance value. The rectangular substrate 2 provides good mechanical strength and durability, capable of withstanding mechanical stress during use and reducing the risk of damage.

[0040] The lead wire 3 is coated with insulating material near one end of the resistor film, which helps to prevent short circuits and improve the safety of the resistor. The design of this metal film non-inductive resistor provided in this embodiment has significant advantages in improving thermal management efficiency, resistance stability and accuracy, mechanical strength and durability, safety, wide range of applications, and process controllability.

[0041] In this embodiment, the metal heat sink 1 and the rectangular substrate 2 are bonded by high-temperature adhesive. Please refer to Figure 3 - Figure 5 , Figure 3 - Figure 5 The shape and path of the wire slot 21 on the rectangular substrate 2 are shown schematically in

[0042] Further, the material of the rectangular substrate 2 includes ceramic.

[0043] In this embodiment, the ceramic substrate can provide excellent electrical insulation, high thermal conductivity, and good mechanical strength, which is crucial for ensuring the stability and reliability of the resistor in high-voltage and high-temperature environments. The types of ceramic substrates include but are not limited to alumina, aluminum nitride, silicon nitride, etc. The manufacturing processes of ceramic substrates include high-temperature co-fired ceramic (HTCC), low-temperature co-fired ceramic (LTCC), direct bonded copper (DBC), active metal brazing (AMB), and direct plating copper (DPC), etc.

[0044] The four corners of the metal heat sink 1 are rounded corners with a radius of 5-10 mm, for example, they can be 5 mm, 6 mm, 7 mm, 8 mm, 9 mm or 10 mm.

[0045] The four edges of the metal heat sink 1 are chamfered, so that each corner becomes a rounded corner with a radius of 5-10 mm. Preferably, the four corners are chamfered R6-R8. By implementing the rounding and chamfering process on the metal heat sink 1, the aim is to improve the durability, safety and aesthetics of the product, while maintaining high-efficiency heat dissipation performance.

[0046] Further, the thickness of the resistive film is 0.1-0.3mm, for example, it can be 0.11mm, 0.13mm, 0.14mm, 0.15mm, 0.17mm, 0.18mm, 0.19mm, 0.21mm, 0.23mm, 0.24mm, 0.25mm, 0.27mm, 0.28mm or 0.29mm.

[0047] The width of the resistive film is 0.7-0.9mm, for example, it can be 0.71mm, 0.73mm, 0.74mm, 0.75mm, 0.77mm, 0.78mm, 0.79mm, 0.81mm, 0.83mm, 0.84mm, 0.85mm, 0.87mm, 0.88mm or 0.89mm.

[0048] In this embodiment, preferably, the thickness of the resistive film is in the range of 0.2mm and the width is 0.8mm. Fine size control helps to achieve precise resistance adjustment during the manufacturing process.

[0049] A higher resistance accuracy is provided, and a narrower width helps to reduce parasitic inductance and resistance variation. In addition, a thinner resistive film and a narrower width help to reduce the volume of the resistor, which is an important advantage for space-limited application scenarios. This not only makes the resistor more flexible in circuit design, but also reduces its occupied space. Fine size control helps to improve the performance stability of the resistor, especially in the case of temperature changes and current fluctuations. Thinner resistive film and narrower width can reduce the influence of these factors on resistance, thereby ensuring more stable performance of the resistor.

[0050] Further, the material of the metal heat sink 1 includes red copper and aluminum.

[0051] In this embodiment, both red copper and aluminum are excellent heat conductors, which can quickly conduct heat from the resistive film to the heat sink and then dissipate it to the surrounding environment. Red copper has particularly excellent heat conduction performance, and the material of the metal heat sink 1 is preferably red copper.

[0052] Further, the material of the lead wire 3 includes red copper, tin-plated red copper or aluminum. Preferably, tin-plated red copper is used as the material of the lead wire 3.

[0053] In this embodiment, the tin layer can protect the red copper from oxidation and corrosion, especially in humid or corrosive gas-containing environments. The tin plating layer can provide a good soldering surface, making it easier for the lead wire 3 to form a stable solder connection with the pads on the circuit board or other components during the soldering process. In addition, the tin layer can prevent copper from oxidizing at high temperatures or during long-term use, maintaining the electrical conductivity of the lead wire 3. The tin layer reduces the contact resistance between the lead wire 3 and the connection point, improving the efficiency of the electrical connection.

[0054] Further, due to the low contact resistance and good electrical conductivity of the tin-plated red copper, it can improve the quality of signal transmission and reduce signal loss.

[0055] Further, the diameter of the lead wire 3 is 0.7-0.9mm, for example, it can be 0.71mm, 0.73mm, 0.74mm, 0.75mm, 0.77mm, 0.78mm, 0.79mm, 0.81mm, 0.83mm, 0.84mm, 0.85mm, 0.87mm, 0.88mm or 0.89mm.

[0056] The length of the lead wire 3 is 70-100mm. For example, it can be 71mm, 0.75mm, 78mm, 79mm, 81mm, 83mm, 84mm, 95mm, 97mm, 98mm or 99mm.

[0057] In this embodiment, preferably, the diameter of the lead wire 3 is 0.8mm, and the length of the lead wire 3 is 80mm. The lead wire 3 provides sufficient mechanical strength while maintaining a small volume, which helps to provide flexibility and space efficiency in circuit design.

[0058] Further, insulating glue is applied at a distance of about 15mm from the end of the resistance film of the lead wire 3 to prevent electrical short circuit and leakage, and to improve the safety of the resistor. The application of insulating material at the connection between the lead wire 3 and the resistance film can reduce the possibility of arc generation.

[0059] Further, the material of the resistance film includes one of manganese copper alloy, nickel chromium alloy, constantan alloy, iron chromium aluminum alloy, nickel copper alloy, titanium alloy or metal glaze.

[0060] Preferably, the material of the resistance film includes a combination of manganese copper alloy and nickel copper alloy, a combination of constantan alloy and titanium alloy, and a combination of nickel chromium alloy and iron chromium aluminum alloy to meet specific electrical performance requirements such as resistivity, temperature coefficient, corrosion resistance, etc.

[0061] In this embodiment, a specific combination of alloy materials is selected to prepare the resistance film to optimize the electrical performance and mechanical properties of the resistor. Each alloy has its unique attributes, and when they are used in combination, they can complement each other to meet specific application requirements.

[0062] Further, the metal heat sink 1 has a length of 40-50mm, a width of 15-25mm, and a thickness of 1-3mm.

[0063] In the present embodiment, the metal heat sink 1 preferably has a size of 45mm in length, 20mm in width and 2mm in thickness, which provides sufficient heat dissipation area while keeping a small volume, thus contributing to flexibility and space efficiency in circuit design.

[0064] Further, the surface of the resistance film is provided with an insulating layer, and the material of the insulating layer is insulating solidified powder.

[0065] Further, the metal heat sink 1 extends beyond the rectangular substrate 2 in the length direction.

[0066] In the present embodiment, the part of the metal heat sink 1 extending beyond the substrate can provide additional heat dissipation area, thus dissipating the heat generated by the resistor more effectively.

[0067] Further, the resistance value of the metal film non-inductive resistor ranges from 0.5 to 30 ohms, the resistance value accuracy is ±0.1%, and the temperature coefficient is ±5PPM / ℃.

[0068] Further, the material of the rectangular substrate 2 includes ceramic.

[0069] In the present embodiment, the ceramic substrate can provide excellent electrical insulation performance, high thermal conductivity and good mechanical strength, which are crucial for ensuring the stability and reliability of the resistor in high-voltage and high-temperature environments. The types of ceramic substrates include, but are not limited to, alumina, aluminum nitride, silicon nitride, etc. The manufacturing processes of ceramic substrates include high-temperature co-fired ceramic (HTCC), low-temperature co-fired ceramic (LTCC), direct bonded copper (DBC), active metal brazing (AMB) and direct plating copper (DPC), etc.

[0070] In summary, the utility model provides a kind of metal film non-inductive resistance, including one metal heat sink 1, rectangular substrate 2 is equipped on it, the four corners of metal heat sink 1 are fillet with radius 5~10mm, help to improve the heat dissipation effect and reduce stress concentration;The front and back of rectangular substrate 2 are deposited resistance film, the resistance film is serpentine winding structure, reduces the inductance of resistor. Resistance film two ends are connected lead-out wire 3 respectively, the end of lead-out wire 3 close to resistance film is coated with 15mm long insulating material, to ensure electrical safety. The thickness of resistance film is 0.1~0.3mm, the width of wire slot is 0.7~0.9mm, selects red copper and aluminum as the material of metal heat sink 1, with good heat conductivity. Lead-out wire 3 can be made of red copper, tinned red copper or aluminum, with good conductivity. Metal heat sink 1 provides sufficient heat dissipation area for resistor. Resistance film surface is provided with a layer of insulating layer, to improve the insulation performance of resistor. Metal heat sink 1 exceeds rectangular substrate 2 in length direction, help to provide better mechanical support and heat dissipation. The resistance of metal film non-inductive resistor is 0.5~30 ohms, resistance precision is ±0.1%, temperature coefficient is ±5PPM / ℃, ensure the stability and accuracy of resistor at different temperatures.

[0071] Obviously, those skilled in the art can make various modifications and variations to the utility model without departing from the spirit and scope of the utility model. Thus, if these modifications and variations of the utility model fall within the scope of the utility model claims and their equivalents, the utility model also intends to include these modifications and variations.

Claims

1. A metal film non-inductive resistor, characterized by comprising: The metal heat dissipation plate has four corners with a radius of 5-10 mm, and a rectangular substrate is arranged on the metal heat dissipation plate, the front and back surfaces of the rectangular substrate are provided with resistance films in a serpentine winding structure, the resistance films are connected with lead-out wires at two ends respectively, and the end of the lead-out wires close to the resistance films is coated with insulating material.

2. The metal film non-inductive resistor as claimed in claim 1, wherein The rectangular substrate is arranged on the metal heat dissipation plate by means of an adhesive.

3. The metal film non-inductive resistor of claim 1, wherein The diameter of the lead-out wire is 0.7-0.9 mm, and the length is 70-100 mm.

4. The metal film non-inductive resistor of claim 1, wherein The thickness of the resistance film is 0.1-0.3 mm, and the width of the resistance film is 0.7-0.9 mm.

5. The metal film non-inductive resistor of claim 1, wherein The material of the resistance film comprises one of manganese-copper alloy, nickel-chromium alloy, constantan alloy, iron-chromium-aluminum alloy, nickel-copper alloy, titanium alloy or metal glaze.

6. The metal film non-inductive resistor of claim 1, wherein An insulating layer is arranged on the surface of the resistance film.

7. The metal film non-inductive resistor of claim 1, wherein The metal heat dissipation plate exceeds the rectangular substrate in the length direction.

8. The metal film non-inductive resistor of claim 1, wherein The resistance value of the non-inductive resistance film ranges from 0.5 to 30 ohms, the resistance value accuracy is ±0.1%, and the temperature coefficient is ±5 PPM / ℃.

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