Wafer carrying mechanism

Abstract

The utility model relates to the technical field of wafer detection, and discloses a wafer carrying mechanism, which comprises a loading device and a carrying device used for driving the loading device to move, the loading device comprises a tray, the top surface of the tray is sequentially provided with a plurality of accommodating grooves with gradually reduced diameters along the vertical direction, the centers of circles of the accommodating grooves are the same, and the accommodating grooves are communicated with the tray. The plurality of accommodating grooves are respectively used for accommodating wafers with different sizes; the carrying device comprises a sliding rail, a sliding block and a driving device, the sliding rail is slidably connected with the sliding block, the sliding block is fixedly connected with the tray, and the driving device is connected with the tray to drive the tray to move along the sliding rail; according to the utility model, the plurality of accommodating grooves are arranged on the tray, so that the tray can play a good role in limiting when facing wafers with different sizes, the position deviation and the like caused by shaking of the wafers in the moving process are avoided, the accuracy of the positions of the wafers is ensured, and the working efficiency is improved. And the transfer efficiency of the wafers with different sizes is also improved through the arrangement of the carrying device and the plurality of accommodating grooves.

Description

TECHNICAL FIELD

[0001] The utility model relates to wafer detection technical field, in particular to a wafer carrying mechanism. BACKGROUND

[0002] Wafer profile detection is an important process in semiconductor production process, it can help enterprises to guarantee the quality and production efficiency of product, reduce cost and risk. Wafer profile measurement includes measuring edge, V-notch, diameter, chamfer, V-port and thickness of wafer.

[0003] The existing wafer profile measurement equipment is mostly manual wafer placement in measurement position, the process is difficult to ensure the stability and accuracy of wafer placement orientation and position, also difficult to ensure the accuracy, consistency and efficiency of detection result. SUMMARY

[0004] The utility model solves the technical problem of how to improve the efficiency and accuracy in wafer transfer process, in order to solve the above technical problem, the utility model provides a wafer carrying mechanism, including loading device and the carrying device for driving the movement of loading device:

[0005] The loading device includes a tray, the top surface of the tray is sequentially provided with a plurality of accommodation grooves with gradually decreasing diameters along the vertical direction, the centers of the plurality of accommodation grooves are the same, and the plurality of accommodation grooves are used for accommodating wafers of different sizes respectively.

[0006] The carrying device includes a sliding rail, a sliding block and a driving device, the sliding rail is connected with the sliding block, the sliding block is fixedly connected with the tray, and the driving device is connected with the tray to drive the tray to move along the sliding rail.

[0007] Preferably, the depths of the plurality of accommodation grooves along the vertical direction are the same.

[0008] Preferably, the tray is provided with a plurality of arc-shaped bosses at the side wall of the accommodation groove, and the arc surface of the boss is used for abutting and limiting the wafer.

[0009] Preferably, the tray is provided with a positioning hole at the bottom surface of the accommodation groove, the positioning hole penetrates the tray along the vertical direction, and the positioning hole corresponds to the notch on the wafer.

[0010] Preferably, the top surface of the tray is provided with a center cavity penetrating the tray along the vertical direction, the center cavity is a half-waist hole structure, one end of the center cavity away from the accommodation groove penetrates the side wall of the tray, the center of the other end of the center cavity coincides with the projection of the center of the accommodation groove along the vertical direction, and the diameter of the end of the center cavity is smaller than the diameter of the smallest accommodation groove.

[0011] Preferably, the top surface of the tray is provided with a baffle plate on the side away from the central cavity, and the baffle plate is provided with a groove on the side facing the accommodation groove.

[0012] Preferably, the top surface of the tray is provided with a weight-reducing hole penetrating the tray in the vertical direction, and the weight-reducing hole is arranged on the side of the accommodation groove away from the central cavity.

[0013] Preferably, the tray is symmetrically provided with a plurality of first connecting holes and a plurality of second connecting holes along the central cavity axis, and the tray is fixedly connected with the sliding block through the first connecting holes and the second connecting holes.

[0014] Preferably, the driving device comprises a driving motor, a gear and a rack, the driving motor is fixedly connected with the sliding rail, the gear is fixedly connected with the output end of the driving motor, the rack is fixedly connected with the bottom surface of the tray, the extension direction of the rack is the same as the extension direction of the sliding rail, and the gear is engaged with the rack.

[0015] Preferably, the bottom of the carrying device is provided with a support structure, the support structure comprises a support plate and a support column, the top surface of the support plate is fixedly provided with the sliding rail and the driving motor, and the support column is arranged on the bottom surface of the support plate and is symmetrically arranged.

[0016] The wafer carrying mechanism provided in the embodiment of the utility model has the following beneficial effects compared with the prior art:

[0017] In the utility model, a plurality of accommodation grooves are arranged on the tray, so that the tray can play a good limiting role when facing wafers of different sizes, the problem of position deviation caused by shaking of the wafer during movement is avoided, the accuracy of the position during wafer transfer is ensured, and the wafer transfer efficiency is improved by the combination of the tray and the carrying device. In addition, the plurality of accommodation grooves also improve the wafer transfer efficiency of wafers of different sizes. BRIEF DESCRIPTION OF DRAWINGS

[0018] Figure 1 is the perspective view of the utility model;

[0019] Figure 2 is another perspective view of the utility model from another angle;

[0020] Figure 3 is the top view of the utility model;

[0021] Figure 4 is the perspective view of the utility model Figure 3 is the local enlarged view of A in the utility model;

[0022] Figure 5It is the structure schematic view of the tray of the utility model;

[0023] Figure 6 It is the structure schematic view of the tray of the utility model Figure 5 The partial close-up view of B in the middle.

[0024] In the figure: 1, tray;11, accommodating groove;111, boss;112, positioning hole;12, center cavity;13, baffle;14, weight-reducing hole;15, first connecting hole;16, second connecting hole

[0025] 2, slide rail;21, stop block;3, sliding block;4, driving device;41, driving motor;42, gear;

[0026] 5, support plate;6, support column;7, wafer. Specific embodiments

[0027] The specific embodiments of the utility model are described in further detail below in combination with the drawings and examples. The following examples are used to illustrate the utility model, but are not used to limit the scope of the utility model.

[0028] As Figures 1 to 3 Indicated, the utility model preferred embodiments provide a kind of wafer carrying mechanism, it includes loading device and for driving loading device to move carrying device:

[0029] Loading device includes tray 1, the top surface of tray 1 is sequentially provided with multiple accommodating grooves 11 of gradually smaller diameter along vertical direction, the center of multiple accommodating grooves 11 is same, multiple accommodating grooves 11 are used to accommodate different size wafer 7 respectively;

[0030] Carrying device includes slide rail 2, sliding block 3 and driving device 4, slide rail 2 is slidably connected with sliding block 3, sliding block 3 is fixedly connected with tray 1, driving device 4 is connected with tray 1 to drive tray 1 moves along slide rail 2.

[0031] Specifically, compared with the prior art that the worker manually transfers the wafer 7 to the wafer detection device, the tray 1 and the carrying device are arranged in the present application, the driving device 4 in the carrying device can drive the tray 1 to move along the slide rail 2 by placing the wafer 7 to be detected on the tray 1, thereby realizing the rapid transfer of the wafer 7, improving the transfer efficiency of the wafer 7 in the wafer 7 detection process, and making the wafer 7 flow more efficiently in the detection process. In addition, in the present embodiment, a plurality of concentric accommodation grooves 11 are further arranged on the tray 1, so that the tray 1 can better adapt to the transfer work of wafers 7 of different sizes, further improving the efficiency of wafer 7 detection and transfer, and each accommodation groove 11 can better adapt to the wafer 7 of the corresponding size, better limiting the wafer 7, avoiding the position and orientation of the wafer 7 from deviating in the transfer process, thereby ensuring the accuracy of the wafer 7 in the detection and transfer process. In a specific embodiment, the accommodation grooves 11 are arranged in a total of four according to different diameters, which meets the detection requirements of wafers 7 of different sizes under general conditions.

[0032] In some embodiments, the plurality of accommodation grooves 11 have the same depth in the vertical direction. Specifically, the depths of the accommodation grooves 11 are the same, which is convenient for the processing and production of the tray 1 on the one hand, and can better adapt to the size of the wafer 7 on the other hand, avoiding the problem that the wafer 7 is difficult to take out due to the excessive depth of some accommodation grooves 11.

[0033] As shown in Figures 4 to 6 In some embodiments, the tray 1 is provided with a plurality of circular-arc-shaped bosses 111 at the side wall of the accommodation groove 11, and the arc surface of the boss 111 is used for abutting and limiting the wafer 7. The boss 111 not only achieves the limiting effect on the wafer 7, but also makes a gap exist between the wafer 7 and the side wall of the accommodation groove 11, so that the wafer 7 is more convenient and fast in the process of being placed into the accommodation groove 11 and taken out from the accommodation groove 11, and the transfer process of the wafer 7 is more efficient and accurate. In addition, the boss 111 is symmetrically arranged with two in the accommodation groove 11 along the axis of the central cavity 12, and is arranged on the side of the accommodation groove 11 away from the central cavity 12. At the same time, in some specific embodiments, the diameter of the outer circle of the accommodation groove 11 tangent to the plurality of bosses 111 is greater than the diameter of the wafer 7 corresponding to the accommodation groove 11, which makes the wafer 7 more flexible and convenient when taking and placing.

[0034] In some embodiments, the tray 1 is provided with a positioning hole 112 at the bottom surface of the accommodation groove 11, the positioning hole 112 penetrates the tray 1 in the vertical direction, and the positioning hole 112 corresponds to the notch on the wafer 7. Specifically, in the production process of the wafer 7, a notch, i.e., a notch, is arranged on the wafer 7. The notch generally includes a U-shaped notch and a V-shaped notch. The notch on the wafer 7 also serves to position the orientation of the wafer 7. In this embodiment, the positioning hole 112 on the tray 1 corresponds to the notch on the wafer 7. When the wafer 7 is placed into the tray 1 by the mechanical arm, the orientation of the wafer 7 can be easily confirmed and adjusted, thereby avoiding the problem of wafer 7 detection error caused by the orientation error of the wafer 7 in the subsequent wafer 7 detection process, and ensuring the accuracy of the orientation of the wafer 7 in the wafer 7 detection and transportation process.

[0035] In some embodiments, the top surface of the tray 1 is provided with a center cavity 12 penetrating the tray 1 in the vertical direction, the center cavity 12 is in a half waist hole structure, and the center cavity 12 penetrates the side wall of the tray 1 away from the accommodation groove 11; the center of the other end of the center cavity 12 coincides with the vertical projection of the center of the accommodation groove 11, and the diameter of the end of the center cavity 12 is smaller than the smallest diameter of the accommodation groove 11. Specifically, the arrangement of the center cavity 12 can reduce the overall weight of the tray 1, thereby reducing the resistance of the carrier driving the tray 1, and making the transfer of the tray 1 and the wafer 7 thereon more efficient. On the other hand, the arrangement of the center cavity 12 also facilitates the taking and placing of the wafer 7. In the actual wafer 7 taking and placing process, the center cavity 12 can provide a space for the mechanical arm or the worker's arm to move, facilitating the mechanical arm to place the wafer 7 into the corresponding accommodation groove 11 or take the wafer 7 out of the corresponding accommodation groove 11, and improving the wafer 7 taking and placing efficiency.

[0036] In some embodiments, the top surface of the tray 1 is provided with a baffle 13 away from the center cavity 12, and the baffle 13 is provided with a groove on the side facing the accommodation groove 11. The width of the baffle 13 matches the width of the tray 1, and the edges of the baffle 13 are rounded. The baffle 13 can limit and block the movement of the wafer 7 and the mechanical arm and other structures, and can prevent the tray 1 from being damaged by contacting and colliding with other structures when the tray 1 exceeds the stroke, thereby protecting the tray 1 and other structures.

[0037] In some embodiments, the top surface of the tray 1 is provided with a weight-reducing hole 14 penetrating the tray 1 in the vertical direction, and the weight-reducing hole 14 is arranged on the side of the accommodation groove 11 away from the center cavity 12. The arrangement of the weight-reducing hole 14 reduces the overall weight of the tray 1, making the tray 1 more flexible and convenient to move, and making the wafer 7 transfer more efficient.

[0038] In some embodiments, the tray 1 is symmetrically provided with a plurality of first connection holes 15 and a plurality of second connection holes 16 along the axis of the central cavity 12. The tray 1 is fixedly connected to the slider 3 via the first connection holes 15 and the second connection holes 16. Four first connection holes 15 are provided on one side of the axis of the central cavity 12, and bolts are used to secure the tray 1 and the slider 3 together. The second connection holes 16 are provided with pins that can position the tray 1 and the slider 3, ensuring that the tray 1 is correctly installed.

[0039] In some embodiments, the drive device 4 includes a drive motor 41, a gear 42, and a rack. The drive motor 41 is fixed relative to the slide rail 2, the gear 42 is fixedly connected to the output end of the drive motor 41, and the rack is fixedly connected to the bottom surface of the tray 1. The rack extends in the same direction as the slide rail 2, and the gear 42 meshes with the rack. The bottom surface of the tray 1 is provided with a mounting slot opening toward the slide rail 2, and the rack is fixed in the mounting slot by bolts. When the tray 1 needs to be driven, the drive motor 41 is operated to drive the gear 42 to rotate, thereby driving the tray 1 to move along the slide rail 2.

[0040] In addition, in some embodiments, a stopper 21 is provided at the end of the slide rail 2 , and the stopper 21 can limit the movement of the tray 1 on the slide rail 2 , thereby preventing the slider 3 and the tray 1 thereon from detaching from the slide rail 2 .

[0041] In some embodiments, a support structure is provided at the bottom of the carrier. The support structure includes a support plate 5 and support columns 6. The slide rail 2 and drive motor 41 are fixed to the top surface of the support plate 5. Multiple support columns 6 are symmetrically arranged on the bottom surface of the support plate 5. In one specific embodiment, four support columns 6 are symmetrically arranged, and the support columns 6 are in an inverted T-shaped structure, which increases the support area at the bottom of the support columns 6 and provides greater stability.

[0042] In summary, the embodiment of the utility model provides a wafer transport mechanism of a wafer profile measuring machine, which can adapt to the transportation of wafers 7 of various sizes, and can well limit the position of wafers 7 of different sizes to ensure the stability of the position and orientation of the wafer 7, facilitate the transportation of the wafer 7, and make the transportation process of the wafer 7 more efficient and accurate.

[0043] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and replacements can be made without departing from the technical principles of the present invention. These improvements and replacements should also be regarded as the scope of protection of the present invention.

Claims

1. A wafer transport mechanism, characterized in that: The application relates to a loading device and a carrying device for driving the loading device to move. The loading device comprises a tray, the top surface of the tray is sequentially provided with a plurality of accommodation grooves with gradually decreasing diameters in the vertical direction, the centers of the plurality of accommodation grooves are the same, and the plurality of accommodation grooves are used for accommodating wafers with different sizes. The carrying device comprises a sliding rail, a sliding block and a driving device, the sliding rail is in sliding connection with the sliding block, the sliding block is fixedly connected with the tray, and the driving device is connected with the tray to drive the tray to move along the sliding rail.

2. The wafer carrier mechanism according to claim 1, wherein The depths of the plurality of accommodation grooves in the vertical direction are the same.

3. The wafer carrier mechanism according to claim 1, wherein The tray is provided with a plurality of circular-arc-shaped bosses at the side walls of the accommodation grooves, and the arc surfaces of the bosses are used for abutting and limiting the wafers.

4. The wafer carrier mechanism of claim 1, wherein, The tray is provided with positioning holes at the bottom surface of the accommodation grooves, the positioning holes penetrate the tray in the vertical direction, and the positioning holes correspond to notches on the wafers to realize positioning.

5. The wafer carrier mechanism of claim 1, wherein, The top surface of the tray is provided with a center cavity penetrating the tray in the vertical direction, the center cavity is in a half-hip structure, one end of the center cavity away from the accommodation grooves penetrates the side wall of the tray, the center of the other end of the center cavity coincides with the projection of the center of the accommodation grooves in the vertical direction, and the diameter of the end of the center cavity is smaller than the diameter of the smallest accommodation groove.

6. The wafer carrier mechanism of claim 5, wherein, The top surface of the tray is provided with a baffle away from the center cavity, and the baffle is provided with a groove on the side facing the accommodation grooves.

7. The wafer carrier mechanism of claim 5, wherein, The top surface of the tray is provided with a weight-reducing hole penetrating the tray in the vertical direction, and the weight-reducing hole is arranged on the side of the accommodation grooves away from the center cavity.

8. The wafer carrier mechanism of claim 5, wherein, The tray is symmetrically provided with a plurality of first connecting holes and a plurality of second connecting holes along the axis of the center cavity, and the tray is fixedly connected with the sliding block through the first connecting holes and the second connecting holes.

9. The wafer carrier mechanism of claim 8, wherein, The driving device comprises a driving motor, a gear and a rack, the driving motor is fixed opposite to the sliding rail, the gear is fixedly connected with the output end of the driving motor, the rack is fixedly connected with the bottom surface of the tray, the extension direction of the rack is the same as the extension direction of the sliding rail, and the gear is in meshing connection with the rack.

10. The wafer carrier mechanism of claim 9, wherein, The bottom of the carrying device is provided with a support structure, the support structure comprises a support plate and a support column, the top surface of the support plate is fixed with the sliding rail and the driving motor, the support column is arranged on the bottom surface of the support plate and is symmetrically provided with a plurality of support columns.

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