Power device

Abstract

The utility model provides a power device comprising a first bridge arm structure comprising a first lining plate, a first chip and a first PCB, the upper surface of the first lining plate is provided with a first conductive layer, the first chip is arranged on the first lining plate, the drain electrode of the first chip is electrically connected with the first conductive layer, and the drain electrode of the first chip is electrically connected with the first PCB; the upper surface of the first PCB is electrically connected with the grid electrode and the auxiliary source electrode of the first chip, and a first resistor structure is arranged on the first PCB; the terminal assembly comprises a first power terminal, a second power terminal and a first driving terminal, the first power terminal and the second power terminal are both arranged on the first lining plate, the first power terminal is electrically connected with the first conductive layer, the second power terminal is electrically connected with a source electrode of the first chip, and the first driving terminal is electrically connected with the upper surface of the first PCB. Through the technical scheme provided by the invention, the problem of large thermal resistance from the power chip to the power device shell in the related technology can be solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to power device technical field, specifically, relate to a kind of power device. BACKGROUND

[0002] Power device is applied in power electronics field, for controlling and converting electric energy equipment. For executing rectification, inverter, chopper and frequency conversion etc. Power conversion function. Widely used in power management, motor drive, solar inverter, power system, energy storage etc.

[0003] In related art, power device includes copper clad ceramic substrate and power element arranged on the upper surface of copper clad ceramic substrate. In order to realize the electrical connection of power element, the upper copper layer of copper clad ceramic substrate needs to be segmented to form multiple patterns, different power elements are connected by different patterns, and the power elements are connected.

[0004] However, by using the above setting mode, the heat dissipation area of the upper copper layer of the copper clad ceramic substrate and the power chip will be reduced, thereby increasing the thermal resistance from the power chip to the power device shell. UTILITY MODEL CONTENTS

[0005] The utility model provides a kind of power device, to solve the problem of large thermal resistance from power chip to power device shell in related art.

[0006] The utility model provides a kind of power device, power device includes first bridge arm structure, including first lining plate, first chip and first PCB plate, the upper surface of first lining plate has first conductive layer, first chip is arranged on first lining plate, the drain electrode of first chip is electrically connected with first conductive layer, the upper surface of first PCB plate is electrically connected with the gate of first chip and auxiliary source electrode, first PCB plate is provided with first resistance structure;Terminal assembly, including first power terminal, second power terminal and first drive terminal, first power terminal and second power terminal are all arranged on first lining plate, first power terminal is electrically connected with first conductive layer, second power terminal is electrically connected with the source electrode of first chip, first drive terminal is electrically connected with the upper surface of first PCB plate.

[0007] Further, the power device further includes a bottom plate, the first lining plate is arranged on the bottom plate, and the first PCB plate is arranged on the first lining plate or the bottom plate.

[0008] Further, the first resistance structure includes a gate resistor and an auxiliary source resistor, the first drive terminal includes a gate terminal and an auxiliary source terminal, the gate terminal, the gate resistor, the first chip, the auxiliary source resistor and the auxiliary source terminal are connected in series.

[0009] Further, the first bridge arm structure further comprises a power element, a lower surface of the power element is electrically connected with the first conductive layer, and an upper surface of the power element is electrically connected with the second power terminal.

[0010] Further, the upper surface of the first backing plate further has a second conductive layer which is spaced apart from the first conductive layer, the source of the first chip, the upper surface of the power element, and the second power terminal are respectively electrically connected with the second conductive layer.

[0011] Further, the first chip, the resistor, and the power element are all multiple, the multiple resistors are all arranged on the upper surface of the first PCB, the multiple first chips and the multiple resistors are one-to-one electrically connected, and the multiple power elements are one-to-one and parallelly arranged with the multiple first chips.

[0012] Further, the multiple first chips are spaced apart along the width direction of the first backing plate; and / or, the multiple power elements are located on one side of the multiple first chips and are spaced apart along the width direction of the first backing plate.

[0013] Further, the power element is a power chip or a diode.

[0014] Further, the first bridge arm structure further comprises a first driving backing plate, an upper surface of the first chip is electrically connected with an upper surface of the first driving backing plate, and the first driving terminal is arranged on the upper surface of the first driving backing plate.

[0015] Further, the first PCB is located between the first driving backing plate and the first chip.

[0016] Further, the power device further comprises a second bridge arm structure, the second bridge arm structure comprises a second backing plate, a second chip, and a second PCB, the second backing plate has a third conductive layer and a fourth conductive layer which are spaced apart, the second chip is arranged on the second backing plate, a lower surface of the second chip is electrically connected with the third conductive layer, an upper surface of the second chip is electrically connected with the fourth conductive layer, the fourth conductive layer is electrically connected with the first conductive layer, an upper surface of the second PCB is electrically connected with the upper surface of the second chip, and a second resistor structure is arranged on the second PCB; the terminal assembly further comprises a third power terminal and a second driving terminal, the third power terminal is arranged on the second backing plate and is electrically connected with the third conductive layer, and the second driving terminal is electrically connected with the upper surface of the second PCB.

[0017] The utility model discloses a technical scheme, power device includes first bridge arm structure and terminal assembly, the current of power circuit flows through first power terminal, the upper surface of first lining, the drain of first chip, the source of first chip and second power terminal forms power circuit, the current of drive circuit flows through first drive terminal, the internal circuit of first PCB board, first resistance structure, the grid of first chip and auxiliary source, the internal circuit of first PCB board and flows out and forms drive circuit. BRIEF DESCRIPTION OF DRAWINGS

[0018] The accompanying drawings, which form a part of this application, are included to provide a further understanding of the application and are incorporated herein for reference. The embodiments of the application and the drawings illustrate the principles of the application and, however, should not be taken to limit the proper scope of the application. In the drawings:

[0019] Figure 1 Fig. 1 shows a structural schematic diagram of a power device according to an embodiment of the utility model;

[0020] Figure 2 Fig. 2 shows an exploded view of a power device according to an embodiment of the utility model;

[0021] Figure 3 Fig. 3 shows a partial enlarged view of A in Fig. 1; Figure 2

[0022] Figure 4 Fig. 4 shows a packaging diagram of a power device according to an embodiment of the utility model.

[0023] In the above drawings, the following reference signs are used:

[0024] 10, bottom plate;

[0025] 20, first bridge arm structure; 21, first conductive layer; 22, second conductive layer; 23, first chip; 24, first PCB board; 241, first resistance structure; 242, grid resistance; 243, auxiliary source resistance; 25, first drive lining; 26, power element; 27, first lining;

[0026] ​30. Terminal assembly; 31. First power terminal; 32. Second power terminal; 33. First drive terminal; 331. Gate terminal; 332. Auxiliary source terminal; 34. Third power terminal; 35. Second drive terminal;

[0027] 40. Second bridge arm structure; 41. Third conductive layer; 42. Fourth conductive layer; 43. Second chip; 44. Second PCB board; 45. Second driving lining board; 46. Second lining board; 47. Second resistor structure. DETAILED DESCRIPTION

[0028] The following will be combined with the drawings in the embodiments of the present invention to clearly and completely describe the technical solutions in the embodiments of the present invention. Obviously, the embodiments described are only some embodiments of the present invention, not all embodiments. The following description of at least one exemplary embodiment is actually only illustrative and is in no way intended to limit the present invention and its application or use. Based on the embodiments of the present invention, all other embodiments obtained by ordinary technicians in this field without making creative efforts are within the scope of protection of the present invention.

[0029] like Figures 1 to 4 As shown, an embodiment of the present invention provides a power device, which includes a first bridge arm structure 20 and a terminal assembly 30. The first bridge arm structure 20 includes a first liner 27, a first chip 23 and a first PCB board 24. The upper surface of the first liner 27 has a first conductive layer 21. The first chip 23 is arranged on the first liner 27. The drain of the first chip 23 is electrically connected to the first conductive layer 21. The upper surface of the first PCB board 24 is electrically connected to the gate and auxiliary source of the first chip 23. A first resistor structure 241 is provided on the first PCB board 24; the terminal assembly 30 includes a first power terminal 31, a second power terminal 32 and a first drive terminal 33. The first power terminal 31 and the second power terminal 32 are both arranged on the first liner 27. The first power terminal 31 is electrically connected to the first conductive layer 21, the second power terminal 32 is electrically connected to the source of the first chip 23, and the first drive terminal 33 is electrically connected to the upper surface of the first PCB board 24.

[0030] The technical scheme is applied to the power device, the power device comprises a first bridge arm structure 20 and a terminal assembly 30, current of the power circuit flows through a first power terminal 31, an upper surface of a first backing plate 27, a drain of a first chip 23, a source of the first chip 23 and a second power terminal 32 to form the power circuit, and current of the drive circuit flows through a first drive terminal 33, an internal circuit of a first PCB plate 24, a first resistance structure, a gate and an auxiliary source of the first chip 23, the internal circuit of the first PCB plate 24 and flows out to form the drive circuit. Since the first resistance structure is arranged on the first PCB plate 24, the internal circuit of the first PCB plate 24 is utilized to form an electrical connection relationship between the first drive terminal 33 and the gate and the auxiliary source of the different first chip 23. Compared with etching the upper copper layer of the first backing plate 27, the first PCB plate 24 can reduce the space occupation of the upper copper layer of the first backing plate 27, increase the area of the upper copper layer of the first backing plate 27, and further make the area of the first backing plate 27 for heat dissipation of the first chip 23 larger, thereby reducing the thermal resistance from the first chip 23 to the power device shell.

[0031] In the embodiment, the first backing plate 27 adopts a copper-clad ceramic substrate, the copper-clad ceramic substrate has a three-layer structure, the upper layer and the lower layer are both conductor layers, and the middle layer is a ceramic substrate. The upper conductor layer is a conductive layer and forms a topology structure of a circuit. The ceramic substrate of the middle layer plays an insulating and heat conducting role. The lower copper foil is generally connected with the bottom plate 10 through a thermal interface material and plays a heat conducting role.

[0032] The ceramic substrate of the middle layer can generally be selected from ceramic materials such as aluminum oxide, aluminum nitride, aluminum oxide doped with zirconium oxide and silicon nitride.

[0033] In addition, compared with a drive connection mode of directly dividing regions on the copper-clad ceramic substrate, the multi-layer circuit structure of the PCB plate can improve the flexibility of the drive circuit, save the space of the copper-clad ceramic substrate, provide a larger heat dissipation space for the power chip and reduce the shell thermal resistance of the chip. Compared with other devices, the drive connection PCB plate is suspended on the shell, the process is relatively simple, a special designed shell is not needed, and the drive connection PCB plate is directly welded on the copper-clad ceramic substrate together with the power chip.

[0034] As shown in FIG. 1, Figure 1 The power device further comprises a bottom plate 10, the first backing plate 27 is arranged on the bottom plate 10, and the first PCB plate 24 is arranged on the first backing plate 27 or the bottom plate 10. The above arrangement has the advantage of facilitating processing.

[0035] In the embodiment, the first PCB plate 24 is arranged on the first backing plate 27.

[0036] As shown in FIG. 1, Figure 2As shown, the first resistance structure 241 includes the gate resistance 242 and the auxiliary source resistance 243, the first driving terminal 33 includes the gate terminal 331 and the auxiliary source terminal 332, and the gate terminal 331, the gate resistance 242, the first chip 23, the auxiliary source resistance 243, and the auxiliary source terminal 332 are connected in series. With the above structure, the gate resistance 242 and the auxiliary source resistance 243 can be used to form appropriate driving current, facilitating the normal operation of the first chip 23.

[0037] In the embodiment, the driving current flows from the gate terminal 331, passes through the first PCB board 24, flows through the gate resistance 242 via the internal circuit of the first PCB board 24, flows to the gate of the first chip 23 via the internal circuit of the first PCB board 24, and flows out from the auxiliary source of the first chip 23, and then flows to the auxiliary source resistance 243 via the internal circuit of the first PCB board 24 and flows out from the auxiliary source terminal 332 via the internal circuit of the first PCB board 24.

[0038] As shown in Figure 2 and Figure 3 The first bridge arm structure 20 further includes the power element 26, the lower surface of the power element 26 is electrically connected with the first conductive layer 21, and the upper surface of the power element 26 is electrically connected with the second power terminal 32. The power element 26 can improve the performance of the first bridge arm structure 20, so that the power device has higher reliability and adaptability.

[0039] The power element 26 can be a power chip. The power chip can form a parallel relationship with the original first chip 23, so as to improve the current-carrying capacity of the first bridge arm structure 20 and improve the performance of the power device to improve its adaptability.

[0040] In other embodiments, the power element 26 can be a diode. The diode can withstand reverse current, thereby avoiding current flowing through the first chip 23, protecting the first chip 23 and prolonging the service life of the first chip 23.

[0041] Specifically, when a reverse voltage is added between the first power terminal 31 and the second power terminal 32, the first chip 23 cannot be turned on, but the first chip 23 needs to withstand a potential difference. After setting the diode, the current can pass through the second power terminal 32, the second conductive layer 22, the diode, the first conductive layer 21, and the first power terminal 31 in sequence to be directly turned on, thereby avoiding flowing through the first chip 23 and avoiding the first chip 23 to withstand the potential difference, thereby protecting the first chip 23.

[0042] As shown in Figure 2As shown, the upper surface of the first backing plate 27 further has a second conductive layer 22 spaced apart from the first conductive layer 21, and the source of the first chip 23, the upper surface of the power element 26 and the second power terminal 32 are electrically connected with the second conductive layer 22 respectively. By dividing the first conductive layer 21 and the second conductive layer 22 on the upper surface of the first backing plate 27, the first conductive layer 21 and the second conductive layer 22 can be insulated, so that the current can flow from the upper surface of the first chip 23 or the power element 26 to the second power terminal 32, without short circuit.

[0043] As shown, the upper surface of the first backing plate 27 further has a second conductive layer 22 spaced apart from the first conductive layer 21, and the source of the first chip 23, the upper surface of the power element 26 and the second power terminal 32 are electrically connected with the second conductive layer 22 respectively. By dividing the first conductive layer 21 and the second conductive layer 22 on the upper surface of the first backing plate 27, the first conductive layer 21 and the second conductive layer 22 can be insulated, so that the current can flow from the upper surface of the first chip 23 or the power element 26 to the second power terminal 32, without short circuit.

[0044] As shown, Figure 1 The first chip 23, the first resistance structure 241 and the power element 26 are multiple, the multiple first resistance structures 241 are arranged on the upper surface of the first PCB plate 24, the multiple first chips 23 and the multiple first resistance structures 241 are electrically connected one by one, and the multiple power elements 26 are arranged in parallel one by one corresponding to the multiple first chips 23. By using multiple first chips 23, the current carrying capacity of the power device during operation can be enhanced to withstand greater current. By corresponding the first resistance structure 241 to the first chip 23, a driving circuit can be formed for each first chip 23 to make each first chip 23 work normally.

[0045] As shown, Figure 1 The multiple first chips 23 are arranged in the width direction of the first backing plate 27. By using the above layout, the space in the width direction of the bottom plate 10 can be fully utilized to improve the space utilization.

[0046] The multiple first chips 23 form a parallel structure in the power circuit. The sum of the currents of the multiple first chips 23 is the current of the power circuit of the first bridge arm structure 20.

[0047] As shown, Figure 2 The multiple power elements 26 are arranged in the width direction of the first backing plate 27. By using the above layout, the space in the length direction of the bottom plate 10 can be fully utilized to improve the space utilization.

[0048] As shown, Figure 1As shown, the first bridge arm structure 20 further comprises a first driving backing plate 25, the first driving backing plate 25 is arranged on the bottom plate 10, the upper surface of the first chip 23 is electrically connected with the upper surface of the first driving backing plate 25, and the first driving terminal 33 is arranged on the upper surface of the first driving backing plate 25. By adopting the above structure, the first driving terminal 33 can be mounted on the first driving backing plate 25, avoiding mounting the first driving terminal 33 on the first backing plate 27, avoiding pattern division of the upper copper layer of the first backing plate 27, thereby increasing the area of the upper copper layer of the first backing plate 27, reducing the space occupation of the upper copper layer of the first backing plate 27, and making the area of the first backing plate 27 for heat dissipation of the first chip 23 larger.

[0049] As shown in the figure, Figure 1 The first PCB plate 24 is located between the first driving backing plate 25 and the first chip 23. By adopting the above layout, the length direction space of the bottom plate 10 can be fully utilized, and the space utilization rate is improved.

[0050] The first driving backing plate 25 and the first PCB plate are arranged on the side close to the auxiliary source electrode and the gate electrode of the first chip 23, which is beneficial to the arrangement of the driving circuit. The second conductive layer 22 is arranged on the side close to the source electrode of the first chip 23, which is beneficial to the arrangement of the power circuit. At the same time, the gate terminal 331 and the auxiliary source electrode terminal 332, the first power terminal 31 and the second power terminal are arranged at two ends of the first bridge arm structure 20 respectively, which is beneficial to reasonable layout and elimination of parasitic inductance of the circuit.

[0051] As shown in the figure, Figure 2 The power device further comprises a second bridge arm structure 40, the second bridge arm structure 40 comprises a second backing plate 46, a second chip 43 and a second PCB plate 44, the second backing plate 46 has a third conductive layer 41 and a fourth conductive layer 42 arranged at intervals, the second chip 43 is arranged on the second backing plate 46, the lower surface of the second chip 43 is electrically connected with the third conductive layer 41, the upper surface of the second chip 43 is electrically connected with the fourth conductive layer 42, the fourth conductive layer 42 is electrically connected with the first conductive layer 21, the upper surface of the second PCB plate 44 is electrically connected with the upper surface of the second chip 43, and the second PCB plate 44 is provided with a second resistance structure 47; the terminal assembly 30 further comprises a third power terminal 34 and a second driving terminal 35, the third power terminal 34 is arranged on the second backing plate 46, and the third power terminal 34 is electrically connected with the third conductive layer 41; the second driving terminal 35 is electrically connected with the upper surface of the second PCB plate 44. By adopting the above-mentioned second bridge arm structure 40, a half-bridge topology circuit can be formed in cooperation with the first bridge arm structure 20, and power amplification and inverter functions can be realized.

[0052] In a half-bridge circuit, both bridge arms are not usually turned on at the same time, because this would cause a short circuit. The working principle of a half-bridge circuit is to turn on the two bridge arms alternately to generate the required output voltage and current waveform. For example, in a half-bridge inverter, when one bridge arm is turned on, the other bridge arm should be in an off state to avoid the current flowing directly from the power supply back to the power supply, causing a short circuit.

[0053] In the embodiment, the first power terminal 31 is an AC terminal, the second power terminal 32 is a DC- terminal, and the third power terminal 34 is a DC+ terminal.

[0054] Specifically, when the power circuit of the second bridge arm structure 40 is turned on, the current flows from the third power terminal 34, passes through the third conductive layer 41 of the second back plate 46, flows to the drain of the second chip 43, flows out from the source of the second chip 43, passes through the fourth conductive layer 42, and then flows out through the second conductive layer 22 and the first power terminal 31.

[0055] In addition, when the drive circuit of the second bridge arm structure 40 is turned on, the current of the drive circuit flows through the second drive terminal 35, the internal circuit of the second PCB plate 44, the second resistance structure 47, the gate and auxiliary source of the second chip 43, the internal circuit of the second PCB plate 44, and then flows out to form the drive circuit.

[0056] It should be noted that the first chip 23 and the second chip 43 provided in the embodiment are both silicon carbide MOSFET chips.

[0057] The first bridge arm structure 20 and the second bridge arm structure 40 are symmetrically arranged on the bottom plate 10. The second bridge arm structure 40 further includes a second drive back plate 45, which is arranged on the bottom plate 10. The gate terminal and the auxiliary source terminal of the second bridge arm structure 40 are arranged on the second drive back plate 45, and the upper surface of the second drive back plate 45 is electrically connected to the upper surface of the second PCB plate 44.

[0058] Specifically, the resistors on the second PCB plate 44 also include gate resistors and auxiliary source resistors, and the electrical connection structure thereof is the same as that of the first PCB plate 24.

[0059] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments in accordance with the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise. It will be further understood that the terms "comprises" and / or "comprising," when used in this specification, specify the presence of stated features, steps, operations, elements, and / or components, but do not preclude the presence or addition of one or more other features, steps, operations, elements, components, and / or groups thereof.

[0060] The foregoing description, for purposes of explanation, sets forth specific values and arrangements of components and steps that are subject to many options. It is their functions, equivalents, and combinations thereof, that are intended to be abidingly abstracted. The relative arrangements of components and steps, numerical expressions, and numerical values set forth in the examples herein are not intended to limit the scope of the application unless specifically recited. Also, it is to be understood that the dimensions of the various parts shown in the drawings are not necessarily to scale as the drawings are shown for purposes of convenience and clarity of description. Techniques, methods, and apparatus known to those of ordinary skill can not be discussed in detail because such techniques, methods, and apparatus are considered to be part of the base art. In all examples shown and discussed herein, any specific value is to be interpreted as merely an example, and not a limitation. Thus, other examples of the example embodiments can have different values. It is to be noted that like reference numerals and letters refer to like items in the several views of the drawings, and, once an item is defined in one view, it need not be discussed further in subsequent views.

[0061] In the description of the present application, it needs to be understood that the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" and the like indicated orientation or position relationship is usually based on the orientation or position relationship shown in the drawings, only for the convenience of describing the present application and simplifying the description, without making the opposite statement, these orientation words do not indicate and imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, therefore, it cannot be understood as a limitation on the scope of protection of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component itself.

[0062] For the convenience of description, spatial relative terms such as "above", "upper", "on", "top", and the like can be used herein to describe the spatial relationship of one device or feature to another device or feature as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device described in the drawings. For example, if the device in the drawings is inverted, the device described as "above" or "on" other devices or structures will be positioned "below" or "under" other devices or structures. Thus, the example term "above" can include both "above" and "below" orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0063] In addition, it needs to be pointed out that the use of "first", "second" and the like to limit the parts is only for the convenience of distinguishing the corresponding parts, and the above words have no special meaning unless otherwise stated, therefore, it cannot be understood as a limitation on the scope of protection of the present application.

[0064] The above merely describes preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A power device, characterized by, The power device comprises: A first bridge arm structure (20) comprising a first back plate (27), a first chip (23) and a first PCB plate (24), the upper surface of the first back plate (27) having a first conductive layer (21), the first chip (23) being arranged on the first back plate (27), the drain of the first chip (23) being electrically connected with the first conductive layer (21), the upper surface of the first PCB plate (24) being electrically connected with the gate and auxiliary source of the first chip (23), and the first PCB plate (24) being provided with a first resistance structure (241); A terminal assembly (30) comprising a first power terminal (31), a second power terminal (32) and a first driving terminal (33), the first power terminal (31) and the second power terminal (32) being arranged on the first back plate (27), the first power terminal (31) being electrically connected with the first conductive layer (21), the second power terminal (32) being electrically connected with the source of the first chip (23), and the first driving terminal (33) being electrically connected with the upper surface of the first PCB plate (24).

2. The power device of claim 1, wherein, The power device further comprises a bottom plate (10), the first back plate (27) being arranged on the bottom plate (10), and the first PCB plate (24) being arranged on the first back plate (27) or the bottom plate (10).

3. The power device of claim 1, wherein, The first resistance structure (241) comprises a gate resistance (242) and an auxiliary source resistance (243), the first driving terminal (33) comprises a gate terminal (331) and an auxiliary source terminal (332), and the gate terminal (331), the gate resistance (242), the first chip (23), the auxiliary source resistance (243) and the auxiliary source terminal (332) are connected in series.

4. The power device of claim 1, wherein, The first bridge arm structure (20) further comprises a power element (26), the lower surface of the power element (26) being electrically connected with the first conductive layer (21), and the upper surface of the power element (26) being electrically connected with the second power terminal (32).

5. The power device of claim 4, wherein, The upper surface of the first back plate (27) further has a second conductive layer (22) arranged apart from the first conductive layer (21), the source of the first chip (23), the upper surface of the power element (26) and the second power terminal (32) being electrically connected with the second conductive layer (22) respectively.

6. The power device of claim 4, wherein, The first chip (23), the first resistance structure (241) and the power element (26) are all multiple, the first resistance structures (241) are all arranged on the upper surface of the first PCB plate (24), the first chips (23) and the first resistance structures (241) are electrically connected one by one, and the power elements (26) and the first chips (23) are arranged in parallel one by one.

7. The power device according to claim 4, wherein The first chips (23) are arranged apart along the width direction of the first back plate (27); and / or, A plurality of the power elements (26) are located on one side of the plurality of the first chips (23) and are arranged at intervals along a width direction of the first backing plate (27).

8. The power device of claim 4, wherein, The power element (26) is a power chip or a diode.

9. The power device of claim 1, wherein, The first bridge arm structure (20) further comprises a first driving backing plate (25), an upper surface of the first chip (23) is electrically connected to an upper surface of the first driving backing plate (25), and the first driving terminal (33) is arranged on the upper surface of the first driving backing plate (25).

10. The power device of claim 9, wherein, The first PCB plate (24) is located between the first driving backing plate (25) and the first chip (23).

11. The power device according to claim 1, characterized in that, The power device further comprises a second bridge arm structure (40), the second bridge arm structure (40) comprises a second backing plate (46), a second chip (43) and a second PCB plate (44), the second backing plate (46) has a third conductive layer (41) and a fourth conductive layer (42) arranged at intervals, the second chip (43) is arranged on the second backing plate (46), a lower surface of the second chip (43) is electrically connected to the third conductive layer (41), an upper surface of the second chip (43) is electrically connected to the fourth conductive layer (42), the fourth conductive layer (42) is electrically connected to the first conductive layer (21), an upper surface of the second PCB plate (44) is electrically connected to the upper surface of the second chip (43), and a second resistance structure (47) is arranged on the second PCB plate (44); The terminal assembly (30) further comprises a third power terminal (34) and a second driving terminal (35), the third power terminal (34) is arranged on the second backing plate (46), the third power terminal (34) is electrically connected to the third conductive layer (41), and the second driving terminal (35) is electrically connected to the upper surface of the second PCB plate (44).

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