Power device

Abstract

The utility model provides a power device. The power device comprises a base plate; the first bridge arm structure comprises a first lining plate and a plurality of first chips, the first lining plate is arranged on the bottom plate, a first conductive layer is arranged on the upper surface of the first lining plate, and drain electrodes of the first chips are electrically connected with the first conductive layer; the terminal assembly comprises a first power terminal, a second power terminal, a first auxiliary source terminal and a plurality of first gate terminals, the first power terminal and the second power terminal are both arranged on the first lining plate, the first power terminal is electrically connected with the first conductive layer, the second power terminal is conductively connected with the source electrode of the first chip, and the first auxiliary source terminal is electrically connected with the source electrode of the second chip; the plurality of first gate terminals are electrically connected with the gates of the plurality of first chips in a one-to-one correspondence manner, and the first auxiliary source terminal is electrically connected with the auxiliary sources of the plurality of first chips. Through the technical scheme provided by the invention, the problem of poor stability of the power device driving circuit in the related technology can be solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to power device technical field, specifically, relate to a kind of power device. BACKGROUND

[0002] Power device is applied in power electronics field, for controlling and converting electric energy equipment. For executing rectification, inverter, chopper and frequency conversion etc. Power conversion function. Widely used in power management, motor drive, solar inverter, power system, energy storage etc.

[0003] In related art, power device includes lining plate and multiple power chips arranged on the lining plate, the gate of multiple power chips is provided with driving control signal by the same gate control terminal, although this simple structure is usually used to save cost in business, even the power chips of same batch also exist greater dispersity, the switching time sequence etc. of each power chip is not the same after multiple power chips are connected in parallel, leading to that the electric thermal stress that power chip bears is not balanced in actual working condition, and some power chips are damaged directly due to electric thermal out of control, and further leading to that entire power device is damaged. To solve the above problem, an gate control terminal and a source terminal form driving circuit to provide control signal for the gate of each power chip.

[0004] However, the above driving circuit increases the terminal quantity of driving circuit, and the driving circuit between different chips produces mutual inductance, which reduces the stability of the driving circuit. UTILITY MODEL CONTENTS

[0005] The utility model provides a kind of power device to solve the problem of poor stability of power device driving circuit in related art.

[0006] The utility model provides a kind of power device, power device includes: bottom plate;First bridge arm structure includes first lining plate and multiple first chips, first lining plate is set on bottom plate, and first conductive layer is provided on the upper surface of first lining plate, and the drain of first chip is electrically connected with first conductive layer;Terminal assembly includes first power terminal, second power terminal, first auxiliary source terminal and multiple first gate terminals, first power terminal and second power terminal are all set on first lining plate, first power terminal is electrically connected with first conductive layer, second power terminal is electrically connected with the source of first chip, multiple first gate terminals are respectively and one-to-one corresponding electrically connected with the gate of multiple first chips, and first auxiliary source terminal is electrically connected with the auxiliary source of multiple first chips.

[0007] Further, the first bridge arm structure further includes a first PCB plate, the upper surfaces of the multiple first chips are respectively electrically connected with the first PCB plate, and the multiple first gate terminals and the first auxiliary source terminal are all arranged on the first PCB plate.

[0008] Further, the first PCB board is arranged on the first backing plate or the bottom plate.

[0009] Further, the upper surface of the first backing plate further has a second conductive layer arranged in insulation with the first conductive layer, and the source of the first chip and the second power terminal are electrically connected with the second conductive layer respectively.

[0010] Further, the upper surface of the first backing plate is stacked with a first source backing plate, and the second conductive layer is arranged on the upper surface of the first source backing plate.

[0011] Further, the power device further comprises a second bridge arm structure, the second bridge arm structure comprises a second backing plate and a plurality of second chips, the second backing plate is arranged on the bottom plate, the upper surface of the second backing plate has a third conductive layer, the second chips are arranged on the second backing plate, the drain of the second chip is electrically connected with the third conductive layer, the third conductive layer is electrically connected with the second conductive layer, and the terminal assembly further comprises a third power terminal, the source of the second chip is electrically connected with the third power terminal.

[0012] Further, the terminal assembly further comprises a plurality of second gate terminals, and the plurality of second gate terminals are respectively and one-to-one corresponding in series with the gates of the plurality of second chips.

[0013] Further, the second bridge arm structure further comprises a second PCB board, the upper surfaces of the plurality of second chips are respectively electrically connected with the second PCB board, and the plurality of second gate terminals are all arranged on the second PCB board.

[0014] Further, the first bridge arm structure and the second bridge arm structure are sequentially arranged on the bottom plate along the length direction of the bottom plate, and the second PCB board is located on the side of the second backing plate away from the first backing plate.

[0015] Further, the multi-terminal assembly further comprises a second auxiliary source terminal, and the second auxiliary source terminal is electrically connected with the auxiliary source of the plurality of second chips.

[0016] The utility model discloses a technical scheme, power device includes bottom plate, first bridge arm structure and terminal assembly, the current of power circuit flows through first power terminal, the upper surface of first lining, the drain of first chip, the source of first chip and second power terminal forms power circuit, and the current of drive circuit flows through first gate terminal, the gate of first chip, auxiliary source and first auxiliary source terminal forms drive circuit. BRIEF DESCRIPTION OF DRAWINGS

[0017] The accompanying drawings, which form a part of the specification, are included to provide a further understanding of the application and are incorporated herein for reference. The embodiments of the present application and the description thereof are presented for the purpose of exemplification and by way of explanation, and are not intended to limit the scope of the application.

[0018] Figure 1 Fig. 1 shows a structural schematic diagram of a power device according to an embodiment of the present application;

[0019] Figure 2 Fig. 2 shows a packaging diagram of a power device according to an embodiment of the present application.

[0020] In the above drawings, the following reference signs are used:

[0021] 10, bottom plate;

[0022] 20, first bridge arm structure; 21, first lining; 22, first chip; 23, first PCB plate; 24, first source lining;

[0023] 30, terminal assembly; 31, first power terminal; 32, second power terminal; 33, first gate terminal; 34, first auxiliary source terminal; 35, second gate terminal; 36, second auxiliary source terminal; 37, third power terminal; 40, second bridge arm structure; 41, second lining; 42, second chip; 43, second PCB plate. DETAILED DESCRIPTION

[0024] The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, rather than all the embodiments. The description of the at least one exemplary embodiment is actually only illustrative, but not as any limitation on the present application and its application or use. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor fall within the scope of the present application.

[0025] As shown in Figure 1 and Figure 2 The embodiments of the present application provide a power device, the power device comprises a bottom plate 10, a first bridge arm structure 20, and a terminal assembly 30, the first bridge arm structure 20 comprises a first backing plate 21 and a plurality of first chips 22, the first backing plate 21 is arranged on the bottom plate 10, a first conductive layer is arranged on the upper surface of the first backing plate 21, and the drain of the first chip 22 is electrically connected with the first conductive layer; the terminal assembly 30 comprises a first power terminal 31, a second power terminal 32, a first auxiliary source terminal 34, and a plurality of first gate terminals 33, the first power terminal 31 and the second power terminal 32 are both arranged on the first backing plate 21, the first power terminal 31 is electrically connected with the first conductive layer, the second power terminal 32 is conductively connected with the source of the first chip 22, the plurality of first gate terminals 33 are respectively and one-to-one conductively connected with the gates of the plurality of first chips 22, and the first auxiliary source terminal 34 is electrically connected with the auxiliary sources of the plurality of first chips 22.

[0026] The technical solutions of the present application are applied, the power device comprises the bottom plate 10, the first bridge arm structure 20 and the terminal assembly 30, the current of the power circuit flows through the first power terminal 31, the upper surface of the first backing plate 21, the drain of the first chip 22, the source of the first chip 22, the first auxiliary source terminal 34 and the second power terminal 32 to form the power circuit, and the current of the driving circuit flows through the first gate terminal 33, the gate and the auxiliary source of the first chip 22 to form the driving circuit. Since the gate of each first chip 22 is respectively conductively connected with the corresponding first gate terminal 33, and the plurality of first chips 22 share one first auxiliary source terminal 34, on the one hand, the driving voltage borne by each chip is not the same, the corresponding driving voltage can be set according to the parameters of the first chip 22 itself, and then the first chip 22 bears a reasonable current, so that the electric and thermal stress received by the plurality of first chips 22 is more balanced, thereby avoiding damage to the first chip 22. On the other hand, compared with the scheme that each chip respectively adopts one gate terminal and one auxiliary source terminal to form a driving circuit, the mutual inductance generated by the driving circuits between different chips is reduced, and the stability of the driving circuit is improved.

[0027] Wherein, since each chip is a separate individual, the parameters of different chips are not the same, so that the parameters of different chips have great dispersion.

[0028] In the embodiment, the first backing plate 21 adopts a copper-clad ceramic substrate, which has a three-layer structure, the upper and lower layers are conductor layers, and the middle layer is a ceramic substrate. The upper conductor layer is a conductive layer, forming the topology of the circuit. The ceramic substrate in the middle layer plays an insulating and heat conducting role. The lower copper foil is generally connected with the bottom plate 10 through a thermal interface material, playing a heat conducting role.

[0029] It should be noted that the first chip 22 provided in the embodiment is a silicon carbide MOSFET chip.

[0030] Specifically, the current of the driving circuit flows in from the first gate terminal 33, flows through the gate and auxiliary source of the first chip 22, and then flows out through the first auxiliary source terminal 34.

[0031] As shown in Figure 1 , the first bridge arm structure 20 further includes a first PCB plate 23, the upper surfaces of the plurality of first chips 22 are respectively electrically connected with the first PCB plate 23, and the plurality of first gate terminals 33 and the first auxiliary source terminals 34 are all arranged on the first PCB plate 23. By using the internal circuit of the first PCB plate 23, different first chips 22 can be made to be conductive with the corresponding first gate terminals 33 and the first auxiliary source terminals 34. Compared with the way of arranging different patterns on the upper copper layer of the first backing plate 21 to connect the first gate terminals 33 and the first auxiliary source terminals 34, the space occupation of the bottom plate 10 can be reduced, the first backing plate 21 has a larger area, the area of the upper copper layer of the first chip 22 is increased, and the heat dissipation of the first chip 22 is facilitated.

[0032] As shown in Figure 1 , the first PCB plate 23 is arranged on the first backing plate 21 or the bottom plate 10. By adopting the above arrangement, the advantage of facilitating processing is achieved.

[0033] As shown in Figure 1 , the upper surface of the first backing plate 21 further has a second conductive layer arranged in insulation with the first conductive layer, and the source of the first chip 22 and the second power terminal 32 are respectively electrically connected with the second conductive layer. By arranging the first conductive layer and the second conductive layer on the first backing plate 21, the first conductive layer and the second conductive layer can be insulated, so that the current can flow from the upper surface of the first chip 22 to the second power terminal 32, and short circuit does not occur.

[0034] In the embodiment, the upper surface of the first back plate 21 is stacked with the first source back plate 24, and the second conductive layer is arranged on the upper surface of the first source back plate 24. Since the current flows in opposite directions in the first back plate 21 and the first source back plate 24 when the current flows through the first back plate 21 and the first source back plate 24 through the first chip 22, the parasitic inductance of the power circuit can be reduced.

[0035] As shown in Figure 1 The power device further includes a second bridge arm structure 40, the second bridge arm structure 40 includes a second back plate 41 and a plurality of second chips 42, the second back plate 41 is arranged on the bottom plate 10, and the upper surface of the second back plate 41 has a third conductive layer. The second chip 42 is arranged on the second back plate 41, the drain of the second chip 42 is electrically connected with the third conductive layer, the third conductive layer is electrically connected with the second conductive layer, and the terminal assembly 30 further includes a third power terminal 37. The source of the second chip 42 is electrically connected with the third power terminal 37. The second bridge arm structure 40 described above can cooperate with the first bridge arm structure 20 to form a half-bridge topology circuit, and realize power amplification and inversion functions.

[0036] In the half-bridge circuit, the two bridge arms are not usually turned on at the same time, because this would cause a short circuit. The working principle of the half-bridge circuit is to alternately turn on the two bridge arms to generate the required output voltage and current waveform. For example, in a half-bridge inverter, when one bridge arm is turned on, the other bridge arm should be in an off state to avoid a short circuit caused by current flowing directly back from the power supply.

[0037] In the embodiment, the first power terminal 31 is an AC terminal, the second power terminal 32 is a DC- terminal, and the third power terminal 37 is a DC+ terminal.

[0038] Specifically, when the power circuit of the second bridge arm structure 40 is turned on, the current flows from the third power terminal 37, flows to the drain of the second chip 42 through the second back plate 41, and flows out from the source of the second chip 42, and then flows out through the first power terminal 31.

[0039] As shown in Figure 1 The terminal assembly 30 further includes a plurality of second gate terminals 35, and the plurality of second gate terminals 35 are respectively and one-to-one connected in series with the gates of the plurality of second chips 42. By forming an electrically conductive connection between the gate of each second chip 42 and the corresponding second gate terminal 35, the driving voltage borne by each chip is not the same, and the driving voltage can be set according to the parameters of the second chip 42 itself. In this way, the second chip 42 can bear a reasonable current, and the electrical and thermal stress borne by the plurality of second chips 42 is more balanced, thereby avoiding damage to the second chip 42.

[0040] As shown in Figure 1As shown, the second bridge arm structure 40 further comprises a second PCB plate 43, the upper surfaces of the plurality of second chips 42 are respectively electrically connected with the second PCB plate 43, and the plurality of second gate terminals 35 are all arranged on the second PCB plate 43.

[0041] Specifically, when the driving circuit of the second bridge arm structure 40 is turned on, the current of the driving circuit flows through the second gate terminal 35, the internal circuit of the second PCB plate 43, the gate and the auxiliary source of the second chip 42, the internal circuit of the second PCB plate 43, and the second auxiliary source terminal 36 to form the driving circuit.

[0042] As shown in FIG. 1, the plurality of second chips 42 are arranged on the second source plate 31 in the length direction of the second source plate 31. Figure 1 As shown, the first bridge arm structure 20 and the second bridge arm structure 40 are arranged on the bottom plate 10 in sequence along the length direction of the bottom plate 10, and the second PCB plate 43 is located on the side of the second backing plate 41 away from the first backing plate 21. With the above structure, the space in the length direction of the bottom plate 10 can be fully utilized, and the space utilization rate is increased.

[0043] As shown in FIG. 1, the plurality of second chips 42 are arranged on the second source plate 31 in the length direction of the second source plate 31. Figure 1 As shown, the multi-terminal assembly 30 further comprises a second auxiliary source terminal 36, and the second auxiliary source terminal 36 is electrically connected with the auxiliary source of the plurality of second chips 42. The second auxiliary source terminal 36 can form a driving circuit with the second gate terminal 35 and the corresponding second chip 42 to provide a driving voltage for the second chip 42.

[0044] Among them, the first bridge arm structure 20 and the second bridge arm structure 40 are symmetrically arranged on the bottom plate 10.

[0045] In this embodiment, the upper surface of the second backing plate 41 is stacked with the second source backing plate, and the third conductive layer is arranged on the upper surface of the second source backing plate.

[0046] It should be noted that the terms used herein are only intended to describe specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, the singular form is intended to include the plural form unless the context clearly indicates otherwise, and it should also be understood that when the terms "comprise" and / or "include" are used in the specification, they indicate the presence of the features, steps, operations, devices, components and / or combinations thereof.

[0047] The foregoing description, for purposes of explanation, sets forth specific values and arrangements of components and steps that are subject to many variations in the light of specific circumstances and / or material or workpiece shapes. Such examples, while indicating preferred embodiments, are not intended to limit or restrict the various concepts taught herein. It will be appreciated that the dimensions of the parts shown in the drawings are not necessarily to scale, and have been shown as such for illustrative purposes only. Techniques, methods, and apparatus known to those of ordinary skill in the art can not be discussed in detail, but are contemplated as being part of the specification, where appropriate. In all examples shown and discussed herein, any specific values are to be interpreted as merely illustrative of the examples, and not as a limitation thereon. Thus, other examples of the exemplary embodiments can have different values. It is noted that like numbers and letters on the figures identify like parts throughout the disclosure, and thus, once an item is defined in one figure, it is not necessary to discuss it further in connection with other figures where it is shown and / or discussed.

[0048] In the description of the present application, it should be understood that the orientation words such as "front, back, up, down, left, right", "horizontal, vertical, perpendicular, horizontal" and "top, bottom" and the like indicated orientation or position relationship are usually based on the orientation or position relationship shown in the drawings, and only for the convenience of describing the present application and simplifying the description, without the opposite description, these orientation words do not indicate and imply that the indicated device or element must have a specific orientation or be constructed and operated in a specific orientation, therefore it cannot be understood as a limitation on the protection scope of the present application; the orientation words "inner, outer" refer to the inner and outer of the contour of each component itself.

[0049] For the convenience of description, spatial relative terms such as "on", "above", "upper surface", "upper" and the like can be used herein to describe the spatial position relationship of one device or feature with other devices or features as shown in the drawings. It should be understood that the spatial relative terms are intended to include different orientations in use or operation in addition to the orientation of the device described in the drawings. For example, if the device in the drawing is inverted, the device described as "above" or "on" other devices or structures will be positioned "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below" orientations. The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein are interpreted accordingly.

[0050] In addition, it should be noted that the use of the words "first", "second" and the like to define parts of components is only for the convenience of distinguishing the corresponding parts of components, and the above words have no special meaning unless otherwise stated, therefore it cannot be understood as a limitation on the protection scope of the present application.

[0051] The above merely describes preferred embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims

1. A power device, characterized by, The power device comprises: a bottom plate (10); a first bridge arm structure (20) comprising a first backing plate (21) and a plurality of first chips (22), the first backing plate (21) is arranged on the bottom plate (10), a first conductive layer is arranged on the upper surface of the first backing plate (21), and the drain of the first chip (22) is electrically connected with the first conductive layer; a terminal assembly (30) comprising a first power terminal (31), a second power terminal (32), a first auxiliary source terminal (34) and a plurality of first gate terminals (33), the first power terminal (31) and the second power terminal (32) are arranged on the first backing plate (21), the first power terminal (31) is electrically connected with the first conductive layer, the second power terminal (32) is conductively connected with the source of the first chip (22), a plurality of the first gate terminals (33) are respectively and one-to-one conductively connected with the gates of a plurality of the first chips (22), and the first auxiliary source terminal (34) is electrically connected with the auxiliary sources of a plurality of the first chips (22).

2. The power device of claim 1, wherein, The first bridge arm structure (20) further comprises a first PCB plate (23), the upper surfaces of a plurality of the first chips (22) are respectively electrically connected with the first PCB plate (23), and a plurality of the first gate terminals (33) and the first auxiliary source terminal (34) are arranged on the first PCB plate (23).

3. The power device of claim 2, wherein, The first PCB plate (23) is arranged on the first backing plate (21) or the bottom plate (10).

4. The power device of claim 1, wherein, The upper surface of the first backing plate (21) further has a second conductive layer which is arranged in an insulating manner with the first conductive layer, and the source of the first chip (22) and the second power terminal (32) are respectively electrically connected with the second conductive layer.

5. The power device of claim 4, wherein, The upper surface of the first backing plate (21) is stacked with a first source backing plate (24), and the second conductive layer is arranged on the upper surface of the first source backing plate (24).

6. The power device of claim 4, wherein, The power device further comprises a second bridge arm structure (40), the second bridge arm structure (40) comprises a second backing plate (41) and a plurality of second chips (42), the second backing plate (41) is arranged on the bottom plate (10), the upper surface of the second backing plate (41) has a third conductive layer, the second chip (42) is arranged on the second backing plate (41), the drain of the second chip (42) is electrically connected with the third conductive layer, the third conductive layer is electrically connected with the second conductive layer, and the terminal assembly (30) further comprises a third power terminal (37), the source of the second chip (42) is electrically connected with the third power terminal (37).

7. The power device of claim 6, wherein, The terminal assembly (30) further comprises a plurality of second gate terminals (35), and a plurality of the second gate terminals (35) are respectively and one-to-one connected in series with the gates of a plurality of the second chips (42).

8. The power device of claim 7, wherein, The second bridge arm structure (40) further comprises a second PCB plate (43), and upper surfaces of the plurality of second chips (42) are respectively electrically connected with the second PCB plate (43), and the plurality of second gate terminals (35) are all arranged on the second PCB plate (43).

9. The power device of claim 8, wherein, The first bridge arm structure (20) and the second bridge arm structure (40) are sequentially arranged on the bottom plate (10) along a length direction of the bottom plate (10), and the second PCB plate (43) is located on a side of the second backing plate (41) away from the first backing plate (21).

10. The power device of claim 7, wherein, The terminal assembly (30) further comprises a second auxiliary source terminal (36), and the second auxiliary source terminal (36) is electrically connected with auxiliary source terminals of the plurality of second chips (42).

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