Cooling structure of airborne dual-band satellite communication antenna

Abstract

The utility model discloses a cooling structure of an airborne dual-band satellite communication antenna, which comprises a first heat dissipation substrate, a second heat dissipation substrate, a first air cooling structure, a second air cooling structure, a first liquid cooling device and a second liquid cooling device, and is characterized in that the first heat dissipation substrate is connected to an antenna housing and is used for installing a first-band antenna body, and the second heat dissipation substrate is connected to the antenna housing and is used for installing a second-band antenna body. The first cooling structure is arranged on the first heat dissipation substrate and used for installing a second frequency band antenna body, the first air cooling structure is arranged on the first heat dissipation substrate and forms a first air cooling heat dissipation structure, the second air cooling structure is arranged on the second heat dissipation substrate and forms a second air cooling heat dissipation structure, and the first liquid cooling device is arranged on the first heat dissipation substrate and forms a first liquid cooling heat dissipation structure. The second liquid cooling device is arranged on the second heat dissipation substrate and forms a second liquid cooling heat dissipation structure. The two frequency band antenna bodies are independently installed through a split type design structure, high interchangeability is achieved, an air cooling heat dissipation structure and a liquid cooling heat dissipation structure are integrated, heat accumulation can be reduced, and the heat dissipation effect can be greatly improved through a double-heat-dissipation structure.

Description

TECHNICAL FIELD

[0001] The utility model relates to airborne satellite communication antenna thermal control technical field especially relates to a kind of cooling structure of airborne dual-band satellite communication antenna. BACKGROUND

[0002] Airborne satellite communication antenna is the important component of aircraft communication system, mainly including antenna cover and antenna body. With the rapid development of microelectronics technology and integrated circuit, airborne satellite communication antenna has the development trend of high performance and miniaturization, meanwhile, the environment where satellite communication antenna is located is more severe, heat flux density increases sharply, and the temperature of components is continuously rising, and thermal failure has become one of the main damage modes of satellite communication antenna.

[0003] At present, the industry adopts integrated heat dissipation form for the heat dissipation of airborne dual-band satellite communication antenna, and the two antennas adopt common heat dissipation substrate design, which has poor interchangeability. At the same time, the cooling method adopts liquid cooling or air cooling single heat dissipation, and the airborne environmental control mainly uses fuel as heat sink. The heat dissipation effect of satellite communication antenna is affected by the fuel quantity and fuel temperature of the aircraft, and in serious cases, there is a liquid cooling failure. UTILITY MODEL CONTENT

[0004] The embodiment of the application provides a cooling structure of airborne dual-band satellite communication antenna, which is used for improving the heat dissipation effect of the antenna.

[0005] The embodiment of the application provides a cooling structure of airborne dual-band satellite communication antenna, which comprises:

[0006] The first heat dissipation substrate is connected to the antenna cover and is used for mounting the first frequency band antenna body.

[0007] The second heat dissipation substrate is connected to the antenna cover and is used for mounting the second frequency band antenna body.

[0008] The first air cooling structure is arranged on the first heat dissipation substrate and forms a first air cooling heat dissipation structure.

[0009] The second air cooling structure is arranged on the second heat dissipation substrate and forms a second air cooling heat dissipation structure.

[0010] The first liquid cooling device is arranged on the first heat dissipation substrate and forms a first liquid cooling heat dissipation structure.

[0011] The second liquid cooling device is arranged on the second heat dissipation substrate and forms a second liquid cooling heat dissipation structure.

[0012] The above-mentioned embodiment has the beneficial effects that the cooling structure of airborne dual-band satellite communication antenna has high interchangeability by the split design structure when in use, two frequency band antenna bodies are independently installed, and air cooling and liquid cooling heat dissipation structures are integrated on different heat dissipation substrates, which can not only reduce heat accumulation, but also greatly improve the heat dissipation effect.

[0013] On the basis of the above-mentioned embodiments, the embodiments of the present application can also be improved as follows:

[0014] In one of the embodiments of the present application, the first air cooling structure comprises: a first air cooling flow channel arranged on one side surface of the first heat dissipation substrate; and a first air fan arranged at one end of the first air cooling flow channel, and the first air fan is used to discharge the gas in the first air cooling flow channel. The beneficial effect of this step is that the heat of the first-band antenna body is taken away by the airflow in the first air cooling flow channel.

[0015] In one of the embodiments of the present application, the first air cooling flow channel is a multi-section structure, and each section structure has a first mixing flow space therebetween. The beneficial effect of this step is that the gas in the first flow channel is mixed by the first mixing flow space, so as to ensure the uniformity of the heat dissipation effect in the flow channel.

[0016] In one of the embodiments of the present application, the second air cooling structure comprises: a second air cooling flow channel arranged on one side surface of the second heat dissipation substrate; and a second air fan arranged at one end of the second air cooling flow channel, and the second air fan is used to discharge the gas in the second air cooling flow channel. The beneficial effect of this step is that the heat of the second-band antenna body is taken away by the airflow in the second air cooling flow channel.

[0017] In one of the embodiments of the present application, the second air cooling flow channel is a multi-section structure, and each section structure has a second mixing flow space therebetween. The beneficial effect of this step is that the gas in the second flow channel is mixed by the second mixing flow space, so as to ensure the uniformity of the heat dissipation effect in the flow channel.

[0018] In one of the embodiments of the present application, the first liquid cooling device comprises a first liquid cooling flow channel arranged on the first heat dissipation substrate, and the second liquid cooling device comprises a second liquid cooling flow channel arranged on the second heat dissipation substrate, the first liquid cooling flow channel has a first liquid cooling branch A and a first liquid cooling branch B connected in series, the first liquid cooling branch A is connected with a total liquid inlet, and the first liquid cooling branch B is connected with a total liquid outlet after forming a parallel structure with the second liquid cooling flow channel. The beneficial effect of this step is that the parallel connection relationship between the second liquid cooling flow channel and the partial structure of the first liquid cooling flow channel is formed, so as to avoid the heat accumulation effect in the second liquid cooling flow channel, thereby improving the heat dissipation effect of the second-band antenna.

[0019] In one of the embodiments of the present application, the first heat dissipation substrate is provided with first heat dissipation fins, and the second heat dissipation substrate is provided with second heat dissipation fins. The beneficial effect of this step is that the heat dissipation fins improve the heat dissipation effect of the first heat dissipation substrate and the second heat dissipation substrate.

[0020] In one of the embodiments of the present application: further comprising: a first heat pipe arranged on the first heat dissipation substrate, one end of the first heat pipe extending to below the first air cooling flow channel.

[0021] In one of the embodiments of the present application: further comprising: a second heat pipe arranged on the second heat dissipation substrate, one end of the second heat pipe extending to below the second air cooling flow channel. BRIEF DESCRIPTION OF DRAWINGS

[0022] In order to more clearly illustrate the specific embodiments of the present application or the technical solutions in the prior art, the drawings needed in the specific embodiments or prior art description will be briefly introduced below. In all the drawings, similar elements or parts are generally identified by similar reference numerals. In the drawings, the elements or parts are not necessarily drawn according to the actual scale.

[0023] Figure 1 It is a top view of the cooling structure of the airborne dual-band satellite communication antenna;

[0024] Figure 2 It is a partial structure top view of the cooling structure of the airborne dual-band satellite communication antenna;

[0025] Figure 3 It is a partial structure three-dimensional view of the cooling structure of the airborne dual-band satellite communication antenna;

[0026] Figure 4 It is a structure schematic view of the first liquid cooling flow channel and the second liquid cooling flow channel;

[0027] Figure 5 It is a structure schematic view of the receiving active antenna array surface and the transmitting active antenna array surface arranged on the first heat pipe or the second heat pipe.

[0028] In the drawings: 1 is a first heat dissipation substrate, 2 is a second heat dissipation substrate, 3 is an antenna cover, 4 is a first air cooling flow channel, 401 is a first mixing space, 5 is a first air fan, 6 is a second air cooling flow channel, 601 is a second mixing space, 7 is a second air fan, 8 is a first liquid cooling flow channel, 801 is a first liquid cooling branch A, 802 is a first liquid cooling branch B, 803 is a total liquid inlet, 804 is a total liquid outlet, 805 is a first liquid outlet, 806 is a first liquid inlet, 9 is a second liquid cooling flow channel, 901 is a second liquid inlet, 902 is a second liquid outlet, 10 is a first heat dissipation fin, 11 is a second heat dissipation fin, 12 is a first heat pipe, and 13 is a second heat pipe. DETAILED DESCRIPTION

[0029] In the present application, unless otherwise explicitly specified and limited, the terms in the present application should be understood in a broad sense, such as the connection can be fixed connection, can also be detachable connection or integral, can be directly connected, or indirectly connected through intermediate medium. For those skilled in the art, the specific meaning of different terms in the present application can be understood according to the specific circumstances, and the scope of the specific meaning should be limited to the function of the present application.

[0030] In the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, and does not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, therefore it cannot be understood as a limitation of the present application.

[0031] As shown in Figures 1-4 , a cooling structure of an airborne dual-band satellite communication antenna, comprising: a first heat dissipation substrate 1, a second heat dissipation substrate 2, a first air cooling structure, a second air cooling structure, a first liquid cooling device, a second liquid cooling device, the first heat dissipation substrate 1 is connected to the antenna cover 3 and is used for mounting the first frequency band antenna body, the second heat dissipation substrate 2 is connected to the antenna cover 3 and is used for mounting the second frequency band antenna body, the first air cooling structure is arranged on the first heat dissipation substrate 1 and forms a first air cooling heat dissipation structure, the second air cooling structure is arranged on the second heat dissipation substrate 2 and forms a second air cooling heat dissipation structure, the first liquid cooling device is arranged on the first heat dissipation substrate 1 and forms a first liquid cooling heat dissipation structure, and the second liquid cooling device is arranged on the second heat dissipation substrate 2 and forms a second liquid cooling heat dissipation structure.

[0032] Specifically, as shown in Figure 2 , 3 , one side surface of the first heat dissipation substrate 1 is surrounded by a stand plate and a cover plate to form a mounting space for the main control module, the frequency conversion module and the power supply module, and the first air cooling structure is located outside the mounting space and adjacent to the stand plate; the same side surface of the second heat dissipation substrate 2 is surrounded by a stand plate and a cover plate to form a mounting space for the frequency conversion module and the power supply module, and the second air cooling structure is located outside the mounting space and adjacent to the stand plate; the antenna cover 3 is the aircraft skin.

[0033] Specifically, as shown in Figure 2 , 3 , the first air cooling structure comprises: a first air cooling flow channel 4 and a first air fan 5, the first air cooling flow channel 4 is arranged on one side surface of the first heat dissipation substrate 1, and the first air fan 5 is arranged at one end of the first air cooling flow channel 4, and the first air fan 5 is used to exhaust the gas in the first air cooling flow channel 4. The heat of the first frequency band antenna body is taken away by the airflow in the first air cooling flow channel 4.

[0034] Specifically, as shown in Figure 2 , 3 , the first air cooling flow channel 4 is a plurality of cooling air channels formed by a plurality of heat dissipation plates arranged in parallel, one side port of the first air cooling flow channel 4 is an open structure, and the other side port and the upper side are closed structures formed by sealing plates, the sealing plates at the closed ports are provided with through holes, and the first fan 5 is installed at the through holes to exhaust the gas in the flow channel through the first fan 5.

[0035] Specifically, as shown in Figure 2 , 3 , the second air cooling structure includes a second air cooling flow channel 6 and a second fan 7, the second air cooling flow channel 6 is arranged on one side surface of the second heat dissipation substrate 2, and the second fan 7 is arranged at one end of the second air cooling flow channel 6. The second fan 7 is used to exhaust the gas in the second air cooling flow channel 6. The heat of the second frequency band antenna body is taken away by the airflow in the second air cooling flow channel 6.

[0036] Specifically, as shown in Figure 2 , 3 , the second air cooling flow channel 6 is a cooling air channel formed by a plurality of heat dissipation plates arranged in parallel, one side port of the second air cooling flow channel 6 is an open structure, and the other side port and the upper side are closed structures formed by sealing plates, the sealing plates at the closed ports are provided with through holes, and the second fan 7 is installed at the through holes to exhaust the gas in the flow channel through the second fan 7.

[0037] Specifically, as shown in Figure 2 , 3 , the first air cooling flow channel 4 is a multi-section structure, and each section of the structure has a first mixing space 401. The gas in the first flow channel is mixed through the first mixing space 401 to ensure the uniformity of the heat dissipation effect in the flow channel.

[0038] Specifically, as shown in Figure 2 , 3 , the second air cooling flow channel 6 is a multi-section structure, and each section of the structure has a second mixing space 601. The gas in the second flow channel is mixed through the second mixing space 601 to ensure the uniformity of the heat dissipation effect in the flow channel.

[0039] Specifically, as shown in Figure 1 , 4As shown, the first liquid cooling device includes a first liquid cooling flow channel 8 arranged on the first heat dissipation substrate 1, and the second liquid cooling device includes a second liquid cooling flow channel 9 arranged on the second heat dissipation substrate 2. The first liquid cooling flow channel 8 has a first liquid cooling branch A 801 and a first liquid cooling branch B 802 connected in series. The first liquid cooling branch A 801 is connected with a total liquid inlet 803, and the first liquid cooling branch B 802 is connected with the total liquid outlet 804 after forming a parallel structure with the second liquid cooling flow channel 9. By forming a parallel connection relationship between the second liquid cooling flow channel 9 and the first liquid cooling flow channel 8, the heat accumulation effect in the second liquid cooling flow channel 9 is avoided, so as to improve the heat dissipation effect of the second frequency band antenna.

[0040] Specifically, as shown in Figure 1 , 4 , the first liquid cooling flow channel 8 and the second liquid cooling flow channel 9 are both multi-channel S-shaped bending structures. One end of the first liquid cooling branch A 801 is communicated with the first liquid cooling branch B 802, and the other end of the first liquid cooling branch A 801 is communicated with the total liquid inlet 803. The connection position of the first liquid cooling branch A 801 and the first liquid cooling branch B 802 is configured with a first liquid outlet 805 after leading out a liquid cooling channel. The second liquid cooling channel is configured with a second liquid inlet 901 corresponding to the first liquid outlet 805. The first liquid outlet 805 and the second liquid inlet 901 are communicated through a pipeline. The other end of the second liquid cooling channel is configured with a second liquid outlet 902. The other end of the first liquid cooling branch B 802 is configured with a first liquid inlet 806 corresponding to the second liquid outlet 902. The first liquid inlet 806 is communicated with the second liquid outlet 902 through a pipeline. The end of the first liquid cooling branch B 802 communicated with the second liquid outlet 902 is configured with a total liquid outlet 804 after leading out a liquid cooling channel. The total liquid inlet 803 and the total liquid outlet 804 are both connected with a liquid cooling connector, and are connected in series into a liquid cooling system of an airplane through the liquid cooling connector.

[0041] Specifically, as shown in Figure 2 , the first heat dissipation substrate 1 is configured with a first heat dissipation fin 10, and the second heat dissipation substrate 2 is configured with a second heat dissipation fin 11. The heat dissipation fins improve the heat dissipation effect of the first heat dissipation substrate 1 and the second heat dissipation substrate 2.

[0042] Specifically, as shown in Figure 5 , the cooling structure further includes a first heat pipe 12 arranged on the first heat dissipation substrate 1. One end of the first heat pipe 12 extends to below the first air cooling flow channel 4. The receiving active antenna array and the transmitting active antenna array in the first frequency band antenna body conduct heat to the first air cooling flow channel 4 through the first heat pipe 12. The first heat pipe 12 improves the heat dissipation efficiency.

[0043] Specifically, as shown in Figure 5As shown, the cooling structure further comprises: a second heat pipe 13, the second heat pipe 13 is arranged on the second heat dissipation substrate 2, one end of the second heat pipe 13 extends to below the second air cooling flow channel 6, and the active antenna array surface received in the second frequency band antenna body and the active antenna array surface for emitting are conducted to the second air cooling flow channel 6 through the second heat pipe 13. The heat dissipation efficiency is improved through the second heat pipe 13.

[0044] Specifically, the first heat pipe 12 and the second heat pipe 13 are purchased parts, which can be copper pipes or copper pipes filled with phase change liquid; the first heat pipe 12 and the main body of the first air cooling flow channel 4 are in a vertical structure, and the second heat pipe 13 and the main body of the second air cooling flow channel 6 are in a vertical structure, so as to shorten the heat conduction path and improve the heat dissipation effect.

[0045] The scheme adopts independent design in the dual-frequency satellite communication antenna body, and each of the two types of antenna bodies is equipped with a set of liquid cooling and air cooling heat dissipation system, the two types of antenna bodies are LRU units, and have good interchangeability.

[0046] The liquid cooling and air cooling mixed heat dissipation form is adopted in the heat dissipation system of each antenna body, a plurality of heat pipes are arranged between the air cooling flow channel and the heat source, the heat generated by the heat source can be quickly transmitted to the air cooling flow channel and taken away by the fan, and the liquid cooling flow channel is further used to dissipate heat and take away heat, so that the scheme has the characteristics of good reliability and high heat dissipation efficiency.

[0047] The above is only an embodiment of the present application, and the specific structure and characteristics of the scheme and the like are not described in detail, the ordinary technical personnel in the art know all the ordinary technical knowledge in the technical field of the present application before the application date or the priority date, can know all the prior art in the field and have the ability to apply conventional experimental means before the date, and the ordinary technical personnel in the art can improve and implement the scheme under the inspiration of the present application, some typical known structures or known methods should not be an obstacle for the ordinary technical personnel to implement the present application. It should be pointed out that, for the technical personnel in the art, without departing from the structure of the present application, a number of modifications and improvements can be made, which should also be regarded as the protection scope of the present application, and these will not affect the effect and practicality of the present application.

Claims

1. A cooling structure for an airborne dual-band SATCOM antenna, comprising: The application relates to a heat dissipation device for an antenna, which comprises the following: a first heat dissipation substrate connected to a radome and used for mounting a first frequency band antenna body; a second heat dissipation substrate connected to the radome and used for mounting a second frequency band antenna body; a first air cooling structure arranged on the first heat dissipation substrate and forming a first air cooling heat dissipation structure; a second air cooling structure arranged on the second heat dissipation substrate and forming a second air cooling heat dissipation structure; a first liquid cooling device arranged on the first heat dissipation substrate and forming a first liquid cooling heat dissipation structure; a second liquid cooling device arranged on the second heat dissipation substrate and forming a second liquid cooling heat dissipation structure.

2. The cooling structure according to claim 1, characterized by The first air cooling structure comprises: a first air cooling flow channel arranged on one side surface of the first heat dissipation substrate; a first air fan arranged at one end of the first air cooling flow channel, which is used for discharging gas in the first air cooling flow channel.

3. The cooling structure according to claim 2, characterized by The first air cooling flow channel is a multi-section structure, and each section structure has a first mixing space.

4. The cooling structure according to claim 1, characterized by The second air cooling structure comprises: a second air cooling flow channel arranged on one side surface of the second heat dissipation substrate; a second air fan arranged at one end of the second air cooling flow channel, which is used for discharging gas in the second air cooling flow channel.

5. The cooling structure according to claim 4, characterized by The second air cooling flow channel is a multi-section structure, and each section structure has a second mixing space.

6. The cooling structure according to claim 1, characterized by The first liquid cooling device comprises a first liquid cooling flow channel arranged on the first heat dissipation substrate, and the second liquid cooling device comprises a second liquid cooling flow channel arranged on the second heat dissipation substrate; the first liquid cooling flow channel has a first liquid cooling branch A and a first liquid cooling branch B connected in series; the first liquid cooling branch A is connected with a total liquid inlet; the first liquid cooling branch B is connected with a total liquid outlet after forming a parallel structure with the second liquid cooling flow channel.

7. The cooling structure according to claim 1, characterized by The first heat dissipation substrate is provided with first heat dissipation fins, and the second heat dissipation substrate is provided with second heat dissipation fins.

8. The cooling structure according to claim 2, characterized by The application further comprises: a first heat pipe arranged on the first heat dissipation substrate, one end of the first heat pipe extending to below the first air cooling flow channel.

9. The cooling structure according to claim 4, characterized by The application further comprises: a second heat pipe arranged on the second heat dissipation substrate, one end of the second heat pipe extending to below the second air cooling flow channel.

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