Circuit board and terminal product

Abstract

The utility model discloses a circuit board and a terminal product. The circuit board comprises a double-sided substrate, a first antenna, a second antenna and a decoupling assembly. The double-sided substrate comprises a top layer and a bottom layer, the top layer is the upper surface of the double-sided substrate, and the bottom layer is the lower surface of the double-sided substrate. The first antenna and the second antenna are arranged on two sides of the double-sided substrate, the first antenna is electrically connected to the bottom layer, and the second antenna is electrically connected to the top layer. Wherein a copper foil is arranged in the top layer to form the ground, a groove is arranged on the copper foil forming the ground, and the groove is arranged between the first antenna and the second antenna. The decoupling assembly is realized by arranging a copper foil on the bottom layer, the decoupling assembly is arranged between the first antenna and the second antenna, and the decoupling assembly is configured to form a resonance network to absorb emission signals of the first antenna and the second antenna. Through the above mode, the isolation degree between the antennas is large, and the signal transmission efficiency is improved.

Description

TECHNICAL FIELD

[0001] Embodiments of the present application relate to the technical field of electronic circuit, in particular to a circuit board and a terminal product. BACKGROUND

[0002] With the development of mobile terminal or wireless terminal technology, the wireless throughput of various terminal products (such as mobile phones) is getting larger and larger, while the size of the circuit board in the terminal product cannot be increased, at the same time, the number of antennas is also increasing, such as mobile phone products need to support 2G, 3G, 4G, 5G, WiFi and Bluetooth, and also need to support MIMO (Multiple-Input Multiple-Output), based on the above factors, the distance between the antennas is close, the influence degree between different antennas is deep, and the signal transmission efficiency between the antennas is low.

[0003] At present, a discrete component is usually used to form an antenna decoupling network, for example, as shown in Figure 1 , an antenna decoupling network is formed by five capacitors and two inductors to increase the isolation degree between the antennas, thereby reducing the influence degree between different antennas. However, the isolation degree increased by this method is small, resulting in a still low signal transmission efficiency between the antennas. CONTENT OF THE INVENTION

[0004] Embodiments of the present application provide a circuit board and a terminal product, which can have a large isolation degree between the antennas and improve the signal transmission efficiency.

[0005] In a first aspect, embodiments of the present application provide a circuit board, comprising:

[0006] a double-sided substrate, the double-sided substrate comprising a top layer and a bottom layer, the top layer being an upper surface of the double-sided substrate, and the bottom layer being a lower surface of the double-sided substrate;

[0007] a first antenna and a second antenna, the first antenna and the second antenna being arranged on two sides of the double-sided substrate, and the first antenna being electrically connected to the top layer, and the second antenna being electrically connected to the bottom layer;

[0008] wherein a copper foil is arranged in the top layer to form a ground, and a groove is arranged on the copper foil forming the ground, the groove being arranged between the first antenna and the second antenna;

[0009] a decoupling component, the decoupling component being realized by arranging a copper foil on the bottom layer, the decoupling component being arranged between the first antenna and the second antenna, and the decoupling component being configured to form a resonance network to absorb the transmission signals of the first antenna and the second antenna.

[0010] In one or more embodiments, the decoupling component includes a first connecting segment, a second connecting segment and a third connecting segment formed by copper foils, the second connecting segment is electrically connected with the first connecting segment and the third connecting segment respectively by copper foils;

[0011] The first connecting segment is in an inverted L shape, the second connecting segment is in an M shape, and the third connecting segment is in a π shape.

[0012] In one or more embodiments, the circuit board further includes a first pad, a second pad and a third pad disposed on the top layer;

[0013] The first pad is connected with a fixed pin of the first antenna, the second pad is electrically connected with a signal pin of the first antenna, and the third pad is electrically connected with a ground pin of the first antenna.

[0014] In one or more embodiments, the circuit board further includes a fourth pad, a fifth pad and a first decoupling circuit disposed on the top layer;

[0015] The fourth pad is short-circuited with the third pad, the first decoupling circuit is electrically connected between the fourth pad and the fifth pad, and the fifth pad is electrically connected to the ground, wherein the first decoupling circuit is used to reduce electromagnetic interference between the first antenna and other elements on the circuit board except the first antenna.

[0016] In one or more embodiments, the first decoupling circuit includes at least one discrete element, and the discrete element is a resistor, a capacitor or an inductor.

[0017] When the first decoupling circuit includes at least two discrete elements, each of the discrete elements is connected in series or in parallel.

[0018] In one or more embodiments, the circuit board further includes a sixth pad, a seventh pad and an eighth pad disposed on the bottom layer;

[0019] The sixth pad is connected with a fixed pin of the second antenna, the seventh pad is electrically connected with a signal pin of the second antenna, and the eighth pad is electrically connected with a ground pin of the second antenna.

[0020] In one or more embodiments, the circuit board further includes a ninth pad, a tenth pad and a second decoupling circuit disposed on the bottom layer;

[0021] The ninth pad is short-circuited with the eighth pad, the second decoupling circuit is electrically connected between the ninth pad and the tenth pad, and the tenth pad is electrically connected to the ground, wherein the second decoupling circuit is used to reduce electromagnetic interference between the second antenna and other elements on the circuit board except the second antenna.

[0022] In one or more embodiments, the second decoupling circuit comprises at least one discrete component, the discrete component being a resistor, a capacitor or an inductor.

[0023] When the second decoupling circuit comprises at least two discrete components, each of the discrete components is connected in series or in parallel.

[0024] In one or more embodiments, the first antenna is a PCB antenna or a ceramic antenna, and the second antenna is a PCB antenna or a ceramic antenna.

[0025] In a second aspect, the embodiments of the present application provide a terminal product comprising the circuit board as described above.

[0026] The beneficial effects of the present application are as follows: the circuit board of the embodiments of the present application comprises a double-sided substrate, a first antenna, a second antenna and a decoupling component. The double-sided substrate comprises a top layer and a bottom layer, the top layer being an upper surface of the double-sided substrate, and the bottom layer being a lower surface of the double-sided substrate. The first antenna and the second antenna are arranged on two sides of the double-sided substrate, and the first antenna is electrically connected to the bottom layer, and the second antenna is electrically connected to the top layer. A copper foil is arranged in the top layer to form a ground, and a groove is arranged on the copper foil forming the ground, the groove being arranged between the first antenna and the second antenna. The decoupling component is realized by arranging a copper foil on the bottom layer, the decoupling component being arranged between the first antenna and the second antenna, and the decoupling component being configured to form a resonance network to absorb the emitted signals of the first antenna and the second antenna. In this way, the decoupling process can be realized on the top layer and the bottom layer respectively to increase the isolation between the antennas. Moreover, compared with the related art in which discrete components are used to form an antenna decoupling network, the isolation increased by the present application is more, so that the antennas have a large isolation, which is conducive to improving the signal transmission efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0027] One or more embodiments are exemplarily illustrated by the pictures in the drawings corresponding thereto, and the exemplarily illustrations do not configure the limitation of the embodiments, and the elements with the same reference numerals in the drawings represent the similar elements.

[0028] Figure 1 is a circuit structure schematic diagram of an antenna decoupling network in the related art;

[0029] Figure 2 is a structure schematic diagram of a circuit board provided by the embodiments of the present application;

[0030] Figure 3 is Figure 2 is a schematic diagram of the top layer of a double-layer substrate and the structure arranged on the top layer;

[0031] Figure 4 isFigure 2 A schematic diagram of the bottom layer of a double-layer substrate and the structure provided on the bottom layer is shown. DETAILED DESCRIPTION

[0032] To make the objectives, technical solutions, and advantages of the embodiments of the present application more clear, the technical solutions in the embodiments of the present application will be described in detail below in conjunction with the accompanying drawings. Obviously, the described embodiments are only part of the embodiments of the present application, not all of them. It should be understood that the specific embodiments described herein are only used to explain the present application and are not intended to limit the present application.

[0033] It should be noted that, when an element is referred to as being “connected to” another element, it may be directly connected to the other element, or one or more intervening elements may exist therebetween.

[0034] In addition, the technical features involved in the various embodiments of the present application described below can be combined with each other as long as there is no structural conflict between them.

[0035] In related technologies, in order to solve the problem that different antennas have a greater degree of influence on each other due to the close distance between the antennas, thereby resulting in low signal transmission efficiency between the antennas, an antenna decoupling network composed of discrete components is usually provided.

[0036] For example, Figure 1 The antenna decoupling network 2000 shown includes five capacitors and two inductors. The five capacitors include a first decoupling capacitor CA1, a second decoupling capacitor CA2, a third decoupling capacitor CA3, a fourth decoupling capacitor CA4 and a fifth decoupling capacitor CA5; the two inductors include a first decoupling inductor LA1 and a second decoupling inductor LA2. The antenna ANT11 is electrically connected to the first end of the second decoupling capacitor CA2, the second end of the second decoupling capacitor CA2 is electrically connected to the first end of the first decoupling capacitor CA1 and the first end of the first decoupling inductor LA1 respectively, the second end of the first decoupling capacitor CA1 is grounded GND, the second end of the first decoupling inductor LA1 is electrically connected to the first end of the fifth decoupling capacitor CA5, the second end of the fifth decoupling capacitor CA5 is electrically connected to the first end of the second decoupling inductor LA2, the second end of the second decoupling inductor LA2 is electrically connected to the first end of the fourth decoupling capacitor CA4 and the first end of the third decoupling capacitor CA3 respectively, the second end of the fourth decoupling capacitor CA4 is grounded GND, and the second end of the third decoupling capacitor CA3 is electrically connected to the antenna ANT12.

[0037] Specifically, the decoupling network composed of the first decoupling capacitor CA1, the second decoupling capacitor CA2, the third decoupling capacitor CA3, the fourth decoupling capacitor CA4, the fifth decoupling capacitor CA5, the first decoupling inductor LA1 and the second decoupling inductor LA2 can reduce the coupling between the antenna ANT11 and the antenna ANT12, and further reduce the mutual influence between the antenna ANT11 and the antenna ANT12 without affecting the performance of the antenna ANT11 and the antenna ANT12. However, the isolation degree increased by this way is small, resulting in a still low signal transmission efficiency between the antennas. For example, in some embodiments, the distance between the antenna ANT11 and the antenna ANT12 (taking the case that both the antenna ANT11 and the antenna ANT12 are antennas of the 2.4 GHz frequency band as an example) is only about 20 mm, although the antenna decoupling network 2000 is added, the isolation degree is only 10 dB, which is low and cannot meet the chip specified isolation degree requirement.

[0038] The isolation degree between two antennas corresponds to the signal transmission efficiency between the two antennas, the higher the isolation degree, the higher the signal transmission efficiency, and the lower the isolation degree, the lower the signal transmission efficiency. The isolation degree is represented by the ratio between the transmission intensity and the reception intensity between the two antennas, and the unit is usually dB.

[0039] Secondly, Figure 1 The bandwidth realized by the way shown in the figure is small, and the decoupling of the antennas supporting different frequency bands (such as the 2.4 GHz to 2.5 GHz frequency band and the 5.15 GHz to 5.85 GHz frequency band) cannot be realized at the same time to increase the isolation degree. In other words, Figure 1 The way shown in the figure can usually only realize the decoupling of the antennas of one frequency band to increase the isolation degree.

[0040] Based on this, the embodiments of the present application provide a circuit board, which usually realizes the decoupling of the antennas in two different ways to increase more isolation degree; and realizes the decoupling of the antennas of different frequency bands by two different ways to realize the decoupling of the antennas supporting different frequency bands.

[0041] Please refer to Figures 2-4 , Figure 2 for the structural schematic diagram of the circuit board provided by the embodiments of the present application; Figure 3 for Figure 2 the structural schematic diagram of the top layer of the double-layer substrate and the structure arranged on the top layer; Figure 4 for Figure 2 the structural schematic diagram of the bottom layer of the double-layer substrate and the structure arranged on the bottom layer.

[0042] As Figures 2-4As shown, the circuit board 1000 comprises a double-sided substrate 100, a first antenna ANT21, a second antenna ANT22 and a decoupling component 200.

[0043] The double-sided substrate 100 comprises a top layer 101 and a bottom layer 102. The top layer 101 is an upper surface of the double-sided substrate 100, and the bottom layer 102 is a lower surface of the double-sided substrate 100. Both the top layer 101 and the bottom layer 102 can be used to set copper foils to connect resistors, capacitors and other elements. In some embodiments, electrical connection between the top layer 101 and the bottom layer 102 can also be achieved through vias. For example, in some specific embodiments, copper foils are set in the top layer 101 to form a ground, and the bottom layer 102 can be electrically connected to the ground of the top layer 101 through vias.

[0044] The first antenna ANT21 and the second antenna ANT22 are arranged on two sides of the double-sided substrate 100. In this embodiment, the first antenna ANT21 is arranged on the left side of the double-sided substrate 100, and the second antenna ANT22 is arranged on the right side of the double-sided substrate 100. The first antenna ANT21 is electrically connected to the top layer 101, and the second antenna ANT22 is electrically connected to the bottom layer 102.

[0045] In some embodiments, the first antenna ANT21 is a PCB antenna or a ceramic antenna, and the second antenna ANT22 is a PCB antenna or a ceramic antenna. A PCB (Printed Circuit Board) antenna is an antenna directly integrated on a circuit board. PCB antennas include patch antennas, inverted-F antennas (IFA) and loop antennas, etc.

[0046] In this embodiment, copper foils are set in the top layer 101 to form a ground GND, and a groove 1011 is arranged on the copper foils forming the ground GND. The groove 1011 is arranged between the first antenna ANT21 and the second antenna ANT22. By setting the groove 1011, the coupling path between the signal of the ground GND of the first antenna ANT21 and the signal of the ground GND of the second antenna ANT22 can be separated from each other, thereby achieving decoupling and improving the isolation between the first antenna ANT21 and the second antenna ANT22.

[0047] The decoupling component 200 is implemented by disposing a copper foil on the bottom layer 102, and is disposed between the first antenna ANT21 and the second antenna ANT22. The decoupling component 200 is configured to form a resonance network (since the decoupling component 200 is a copper foil, there is a parasitic capacitance and / or a parasitic inductance between the copper foil and the substrate, so that a resonance network can be formed) to absorb the transmitted signals of the first antenna ANT21 and the second antenna ANT22, so that the transmitted signals of the first antenna ANT21 are reduced when reaching the second antenna ANT22, and the transmitted signals of the second antenna ANT22 are also reduced when reaching the first antenna ANT21, so that the decoupling purpose is achieved, and the isolation between the first antenna ANT21 and the second antenna ANT22 is improved.

[0048] In summary, the decoupling process can be implemented on the top layer 101 and the bottom layer 102 respectively to increase the isolation between the antennas. Moreover, compared with the related art in which a separate component is used to form an antenna decoupling network, the isolation can be increased more by using two different ways to increase the isolation in the present application. For example, for the above embodiment, that is, the distance between the antenna ANT11 and the antenna ANT12 (for example, the antenna ANT11 and the antenna ANT12 are both 2.4 GHz frequency band antennas) is only about 20 mm, by using the way provided by the present application, the isolation can be increased to 20 dB. As can be seen, the embodiment of the present application can make the isolation between the antennas larger, which is beneficial to improve the signal transmission efficiency.

[0049] Secondly, the decoupling of the antennas of different frequency bands is implemented by two different ways, for example, the way of disposing the groove 1011 on the copper foil forming the ground GND to implement the decoupling of the antennas of the 2.4 GHz to 2.5 GHz frequency band, and the decoupling component 200 is configured to implement the decoupling of the antennas of the 5.15 GHz to 5.85 GHz frequency band, so that the decoupling of the antennas supporting different frequency bands can be implemented.

[0050] In an embodiment, as shown in FIG. 10, the circuit board 1000 further includes a first pad PAD1, a second pad PAD2 and a third pad PAD3 disposed on the bottom layer 101. Figure 3

[0051] It can be understood that in the embodiment of the present application, each pad (including the first pad PAD1 to the tenth pad PAD10) is a metal contact point on the double-sided substrate 100 for connecting the pins of electronic components. The pads include through-hole pads, surface mount pads, via hole pads, etc.

[0052] ​Among them, the first pad PAD1 is connected to the fixed pin of the first antenna ANT21 to fix the first antenna ANT21. The second pad PAD2 is electrically connected to the signal pin of the first antenna ANT21. The signal pin of the first antenna ANT21 can be responsible for transmitting the signal captured by the antenna to the RF module or microcontroller, or sending the signal from the RF module to the antenna; the signal pin of the first antenna ANT21 can also ensure the impedance matching between the antenna and the circuit board to help reduce signal reflection and loss and improve transmission efficiency. The third pad PAD3 is electrically connected to the ground pin of the first antenna ANT21. The ground pin of the first antenna ANT21 can provide a stable reference voltage for the antenna to ensure the correct transmission of the signal; it can also form a complete signal path together with the signal pin to ensure that the current can flow from the antenna through the substrate and then return to the antenna; it can also help suppress electromagnetic interference (EMI) and improve the electromagnetic compatibility of the system.

[0053] In this embodiment, the circuit board 1000 further includes a fourth pad PAD4 , a fifth pad PAD4 , and a first decoupling circuit 300 disposed on the bottom board 101 .

[0054] The fourth pad PAD4 is short-circuited with the third pad PAD3, the first decoupling circuit 300 is electrically connected between the fourth pad PAD4 and the fifth pad PAD5, and the fifth pad PAD5 is electrically connected to the ground GND, wherein the first decoupling circuit 30 is used to reduce electromagnetic interference between the first antenna ANT21 and other components on the circuit board 1000 other than the first antenna ANT21 (such as the second antenna ANT22).

[0055] In one embodiment, the first decoupling circuit 300 includes at least one discrete component, and the discrete component is a resistor, a capacitor, or an inductor.

[0056] When the first decoupling circuit 300 includes at least two discrete components, the discrete components are connected in series or in parallel. For example, in some specific embodiments, the first decoupling circuit 300 includes a capacitor and a resistor connected in parallel. By adjusting the parameters of the capacitor and the resistor, the electromagnetic interference between the first antenna ANT21 and other components can be reduced to deepen the degree of decoupling, thereby increasing the isolation and improving the signal transmission efficiency.

[0057] In one embodiment, if Figure 4 As shown, the decoupling component 200 includes a first connecting segment 201, a second connecting segment 202 and a third connecting segment 203 formed of copper foil. The second connecting segment 202 is also electrically connected to the first connecting segment 201 and the third connecting segment 203 through the copper foil.

[0058] The first connecting section 201 is in an inverted L shape, the second connecting section 202 is in an M shape, and the third connecting section 203 is in a π shape.

[0059] It can be understood that the embodiment only exemplarily shows one shape of the decoupling assembly 200, and in other embodiments, the decoupling assembly 200 can also be provided in other shapes as long as it can form a resonant network to absorb the transmission signals of the first antenna ANT21 and the second antenna ANT22.

[0060] In this embodiment, the circuit board 1000 further comprises a sixth pad PAD6, a seventh pad PAD7 and an eighth pad PAD8 provided on the bottom layer 102.

[0061] The sixth pad PAD6 is connected with a fixing pin of the second antenna ANT22, the seventh pad PAD7 is electrically connected with a signal pin of the second antenna ANT22, and the eighth pad PAD8 is electrically connected with a ground pin of the second antenna ANT22.

[0062] The sixth pad PAD6 is connected with a fixing pin of the second antenna ANT22 to fix the second antenna ANT22. The seventh pad PAD7 is electrically connected with a signal pin of the second antenna ANT22, and the signal pin of the second antenna ANT22 can be responsible for transmitting the signals captured by the antenna to the radio frequency module or the microcontroller, or transmitting the signals from the radio frequency module to the antenna. The signal pin of the second antenna ANT22 can also ensure the impedance matching between the antenna and the circuit board, so as to help reduce signal reflection and loss and improve transmission efficiency. The eighth pad PAD8 is electrically connected with a ground pin of the second antenna ANT22. The ground pin of the second antenna ANT22 can provide a stable reference voltage for the antenna to ensure correct signal transmission, and can form a complete signal path together with the signal pin to ensure that the current can flow from the antenna through the substrate and return to the antenna. The ground pin of the second antenna ANT22 can also help suppress electromagnetic interference and improve the electromagnetic compatibility of the system.

[0063] In this embodiment, the circuit board 1000 further comprises a ninth pad PAD9, a tenth pad PAD10 and a second decoupling circuit 400 provided on the bottom layer 102.

[0064] The ninth pad PAD9 is shorted with the eighth pad PAD8, the second decoupling circuit 400 is electrically connected between the ninth pad PAD9 and the tenth pad PAD10, and the tenth pad PAD10 is electrically connected to the ground GND. The tenth pad PAD10 is also electrically connected to the fifth pad PAD5 through a via, so that the fifth pad PAD5 and the tenth pad PAD10 are both electrically connected to the ground GND. The second decoupling circuit 400 is used to reduce the electromagnetic interference between the second antenna ANT22 and other elements (such as the first antenna ANT21) on the circuit board 1000 except the second antenna ANT22.

[0065] In an embodiment, the second decoupling circuit 400 includes at least one discrete element, which is a resistor, a capacitor or an inductor.

[0066] When the second decoupling circuit 400 includes at least two discrete elements, the discrete elements are connected in series or in parallel. For example, in some specific embodiments, the second decoupling circuit 400 includes a capacitor and a resistor connected in parallel. By adjusting the parameters of the capacitor and the resistor, the electromagnetic interference between the second antenna ANT22 and other elements can be reduced, the degree of decoupling is deepened, the isolation is increased, and the signal transmission efficiency is improved.

[0067] The application also provides a terminal product including the circuit board 1000 in any of the embodiments of the application.

[0068] In some embodiments, the terminal product includes a smart phone, a tablet computer, a notebook computer or the like.

[0069] The above description is only for the embodiments of the application, and does not limit the patent scope of the application. Any equivalent structure or equivalent process transformation based on the content of the specification and drawings, or direct or indirect application in other related technical fields, is also included in the patent protection scope of the application.

[0070] The above embodiments are only used to illustrate the technical solutions of the application, and not to limit them; the technical features of the above embodiments or different embodiments can also be combined, and the steps can be implemented in any order. Those skilled in the art should understand that the technical solutions recorded in the above embodiments can be modified, or some technical features can be replaced by equivalents; and these modifications or replacements do not change the essence of the corresponding technical solutions from the scope of the technical solutions of the embodiments of the application.

Claims

1. A circuit board, characterized by, The circuit board comprises: a double-sided substrate, the double-sided substrate comprising a top layer and a bottom layer, the top layer being an upper surface of the double-sided substrate, and the bottom layer being a lower surface of the double-sided substrate; a first antenna and a second antenna, the first antenna and the second antenna being arranged on two sides of the double-sided substrate, and the first antenna being electrically connected to the top layer, and the second antenna being electrically connected to the bottom layer; wherein a copper foil is arranged in the top layer to form a ground, and a groove is arranged on the copper foil forming the ground, the groove being arranged between the first antenna and the second antenna; a decoupling component, the decoupling component being realized by arranging a copper foil in the bottom layer, the decoupling component being arranged between the first antenna and the second antenna, and the decoupling component being configured to form a resonance network to absorb the emitted signals of the first antenna and the second antenna.

2. The circuit board of claim 1, wherein The decoupling component comprises a first connecting segment, a second connecting segment and a third connecting segment formed by the copper foil, the second connecting segment being electrically connected to the first connecting segment and the third connecting segment respectively by the copper foil; wherein the first connecting segment is in an inverted L-shaped structure, the second connecting segment is in an M-shaped structure, and the third connecting segment is in a π-shaped structure.

3. The circuit board according to claim 1 or 2, characterized by The circuit board further comprises a first pad, a second pad and a third pad arranged on the top layer; the first pad is connected to a fixed pin of the first antenna, the second pad is electrically connected to a signal pin of the first antenna, and the third pad is electrically connected to a ground pin of the first antenna.

4. The circuit board of claim 3, wherein The circuit board further comprises a fourth pad, a fifth pad and a first decoupling circuit arranged on the top layer; the fourth pad is short-circuited to the third pad, the first decoupling circuit is electrically connected between the fourth pad and the fifth pad, and the fifth pad is electrically connected to the ground, wherein the first decoupling circuit is used to reduce electromagnetic interference between the first antenna and other elements on the circuit board except the first antenna.

5. The circuit board of claim 4, wherein, The first decoupling circuit comprises at least one discrete element, and the discrete element is a resistor, a capacitor or an inductor; when the first decoupling circuit comprises at least two discrete elements, each of the discrete elements is connected in series or in parallel.

6. The circuit board according to claim 1 or 2, characterized by The circuit board further comprises a sixth pad, a seventh pad and an eighth pad arranged on the bottom layer; the sixth pad is connected to a fixed pin of the second antenna, the seventh pad is electrically connected to a signal pin of the second antenna, and the eighth pad is electrically connected to a ground pin of the second antenna.

7. The circuit board of claim 6, wherein The circuit board further comprises a ninth pad, a tenth pad and a second decoupling circuit arranged on the bottom layer; the ninth pad is short-circuited to the eighth pad, the second decoupling circuit is electrically connected between the ninth pad and the tenth pad, and the tenth pad is electrically connected to the ground, wherein the second decoupling circuit is used to reduce electromagnetic interference between the second antenna and other elements on the circuit board except the second antenna.

8. The circuit board of claim 7, wherein, The second decoupling circuit comprises at least one discrete element, and the discrete element is a resistor, a capacitor or an inductor; when the second decoupling circuit comprises at least two discrete elements, each of the discrete elements is connected in series or in parallel.

9. The circuit board according to claim 1 or 2, characterized by The first antenna is a PCB antenna or a ceramic antenna, and the second antenna is a PCB antenna or a ceramic antenna.

10. A terminal product, characterized in that The circuit board according to any one of claims 1 to 9.

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