Hybrid solid-state switching device

Abstract

A hybrid solid-state switching device relates to the field of low-voltage electrical technology and comprises a control module and a body, the body comprises a power supply module, a main control board, a first drive control board, a second drive control board, an isolation switch and two hybrid switches, and the two hybrid switches are sequentially connected with an external power supply in series; the hybrid switch comprises a piezoresistor, a mechanical switch, an insulated gate bipolar transistor and an RC circuit which are connected in parallel; the isolating switch is electrically connected with the first driving control board and is connected in series with any hybrid switch, or is connected in series with an insulated gate bipolar transistor of any hybrid switch and then is connected in parallel with the piezoresistor, the mechanical switch and the RC circuit; the mechanical switch is electrically connected with the second driving control board; the control module is in signal connection with the main control board, the main control board is in signal connection with the first drive control board and the second drive control board, and the power supply module is electrically connected with the main control board, the first drive control board, the second drive control board and a branch where the insulated gate bipolar transistor is located. The device has the characteristics of high on-off speed, no arc generation, low on-state loss and long service life.

Description

TECHNICAL FIELD

[0001] The utility model relates to low voltage electrical technology field, specifically, relate to a kind of hybrid solid state switch device. BACKGROUND

[0002] In DC power system network, since line DC impedance is usually small, when system short-circuit fault occurs, great short-circuit current is generated in line momentarily, if line resistance short-circuit current continues to rise without timely cutting off, it can easily cause system equipment to occur fault protection due to rapid discharge, even equipment damage.

[0003] In existing low-voltage circuit breaker products, mechanical DC circuit breaker is mainly used for breaking and protection in DC system, but mechanical circuit breaker has the characteristics of long action time, easy arc, short service life of contact, and cannot realize fast arcless breaking, but solid state circuit breaker using power electronic devices for fault removal does not have the above problems. However, the product cost of solid state circuit breaker is high, the on-state loss is high, and the heat is serious, and it is mostly applied to small current products below 80A. Therefore, a hybrid solid state circuit breaker combining the advantages of traditional mechanical circuit breaker and solid state circuit breaker is needed. SUMMARY

[0004] The utility model aims at providing a kind of hybrid solid state switch device, which can combine the advantages of mechanical switch and solid state switch, realize the characteristics of fast on-off speed, no arc generation, low on-state loss and long service life.

[0005] The embodiment of the utility model is realized as follows:

[0006] In one aspect of the utility model, a hybrid solid state switch device is provided, which includes a control module, a housing and a body disposed in the housing. The body includes a power supply module, a main control board, a first drive control board, a second drive control board, an isolation switch and two hybrid switches. The two hybrid switches are connected in series with an external power supply. The hybrid switch includes a pressure-sensitive resistor, a mechanical switch, an insulated gate bipolar transistor and an RC circuit connected in parallel. The isolation switch is connected in series with any hybrid switch, or the isolation switch is connected in series with the insulated gate bipolar transistor of any hybrid switch and connected in parallel with the pressure-sensitive resistor, the mechanical switch and the RC circuit. The isolation switch is electrically connected with the first drive control board, and the mechanical switch is electrically connected with the second drive control board. The control module is signal connected with the main control board, and the main control board is signal connected with the first drive control board and the second drive control board respectively. The power supply module is electrically connected with the main control board, the first drive control board, the second drive control board and the branch circuit where the insulated gate bipolar transistor is located.

[0007] Optionally, the body further comprises a busbar and a control panel, the busbar is electrically connected with the hybrid switch, the control panel is stacked with the main control panel and is electrically connected with the main control panel and the power module respectively; the busbar is parallel and spaced apart from the bottom surface of the shell, the control panel is parallel and spaced apart from one side of the busbar away from the bottom surface of the shell, or the control panel is perpendicular to the busbar.

[0008] Optionally, the body further comprises a cover and a key panel, the key panel is electrically connected with the control panel and is arranged side by side on the same plane, and the cover is arranged on the top of the shell, and the key panel is arranged on the surface of the cover.

[0009] Optionally, when the isolating switch is connected in series with the insulated gate bipolar transistor of any hybrid switch and is connected in parallel with the pressure sensitive resistor, the mechanical switch and the RC circuit, the mechanical switch is arranged on one side of the busbar close to the bottom surface of the shell and is electrically connected with the busbar, the pressure sensitive resistor, the insulated gate bipolar transistor, the RC circuit and the isolating switch are arranged in sequence on one side of the busbar away from the bottom surface of the shell, and the insulated gate bipolar transistor is electrically connected with the busbar.

[0010] Optionally, when the isolating switch is connected in series with the insulated gate bipolar transistor of any hybrid switch and is connected in parallel with the pressure sensitive resistor, the mechanical switch and the RC circuit, the mechanical switch is arranged on one side of the busbar away from the bottom surface of the shell and is electrically connected with the busbar, the pressure sensitive resistor, the insulated gate bipolar transistor, the RC circuit and the isolating switch are arranged in sequence on one side of the busbar close to the bottom surface of the shell, and the insulated gate bipolar transistor is electrically connected with the busbar.

[0011] Optionally, the power module is arranged on one side of the busbar facing the mechanical switch.

[0012] Optionally, when the isolating switch is connected in series with the insulated gate bipolar transistor of any hybrid switch, the second control panel is arranged in the height direction of the shell to be perpendicular to the busbar; the mechanical switch of one of the hybrid switches is arranged on one side of the busbar close to the bottom surface of the shell, and the mechanical switch of the other hybrid switch is arranged on one side of the busbar away from the bottom surface of the shell; the pressure sensitive resistor, the insulated gate bipolar transistor and the RC circuit are arranged side by side on one side of the second control panel, and the insulated gate bipolar transistor, the RC circuit and the pressure sensitive resistor are arranged on one side of the busbar away from the mechanical switch; the isolating switch is arranged in the height direction of the shell and is located on one side of the pressure sensitive resistor, the insulated gate bipolar transistor and the RC circuit away from the second control panel.

[0013] Optionally, the insulated gate bipolar transistor and the RC circuit are stacked in the width direction of the shell, and the pressure sensitive resistor and the RC circuit are arranged side by side on one side of the insulated gate bipolar transistor away from the side wall of the shell.

[0014] Optionally, the control panel has a containing cavity on one side facing the mechanical switch, and the power module and the main control panel are arranged side by side in the containing cavity.

[0015] Optionally, the two hybrid switches are arranged side by side and have a preset interval.

[0016] The beneficial effects of the utility model include:

[0017] The application provides a hybrid solid-state switch device, which comprises a control module, a shell and a body arranged in the shell, the body comprises a power module, a main control board, a first drive control board, a second drive control board, an isolation switch and two hybrid switches, the two hybrid switches are connected in series with an external power supply; the hybrid switch comprises a pressure-sensitive resistor, a mechanical switch, an insulated gate bipolar transistor and an RC circuit which are connected in parallel; the isolation switch is connected in series with any hybrid switch, or the isolation switch is connected in series with the insulated gate bipolar transistor of any hybrid switch and is connected in parallel with the pressure-sensitive resistor, the mechanical switch and the RC circuit; the isolation switch is electrically connected with the first drive control board, and the mechanical switch is electrically connected with the second drive control board; the control module is signal-connected with the main control board, the main control board is signal-connected with the first drive control board and the second drive control board respectively, and the power module is electrically connected with the main control board, the first drive control board, the second drive control board and the branch circuit where the insulated gate bipolar transistor is located; the control module can collect voltage signals and current signals in a loop and judge whether the collected voltage signals and current signals are fault signals, and if the voltage signals and current signals are fault signals, the main control board of the body is used to disconnect the loop. The hybrid solid-state switch device can combine the advantages of the mechanical switch and the solid-state switch, realizes fast on-off speed, no electric arc generation, low on-state loss and long service life. BRIEF DESCRIPTION OF DRAWINGS

[0018] In order to more clearly illustrate the technical scheme of the utility model embodiment, the following will be briefly introduced the drawings needed to be used in the embodiment, it should be understood, the following drawings only show some embodiments of the utility model, therefore should not be regarded as the limitation to the scope, for those skilled in the art, under the premise of not paying the creative labor, can also obtain other related drawings according to these drawings.

[0019] Figure 1 It is one of the circuit schematic diagrams of the hybrid solid-state switch device provided by the utility model embodiment;

[0020] Figure 2 It is the second circuit schematic diagram of the hybrid solid-state switch device provided by the utility model embodiment;

[0021] Figure 3 It is one of the structure schematic diagrams of the hybrid solid-state switch device provided by the utility model embodiment;

[0022] Figure 4 It is one of the structure layout schematic diagrams of the hybrid solid-state switch device provided by the utility model embodiment;

[0023] Figure 5The side view of the mixed solid state switch device is provided for the embodiment of the utility model.

[0024] Figure 6 The structure layout schematic diagram two of the mixed solid state switch device is provided for the embodiment of the utility model.

[0025] Figure 7 The structure layout schematic diagram three of the mixed solid state switch device is provided for the embodiment of the utility model.

[0026] Figure 8 The structure layout schematic diagram four of the mixed solid state switch device is provided for the embodiment of the utility model.

[0027] Figure 9 The side view two of the mixed solid state switch device is provided for the embodiment of the utility model.

[0028] Figure 10 The top view of the mixed solid state switch device is provided for the embodiment of the utility model.

[0029] Icon: 100-mixed solid state switch device;111-housing;112-cover;121-conversion module;122-main control board;123-second drive control board;124-isolation switch;125-mixed switch;125A-voltage-dependent resistor;125B-mechanical switch;125C-insulated gate bipolar transistor;125D-RC circuit;126-busbar;127-control panel;128-key panel;a-height direction;b-width direction. DETAILED DESCRIPTION

[0030] In order to make the purpose, technical scheme and advantages of the embodiments of the utility model clearer, the technical scheme in the embodiments of the utility model will be described clearly and completely below in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. The components of the embodiments of the utility model described and shown in the drawings here can be arranged and designed in various different configurations.

[0031] Therefore, the following detailed description of the embodiments of the utility model provided in the drawings is not intended to limit the scope of the claimed utility model, but only represents selected embodiments of the utility model. Based on the embodiments in the utility model, all other embodiments obtained by those of ordinary skill in the art without creative labor fall within the scope of protection of the utility model.

[0032] It should be noted that: similar labels and letters represent similar items in the following drawings, therefore, once an item is defined in one drawing, it does not need to be further defined and explained in subsequent drawings.

[0033] In the description of the utility model, it needs to be explained that the orientation or position relation indicated by the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer" and the like is based on the orientation or position relation shown in the drawings, or is the orientation or position relation commonly placed when the utility model product is used, and is merely for the convenience of describing the utility model and simplifying the description, and therefore cannot be understood as indicating or implying that the indicated device or element must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as limiting the utility model. In addition, the terms "first", "second", "third" and the like are merely used for differentiation in description, and cannot be understood as indicating or implying relative importance.

[0034] In addition, the terms "horizontal", "vertical" and the like do not mean that the components must be absolutely horizontal or vertical, but can be slightly inclined. For example, "horizontal" merely means that it is more horizontal relative to "vertical", and does not mean that the structure must be completely horizontal, but can be slightly inclined.

[0035] In the description of the utility model, it also needs to be explained that, unless otherwise explicitly specified and limited, the terms "setting", "mounting", "connection", "connecting" should be understood broadly, for example, can be fixedly connected, or can be detachably connected, or integrally connected; can be mechanically connected, or can be electrically connected; can be directly connected, or can be indirectly connected through an intermediate medium, or can be the communication inside two elements. For ordinary skilled persons in the art, the specific meanings of the above terms in the utility model can be understood according to the specific circumstances.

[0036] Please refer to Figure 1 , Figure 2 and Figure 3 , the embodiment provides a kind of hybrid solid switch device 100, including control module, shell 111 and the body of being arranged in shell 111, body includes power module, main control board 122, first drive control board, second drive control board 123, isolating switch 124 and two hybrid switches 125, two hybrid switches 125 are successively connected in series with external power supply;Hybrid switch 125 includes the pressure-sensitive resistor 125A, mechanical switch 125B, insulated gate bipolar transistor 125C and RC circuit 125D that are successively connected in parallel;As shown in Figure 2 Isolating switch 124 is connected in series with any hybrid switch 125, or, as shown in Figure 1As shown, the isolating switch 124 is connected in series with the insulated gate bipolar transistor 125C of the arbitrary hybrid switch 125, and is connected in parallel with the pressure sensitive resistor 125A, the mechanical switch 125B and the RC circuit 125D; the isolating switch 124 is electrically connected with the first drive control board, and the mechanical switch 125B is electrically connected with the second drive control board 123; the control module is signal connected with the main control board 122, the main control board 122 is signal connected with the first drive control board and the second drive control board 123 respectively, and the power module is electrically connected with the main control board 122, the first drive control board, the second drive control board 123 and the branch of the insulated gate bipolar transistor 125C respectively.

[0037] Specifically, as shown in the drawings, the hybrid solid-state switch device 100 comprises a shell 111, the shell 111 has a body inside, and further comprises a control module (not shown in the drawings), the control module is used for collecting voltage signals and current signals in a loop, judging whether the collected voltage signals and current signals are fault signals, and being capable of controlling the body through the main control board 122 of the body according to the judgment result, so as to realize the on-off of the loop. Figure 3

[0038] The body is composed of a power module, a main control board 122, a first drive control board, a second drive control board 123, an isolating switch 124 and two hybrid switches 125, and the body is connected in series with a load, and is sequentially connected in series from a positive electrode of a power supply, a first hybrid switch 125, the load, a second hybrid switch 125 to a negative electrode of the power supply; the hybrid switch 125 comprises a pressure sensitive resistor 125A, a mechanical switch 125B, an insulated gate bipolar transistor 125C and an RC circuit 125D connected in parallel, wherein the pressure sensitive resistor 125A, the insulated gate bipolar transistor and the RC circuit 125D are solid-state switch elements, and the solid-state switch elements and the mechanical switch 125B jointly constitute the hybrid switch 125.

[0039] It should be noted that, in an embodiment of the present application, as shown in the drawings, Figure 5 and Figure 9 The two hybrid switches 125 are arranged side by side and have a preset interval, so as to form a heat dissipation cavity in the middle of the two hybrid switches 125, thereby improving the reliability of the hybrid solid-state switch device 100.

[0040] In normal operation, the mechanical switch 125B is in a closed state and undertakes the task of current transmission of the circuit; when switching operation is needed, the solid-state switch acts first, and then the mechanical switch 125B, so as to transfer the fault current from the branch of the mechanical switch 125B to the branch of the insulated gate bipolar transistor, and then the insulated gate bipolar transistor divides the fault into segments, so as to form segmented protection for the connected circuit and the load. After the current switching is completed, the mechanical switch 125B performs corresponding action to complete the whole switching process. Through the cooperative control of the solid-state switch and the mechanical switch 125B, efficient and reliable circuit switching function can be realized.​

[0041] Due to the extremely fast response speed of the solid-state switch part, the switching action can be completed within microseconds or even nanoseconds, so that fast and accurate control of the circuit can be realized. The mechanical switch 125B has high current carrying capacity and low cost. The hybrid solid-state switch device 100 combines the two, can quickly act in occasions requiring fast switching, and at the same time, uses the mechanical switch 125B to bear most of the current during normal operation, combining speed and stability.

[0042] At the same time, the solid-state switch has a certain conduction resistance when conducting, which will produce a certain power loss. The mechanical switch 125B has very low resistance in the on state, and the conduction loss is very low. The hybrid solid-state switch can make the mechanical switch 125B conduct during normal operation, reduce the overall conduction loss, and improve energy utilization efficiency.

[0043] In addition, during the breaking process of the mechanical switch 125B, the separation of the contacts will produce an arc, which not only causes wear to the contacts and reduces the service life of the switch, but also may cause fire and other safety problems. The solid-state switch does not produce an arc during switching, and the hybrid solid-state switch can use the arcless characteristics of the solid-state switch during switching to reduce the generation of arcs and improve the reliability and safety of the switch.

[0044] In the hybrid solid-state switch device 100, the disconnector 124 can be provided on the main circuit in series with any hybrid switch 125, or the disconnector 124 is provided on the branch of the hybrid switch 125 in series with the insulated gate bipolar transistor 125C of any hybrid switch 125, and is connected in parallel with the pressure-sensitive resistor 125A, the mechanical switch 125B and the RC circuit 125D. For different positions of the disconnector 124 in the hybrid solid-state switch device 100, different layout forms can be correspondingly provided in the body to improve the space utilization of the hybrid solid-state switch device 100 and realize miniaturization of the device. Moreover, the disconnector 124 is electrically connected with the first drive control board, and the mechanical switch 125B is electrically connected with the second drive control board 123; the main control board 122 is signal connected with the first drive control board and the second drive control board 123 respectively, so as to control the closing or opening of the disconnector 124 and the mechanical switch 125B according to the control signal sent by the control module.

[0045] The power module is electrically connected with the main control board 122, the first drive control board, the second drive control board 123 and the branch where the insulated gate bipolar transistor 125C is located, so as to provide power for the hybrid solid-state switch device 100 and related circuits and ensure the continuous operation of the circuit; wherein the power module can be in the form of external power supply or self-power supply.

[0046] When the circuit is in normal operation, the mechanical switch 125B is in a closed state, bearing the main current transmission task of the circuit, at this time the battery module is in a charging or standby state. The input of the power supply is directly transmitted to the load end through the mechanical switch 125B, providing stable power for the load. When the main power fails or needs to be switched, the solid-state switch responds quickly. After the control circuit of the solid-state switch receives the signal, the solid-state switch element is turned on, connecting the battery module to the circuit. At this time, the battery module begins to supply power to the load, realizing seamless switching of the power supply.

[0047] The hybrid solid-state switch device 100 provided in the application includes a control module, a shell 111, and a body provided in the shell 111. The body includes a power module, a main control board 122, a first drive control board, a second drive control board 123, an isolation switch 124, and two hybrid switches 125, which are connected in series. The hybrid switch 125 includes a pressure-sensitive resistor 125A, a mechanical switch 125B, an insulated gate bipolar transistor 125C, and an RC circuit 125D connected in parallel. The isolation switch 124 is connected in series with any hybrid switch 125, or the isolation switch 124 is connected in series with the insulated gate bipolar transistor 125C of any hybrid switch 125 and connected in parallel with the pressure-sensitive resistor 125A, the mechanical switch 125B, and the RC circuit 125D. The isolation switch 124 is electrically connected with the first drive control board, and the mechanical switch 125B is electrically connected with the second drive control board 123. The control module is signal connected with the main control board 122, the main control board 122 is signal connected with the first drive control board and the second drive control board 123 respectively, and the power module is electrically connected with the branch in which the main control board 122, the first drive control board, the second drive control board 123, and the insulated gate bipolar transistor 125C are located. The control module can collect voltage signals and current signals in the circuit and determine whether the collected voltage signals and current signals are fault signals. If the collected voltage signals and current signals are fault signals, the main control board 122 of the body is used to disconnect the circuit. The hybrid solid-state switch device 100 described above can combine the advantages of the mechanical switch 125B and the solid-state switch, realizing the characteristics of fast on-off speed, no electric arc generation, low on-state loss, and long service life.

[0048] In an implementation manner of the application, the body further includes a busbar 126 and a control panel 127. The busbar 126 is fixedly connected with the hybrid switch 125, and the control panel 127 is stacked with the main control board 122 and electrically connected with the main control board 122 and the power module respectively. The busbar 126 is parallel to and spaced apart from the bottom surface of the shell 111, and the control panel 127 is parallel to and spaced apart from one side of the busbar 126 away from the bottom surface of the shell 111, or the control panel 127 is perpendicular to the busbar 126.

[0049] Specifically, please refer to Figure 4 , Figure 6 and Figure 7The body further comprises a busbar 126, the mechanical switch 125B and the solid-state switch are electrically connected with the busbar 126, the busbar 126 can carry a large current and provide a stable current path for the hybrid solid-state switch; meanwhile, the busbar 126 has a certain strength and rigidity, and can also provide mechanical support for the components of the hybrid solid-state switch.

[0050] As shown in Figure 3 , the body further comprises a control panel 127, the control panel 127 is stacked with the main control board 122 and is electrically connected with the main control board 122 and the power module respectively, the working state of the hybrid solid-state switch device 100 can be manually controlled through the control panel 127;

[0051] Please refer to Figure 3 and Figure 4 , the busbar 126 is parallel and spaced apart from the bottom surface of the shell 111, so as to form two accommodation spaces in the shell 111; the control panel 127 is parallel and spaced apart from one side of the busbar 126 away from the bottom surface of the shell 111, so as to be located at the top end of the shell 111, or the control panel 127 is perpendicular to the busbar 126, so as to be located at the side wall (not shown in the figure) of the shell 111.

[0052] Optionally, as shown in Figure 3 , in order to facilitate better control of the control panel 127, the body further comprises a cover 112 and a key panel 128, the key panel 128 is electrically connected with the control panel 127 and is arranged side by side on the same plane, the cover 112 is arranged on the top of the shell 111, and the key panel 128 is arranged on the surface of the cover 112. It should be noted that in order to further improve the space utilization of the hybrid solid-state switch device 100, one side of the cover 112 facing the busbar 126 is provided with an accommodation cavity, when the main control board 122, the power module and the like are arranged at the top end of the shell 111, they can be accommodated in the accommodation cavity of the cover 112.

[0053] Of course, in addition to the above-mentioned arrangement of the control panel 127, the main control board 122 and the key panel 128 on the top surface or the side wall of the shell 111, in an embodiment of the present application, the hybrid solid-state switch device 100 can further be externally connected with a backpack module (not shown in the figure) on the side wall of the shell 111, the backpack module comprises the power module, the main control board 122, the control panel 127 and the key panel 128, which not only can further improve the space utilization of the hybrid solid-state switch device 100, but also can realize the modularization of the components.

[0054] In an embodiment of the present application, please refer to Figure 1 and Figure 4After the isolating switch 124 is connected in series with the insulated gate bipolar transistor 125C of any hybrid switch 125 and connected in parallel with the varistor 125A, the mechanical switch 125B and the RC circuit 125D, the mechanical switch 125B is arranged on the side of the busbar 126 close to the bottom surface of the shell 111 and is electrically connected to the busbar 126, the varistor 125A, the insulated gate bipolar transistor 125C, the RC circuit 125D and the isolating switch 124 are arranged in sequence on the side of the busbar 126 away from the bottom surface of the shell 111, and the insulated gate bipolar transistor 125C is electrically connected to the busbar 126.

[0055] Specifically, if Figure 4 As shown, when the isolating switch 124 is connected in series with the insulated gate bipolar transistor 125C of any hybrid switch 125, and in parallel with the varistor 125A, the mechanical switch 125B and the RC circuit 125D, the isolating switch 124 is set on the branch of the insulated gate bipolar transistor 125C of the hybrid switch 125. The varistor 125A, the RC circuit 125D and the insulated gate bipolar transistor 125C are sequentially arranged in parallel above the busbar 126. The isolating switch 124 and the first drive control board are connected in series on the side of the insulated gate bipolar transistor 125C away from the RC circuit 125D; the mechanical switch 125B and the second drive control board 123 are arranged below the busbar 126. The copper bars on both sides of the mechanical switch 125B can be fixedly connected to the busbar 126 by screws. Among them, the main control board 122 is connected to the side of the isolating switch 124 away from the busbar 126; as shown in FIG. Figure 4 As shown, the control panel 127 is located at the top of the shell 111 and is stacked with the main control board 122; of course, the control panel 127 can also be set on the side wall of the shell 111, and this application does not limit this.

[0056] like Figure 4 As shown, the power module is disposed on the side of the busbar 126 facing the mechanical switch 125B. The power module includes two conversion modules 121, namely a 5V / 48V conversion module 121 and a 450V conversion module 121. The two conversion modules 121 are respectively disposed below the busbar 126 and on the left and right sides of the mechanical switch 125B.

[0057] This layout allows for arrangement of components based on their series and parallel connections, facilitating connection during assembly while effectively improving space utilization within the housing 111 and miniaturizing the hybrid solid-state switch device 100. Furthermore, due to the predetermined spacing between the two hybrid switches 125, the mechanical switch 125B and the copper busbar, which serve as the primary heat sources, can effectively dissipate heat, thereby enhancing the reliability of the hybrid solid-state switch device 100.

[0058] In another implementation of the present application, please refer to Figure 1 and Figure 6 , when the isolation switch 124 is connected in series with the insulated gate bipolar transistor 125C of any hybrid switch 125 and in parallel with the pressure-sensitive resistor 125A, the mechanical switch 125B and the RC circuit 125D, the mechanical switch 125B is arranged on the side of the busbar 126 away from the bottom surface of the shell 111 and is electrically connected with the busbar 126, the pressure-sensitive resistor 125A, the insulated gate bipolar transistor 125C, the RC circuit 125D and the isolation switch 124 are arranged in sequence on the side of the busbar 126 close to the bottom surface of the shell 111, and the insulated gate bipolar transistor 125C is electrically connected with the busbar 126.

[0059] Specifically, since the mechanical switch 125B and the copper bar are the main heat sources of the hybrid switch 125, when the hybrid switch 125 is assembled, in order to meet the temperature rise requirement of the bottom surface of the shell 111, as shown in Figure 6 , the mechanical switch 125B of the hybrid solid-state switch device 100 of the present application is arranged on the side of the busbar 126 away from the bottom surface of the shell 111, so that the heat source of the hybrid solid-state switch device 100 is arranged in the upper middle area of the shell 111. In addition, since there is a preset interval between the two hybrid switches 125, the mechanical switch 125B and the copper bar as the main heat source can achieve good heat dissipation, thereby improving the use reliability of the hybrid solid-state switch device 100.

[0060] As shown in Figure 6 , above the busbar 126, in addition to the mechanical switch 125B and the second drive control board 123, a power module is also arranged, including two conversion modules 121, which are 5V and 48V conversion modules 121 and 450V conversion modules 121, and the two conversion modules 121 are respectively located on the left and right sides of the mechanical switch 125B.

[0061] Below the busbar 126, the pressure-sensitive resistor 125A, the RC circuit 125D and the insulated gate bipolar transistor 125C are arranged in parallel in sequence, and the insulated gate bipolar transistor 125C is connected in series with the isolation switch 124 and the first drive control board on the side away from the RC circuit 125D; wherein the side of the mechanical switch 125B away from the busbar 126 is connected with the main control board 122; as shown in Figure 6 , the control panel 127 is located at the top end of the shell 111 and is arranged in a stack with the main control board 122; of course, the control panel 127 can also be arranged on the side wall of the shell 111, which is not limited in the present application.

[0062] Through the layout, the components can be arranged according to the series and parallel relationship, while meeting the temperature rise requirement of the bottom surface of the shell 111. In addition, since the two hybrid switches 125 have a preset interval, the mechanical switch 125B and the copper bar as the main heat source can achieve good heat dissipation, further improving the use reliability and layout rationality of the hybrid solid-state switch device 100.

[0063] In an embodiment of the present application, please refer to Figure 2 、 Figure 7 and Figure 8 , when the disconnector 124 is connected in series with any hybrid switch 125, the second drive control board 123 is arranged along the height direction a of the shell 111 to be perpendicular to the busbar 126; the mechanical switch 125B of one hybrid switch 125 is arranged on the side of the busbar 126 close to the bottom surface of the shell 111, and the mechanical switch 125B of the other hybrid switch 125 is arranged on the side of the busbar 126 away from the bottom surface of the shell 111; the pressure-sensitive resistor 125A, the insulated gate bipolar transistor 125C and the RC circuit 125D are arranged side by side on one side of the second drive control board 123, and the insulated gate bipolar transistor 125C, the RC circuit 125D and the pressure-sensitive resistor 125A are all arranged on the side of the busbar 126 away from the mechanical switch 125B; the disconnector 124 is arranged along the height direction a of the shell 111 and is located on the side of the pressure-sensitive resistor 125A, the insulated gate bipolar transistor 125C and the RC circuit 125D away from the second drive control board 123.

[0064] Specifically, the disconnector 124 can also be arranged on the main circuit to be connected in series with any hybrid switch 125. Since the disconnector 124 needs to carry the main circuit current, its volume and temperature rise will increase. In order to make the layout of the hybrid solid-state switch device 100 more reasonable and improve the space utilization rate as much as possible, the disconnector 124 can be arranged on the main circuit to be connected in series with any hybrid switch 125, such as Figure 7 and Figure 8As shown, the second drive plate 123 is arranged along the height direction a of the shell 111 to be perpendicular to the busbar 126; the mechanical switch 125B is arranged on the side of the busbar 126 close to the bottom surface of the shell 111 to form an L-shaped structure; and the mechanical switch 125B of one hybrid switch 125 is arranged on the side of the busbar 126 close to the bottom surface of the shell 111, and the mechanical switch 125B of the other hybrid switch 125 is arranged on the side of the busbar 126 away from the bottom surface of the shell 111; the pressure-sensitive resistor 125A, the insulated gate bipolar transistor 125C and the RC circuit 125D are arranged side by side along the height direction a of the shell 111 on one side of the second drive plate 123, and the mechanical switch 125B, the pressure-sensitive resistor 125A, the insulated gate bipolar transistor 125C and the RC circuit 125D are connected in parallel with each other; so that the arrangement positions of the mechanical switch 125B, the pressure-sensitive resistor 125A, the insulated gate bipolar transistor 125C and the RC circuit 125D of the two hybrid switches 125 are exchanged up and down with the busbar 126 as the boundary. The isolating switch 124 is arranged along the height direction a of the shell 111 and is located on the side of the pressure-sensitive resistor 125A, the insulated gate bipolar transistor 125C and the RC circuit 125D away from the second drive plate 123.

[0065] It should be noted that, in an embodiment of the present application, first, please refer to Figure 7 、 Figure 8 and Figure 10 , in order to further improve the rationality of the layout of the hybrid solid-state switch device 100, the insulated gate bipolar transistor 125C and the RC circuit 125D are arranged in a stack along the width direction b of the shell 111, and the pressure-sensitive resistor 125A and the RC circuit 125D are arranged side by side on the side of the insulated gate bipolar transistor 125C away from the side wall of the shell 111. Since the two hybrid switches 125 are arranged side by side and have a preset interval, the insulated gate bipolar transistor 125C is arranged in a stack along the width direction b of the shell 111 with the RC circuit 125D and the pressure-sensitive resistor 125A, so that the RC circuit 125D and the pressure-sensitive resistor 125A are located in the preset interval between the two hybrid switches 125. Since the mechanical switch 125B of one hybrid switch 125 is arranged on the side of the busbar 126 close to the bottom surface of the shell 111, and the mechanical switch 125B of the other hybrid switch 125 is arranged on the side of the busbar 126 away from the bottom surface of the shell 111, so that the arrangement positions of the mechanical switch 125B, the pressure-sensitive resistor 125A, the insulated gate bipolar transistor 125C and the RC circuit 125D of the two hybrid switches 125 are exchanged up and down with the busbar 126 as the boundary, the RC circuit 125D and the pressure-sensitive resistor 125A of one hybrid switch 125 are located in the space above the preset interval between the two hybrid switches 125, and the RC circuit 125D and the pressure-sensitive resistor 125A of the other hybrid switch 125 are located in the space below the preset interval between the two hybrid switches 125, as shown in Figure 9The space structure in the shell 111 is effectively utilized, and the preset interval capable of ventilation still exists between the two hybrid switches 125, thereby improving the use reliability of the hybrid solid-state switch device 100.

[0066] Second, the side of the cover 112 towards the mechanical switch 125B has a receiving cavity, and the power module and the main control board 122 are arranged side by side in the receiving cavity, so that the size of the hybrid solid-state switch device 100 in the height direction a of the shell 111 is saved, and the space utilization is further improved.

[0067] The above is only optional embodiments of the present application and is not intended to limit the present application. For those skilled in the art, the present application can have various modifications and changes. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included in the protection scope of the present application.

[0068] In addition, it should be noted that each specific technical feature described in the above specific embodiments can be combined in any appropriate manner without contradiction. In order to avoid unnecessary repetition, the present application will not describe various possible combinations again.

Claims

1. A hybrid solid state switching device, characterized by, The utility model provides a kind of power distribution cabinet, including control module, shell (111) and the body being arranged in the shell (111), the body includes power module, main control board (122), first drive control board, second drive control board (123), isolating switch (124) and two hybrid switches (125), two the hybrid switch (125) is successively connected with external power supply in series;The hybrid switch (125) includes successively parallel piezoresistor (125A), mechanical switch (125B), insulated gate bipolar transistor (125C) and RC circuit (125D);The isolating switch (124) is connected with any hybrid switch (125) in series, or, the isolating switch (124) is connected with the insulated gate bipolar transistor (125C) of any hybrid switch (125) in series, and is connected with piezoresistor (125A), mechanical switch (125B) and RC circuit (125D) in parallel;The isolating switch (124) is electrically connected with the first drive control board, and the mechanical switch (125B) is electrically connected with the second drive control board (123);The control module is signal connected with the main control board (122), and the main control board (122) is signal connected with the first drive control board and the second drive control board (123) respectively, and the power module is electrically connected with the main control board (122), the first drive control board, the second drive control board and the branch of the insulated gate bipolar transistor (125C) respectively.

2. The hybrid solid state switching device of claim 1, wherein, The body further includes busbar (126) and control panel (127), the busbar (126) is electrically connected with the hybrid switch (125), and the control panel (127) is arranged in stack with the main control board (122) and is electrically connected with the main control board (122) and the power module respectively;The busbar (126) is parallel and spaced apart with the bottom surface of the shell (111), and the control panel (127) is parallel and spaced apart with the side of the busbar (126) away from the bottom surface of the shell (111), or the control panel (127) is vertically arranged with the busbar (126).

3. The hybrid solid state switching device of claim 2, wherein, The body further includes cover body (112) and key panel (128), the key panel (128) is electrically connected with the control panel (127) and is arranged side by side in the same plane, and the cover body (112) is covered on the top of the shell (111), and the key panel (128) is arranged on the surface of the cover body (112).

4. The hybrid solid state switching device of claim 3, wherein, When the isolating switch (124) is connected in series with the insulated gate bipolar transistor (125C) of any of the hybrid switches (125) and is connected in parallel with the pressure sensitive resistor (125A), the mechanical switch (125B) and the RC circuit (125D), the mechanical switch (125B) is arranged on the side of the busbar (126) away from the bottom surface of the shell (111) and is electrically connected with the busbar (126), the pressure sensitive resistor (125A), the insulated gate bipolar transistor (125C), the RC circuit (125D) and the isolating switch (124) are arranged on the side of the busbar (126) close to the bottom surface of the shell (111) in sequence, and the insulated gate bipolar transistor (125C) is electrically connected with the busbar (126).

5. The hybrid solid state switching device of claim 3, wherein, When the isolating switch (124) is connected in series with the insulated gate bipolar transistor (125C) of any of the hybrid switches (125) and is connected in parallel with the pressure sensitive resistor (125A), the mechanical switch (125B) and the RC circuit (125D), the mechanical switch (125B) is arranged on the side of the busbar (126) away from the bottom surface of the shell (111) and is electrically connected with the busbar (126), the pressure sensitive resistor (125A), the insulated gate bipolar transistor (125C), the RC circuit (125D) and the isolating switch (124) are arranged on the side of the busbar (126) close to the bottom surface of the shell (111) in sequence, and the insulated gate bipolar transistor (125C) is electrically connected with the busbar (126).

6. The hybrid solid state switching device of claim 4 or 5, wherein, The power module is arranged on the side of the busbar (126) facing the mechanical switch (125B).

7. The hybrid solid state switching device of claim 3, wherein, When the isolating switch (124) is connected in series with any of the hybrid switches (125), the second drive control board (123) is arranged along the height direction (a) of the shell (111) to be perpendicular to the busbar (126); the mechanical switch (125B) of one of the hybrid switches (125) is arranged on the side of the busbar (126) close to the bottom surface of the shell (111), and the mechanical switch (125B) of the other of the hybrid switches (125) is arranged on the side of the busbar (126) away from the bottom surface of the shell (111); the pressure sensitive resistor (125A), the insulated gate bipolar transistor (125C) and the RC circuit (125D) are arranged side by side on one side of the second drive control board (123), and the insulated gate bipolar transistor (125C), the RC circuit (125D) and the pressure sensitive resistor (125A) are all arranged on the side of the busbar (126) away from the mechanical switch (125B); the isolating switch (124) is arranged along the height direction (a) of the shell (111) and is located on the side of the pressure sensitive resistor (125A), the insulated gate bipolar transistor (125C) and the RC circuit (125D) away from the second drive control board (123).

8. The hybrid solid state switching device of claim 7, wherein, The insulated gate bipolar transistor (125C) and the RC circuit (125D) are arranged in a stacked manner along the width direction (b) of the shell (111), and the pressure-sensitive resistor (125A) is arranged side by side with the RC circuit (125D) on the side of the insulated gate bipolar transistor (125C) away from the sidewall of the shell (111).

9. The hybrid solid state switching device of claim 7, wherein, The control panel (127) has a receiving cavity on the side facing the mechanical switch (125B), and the power module and the main control panel (122) are arranged side by side in the receiving cavity.

10. The hybrid solid state switching device of claim 1, wherein, The two mixed switches (125) are arranged side by side with a preset interval.

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