Thick film plate structure

Abstract

The utility model discloses a thick film heater, and particularly relates to a thick film plate structure of the thick film heater. The thickness of the substrate is 0.5-10mm, the thickness of the ceramic insulation heat conduction layer is 10-100mu m, the thickness of the conductive layer is 10-30mu m, the thickness of the heating layer is 10-30mu m, the thickness of the heating layer is 10-30mu m, and the heat preservation insulation layer is made of PI materials and arranged on the upper surface of the heating layer. And the thickness of the thermal insulation layer is 30-100 microns. Compared with the prior art, the heat insulation layer made of the PI material is arranged on the upper surface of the heating layer, so that the heat loss is greatly reduced, the heat can only be transferred downwards, the withstand voltage level is improved, the heating efficiency is also improved, and the heating efficiency is greatly improved by reasonably optimizing the thickness of each structural layer on the basis of ensuring the heating efficiency to the greatest extent. And the total thickness of the whole product is reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to a thick film heater, especially a thick film plate structure of thick film heater. BACKGROUND

[0002] The thick film plate of the heater is usually formed by printing an insulating layer, a heating layer, a conductive layer and an upper insulating layer on a substrate by using a silk screen printing process and sintering once for each printing, wherein the substrate material can be ceramic or stainless steel plate, and most of the current market parts use ceramic material for the insulating layer. SUMMARY

[0003] The utility model provides a structure design is reasonable, thickness small and can effectively improve the thick film plate structure of heating efficiency.

[0004] In order to solve the above technical problem, the thick film plate structure of the utility model, including the substrate of thickness 0.5-10mm, the ceramic insulating heat conducting layer of thickness 10-100um being arranged on the upper surface of the substrate, the conductive layer of thickness 10-30um being arranged on the upper surface of the ceramic insulating heat conducting layer, the heating layer of thickness 10-30um being arranged on the upper surface of the conductive layer and the heat preservation insulating layer made of PI material being arranged on the upper surface of the heating layer, and the thickness of the heat preservation insulating layer is 30-100um.

[0005] The heat conductivity of the substrate is 26.1W / m K, and the lower surface of the substrate is in contact with the cooling liquid for heat exchange.

[0006] The heat conductivity of the ceramic insulating heat conducting layer is 16.7W / m K.

[0007] The conductive layer is a conductive silver layer.

[0008] The heating layer is made of noble metal material.

[0009] The heat conductivity of the PI material in the heat preservation insulating layer is 0.15W / m K.

[0010] The NTC thermistor for collecting temperature is arranged between the ceramic insulating heat conducting layer and the heat preservation insulating layer.

[0011] The utility model has the advantages of the following:

[0012] On one hand, the heat loss is greatly reduced by the heat preservation and insulation layer made of PI material on the surface of the heat generating layer, so that the heat can only be transferred downward, and the voltage resistance level is improved, and the heating efficiency is also improved, and on the other hand, the total thickness of the whole product is reduced on the basis of maximum guarantee of the heating efficiency by reasonably optimizing the thickness of each layer structure. BRIEF DESCRIPTION OF DRAWINGS

[0013] Figure 1 is a decomposition structure schematic view of the thick film plate structure of the utility model;

[0014] Figure 2 is a top view structure schematic view of the thick film plate structure of the utility model;

[0015] Figure 3 is Figure 2 A-A cross section structure schematic view. DETAILED DESCRIPTION

[0016] The thick film plate structure of the utility model will be further explained in detail below in combination with the drawings and specific embodiments.

[0017] As shown in the drawings, the thick film plate structure of the utility model comprises a substrate 1 with a thickness of 0.5-10 mm, a ceramic insulation and heat conduction layer 2 arranged on the upper surface of the substrate and with a thickness of 10-100 μm, a conductive layer 3 arranged on the upper surface of the ceramic insulation and heat conduction layer and with a thickness of 10-30 μm, a heat generating layer 4 arranged on the upper surface of the conductive layer and with a thickness of 10-30 μm, and a heat preservation and insulation layer 5 made of PI material arranged on the upper surface of the heat generating layer, and the thickness of the heat preservation and insulation layer 5 is 30-100 μm, wherein the heat conduction coefficient of the substrate 1 is 26.1 W / m·K, the lower surface of the substrate is in contact with the cooling liquid for heat exchange, the heat conduction coefficient of the ceramic insulation and heat conduction layer 2 is 16.7 W / m·K, the conductive layer 3 is a conductive silver layer, the heat generating layer 4 is made of a noble metal material, and the heat conduction coefficient of the PI material in the heat preservation and insulation layer 5 is 0.15 W / m·K.

[0018] Further, the NTC thermistor 6 for collecting temperature is arranged between the ceramic insulation and heat conduction layer 2 and the heat preservation and insulation layer 5.

[0019] Of course, the above description is not a limitation of the utility model, and the utility model is not limited to the above examples, and the changes, modifications, additions or replacements made by the technical personnel in the technical field within the essential range of the utility model should also belong to the protection range of the utility model.

Claims

1. A thick film plate structure, characterized by: The substrate (1) has a thickness of 0.5-10 mm; the ceramic insulating and heat-conducting layer (2) is arranged on the upper surface of the substrate and has a thickness of 10-100 μm; the conductive layer (3) is arranged on the upper surface of the ceramic insulating and heat-conducting layer and has a thickness of 10-30 μm; the heating layer (4) is arranged on the upper surface of the conductive layer and has a thickness of 10-30 μm; and the heat-insulating and insulating layer (5) made of PI material is arranged on the upper surface of the heating layer and has a thickness of 30-100 μm.

2. The thick film plate structure of claim 1, wherein: The substrate (1) has a heat conductivity of 26.1 W / m·K, and the lower surface of the substrate is in contact with the cooling liquid for heat exchange.

3. A thick film plate structure according to claim 1 or 2, characterised in that: The ceramic insulating and heat-conducting layer (2) has a heat conductivity of 16.7 W / m·K.

4. The thick film plate structure of claim 3, wherein: The conductive layer (3) is a conductive silver layer.

5. The thick film plate structure of claim 1, 2 or 4, wherein: The heating layer (4) is made of a noble metal material.

6. The thick film plate structure of claim 5, wherein: The PI material in the heat-insulating and insulating layer (5) has a heat conductivity of 0.15 W / m·K.

7. The thick film plate structure of claim 1, 2, 4 or 6, wherein: An NTC thermistor (6) for collecting temperature is arranged between the ceramic insulating and heat-conducting layer (2) and the heat-insulating and insulating layer (5).

Images