Semiconductor wafer multi-chip chamfering machine convenient for chip cleaning

Abstract

The utility model discloses a semiconductor wafer multi-chip chamfering machine convenient for chip cleaning, which comprises a bottom plate, a top plate is arranged above the bottom plate, and the top plate and the bottom plate are connected through a support column; a workbench is fixed to the upper surface of the bottom plate, a driving motor is fixed to the lower surface of the workbench, the output end of the driving motor is connected with a fixing assembly, and meanwhile the fixing assembly is arranged on the upper surface of the workbench; and one end of the connecting rod is fixed with the output end of a cylinder fixed on the upper end surface of the top plate. According to the semiconductor wafer multi-piece chamfering machine convenient to clean the chippings, the chippings on the surface of the workbench can be cleaned, accumulation of the chippings on the surface of the workbench is avoided, meanwhile, manual cleaning in the later period is not needed, the effect of cleaning while working of the device is achieved, meanwhile, the workbench can be cleaned at a time, and the working efficiency is improved. And therefore, the cleaning effect is better, and the practicability is higher.

Description

TECHNICAL FIELD

[0001] The utility model relates to a chamfering machine technical field, concretely to a semiconductor wafer multi -piece chamfering machine convenient to chip clearance. BACKGROUND

[0002] In the processing technology of semiconductor wafer, the edge of wafer needs to be ground to prevent the sharp edge formed after the ingot material is cut into wafer, has the defect such as angle, burr, edge collapse, therefore needs to use chamfering machine to process semiconductor wafer, such as in the patent name "semiconductor wafer chamfering tool" with the announcement number "CN220388917U", by reducing the clearance of servo motor in the clamping process, to reduce the generation of servo motor vibration, the pressing structure includes the connecting sleeve fixedly connected on the outer side circumference of servo motor, the upper side of connecting sleeve is equidistantly provided with threaded groove, threaded groove extends to the inside of support frame through the wall surface of connecting sleeve, the inside of threaded groove is screw connected with locking threaded column, the side surface of mounting base is equidistantly provided with air slot, air slot is rectangular slot, the upper side of mounting base is symmetrically fixedly connected with two mounting legs, the mounting leg is rectangular block, the upper side of two mounting legs is fixedly connected with baffle, rotation shaft is set through baffle, however, the above structure still has the following problems in actual use process:

[0003] The above structure realizes the chamfering processing of semiconductor wafer through chamfering machine, however, in the process of chamfering processing, a lot of chippings are produced, after long time processing, the chippings are easily accumulated on the workbench, further affect the neatness of workbench, and the accumulated chippings also need to be cleaned after stopping the chamfering machine manually, which affects the processing efficiency of semiconductor wafer.

[0004] Therefore, we propose a semiconductor wafer multi-piece chamfering machine convenient to chip clearance, which can well solve the above problems. SUMMARY

[0005] The utility model discloses a semiconductor wafer multi-piece chamfering machine convenient to chip clearance to solve the problem that the chippings are accumulated on the workbench after long time processing in the market at present, further affect the neatness of workbench, and the accumulated chippings also need to be cleaned after stopping the chamfering machine manually, which affects the processing efficiency of semiconductor wafer.

[0006] To achieve the above object, the utility model provides the following technical scheme: a semiconductor wafer multi-piece chamfering machine convenient to chip clearance, including the bottom plate, the top of bottom plate is provided with the top plate, and the top plate is connected with bottom plate between adopting the support column,

[0007] Further include: the upper surface of the bottom plate is fixed with a workbench, and the lower surface of the workbench is fixed with a driving motor, and the output end of the driving motor is connected with the fixing assembly, and the fixing assembly is arranged on the upper surface of the workbench;

[0008] The workbench is provided with a rack, one end of the connecting rod is fixed with the output end of the cylinder fixed on the upper end surface of the top plate, the lower end of the cylinder penetrates the top plate and is fixed with the grinding piece, the rear end of the connecting rod is fixed with the rack, and the lower end of the rack penetrates the fixing box.

[0009] Preferably, the outer side of the rack is engaged with a gear, and the gear is provided with two groups, which are arranged on the left and right sides of the rack respectively.

[0010] Preferably, the middle of the gear is fixed with a shaft, and the front and rear ends of the shaft are connected with the bearings of the fixing box.

[0011] Preferably, the outer side of the shaft is further fixed with a cam, and the outermost side of the cam is in contact with the air bag, and the air bag is fixedly installed in the inside of the fixing box.

[0012] Preferably, the outer side of the air bag is in communication with one end of the communication pipe, and the other end of the communication pipe extends out of the fixing box and is in communication with the shunt pipe, and the shunt pipe is fixed on the rear side of the workbench.

[0013] Preferably, a row of air blowing heads are arranged at equal intervals on the front side of the shunt pipe, and the direction of the air blowing heads is aligned with the upper surface of the workbench.

[0014] Compared with the prior art, the semiconductor wafer multi-piece chamfering machine has the advantages that: the semiconductor wafer multi-piece chamfering machine can clean the debris on the surface of the workbench, thereby avoiding the accumulation of debris on the surface of the workbench, and the device can be cleaned while working, and the workbench can be cleaned at the same time, so that the cleaning effect is better and the practicality is higher.

[0015] Through the arrangement of the shunt pipe, the gas is shunted into different air blowing heads, and then blown out by the air blowing heads, so that the debris on the surface of the workbench can be cleaned, thereby avoiding the accumulation of debris on the surface of the workbench, and the device can be cleaned while working.

[0016] Through the driving of the cylinder to drive the connecting rod upward and drive the rack upward, the rack drives the gear to rotate, so that the fixed cam is rotated together through the shaft, the cam is extruded through the rotation of the cam, the air in the air bag is extruded into the communication pipe, and then transported to the shunt pipe through the communication pipe.

[0017] Further, the cylinder drives the grinding piece to move, so that the grinding piece moves to be attached to the semiconductor wafer, the grinding piece is used to grind the semiconductor wafer, and the chamfering effect is realized.

[0018] The connecting rod drives the rack to descend, and the rack is reversed while descending, the cam is reversed while being pressed, air in the air bag enters the shunt pipe through the communication pipe, and then is sprayed out of the shunt pipe, so that the cleaning effect is realized, the workbench is cleaned once, the cleaning effect is better, and the practicality is higher.

[0019] Further, the cam is driven to rotate by the driving force of the cylinder, so that the cleaning effect is realized without a separate driving force, and the practical cost of the device is saved. BRIEF DESCRIPTION OF DRAWINGS

[0020] Fig. 1 It is a front view structural schematic diagram of the utility model;

[0021] Fig. 2 It is a rear view structural schematic diagram of the utility model;

[0022] Fig. 3 It is a front view structural schematic diagram of the utility model that the fixed assembly is connected with the driving motor;

[0023] Fig. 4 It is a front view structural schematic diagram of the utility model that the shunt pipe is connected with the communication pipe;

[0024] Fig. 5 It is a sectional view structural schematic diagram of the utility model that the gear is engaged with the rack;

[0025] Fig. 6 It is a front view structural schematic diagram of the utility model that the shaft rod is connected with the cam.

[0026] In the drawing: 1, bottom plate; 2, top plate; 3, cylinder; 4, grinding piece; 5, workbench; 6, driving motor; 7, fixed assembly; 8, connecting rod; 9, rack; 10, fixed box; 11, gear; 12, shaft rod; 13, cam; 14, air bag; 15, communication pipe; 16, shunt pipe; 17, air blowing head. DETAILED DESCRIPTION

[0027] The technical scheme in the embodiments of the utility model will be described clearly and completely in combination with the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor belong to the protection scope of the utility model.

[0028] Please refer to Figs. 1-6 The utility model provides the following technical scheme:

[0029] Embodiment one: in order to solve the long time processing after being proposed in prior art, easy to make the scrap accumulation on worktable 5, and then affect the neatness of worktable 5, and the scrap of accumulation also needs manual chamfering machine to stop to carry out cleaning, influence the processing efficiency of semiconductor wafer, therefore discloses the following scheme, including the rear side of worktable 5 is provided with cleaning mechanism, and worktable 5 realizes cleaning effect through cleaning mechanism, cleaning mechanism includes connecting rod 8 and rack 9, and the output end of the cylinder 3 fixed on the upper end surface of top plate 2 is fixed to the one end of connecting rod 8, and the lower end of cylinder 3 is fixed with abrasive disc 4 through top plate 2, and the outer side of the rear end of connecting rod 8 is fixed with rack 9, and the lower end of rack 9 is fixed through fixed box 10, the outer side of rack 9 is engaged with gear 11, and gear 11 is provided with two groups, which are respectively arranged on the left and right sides of rack 9, the middle of gear 11 is fixed with shaft 12, and the front and rear ends of shaft 12 are all connected with the bearing of fixed box 10;

[0030] When chamfering is completed, the abrasive disc 4 is driven upward by the cylinder 3, and the connecting rod 8 is also driven upward, so that the connecting rod 8 drives the rack 9 upward, and the rack 9 drives the gear 11 engaged in the fixed box 10 to rotate, the gear 11 rotates, and the fixed shaft 12 is driven to rotate, the shaft 12 rotates, and the fixed cam 13 is driven to rotate together, the cam 13 is extruded by the air bag 14, and the air in the air bag 14 is extruded into the communication pipe 15, and then is delivered to the shunt pipe 16, the air is shunted into different air blowing heads 17 through the shunt pipe 16, and then is blown out by the air blowing heads 17, so that the scrap on the surface of the worktable 5 can be cleaned, and the accumulation of the scrap on the surface of the worktable 5 is avoided, and manual cleaning is not needed, so that the device can be cleaned while working;

[0031] Embodiment two: different from embodiment one, the embodiment is convenient for chamfering of semiconductor wafer, and specifically refers to Figs. 1-2 The bottom plate 1 is provided with the top plate 2 above, and the top plate 2 and the bottom plate 1 are connected by support columns;It also includes: the upper surface of the bottom plate 1 is fixed with the worktable 5, and the lower surface of the worktable 5 is fixed with the driving motor 6, and the output end of the driving motor 6 is connected with the fixed assembly 7, and the fixed assembly 7 is arranged on the upper surface of the worktable 5;

[0032] By fixing the semiconductor wafer on the fixing assembly 7, then by driving the motor 6, the fixing assembly 7 at the upper end can be driven to rotate, so that the fixing assembly 7 drives the semiconductor wafer to rotate, then the air cylinder 3 is started, so that the air cylinder 3 drives the grinding piece 4 to move, so that the grinding piece 4 is moved to be in contact with the semiconductor wafer, the grinding piece 4 is used to grind the semiconductor wafer, and the chamfering effect is realized.

[0033] In the embodiment, the cleaning effect is better, the practicability is higher, the cleaning effect can be realized without a separate driving force, the practical cost of the device is saved, and details are referred to Figs. 2-6 The outer side of the shaft 12 is further fixed with a cam 13, the outermost side of the cam 13 is in contact with an air bag 14, the air bag 14 is fixedly installed in the inside of the fixed box 10, the outer side of the air bag 14 is in communication with one end of a communication pipe 15, the other end of the communication pipe 15 extends out of the fixed box 10 and is in communication with a shunt pipe 16, the shunt pipe 16 is fixed at the rear side of the workbench 5, a row of air blowing heads 17 are arranged at equal intervals at the front side of the shunt pipe 16, and the air blowing heads 17 are oriented to the upper surface of the workbench 5.

[0034] When the air cylinder 3 descends, the connecting rod 8 drives the rack 9 to descend, so that the rack 9 drives the gear 11 to reverse, the shaft 12 drives the cam 13 to reverse, the air bag 14 is pressed, air in the air bag 14 enters the shunt pipe 16 through the communication pipe 15, and then is sprayed out of the shunt pipe 16, so that the workbench 5 is cleaned, the cleaning effect is better, the practicability is higher, the cleaning effect can be realized without a separate driving force, and the practical cost of the device is saved.

[0035] The contents not described in detail in the specification belong to the prior art known to those skilled in the art.

[0036] Although the utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions recorded in the foregoing embodiments or make equivalent replacement to part of the technical features, and any modification, equivalent replacement, improvement, etc. within the spirit and principles of the utility model should be included in the protection scope of the utility model.

Claims

1. A semiconductor wafer multi-piece chamfering machine facilitating debris cleaning, comprising a bottom plate (1), a top plate (2) is arranged above the bottom plate (1), and the top plate (2) and the bottom plate (1) are connected by support columns; characterized in that Further comprising: The upper surface of the bottom plate (1) is fixedly connected with a workbench (5), the lower surface of the workbench (5) is fixedly connected with a driving motor (6), and the output end of the driving motor (6) is connected with a fixing assembly (7), and the fixing assembly (7) is arranged on the upper surface of the workbench (5); The rear side of the workbench (5) is provided with a cleaning mechanism, and the workbench (5) realizes the cleaning effect through the cleaning mechanism.

2. The semiconductor wafer multi-piece chamfering machine of claim 1, wherein: The cleaning mechanism comprises a connecting rod (8) and a rack (9), one end of the connecting rod (8) is fixedly connected with the output end of a cylinder (3) fixedly arranged on the upper end surface of the top plate (2), the lower end of the cylinder (3) penetrates the top plate (2) and is fixedly connected with a grinding piece (4), the rear end of the connecting rod (8) is fixedly connected with the rack (9), and the lower end of the rack (9) penetrates a fixed box (10).

3. The semiconductor wafer multi-piece chamfering machine of claim 2, wherein: The outer side of the rack (9) is engaged with a gear (11), and the gear (11) is provided with two groups, which are arranged on the left and right sides of the rack (9).

4. The semiconductor wafer multi-piece chamfering machine of claim 3, wherein: The middle of the gear (11) is fixedly connected with a shaft rod (12), and the front and rear ends of the shaft rod (12) are connected with bearings of the fixed box (10).

5. The semiconductor wafer multi-piece chamfering machine of claim 4, wherein: The outer side of the shaft rod (12) is further fixedly connected with a cam (13), the outermost side of the cam (13) is in contact with an air bag (14), and the air bag (14) is fixedly arranged in the fixed box (10).

6. The semiconductor wafer multi-piece chamfering machine of claim 5, wherein: The outer side of the air bag (14) is connected with one end of a communication pipe (15), the other end of the communication pipe (15) extends out of the fixed box (10) and is connected with a shunt pipe (16), and the shunt pipe (16) is fixedly arranged on the rear side of the workbench (5).

7. The semiconductor wafer multi-piece chamfering machine of claim 6, wherein: A row of air blowing heads (17) are arranged on the front side of the shunt pipe (16) at equal intervals, and the air blowing heads (17) are aligned towards the upper surface of the workbench (5).

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