Heat pipe heat transfer type heat dissipation charging module
By introducing a heat pipe heat transfer type heat dissipation structure in the charging module and combining it with a fan and liquid cooling system, the problem of insufficient heat dissipation in air-cooled and liquid-cooled modules is solved, and efficient conduction and convection heat dissipation is achieved, which is suitable for the transformation and promotion of new and old equipment.
Patent Information
- Application Number
- CN202423168809.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-12-23
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-12-23
AI Technical Summary
The air cooling of existing charging modules has the problems of high noise and easy accumulation of dust, which leads to local blockage. The liquid cooling module has some components that cannot contact the shell and there is no convection, resulting in uneven heat dissipation.
A heat pipe heat transfer type heat dissipation charging module is adopted, which combines heat pipes and liquid cooling mechanisms. The heat pipes are located between the PCB motherboards and are attached to the heat source. The heat is dissipated through the fan, heat dissipation holes and liquid cooling system to achieve conduction and convection heat dissipation.
It effectively solves the problems of local blockage and uneven heat dissipation, improves heat dissipation efficiency, reduces costs, and is suitable for the transformation and promotion of new and old equipment.
Smart Images
Figure CN223467016U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to charging pile technical field, concretely relates to a heat pipe heat transfer type heat dissipation charging module. BACKGROUND
[0002] New energy automobile development drives the development and update of fast charging and super charging charging piles, and one of the core components of direct current fast charging and direct current super charging charging piles is a charging module, and the prior art divides the charging module into air-cooled charging modules and liquid-cooled charging modules based on heat dissipation modes.
[0003] Among them, the air-cooled charging module mainly adopts a large overpressure panel fan to forcibly transport air to the internal PCB mainboard to realize convection heat dissipation, and the liquid-cooled charging module mainly adopts a cooling liquid to be introduced into a cold plate type shell to contact and conduct heat dissipation with the internal PCB mainboard.
[0004] However, in the actual operation process, the air-cooled charging module adopts a large overpressure fan, which has a large noise, and dust is easy to accumulate after a period of use, causing local blockage and local heat dissipation disadvantage, resulting in device damage phenomenon, and the liquid-cooled charging module adopts a fully sealed structure, and some devices cannot contact the shell or the cold plate, and there is no convection phenomenon. UTILITY MODEL CONTENTS
[0005] The utility model aims at solving the shortcomings in the prior art and provides a heat pipe heat transfer type heat dissipation charging module.
[0006] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme:
[0007] A heat pipe heat transfer type heat dissipation charging module, comprising:
[0008] A shell, a plurality of fans are installed on the side wall of the shell, a PCB mainboard is fixedly connected to the inner top and inner bottom of the shell, an electrical interface is installed on the side wall of the shell away from the fan, and a plurality of heat dissipation holes are formed in the inner wall of the shell away from the fan;
[0009] A plurality of heat pipes, the heat pipes are located between the two PCB mainboards, and the upper end and the lower end of the heat pipes are respectively attached to the heat sources on the two PCB mainboards;
[0010] A liquid cooling mechanism, the liquid cooling mechanism comprises a metal frame, one end of each of the plurality of heat pipes is located in the side wall of the metal frame, and the side wall of the metal frame away from the heat pipes is fixedly connected with the inner wall of the shell away from the fan.
[0011] Preferably, first cavities and second cavities are respectively formed in the inner wall of the metal frame, the first cavities and the second cavities are symmetrically arranged, and a plurality of heat conduction pipes are fixedly and communicatively connected to the inner walls of the first cavities and the second cavities.
[0012] Preferably, the plurality of heat-conducting pipes are all in a snake shape.
[0013] Preferably, the plurality of heat-conducting pipes are all in a straight line shape.
[0014] Preferably, the inner wall of the first cavity is fixedly connected to a liquid inlet pipe, and the inner wall of the second cavity is fixedly connected to a liquid outlet pipe.
[0015] Preferably, the side wall of the liquid inlet pipe and the liquid outlet pipe away from the metal frame both pass through the inner side wall of the housing away from the fan.
[0016] The utility model has the following beneficial effects:
[0017] 1. A heat pipe is installed between the two PCB mainboards, and the heat pipe is in contact with the heat source between the two PCB mainboards. Even if there is a local blockage and convection heat dissipation cannot be achieved, the heat can be taken out through conduction heat dissipation. At the same time, convection heat dissipation can also be achieved for non-power devices.
[0018] 2. A heat pipe is set between the two PCB mainboards instead of using a customized heat pipe for the entire shell, so that the heat pipe in this module can be processed through profiles, which is lower in cost. It can be used not only for new equipment but also for the transformation of old equipment, facilitating its promotion and use. BRIEF DESCRIPTION OF THE DRAWINGS
[0019] Figure 1 This is a schematic structural diagram of a heat pipe heat transfer type heat dissipation charging module in the present utility model;
[0020] Figure 2 for Figure 1 Schematic diagram of the rear view structure;
[0021] Figure 3 for Figure 1 A vertical cross-sectional structural diagram of ;
[0022] Figure 4 for Figure 1 A schematic diagram of a top cross-sectional structure;
[0023] Figure 5 for Figure 4 A schematic diagram of the structure at center A;
[0024] Figure 6 for Figure 3 Schematic diagram of the vertical cross-sectional structure of the metal frame.
[0025] In the figure: 1. Housing; 2. PCB motherboard; 3. Fan; 4. Heat dissipation holes; 5. Electrical interface; 6. Heat pipe; 7. Metal frame; 8. First cavity; 9. Second cavity; 10. Heat pipe; 11. Liquid inlet pipe; 12. Liquid outlet pipe. DETAILED DESCRIPTION
[0026] Clearly, the described embodiments are merely a part of the embodiments of the present application, but not all the embodiments.
[0027] With reference to Figures 1-6 A heat pipe heat dissipation type charging module, comprising a shell 1, a plurality of fans 3 are installed on the side wall of the shell 1, the inner top and the inner bottom of the shell 1 are fixedly connected with a PCB mainboard 2, an electrical interface 5 is installed on the side wall of the shell 1 away from the fan 3, and a plurality of heat dissipation holes 4 are formed in the inner wall of the shell 1 away from the fan 3.
[0028] It should be noted that the electrical interface 5 is electrically connected with the plurality of fans 3, and the electrical interface 5 is electrically connected with the two PCB mainboards 2, and the connection mode is prior art.
[0029] A plurality of heat pipes 6 are located between the two PCB mainboards 2, and the upper end and the lower end of the heat pipe 6 are respectively attached to the heat source on the two PCB mainboards 2.
[0030] A liquid cooling mechanism, the liquid cooling mechanism comprises a metal frame 7, one end of the plurality of heat pipes 6 is located in the side wall of the metal frame 7, the side wall of the metal frame 7 away from the heat pipe 6 is fixedly connected with the inner wall of the shell 1 away from the fan 3, and the heat pipe 6 can absorb the heat on the two PCB mainboards 2 and transmit it to the metal frame 7.
[0031] The inner wall of the metal frame 7 is provided with a first cavity 8 and a second cavity 9, the first cavity 8 and the second cavity 9 are symmetrically arranged, and the inner wall of the first cavity 8 and the second cavity 9 is fixedly connected with a plurality of heat pipes 10.
[0032] The plurality of heat pipes 10 are in a straight line, in addition, the plurality of heat pipes 10 can also be in a serpentine shape (as shown in Figure 5 and Figure 6 ), which prolongs the flow time of the refrigerant in the metal frame 7 and increases the heat dissipation effect of the heat on the heat pipe 6.
[0033] The inner wall of the first cavity 8 is fixedly connected with a liquid inlet pipe 11, the inner wall of the second cavity 9 is fixedly connected with a liquid outlet pipe 12, and the side wall of the liquid inlet pipe 11 and the liquid outlet pipe 12 away from the metal frame 7 penetrates the inner side wall of the shell 1 away from the fan 3 (as shown in Figure 5 ).
[0034] In use, the module starts the plurality of fans 3, and then the air outside flows through the plurality of fans 3, the inside of the shell 1, and the plurality of heat dissipation holes 4, and carries out the heat on the two PCB mainboards 2; at this time, the heat pipe 6 can absorb the heat on the two PCB mainboards 2 and transmit to the two metal frames 7, and the refrigerant outside is pumped into through the two liquid inlet pipes 11 (the pumping method is the prior art), and then the refrigerant flows out through the first cavity 8, the plurality of heat conduction pipes 10, the second cavity 9, and the liquid outlet pipe 12, so that the heat on the heat pipe 6 is carried out through the liquid cooling mode, the heat dissipation on the two PCB mainboards 2 is accelerated, and even if air cooling is used, the heat can be carried out through conduction heat dissipation, and the heat dissipation on the non-power device can also be realized.
[0035] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, and all of them should be covered in the protection scope of the present application.
Claims
1. A heat pipe heat transfer type heat radiation charging module, characterized by, Include: The shell (1), the side wall of the shell (1) is provided with a plurality of fans (3), the inner top and the inner bottom of the shell (1) are fixedly connected with PCB mainboard (2), the side wall of the shell (1) away from the fan (3) is provided with electrical interface (5), the inner wall of the shell (1) away from the fan (3) is provided with a plurality of heat dissipation holes (4); A plurality of heat pipes (6), the heat pipe (6) is located between two PCB mainboards (2), and the upper end and the lower end of the heat pipe (6) are respectively combined with the heat source on the two PCB mainboards (2); Liquid cooling mechanism, the liquid cooling mechanism includes a metal frame (7), one end of a plurality of heat pipes (6) is located in the side wall of the metal frame (7), the side wall of the metal frame (7) away from the heat pipe (6) is fixedly connected with the inner wall of the shell (1) away from the fan (3).
2. The heat pipe heat transfer type heat radiating charging module according to claim 1, characterized in that, The inner wall of the metal frame (7) is respectively provided with first cavity (8) and second cavity (9), the first cavity (8) and the second cavity (9) are symmetrically arranged, the inner wall of the first cavity (8) and the second cavity (9) is fixedly connected with a plurality of heat conducting pipes (10).
3. The heat pipe heat transfer type heat dissipation charging module according to claim 2, characterized in that: A plurality of the heat conducting pipes (10) are all in the shape of snake.
4. The heat pipe heat transfer type heat radiating charging module according to claim 2, characterized in that, A plurality of the heat conducting pipes (10) are all in the shape of straight line.
5. The heat pipe heat transfer type heat radiating charging module according to claim 2, characterized in that, The inner wall of the first cavity (8) is fixedly connected with liquid inlet pipe (11), the inner wall of the second cavity (9) is fixedly connected with liquid outlet pipe (12).
6. The heat pipe heat transfer type heat radiating charging module according to claim 5, wherein The side wall of the liquid inlet pipe (11) and the liquid outlet pipe (12) away from the metal frame (7) all penetrates the inner side wall of the shell (1) away from the fan (3).