Metal heat conduction type heat dissipation charging module

Abstract

The utility model relates to the technical field of charging piles, in particular to a metal heat conduction type heat dissipation charging module which comprises a shell, a plurality of fans are installed on the side wall of the shell, PCB main boards are fixedly connected to the inner top and the inner bottom of the shell, and an electrical interface is installed on the side wall, away from the fans, of the shell. A plurality of heat dissipation holes are formed in the inner wall, away from the fan, of the shell; the metal plate is located between the two PCB main boards, and the upper end and the lower end of the metal plate are attached to the two PCB main boards respectively; the liquid cooling mechanism comprises two metal frames, plugging ports are formed in the side walls of the two metal frames, and the side walls of the two sides of the metal plate are attached to the inner walls of the two plugging ports respectively. According to the utility model, the metal plate is arranged between the two PCB mainboards, and the metal plate is in contact with the two PCB mainboards, so that heat can be brought out through conduction heat dissipation even if local blockage exists and convection heat dissipation can not be realized, and convection heat dissipation can be realized for non-power devices at the same time.

Description

TECHNICAL FIELD

[0001] The utility model relates to charging pile technical field, concretely relates to a metal heat conduction type heat dissipation charging module. BACKGROUND

[0002] New energy automobile development drives the development and update of fast charging and super charging charging piles, and one of the core components of DC fast charging and DC super charging charging piles is a charging module, and the prior art divides the charging module into air-cooled charging modules and liquid-cooled charging modules based on heat dissipation modes.

[0003] Among them, the air-cooled charging module mainly adopts a large overpressure panel fan to forcibly transport air to the internal PCB mainboard to realize convection heat dissipation, and the liquid-cooled charging module mainly adopts a cooling liquid to be introduced into a cold plate type shell to contact and conduct heat dissipation with the internal PCB mainboard.

[0004] However, in the actual operation process, the air-cooled charging module adopts a large overpressure fan, which has a large noise, and dust is easy to accumulate after a period of use, causing local blockage and local heat dissipation disadvantage, resulting in device damage phenomenon, and the liquid-cooled charging module adopts a fully sealed structure, and some devices cannot contact the shell or the cold plate, and there is no convection phenomenon. UTILITY MODEL CONTENTS

[0005] The utility model aims at solving the shortcomings in the prior art and provides a metal heat conduction type heat dissipation charging module.

[0006] In order to realize the above-mentioned purpose, the utility model adopts the following technical scheme:

[0007] A metal heat conduction type heat dissipation charging module, comprising:

[0008] A shell, a plurality of fans are installed on the side wall of the shell, a PCB mainboard is fixedly connected to the inner top and inner bottom of the shell, an electrical interface is installed on the side wall of the shell away from the fan, and a plurality of heat dissipation holes are formed in the inner wall of the shell away from the fan.

[0009] A metal plate is located between the two PCB mainboards, and the upper end and the lower end of the metal plate are respectively attached to the two PCB mainboards.

[0010] A liquid cooling mechanism, comprising two metal frames, a plug-in interface is formed in the side wall of each metal frame, the side walls of the two metal plates are respectively attached to the inner walls of the two plug-in interfaces, and the side wall of one of the metal frames is fixedly connected to the inner wall of the shell away from the fan.

[0011] Preferably, first cavities and second cavities are respectively formed in the inner walls of the metal frames, the first cavities and the second cavities are symmetrically arranged, and a plurality of heat conducting pipes are fixedly connected to the inner walls of the first cavities and the second cavities.

[0012] Preferably, the plurality of heat pipes are in a serpentine shape.

[0013] Preferably, the plurality of heat pipes are in a straight line shape.

[0014] Preferably, the first cavity has an inner wall fixedly connected with an inlet pipe, and the second cavity has an inner wall fixedly connected with an outlet pipe.

[0015] Preferably, the inlet pipe and the outlet pipe are both penetrated through the inner side wall of the shell away from the fan.

[0016] The utility model has the following beneficial effects:

[0017] 1. The metal plate is arranged between the two PCB mainboards, and the metal plate is in contact with the two PCB mainboards, so that even if there is local blockage and convection cooling is impossible, the heat can be taken out through conduction cooling, and the convection cooling of non-power devices can also be realized.

[0018] 2. The metal plate is arranged between the two PCB mainboards instead of the customized metal plate of the overall shell, so that the metal plate in the module can be processed by section material, and the cost is lower. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a structure schematic view of a metal heat conduction type heat dissipation charging module in the utility model;

[0020] Figure 2 It is a vertical sectional structure schematic view of Figure 1

[0021] Figure 3 It is a rear view structure schematic view of Figure 1

[0022] Figure 4 It is a schematic view of a metal frame in Figure 2

[0023] Figure 5 It is a planar sectional structure schematic view of Figure 1

[0024] Figure 6 It is an enlarged schematic view of the structure at A in Figure 5

[0025] Figure 7 It is a rear view structure schematic view of Figure 4

[0026] ​​​​​​In the figure: 1, the shell; 2, PCB mainboard; 3, fan; 4, heat dissipation hole; 5, electrical interface; 6, metal plate; 7, metal frame; 8, plug interface; 9, first cavity; 10, second cavity; 11, heat pipe; 12, liquid inlet pipe; 13, liquid outlet pipe. DETAILED DESCRIPTION

[0027] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. Obviously, the described embodiments are only part of the embodiments of the utility model, not all the embodiments.

[0028] Referring to Figures 1-7 A metal heat conduction type heat dissipation charging module, comprising a shell 1, a plurality of fans 3 are installed on the side wall of the shell 1, a PCB mainboard 2 is fixedly connected to the top and bottom inside the shell 1, an electrical interface 5 is installed on the side wall of the shell 1 away from the fan 3, and a plurality of heat dissipation holes 4 are formed in the inner wall of the shell 1 away from the fan 3.

[0029] It should be noted that the electrical interface 5 is electrically connected with the plurality of fans 3, and the electrical interface 5 is electrically connected with the two PCB mainboards 2, and the connection mode is prior art.

[0030] A metal plate 6 is located between the two PCB mainboards 2, and the upper end and the lower end of the metal plate 6 are respectively attached to the two PCB mainboards 2.

[0031] A liquid cooling mechanism, comprising two metal frames 7, the side walls of the two metal frames 7 are provided with plug interfaces 8, the side walls of the metal plate 6 are respectively attached to the inner walls of the two plug interfaces 8, the side wall of one of the metal frames 7 is fixedly connected to the inner wall of the shell 1 away from the fan 3, and the metal plate 6 can absorb heat on the two PCB mainboards 2 and transmit it to the two metal frames 7.

[0032] First cavities 9 and second cavities 10 are respectively formed in the inner walls of the metal frames 7, the first cavities 9 and the second cavities 10 are symmetrically arranged, and a plurality of heat pipes 11 are fixedly connected and communicated in the inner walls of the first cavities 9 and the second cavities 10.

[0033] It should be noted that during use, only one metal frame 7 can be arranged on the metal plate 6 according to the heating condition of the two PCB mainboards 2, so as to reduce the production cost.

[0034] The plurality of heat pipes 11 are in a straight line, in addition, the plurality of heat pipes 11 can also be in a serpentine shape (as shown in Figure 6 and Figure 7 ), which prolongs the flow time of the refrigerant in the metal frame 7 and increases the heat dissipation effect on the metal plate 6.

[0035] The inner wall of the first cavity 9 is fixedly connected with a liquid inlet pipe 12, and the inner wall of the second cavity 10 is fixedly connected with a liquid outlet pipe 13. The liquid inlet pipe 12 and the liquid outlet pipe 13 penetrate the inner side wall of the shell 1 away from the fan 3 (as shown in Figure 6

[0036] During use, the plurality of fans 3 are started, and then the external air flows through the plurality of fans 3, the inside of the shell 1, and the plurality of heat dissipation holes 4, and carries away the heat on the two PCB mainboards 2. At this time, the metal plate 6 can absorb the heat on the two PCB mainboards 2 and transmit the heat to the two metal frames 7. Meanwhile, the external refrigerant is pumped into the two liquid inlet pipes 12 (the pumping method is the prior art), and then the refrigerant flows out through the first cavity 9, the plurality of heat conduction pipes 11, the second cavity 10, and the liquid outlet pipe 13, so as to carry away the heat on the metal plate 6 by means of liquid cooling, accelerate the heat dissipation of the two PCB mainboards 2, and enable the heat to be carried away by conduction heat dissipation even if air cooling is used, so that the heat cannot be carried away by convection heat dissipation due to local blockage. Meanwhile, the convection heat dissipation can be realized for the non-power devices.

[0037] The above is only a preferred specific embodiment of the present application, but the protection scope of the present application is not limited to this. Any person skilled in the art can make equivalent replacement or change according to the technical scheme and the inventive concept of the present application within the technical range disclosed by the present application, and all of them should be covered in the protection scope of the present application.​

Claims

1. A metal heat conduction type heat dissipation charging module, characterized by, Include: The shell (1), the side wall of the shell (1) is provided with a plurality of fans (3), the inner top and the inner bottom of the shell (1) are fixedly connected with PCB mainboard (2), the side wall of the shell (1) away from the fan (3) is provided with electrical interface (5), the inner wall of the shell (1) away from the fan (3) is provided with a plurality of heat dissipation holes (4); Metal plate (6), the metal plate (6) is located between two PCB mainboards (2), and the upper end and the lower end of the metal plate (6) are respectively attached to two PCB mainboards (2); Liquid cooling mechanism, the liquid cooling mechanism includes two metal frames (7), the side wall of two metal frames (7) is provided with a plug interface (8), the side wall of the metal plate (6) is respectively attached to the inner wall of two plug interfaces (8), wherein one metal frame (7) is fixedly connected with the inner wall of the shell (1) away from the fan (3).

2. The metal heat-conductive type heat-dissipation charging module according to claim 1, characterized in that, The inner wall of the metal frame (7) is respectively provided with a first cavity (9) and a second cavity (10), the first cavity (9) and the second cavity (10) are symmetrically arranged, the inner wall of the first cavity (9) and the second cavity (10) is fixedly connected with a plurality of heat conducting pipes (11).

3. The metal heat-conductive type heat-dissipation charging module according to claim 2, characterized in that, A plurality of heat conducting pipes (11) are in the shape of a snake.

4. The metal heat-conductive type heat-dissipation charging module according to claim 2, characterized in that, A plurality of heat conducting pipes (11) are in the shape of a straight line.

5. The metal heat-conductive type heat-dissipation charging module according to claim 2, characterized in that, The inner wall of the first cavity (9) is fixedly connected with a liquid inlet pipe (12), and the inner wall of the second cavity (10) is fixedly connected with a liquid outlet pipe (13).

6. The metal heat-conductive type heat-dissipation charging module according to claim 5, characterized in that, The side wall of the liquid inlet pipe (12) and the liquid outlet pipe (13) away from the metal frame (7) penetrates the inner side wall of the shell (1) away from the fan (3).

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