Wafer packaging box and wafer storage and transportation structure
By designing a wafer packaging box with a sloping bottom and a snap-fit structure, the problem of collision during wafer transportation is solved, ensuring that the wafer does not collide during transportation and protecting the integrity of the wafer.
Patent Information
- Application Number
- CN202422834802.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-20
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-11-20
AI Technical Summary
During wafer transportation, wafers tend to come close to each other and collide with each other, causing damage to the crystal structure.
Design a wafer packaging box with an inclined bottom surface and an inclined wafer carrier so that the wafer is tilted in the same direction. It is fixed by first and second snap-fit structures to prevent shaking and collision.
It effectively prevents wafers from colliding with each other during transportation, thus protecting the integrity of the crystal structure.
Smart Images
Figure CN223467472U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer technical field especially relates to a wafer packing box and wafer storage and transportation structure. BACKGROUND
[0002] Wafer refers to the carrier for producing integrated circuit, and the wafer is generally thin round piece, and the wafer can be cleaned by being placed in wafer carrier.In the wafer transportation process, the wafer carrier needs to be placed in the wafer packing box for storage.But in the transportation process, the wafers are in a free state, and the wafers are prone to each other to collide, causing the damage of crystal structure. SUMMARY
[0003] The utility model provides a wafer packing box and wafer storage and transportation structure to solve the defect that wafers are prone to each other to collide in the wafer transportation process in the prior art.
[0004] The utility model provides a wafer packing box, it includes: shell and lid, one side of the shell is hinged with the lid, the other side of the shell can be connected with the lid;The shell is used for accommodating wafer carrier, and the bottom surface of the shell is arranged obliquely relative to the placement surface, so that the wafer carrier is placed in the shell and is in an inclined state, and then the plurality of wafers in the wafer carrier is inclined to the same direction.
[0005] According to the wafer packing box provided by the utility model, the bottom surface of the shell includes: a pair of first bottom surface and second bottom surface, a pair of the first bottom surface is arranged on the two sides of the second bottom surface and is connected with the second bottom surface;The distance between the second bottom surface and the placement surface is greater than the distance between the first bottom surface and the placement surface, so that the first bottom surface and the second bottom surface form a first connecting structure, and the first connecting structure is used for connecting with the bottom of the wafer carrier;The first bottom surface and the second bottom surface are arranged obliquely relative to the placement surface.
[0006] According to the wafer packing box provided by the utility model, the inclination angle of the first bottom surface and the second bottom surface is same.
[0007] According to the wafer packing box provided by the utility model, the shell further includes a plurality of reinforcing ribs, and the plurality of reinforcing ribs are arranged on a pair of the first bottom surface respectively, and the wafer carrier is placed on the reinforcing ribs.
[0008] According to the wafer packing box provided by the utility model, the side surface of the shell and the lid is first side surface, the first side surface is equipped with second connecting structure, and the second connecting structure is used for connecting with one side surface of the wafer carrier.
[0009] According to the wafer packaging box, the bottom surface of the shell is provided as an inclined surface, after the wafer carrier is placed in the shell, the wafer carrier is inclined to one side of the shell, and then all the wafers are inclined to the same direction, and do not collide with each other.
[0010] According to the wafer packaging box, the bottom surface of the shell is provided as an inclined surface, after the wafer carrier is placed in the shell, the wafer carrier is inclined to one side of the shell, and then all the wafers are inclined to the same direction, and do not collide with each other.
[0011] According to the wafer packaging box, the bottom surface of the shell is provided as an inclined surface, after the wafer carrier is placed in the shell, the wafer carrier is inclined to one side of the shell, and then all the wafers are inclined to the same direction, and do not collide with each other.
[0012] According to the wafer packaging box, the bottom surface of the shell is provided as an inclined surface, after the wafer carrier is placed in the shell, the wafer carrier is inclined to one side of the shell, and then all the wafers are inclined to the same direction, and do not collide with each other.
[0013] The utility model also provides a wafer storage and transportation structure, including wafer carrier and wafer packaging box as described above, wafer carrier is arranged in the wafer packaging box is inclined.
[0014] The wafer packaging box provided by the utility model can make the wafer carrier inclined to one side of the shell after the wafer carrier is placed in the shell, and then make all the wafers inclined to the same direction, so that the wafers do not collide with each other. BRIEF DESCRIPTION OF DRAWINGS
[0015] In order to more clearly illustrate the technical scheme in the utility model or the prior art, the following will briefly introduce the drawings needed to be used in the embodiment or the prior art description, and obviously, the drawings in the following description are some embodiments of the utility model, and for those skilled in the art, other drawings can also be obtained according to these drawings without creative labor.
[0016] Figure 1 It is the structure schematic diagram of the wafer packaging box in the closed state provided by the utility model.
[0017] Figure 2 It is the structure schematic diagram of the wafer carrier.
[0018] Figure 3is the structural schematic view of the wafer packaging box in the opened state.
[0019] Figure 4 is the structural schematic view of the wafer carrier placed in the wafer packaging box.
[0020] Figure 5 is the structural schematic view of the two wafer packaging boxes stacked.
[0021] Figure 6 is Figure 5 is the partial enlarged view of A shown in the figure.
[0022] Reference signs:
[0023] 1, wafer packaging box; 2, wafer carrier; 3, wafer; 4, placement surface;
[0024] 11, shell; 12, cover; 21, support; 22, connecting piece; 111, bottom surface; 112, reinforcing rib; 113, buckle; 114, first side surface; 115, first boss; 116, second boss; 117, support leg; 121, surrounding rib; 122, convex edge; 1111, first bottom surface; 1112, second bottom surface. DETAILED DESCRIPTION
[0025] In order to make the purpose, technical scheme and advantages of the utility model more clear, the technical scheme in the utility model will be described clearly and completely below in combination with the drawings in the utility model. Obviously, the described embodiments are part of the embodiments of the utility model, rather than all the embodiments. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor fall within the protection scope of the utility model.
[0026] The utility model discloses a wafer packaging box and wafer storage and transportation structure. Figures 1-6 The utility model discloses a wafer packaging box and wafer storage and transportation structure.
[0027] As Figure 1 shown, the utility model embodiment provides wafer packaging box 1 includes: shell 11 and cover 12, one side of shell 11 is hinged with cover 12, to make cover 12 and shell 11 can cover or open. The other side of shell 11 can be clamped with cover 12, so that when cover 12 and shell 11 are covered, cover 12 and shell 11 can be locked together. Shell 11 is used to accommodate wafer carrier 2, and the bottom surface of shell 11 is inclined relative to placement surface 4, so that the plurality of wafers 3 in wafer carrier 2 is inclined in the same direction after being placed in shell 11.
[0028] Specifically, in the prior art, the bottom surface of the wafer packaging box 1 is parallel to the placement surface 4, and after the wafer carrier 2 is placed in the shell 11, the wafers 3 are prone to move towards the middle, causing the adjacent wafers 3 to collide. In the embodiment, the bottom surface 111 of the shell 11 of the wafer packaging box 1 is arranged in an inclined state, as shown in Figure 4 After the wafer carrier 2 is placed in the shell 11, the wafer carrier 2 is inclined to one side, and the wafers 3 are also inclined to one side under the action of gravity, so that all the wafers 3 are inclined to the same direction and do not move towards each other to collide.
[0029] The wafer packaging box provided by the embodiment of the utility model, through setting the bottom surface of the shell as an inclined surface, can make the wafer carrier inclined to one side of the shell after the wafer carrier is placed in the shell, and then make all the wafers inclined to the same direction and do not move towards each other to collide.
[0030] As shown in Figure 3 In the embodiment of the utility model, the bottom surface 111 of the shell 11 comprises: a pair of first bottom surfaces 1111 and a second bottom surface 1112, the pair of first bottom surfaces 1111 are arranged on both sides of the second bottom surface 1112 and connected with the second bottom surface 1112. The distance between the second bottom surface 1112 and the placement surface 4 is greater than the distance between the first bottom surface 1111 and the placement surface 4, so that the first bottom surface 1111 and the second bottom surface 1112 form a first clamping structure, and the first clamping structure is used for clamping the bottom of the wafer carrier 2.
[0031] Specifically, as shown in Figure 2 The wafer carrier 2 comprises a pair of supports 21, the pair of supports 21 are oppositely arranged and connected by a connecting piece 22 to form the wafer carrier 2, each support 21 is provided with a plurality of interval teeth along the extension direction of the length of the support 21, and a wafer 3 accommodating space is formed between adjacent two interval teeth, and the wafer 3 is placed in the accommodating space. When the wafer carrier 2 is placed in the shell 11, the pair of supports 21 are placed on the two first bottom surfaces 1111, and since the second bottom surface 1112 is higher than the first bottom surface 1111, the second bottom surface 1112 can be embedded between the pair of supports 21 and contact the wafers 3 to prevent the wafers 3 from shaking during transportation.
[0032] Further, in the embodiment, the first bottom surface 1111 and the second bottom surface 1112 are both arranged in an inclined state relative to the placement surface 4, so that after the wafer carrier 2 is placed in the shell 11, the wafer carrier 2 is in an inclined state, and the plurality of wafers 3 in the wafer carrier 2 are inclined to the same direction, and the bottom of the wafer 3 abuts against the second bottom surface 1112, thereby avoiding the wafers 3 from shaking and colliding.
[0033] Furthermore, in an embodiment of the present invention, the first bottom surface 1111 and the second bottom surface 1112 have the same inclination angle.
[0034] like Figure 3 As shown, the first bottom surface 111 of the housing 11 is further provided with reinforcing ribs 112. Specifically, each first bottom surface 111 is provided with a pair of reinforcing ribs 112, which are arranged in parallel. The two brackets 21 of the wafer carrier 2 are placed on the pair of reinforcing ribs 112, respectively, to reduce debris generated by friction between the wafer carrier 2 and the wafer packaging box 1. In this embodiment, the surface of the reinforcing ribs 112 is flat. Because the reinforcing ribs 112 are arranged on an inclined surface, when the wafer carrier 2 is placed on the reinforcing ribs 112, the wafer carrier 2 remains in an inclined state, thereby causing all wafers 3 to tilt in the same direction.
[0035] like Figure 3 As shown, in an embodiment of the present invention, the side where the shell 11 and the cover body 12 are hinged is the first side 114, and the first side 114 is provided with a second clamping structure, which is used to clamp with one side of the wafer carrier 2 to prevent the wafer carrier 2 from shaking left and right during transportation.
[0036] Specifically, the second engaging structure includes a first boss 115 and a pair of second bosses 116. The first boss 115 is disposed in the middle of the first side surface 114, and the pair of second bosses 116 are disposed on either side of the first boss 115 and connected to the first boss 115. The distance between the first boss 115 and the first side surface 114 is greater than the distance between the second boss 116 and the first side surface 114. That is, in this embodiment, the thickness of the first boss 115 is greater than the thickness of the second boss 116. When the wafer carrier 2 is placed in the housing 11, the first boss 115 is engaged between the pair of brackets 21 of the wafer carrier 2, and the second boss 116 is engaged on the outside of the brackets 21. This ensures that the wafer carrier 2 is fixed after being placed in the housing 11 without shaking left and right, further preventing collisions between the wafers 3.
[0037] The wafer packaging box provided by the embodiment of the present invention can tilt the wafer carrier in the wafer packaging box by setting the first bottom surface and the second bottom surface of the shell as inclined surfaces, thereby making all wafers in the wafer carrier tilt in the same direction; by setting a first clamping structure, the wafers can be prevented from shaking left and right; by setting a second clamping structure, the wafer carrier can be prevented from shaking left and right, thereby causing the wafers to shake, so that the wafers will not collide during transportation, thereby ensuring the integrity of the crystal structure of the wafers.
[0038] like Figure 5As shown in the embodiment of the utility model, the shell 11 has a plurality of feet 117, the plurality of feet 117 extend below the bottom surface 111 of the shell 11, the surface of the plurality of feet 117 in contact with the placement surface 4 is in the same horizontal plane, so that the shell 11 can be placed horizontally on the placement surface 4, and the wafer carrier 2 is placed obliquely in the shell 11.
[0039] As shown in the embodiment of the utility model, the outer surface of the top surface of the cover 12 is provided with a plurality of surrounding ribs 121 along the circumferential direction of the cover 12, and the surrounding ribs 121 can abut against the side surface of the feet 117 when the plurality of wafer packaging boxes 1 are stacked. Figure 6
[0040] Specifically, the outer surface of the top surface of the cover 12 is provided with a surrounding rib 121 at each of the four corners of the cover 12, and the surrounding rib 121 forms a half-enclosing structure. During transportation, when the plurality of wafer packaging boxes 1 are stacked, the surrounding rib 121 can block the sliding of the feet 117, thereby preventing the upper wafer packaging box 1 from sliding off.
[0041] As shown in the embodiment of the utility model, the outer side of the surface of the shell 11 opposite to the first side surface 114 is provided with a buckle 113, and the periphery of the cover 12 is provided with a convex edge 122, and when the cover 12 is covered with the shell 11, the buckle 113 is connected with the convex edge 122, so that the cover 12 and the shell 11 are locked together. Figure 3
[0042] As shown in the embodiment of the utility model, the wafer storage and transportation structure further comprises a wafer carrier 2 and a wafer packaging box 1, the bottom surface of the wafer packaging box 1 is in an inclined state, and after the wafer carrier 2 is placed in the wafer packaging box 1, the wafer carrier 2 is also in an inclined state, so that the plurality of wafers 3 in the wafer carrier 2 can be inclined towards the same direction, thereby avoiding the wafers 3 from gathering and colliding. Figure 4 The wafer storage and transportation structure provided by the embodiment of the utility model can make the wafer carrier inclined to one side of the wafer packaging box after the wafer carrier is placed in the wafer packaging box, and then make all the wafers inclined towards the same direction, without colliding with each other.
[0043] Further, the wafer carrier 2 comprises a pair of supports 21, the pair of supports 21 are oppositely arranged and connected by a connecting piece 22 to form the wafer carrier 2, each support 21 is provided with a plurality of interval teeth along the extension direction of the length of the support 21, and a wafer 3 accommodating space is formed between adjacent two interval teeth, and the wafer 3 is placed in the accommodating space.
[0044]
[0045] The wafer packaging box 1 comprises a shell 11 and a cover 12, one side of the shell 11 is hinged with the cover 12, so that the cover 12 can be closed or opened with the shell 11. The other side of the shell 11 can be clamped with the cover 12, so that the cover 12 and the shell 11 can be locked together when they are closed. The bottom surface 111 of the shell 11 comprises a pair of first bottom surfaces 1111 and a second bottom surface 1112, the pair of first bottom surfaces 1111 are arranged on both sides of the second bottom surface 1112 and connected with the second bottom surface 1112. The distance between the second bottom surface 1112 and the placement surface 4 is greater than the distance between the first bottom surface 1111 and the placement surface 4, so that the first bottom surface 1111 and the second bottom surface 1112 form a first clamping structure. When the wafer carrier 2 is placed in the shell 11, the pair of supports 21 are placed on the two first bottom surfaces 1111, and because the second bottom surface 1112 is higher than the first bottom surface 1111, the second bottom surface 1112 can be embedded between the pair of supports 21 and contact with the wafer 3, so as to prevent the wafer from shaking during transportation.
[0046] The side of the shell 11 hinged with the cover 12 is the first side 114, the first side 114 is provided with a second clamping structure, the second clamping structure comprises a first boss 115 and a pair of second bosses 116, the first boss 115 is arranged in the middle of the first side 114, the pair of second bosses 116 are respectively arranged on both sides of the first boss 115 and connected with the first boss 115, and the distance between the first boss 115 and the first side 114 is greater than the distance between the second boss 116 and the first side 114. After the wafer carrier 2 is placed in the shell 11, the first boss 115 is clamped between the pair of supports 21 of the wafer carrier 2, and the second boss 116 is clamped outside the support 21, so that the wafer carrier 2 is fixed after being placed in the shell 11 and cannot shake left and right, thereby avoiding collision between the wafers 3.
[0047] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or make equivalent replacement for part of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present application.
Claims
1. A wafer packaging box, characterized in that: include: A shell and a cover, wherein one side of the shell is hinged to the cover, and the other side of the shell can be snap-fitted to the cover; The housing is used to accommodate the wafer carrier, and the bottom surface of the housing is tilted relative to the placement surface, so that the wafer carrier is tilted after being placed in the housing, thereby causing multiple wafers in the wafer carrier to tilt in the same direction; The housing has a plurality of legs, the plurality of legs extending below the bottom surface, and the surfaces of the plurality of legs in contact with the placement surface being on the same horizontal plane, so that the housing can be placed horizontally on the placement surface; The outer surface of the top surface of the cover body is provided with a plurality of ribs along the circumferential direction of the cover body; when a plurality of the wafer packaging boxes are stacked, the ribs can abut against the side surfaces of the supporting legs.
2. The wafer packaging box according to claim 1, wherein The bottom surface of the housing includes: a pair of first bottom surfaces and a second bottom surface, wherein the pair of first bottom surfaces are arranged on both sides of the second bottom surface and connected to the second bottom surface; The distance between the second bottom surface and the placement surface is greater than the distance between the first bottom surface and the placement surface, so that the first bottom surface and the second bottom surface form a first clamping structure, and the first clamping structure is used to clamp with the bottom of the wafer carrier; The first bottom surface and the second bottom surface are arranged obliquely relative to the placement surface.
3. The wafer packaging box according to claim 2, wherein The first bottom surface and the second bottom surface have the same inclination angle.
4. The wafer packaging box according to claim 2, wherein The shell further includes a plurality of reinforcing ribs, which are respectively arranged on a pair of the first bottom surfaces, and the wafer carrier is placed on the reinforcing ribs.
5. The wafer packaging box according to claim 1, wherein The side surface where the shell and the cover are hinged is a first side surface. The first side surface is provided with a second clamping structure. The second clamping structure is used to clamp with a side surface of the wafer carrier.
6. The wafer packaging box according to claim 5, wherein The second clamping structure includes: a first boss and a pair of second bosses, wherein the first boss is arranged in the middle of the first side surface; A pair of second bosses are respectively arranged on both sides of the first boss and connected to the first boss, and a distance between the first boss and the first side surface is greater than a distance between the second boss and the first side surface.
7. The wafer packaging box according to claim 1, wherein The shell is provided with a buckle, and the periphery of the cover body is provided with a convex edge. When the cover body and the shell are covered, the buckle is engaged with the convex edge.
8. A wafer storage structure, characterized by comprising: The invention comprises a wafer carrier and a wafer packaging box according to any one of claims 1 to 7, wherein the wafer carrier is arranged obliquely in the wafer packaging box.