Device for detecting position and inclination of wafer in material box
By installing a lifting structure and a laser sensor detection device inside the hopper, the position and tilt of the wafer are corrected in real time, solving the collision problem caused by incorrect position or tilt of the wafer in the hopper, and ensuring the safety and processing stability of the wafer.
Patent Information
- Application Number
- CN202422870393.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-25
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-11-25
AI Technical Summary
When wafers are not positioned correctly or are tilted within the hopper, they are prone to collisions and friction, resulting in scratches and damage, which affects yield and processing consistency.
A position and tilt detection device for a material box was designed. The device uses a lifting structure and a laser sensor to detect the position and tilt of the wafer. The lifting and lowering movement of the laser sensor is achieved by a motor driving a threaded block and a guide block, so as to correct the position and tilt of the wafer in real time.
To ensure the stability and consistency of wafers during processing, avoid collisions between wafers or between wafers and the cassette, protect the integrity of wafers, and improve yield.
Smart Images
Figure CN223471569U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to wafer technical field, concretely is a position and inclination detection device of wafer in material box. BACKGROUND
[0002] Wafer refers to the silicon wafer used for making silicon semiconductor integrated circuit, its application field is extremely extensive and key, not only is the microprocessor, storage chip and logic chip etc. integrated circuit of computer, mobile phone, panel and the like electronic equipment foundation, still is widely used in photoelectric communication, display technology, solar cell, MEMS sensor, vehicle-mounted electronic system, photoelectric integrated circuit and various display equipment and optical sensor.
[0003] In order to ensure that wafer is not damaged and contaminated in the processing, needs to be placed, transported and protects wafer through material box, when being placed in material box, the wafer appears incorrect position or the situation of inclination, will lead to the collision or friction between wafer and material box or other wafers, thereby causes scratch, breakage and other physical damage, these damage will directly influence the performance and yield of wafer, and will influence the consistency and stability in subsequent processing process, if the position or inclination of wafer is inconsistent, will lead to the parameter change in processing process, thereby influence the quality and performance of product.
[0004] Therefore, to solve the above problems, a position and inclination detection device of wafer in material box is urgently needed to be developed. UTILITY MODEL CONTENT
[0005] The utility model aims at providing a position and inclination detection device of wafer in material box, has the advantages of ensuring wafer safety, solves the problem in the above background art.
[0006] To achieve the above object, the utility model provides the following technical scheme: a position and inclination detection device of wafer in material box, including material box, the both sides of the inner chamber of material box are fixedly connected with a plurality of placing plates, the inner chamber of material box is provided with a plurality of wafers, the surface of wafer is in contact with placing plate, the both sides of the front side of material box are provided with lifting structure.
[0007] The lifting structure includes a workbench rotatably connected with the material box, a motor is fixedly connected to the top of the workbench through a bolt, the output shaft of the motor penetrates into the inner chamber of the workbench and is fixedly connected with a threaded block, the bottom end of the threaded block is fixedly connected with the workbench, and a threaded rod is screw-connected to the surface of the threaded block.
[0008] One side of the threaded rod penetrates into one side of the workbench and is fixedly connected with a laser sensor.
[0009] The top of the work stand is fixedly connected with a rotating rod, the top end of the rotating rod penetrates through the top of the material box and is fixedly connected with a positioning plate, the surface of the positioning plate is provided with a positioning hole, and the two sides of the top of the material box are provided with positioning structures.
[0010] Further, as a preferred embodiment of the present application, the two sides of the rear side of the inner cavity of the material box are fixedly connected with limiting plates, the surface of the limiting plates is fixedly connected with a plurality of position sensors, and one side of the position sensor is in contact with the wafer.
[0011] Further, as a preferred embodiment of the present application, the two sides of the work stand are slidably connected with guide blocks, and the two sides of the guide block are respectively fixedly connected with a threaded block and a laser sensor.
[0012] Further, as a preferred embodiment of the present application, the positioning structure comprises a fixed block fixedly connected with the material box, a positioning rod penetrating through the fixed block, the positioning rod being matched with the positioning hole, a spring sleeved on the surface of the positioning rod, and the two ends of the spring being fixedly connected with the fixed block and the positioning rod.
[0013] Further, as a preferred embodiment of the present application, the two sides of the material box are provided with sliding grooves matched with the two work stands.
[0014] The technical scheme has the following beneficial effects: the wafer safety is ensured, the sensor is driven to move up and down by the lifting structure, the position or inclination of the wafer at different heights in the material box is detected, problems can be found and corrected in time, the stability and consistency of the wafer during processing are ensured, the collision between wafers or between the wafer and the material box caused by incorrect position or inclination is avoided, thereby physical damage such as scratches and breakage is avoided, and the integrity of the wafer is protected.
[0015] It should be understood that all combinations of the aforementioned concepts and additional concepts described in greater detail below can be seen as part of the utility model subject matter of the present disclosure, as long as such concepts are not mutually contradictory. BRIEF DESCRIPTION OF DRAWINGS
[0016] The accompanying drawings are included to provide a further understanding of the present application, and constitute a part of the specification, which together with the embodiments of the present application serve to explain the present application, and do not constitute a limitation on the present application. In the drawings:
[0017] Figure 1 is a structural schematic view of the present application;
[0018] Figure 2 is a partial three-dimensional schematic view of the structure of the present application;
[0019] Figure 3 The utility model discloses a positioning structure three-dimensional schematic view.
[0020] In the drawing, the meaning of each reference sign is as follows: 1, material box;2, placing plate;3, wafer;4, lifting structure;41, work frame;42, motor;43, threaded block;44, threaded rod;45, guide block;5, laser sensor;6, rotating rod;7, positioning plate;8, positioning hole;9, limiting plate;10, position sensor;11, positioning structure;111, fixed block;112, positioning rod;113, spring. DETAILED DESCRIPTION
[0021] The technical solutions in the embodiments of the utility model will be clearly and completely described below with reference to the drawings in the embodiments of the utility model. In order to understand the technical contents of the utility model more clearly, specific embodiments are shown and described below with reference to the accompanying drawings. In the present disclosure, various aspects of the utility model are described with reference to the drawings, and many embodiments of the description are shown in the drawings. It should be understood that the various concepts and embodiments introduced above, as well as those concepts and embodiments described in more detail below, can be implemented in any one of many ways. Based on the embodiments in the utility model, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the utility model.
[0022] As shown in the accompanying Figure 1 to the accompanying Figure 3 It is shown that the embodiment provides a position and inclination detection device for wafers in a material box, which comprises a material box 1, a plurality of placing plates 2 are fixedly connected to the two sides of the inner cavity of the material box 1, a plurality of wafers 3 are arranged in the inner cavity of the material box 1, the surface of the wafer 3 is in contact with the placing plate 2, and the two sides of the front side of the material box 1 are provided with lifting structures 4.
[0023] The lifting structure 4 comprises a work frame 41 rotatably connected with the material box 1, a motor 42 is fixedly connected to the top of the work frame 41 through bolts, the output shaft of the motor 42 penetrates into the inner cavity of the work frame 41 and is fixedly connected with a threaded block 43, the bottom end of the threaded block 43 is fixedly connected with the work frame 41, and the surface of the threaded block 43 is threadedly connected with a threaded rod 44.
[0024] One side of the threaded rod 44 penetrates into one side of the work frame 41 and is fixedly connected with a laser sensor 5.
[0025] The top of the work frame 41 is fixedly connected with a rotating rod 6, the top end of the rotating rod 6 penetrates into the top of the material box 1 and is fixedly connected with a positioning plate 7, the surface of the positioning plate 7 is provided with a positioning hole 8, and the two sides of the top of the material box 1 are provided with positioning structures 11.
[0026] Specifically, the rear side of the inner cavity of the material box 1 is fixedly connected with two limiting plates 9, and the surface of the limiting plate 9 is fixedly connected with a plurality of position sensors 10, one side of the position sensor 10 is in contact with the wafer 3.
[0027] In this embodiment: through the cooperation of the limiting plate 9 and the position sensor 10, the position of the wafer 3 can be further detected and determined.
[0028] Specifically, the two sides of the workbench 41 are slidingly connected with guide blocks 45, and the two sides of the guide block 45 are respectively fixedly connected with the threaded block 43 and the laser sensor 5.
[0029] In this embodiment: through the setting of the guide block 45, the threaded block 43 and the laser sensor 5 can be guided and limited, further ensuring the movement trajectory of the threaded block 43 and the laser sensor 5.
[0030] Specifically, the positioning structure 11 comprises a fixed block 111 fixedly connected with the material box 1, a positioning rod 112 penetrating through the fixed block 111, the positioning rod 112 being matched with the positioning hole 8, a spring 113 being sleeved on the surface of the positioning rod 112, and the two ends of the spring 113 being fixedly connected with the fixed block 111 and the positioning rod 112.
[0031] In this embodiment: through the cooperation of the fixed block 111, the positioning rod 112 and the spring 113, the positioning plate 7 is fixed, further ensuring the stability of the positioning hole 8.
[0032] Specifically, the two sides of the material box 1 are provided with a sliding groove matched with the two workbenches 41.
[0033] In this embodiment: through the setting of the sliding groove, the space for the workbench 41 to rotate on the surface of the material box 1 is provided.
[0034] The working principle and use process of the utility model: the user places multiple wafers 3 on the top of multiple placing plates 2 respectively, so that the surface of the wafer 3 is in contact with the position sensor 10, the position of the wafer 3 is preliminarily detected through the position sensor 10, the positioning rod 112 is pulled upward, the positioning rod 112 drives the spring 113 to stretch upward, the rotating rod 6 is rotated, the rotating rod 6 drives the positioning plate 7 to enter the inner cavity of the fixed block 111 at the same time, the rotating rod 6 drives the two working racks 41 to move relatively, the positioning rod 112 is released, the positioning rod 112 restores the original position under the elastic force of the spring 113, so that the positioning rod 112 is clamped into the inner cavity of the positioning hole 8, the position of the working rack 41 is fixed, so that the two laser sensors 5 are relatively arranged, the two motors 42 are turned on, the output shaft of the motor 42 drives the threaded block 43 to rotate at the same time and moves up and down, since the guide block 45 plays a limiting role on the threaded block 43, the movement state of the threaded block 43 changes to only up and down, and then the two threaded blocks 43 drive the two laser sensors 5 to move up and down synchronously, the position and inclination of the wafer 3 in the inner cavity of the material box 1 are detected through the laser sensor 5, when the laser sensor 5 on one side detects the wafer 3, the laser sensor 5 on the other side cannot detect the wafer 3, at this time, it indicates that the position of the wafer 3 is dislocated or inclined.
[0035] It should be noted that, in the present document, relational terms such as first and second and the like can be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.
[0036] Although the utility model has disclosed as above with preferred embodiments, it is not used to limit the utility model. Those skilled in the art of the utility model can make various changes and decorations without departing from the spirit and scope of the utility model. Therefore, the protection scope of the utility model is defined by the claims.
Claims
1. A device for detecting the position and tilt of a wafer within a cassette, comprising a cassette (1), characterized in that: Both sides of the inner cavity of the material box (1) are fixedly connected with a plurality of placement plates (2), the inner cavity of the material box (1) is provided with a plurality of wafers (3), the surface of the wafer (3) is in contact with the placement plate (2), and both sides of the front side of the material box (1) are provided with lifting structures (4). The lifting structure (4) comprises a workbench (41) rotatably connected with the material box (1), a motor (42) is fixedly connected to the top of the workbench (41) through bolts, the output shaft of the motor (42) penetrates into the inner cavity of the workbench (41) and is fixedly connected with a threaded block (43), the bottom end of the threaded block (43) is fixedly connected with the workbench (41), and the surface of the threaded block (43) is threadedly connected with a threaded rod (44). One side of the threaded rod (44) penetrates into one side of the workbench (41) and is fixedly connected with a laser sensor (5). The top of the workbench (41) is fixedly connected with a rotating rod (6), the top end of the rotating rod (6) penetrates into the top of the material box (1) and is fixedly connected with a positioning plate (7), the surface of the positioning plate (7) is provided with a positioning hole (8), and both sides of the top of the material box (1) are provided with positioning structures (11).
2. The wafer position and tilt detection apparatus in a pod according to claim 1, wherein: Both sides of the rear side of the inner cavity of the material box (1) are fixedly connected with limiting plates (9), the surface of the limiting plate (9) is fixedly connected with a plurality of position sensors (10), and one side of the position sensor (10) is in contact with the wafer (3).
3. The apparatus according to claim 1, wherein: Both sides of the workbench (41) are slidably connected with guide blocks (45), and both sides of the guide block (45) are fixedly connected with the threaded block (43) and the laser sensor (5).
4. The apparatus for detecting position and tilt of a wafer in a cassette according to claim 1, wherein: The positioning structure (11) comprises a fixed block (111) fixedly connected with the material box (1), the fixed block (111) is provided with a positioning rod (112) penetrating through, the positioning rod (112) is matched with the positioning hole (8), the surface of the positioning rod (112) is sleeved with a spring (113), and both ends of the spring (113) are fixedly connected with the fixed block (111) and the positioning rod (112).
5. The apparatus for detecting position and tilt of a wafer in a cassette according to claim 1, wherein: Both sides of the material box (1) are provided with sliding grooves matched with the two workbenches (41).