Through hole detection device based on conductive medium and conductive microprobe

Abstract

The utility model relates to a through hole detection device based on a conductive medium and a conductive microprobe, and belongs to the technical field of semiconductor manufacturing equipment and microelectronics. The device comprises an object carrying disc which is used for placing a sample wafer to be detected, and an electrode column is arranged in the object carrying disc; the transparent circuit substrate is arranged above the carrying disc, a conductive microprobe directly facing the sample wafer on the carrying disc is arranged on the transparent circuit substrate, the conductive microprobe is used for being in contact with the conductive medium to detect the conductivity injection mechanism of the through hole, and the transparent circuit substrate is used for injecting the conductive medium into the carrying disc. The conducting medium enters the through hole of the sample sheet under the capillary action to form a liquid column; and the observation device is arranged above the transparent circuit substrate and is used for observing the conductive medium in the through hole and the contact condition between the conductive microprobe and the conductive medium. According to the utility model, the conductive probe is combined with the carrying disc, the through hole is detected by using the conductivity and capillary action of the liquid metal, and the test efficiency is high.

Description

Technical Field

[0001] The utility model relates to the technical field of semiconductor manufacturing equipment and microelectronics, in particular to a through-hole detection device based on a conductive medium and a conductive microprobe. Background Art

[0002] With the development of the semiconductor field, through-silicon via (TSV) technology and through-glass via (TGV) technology have emerged. These two technologies form through-holes on silicon and glass substrates respectively to achieve vertical interconnection of electrodes between wafers or chips, as well as microfluidic chip packaging on glass substrates. They have the characteristics of improving integration and performance, which in turn leads to the demand for and related methods for through-hole quality detection.

[0003] In the related art, one method is to use a special optical interferometer to inspect through-silicon vias (TSVs). However, due to the high light transmittance of glass, this method is not very effective in inspecting through-glass vias (TGVs).

[0004] Another method is to use X-ray to scan the through-hole structure layer by layer, synthesize a three-dimensional image of the substrate through image processing, and fit the morphology of the through-hole, and compare it with the pre-designed morphology tolerance to determine whether the through-hole morphology meets the requirements. However, although the above-mentioned X-ray detection method can evaluate the conformity of the through-hole morphology, it has obvious shortcomings. It can only determine whether the through-hole morphology meets the design requirements, but cannot directly evaluate the actual performance of the through-hole in electrical interconnection. In addition, this method also requires the design of the expected morphology in advance to obtain the morphology tolerance, which increases the complexity and time cost of the operation.

[0005] In practical applications, technicians are more concerned about whether the through-hole can support good electrical interconnection, which is often impossible to accurately judge through simple morphology inspection. Utility Model Content

[0006] In response to the shortcomings of the above-mentioned existing production technology, the applicant provides a through-hole detection device based on a conductive medium and a conductive microprobe, so as to quickly detect whether the through-hole can support our subsequent electrical interconnection or packaging, with high detection efficiency and good compatibility.

[0007] The technical solution adopted by the present invention is as follows: a through-hole detection device based on a conductive medium and a conductive microprobe, comprising:

[0008] A loading tray, used for placing the sample to be tested and having a space for accommodating a conductive medium, wherein an electrode column is arranged in the loading tray;

[0009] A transparent circuit substrate is arranged above the object table, and a conductive microprobe is arranged on the transparent circuit substrate and is opposite to the sample on the object table, and the conductive microprobe is used to contact the conductive medium to detect the conductive performance of the through hole;

[0010] An injection mechanism is arranged in the object table, and the conductive medium enters the through hole of the sample under capillary action to form a liquid column;

[0011] An observation device is arranged above the transparent circuit substrate, and the observation device is used to observe the conductive medium in the through hole and the contact between the conductive microprobe and the conductive medium;

[0012] Further, a hollow support and a hollow tube are arranged in the object table, the hollow tube is connected to one side of the transparent circuit substrate, the conductive microprobe is connected to the power supply through the circuit on the transparent substrate, the circuit connecting line enters the hollow support through the hollow tube, and the circuit connecting line is led out from the reserved hole below the hollow support and connected to the external measuring instrument.

[0013] As a further improvement of the above technical solution:

[0014] Preferably, the observation device is an objective lens structure, and the objective lens structure is opposite to the position of the through hole on the sample.

[0015] Preferably, a leveling mechanism is further arranged, and the leveling mechanism comprises a leveling platform and a plurality of leveling screws, and is used to adjust the levelness of the object table, so that the conductive medium is uniformly distributed and enters the through hole of the sample.

[0016] More preferably, the three leveling screws are arranged in an equilateral triangle arrangement under the object table.

[0017] Preferably, the object table is a concave structure, and the bottom of the object table is provided with a heating mechanism.

[0018] Preferably, a lifting mechanism is further arranged, and the lifting mechanism is used to adjust the height between the object table, the transparent circuit substrate and the conductive microprobe.

[0019] More preferably, the lifting mechanism comprises a fixed block, a gear, a support block, a limiting block, a gear fixed block and a guide rail, guide rails are arranged on both sides of the fixed block, a rack is arranged on the side opposite to the gear of the guide rail, and the rack is engaged with the gear; the vertical height is fixed by the rotation of the gear to control the lifting of the fixed block and by the limiting block and the spring below the limiting block.

[0020] More preferably, the gear is connected to the support block through a screw rod, the support block is connected to the gear fixed block, and the gear fixed block is connected to the object table.

[0021] The beneficial effects of the utility model are as follows:

[0022] The utility model discloses compact structure, reasonable, convenient operation can improve the test efficiency of test micropore, effectively solve the problem of traditional method operation complicated or later data processing complex,

[0023] The utility model discloses still include following advantages:

[0024] (1) the utility model discloses can directly measure the on-off condition of micropore, directly judges whether micropore is suitable for electrical connection, and test efficiency is high, effectively solve the problem of traditional method operation complicated or later data processing complex,

[0025] (2) the utility model discloses utilize conductive medium, specifically is liquid metal or conductive solution, because the kind of liquid metal and the kind of conductive solution are various, according to different substrate kind, thickness and the aperture of micropore on substrate, we can select different conductive medium to adapt to different substrate,

[0026] (3) the utility model discloses compared with the method of using SEM to observe the section of sample piece split piece to test process parameters, because liquid metal is easy to remove, is basically harmless to substrate, can be repeatedly used, so the device can directly measure substrate and will not damage substrate, and simultaneously adopts electrical measurement, also will not lead to excessive energy consumption, is more economic and suitable for the popularization of society. BRIEF DESCRIPTION OF DRAWINGS

[0027] Fig. 1 It is the whole structure schematic diagram of the utility model.

[0028] Fig. 2 It is the structure schematic diagram of the utility model under the cooperation state with the lifting mechanism.

[0029] Fig. 3 It is the overhead view of the carrier after putting in sample piece of the utility model.

[0030] Wherein: 1, objective lens;2, transparent circuit substrate;3, carrier;4, leveling platform;5, leveling screw;6, fixed block;7, carrier;8, base;9, hollow support;10, electrode column;11, hollow tube;12, conductive microprobe;13, gear;14, support block;15, limit block;16, gear fixed block;17, guide rail;18, sample piece. DETAILED DESCRIPTION

[0031] The embodiment of the utility model is explained below in connection with the drawings.

[0032] For the convenience of understanding the utility model, the utility model will be described more fully below with reference to the relevant drawings. The drawings show the preferred embodiments of the utility model. However, the utility model can be realized in many different forms and is not limited to the embodiments described herein. On the contrary, the purpose of providing these embodiments is to make the disclosure of the utility model more thorough and comprehensive.

[0033] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which the utility model belongs. The terminology used in the specification of the utility model herein is only for the purpose of describing specific embodiments and is not intended to limit the utility model. The term "and / or" used herein includes any and all combinations of one or more related listed items.

[0034] In the case of using "including", "having", and "containing" described herein, unless using the explicit limiting language, such as "only", "consisting of", etc., another component can be added. Unless otherwise mentioned, the singular form of the term can include the plural form and cannot be understood as one in number.

[0035] It should be understood that although the terms "first", "second", etc. can be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the scope of the utility model, the first element can be called the second element, and similarly, the second element can be called the first element.

[0036] In addition, the drawings are not drawn to scale 1:1, and the relative sizes of the elements are only drawn by example in the drawings, not necessarily in true proportion.

[0037] As Figs. 1-3 , a structure state schematic diagram of a via hole detection device based on conductive medium and conductive microprobe in an embodiment of the utility model is shown; for the convenience of description, the drawings only show the structures related to the embodiments of the utility model.

[0038] The via hole detection device based on conductive medium and conductive microprobe of the embodiment comprises:

[0039] The object table 3 is used for placing the sample 18 to be measured and has a space containing the conductive medium, and an electrode column 10 is arranged in the object table 3;

[0040] The transparent circuit substrate 2 is arranged above the object table 3, and the conductive microprobe 12 opposite to the sample 18 on the object table 3 is arranged on the transparent circuit substrate 2, and the conductive microprobe 12 is used for contacting the conductive medium to detect the conductive performance of the via hole;

[0041] An injection mechanism is arranged for injecting the conductive medium into the carrier disc 3, and the conductive medium enters the through hole of the sample 18 to form a liquid column under the capillary action;

[0042] An observation device is arranged above the transparent circuit board 2, and the observation device is used for observing the conductive medium in the through hole and the contact between the conductive micro probe 12 and the conductive medium;

[0043] Further comprising a hollow support 9 and a hollow tube 11 which are hollow and communicated, and the hollow tube 11 is connected with one side of the transparent circuit board 2, the conductive micro probe 12 is connected with the power supply through the circuit on the transparent circuit board 2, and the circuit connecting line enters the hollow support 9 through the hollow tube 11 and is led out from the reserved hole below the hollow support 9 to be connected with external measuring instruments.

[0044] In the embodiment, the observation device is arranged as an objective lens 1 which is arranged opposite to the position of the through hole on the sample 18.

[0045] In the embodiment, a leveling mechanism is further included, and the leveling mechanism comprises a leveling platform 4 and a plurality of leveling screws 5, which are used for adjusting the levelness of the carrier disc 3 and ensuring that the conductive medium is uniformly distributed and enters the through hole of the sample 18.

[0046] Specifically, the three leveling screws 5 are arranged in an equilateral triangle arrangement state below the carrier disc 3.

[0047] In the embodiment, the carrier disc 3 is a concave structure, and the bottom of the carrier disc 3 is provided with a heating mechanism.

[0048] In the embodiment, a lifting mechanism is further included, and the lifting mechanism is used for adjusting the height between the carrier disc 3 and the transparent circuit board 2 and the conductive micro probe 12.

[0049] Specifically, the lifting mechanism comprises a fixed block 6, a gear 13, a support block 14, a limiting block 15, a gear fixing block 16 and a guide rail 17; the guide rail 17 is arranged on both sides of the fixed block 6, one side of the guide rail 17 opposite to the gear 13 is provided with a rack, and the rack is engaged with the gear 13; the vertical height of the fixed block 6 is fixed through the rotation of the gear 13 and the limiting block 15 and the spring below the limiting block 15.

[0050] Specifically, the gear 13 is connected with the support block 14 through a screw rod, the support block 14 is connected with the gear fixing block 16, and the gear fixing block 16 is connected with the carrier platform 7.

[0051] In actual work, the through hole detection device is used for detection, and the specific steps are as follows:

[0052] Step one: place the sample 18 to be tested on the object plate 3 and make sure it is stable;

[0053] Step two: inject conductive medium into the object plate 3 through the conductive medium injection mechanism, which automatically enters the through hole of the sample 18 to be tested under capillary action and forms a liquid column; at this time, the liquid level of the conductive medium should be controlled between one fourth and two thirds of the thickness of the substrate of the sample 18 to be tested;

[0054] Step three: observe the conductive medium in the through hole through the objective lens 1, and adjust the levelness of the object plate 3 using the leveling mechanism and the lifting mechanism, adjust the horizontal position of the object plate 3 through the object table 7, and adjust the height position of the object plate 3 through the lifting mechanism, so as to change the height of the object plate 3 relative to the transparent circuit substrate 2 and the conductive microprobe 12, so that the conductive microprobe 12 is in good contact with the conductive medium;

[0055] Step four: connect the electrode column 10 and the conductive microprobe 12 to the two probes of the multimeter respectively, and determine whether the hole of the sample 18 is a through hole by measuring the resistance; at the same time, according to the size of the deviation of the measured resistance from the expected resistance, it is determined whether the inside of the through hole is suitable for subsequent electrical connection;

[0056] Step five: after detection, recover the conductive medium, and use ultrasonic cleaning and other technologies to process the sample 18 to ensure that there is no conductive medium residue on the surface.

[0057] In this embodiment, the conductive medium described above is liquid metal or conductive solution; specifically, the conductive medium uses liquid metal gallium-indium alloy.

[0058] Please continue to refer to Fig. 1 , the assembly process of the present application when used with a microscope is as follows:

[0059] Place the fixing block 6 on the microscope stage, then place the leveling platform 4, leveling screw 5 and bottom heating concave object plate 3 in turn, and then place the base 8 on the desktop.

[0060] In summary, the present application has strong compatibility and can detect through holes of various substrate materials such as silicon or glass; the test efficiency is high, the electrical performance of the through hole is directly measured to determine whether it is suitable for electrical interconnection, without complex topography detection or data processing process; for example, by connecting the two probes of the multimeter to the electrode column 10 and the conductive microprobe 12 respectively, the resistance is measured to determine whether the hole of the sample 18 is a through hole, which reduces the operation difficulty and time cost.

[0061] Any combination of the technical features in the above-described embodiments can be made, and for the sake of brevity, not all possible combinations are described, however, as long as the combination of the technical features does not exist in contradiction, it shall be considered as the scope of the description.

[0062] The above-described embodiments only express the implementation manners of the present application, and the description is relatively specific and detailed, but it shall not be understood as the limitation of the scope of the present application patent. It should be noted that, for those skilled in the art, some modifications and improvements can be made without departing from the concept of the present application, and these all belong to the protection scope of the present application. Therefore, the protection scope of the present application patent shall be subject to the appended claims.

Claims

1. A through-hole inspection apparatus based on a conductive medium and a conductive microprobe, characterized by, The utility model relates to a kind of microelectronic circuit test equipment, including: A carrier disc (3) for placing a sample (18) to be tested, having a space for containing an electrically conductive medium, and an electrode column (10) is provided in the carrier disc (3); A transparent circuit substrate (2) is provided above the carrier disc (3), and an electrically conductive microprobe (12) is provided on the transparent circuit substrate (2) opposite the sample (18) on the carrier disc (3), which is used to contact the electrically conductive medium to detect the conductive performance of the via hole; An injection mechanism is used to inject the electrically conductive medium into the carrier disc (3), which enters the via hole of the sample (18) to form a liquid column under capillary action; An observation device is provided above the transparent circuit substrate (2), which is used to observe the electrically conductive medium in the via hole and the contact between the electrically conductive microprobe (12) and the electrically conductive medium; Further comprising a hollow support (9) and a hollow tube (11) that are hollow and communicate with each other, the hollow tube (11) is connected to one side of the transparent circuit substrate (2), the electrically conductive microprobe (12) is connected to the power supply through the circuit on the transparent circuit substrate (2), the circuit connection line enters the hollow support (9) through the hollow tube (11), and is led out from the reserved hole below the hollow support (9) to be connected to external measuring instruments.

2. The electrically conductive medium and electrically conductive microprobe based via detection apparatus of claim 1, wherein, The observation device is an objective lens structure opposite the position of the via hole on the sample (18).

3. The electrically conductive medium and electrically conductive microprobe based via detection apparatus of claim 1, wherein, Further comprising a leveling mechanism, the leveling mechanism includes a leveling platform (4) and a plurality of leveling screws (5) for adjusting the levelness of the carrier disc (3) to ensure uniform distribution of the electrically conductive medium into the via hole of the sample (18).

4. The conductive medium and conductive microprobe based via detection apparatus of claim 3, wherein, The three leveling screws (5) are arranged in an equilateral triangle arrangement under the carrier disc (3).

5. The electrically conductive medium and electrically conductive microprobe based via detection apparatus of claim 1, wherein, The carrier disc (3) is a concave structure, and the bottom of the carrier disc (3) is provided with a heating mechanism.

6. The electrically conductive medium and electrically conductive microprobe based via detection apparatus of claim 1, wherein, Further comprising a lifting mechanism for adjusting the height between the carrier disc (3) and the transparent circuit substrate (2) and the electrically conductive microprobe (12).

7. The electrically conductive medium and electrically conductive microprobe based via detection apparatus of claim 6, wherein, The lifting mechanism includes a fixed block (6), a gear (13), a support block (14), a limiting block (15), a gear fixed block (16), and a guide rail (17). Guide rails (17) are provided on both sides of the fixed block (6), and a rack is provided on the side opposite the gear (13), and the rack is engaged with the gear (13); the vertical height is fixed by the rotation of the gear (13) to control the lifting of the fixed block (6), and the limiting block (15) and the spring below the limiting block (15) are used to complete the fixing of the vertical height.

8. The electrically conductive medium and electrically conductive microprobe based via detection apparatus of claim 7, wherein, The gear (13) is connected to the support block (14) through a screw rod, the support block (14) is connected to the gear fixed block (16), and the gear fixed block (16) is connected to the carrier stage (7).

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