Monitoring equipment with high heat dissipation performance
By setting a sink structure at the bottom of the metal shell of the monitoring equipment to contact the chip, and combining it with heat dissipation fins and heat dissipation glue, the problem of insufficient heat dissipation of the monitoring equipment is solved, efficient heat dissipation is achieved, and the normal operation of the equipment is ensured.
Patent Information
- Application Number
- CN202422784916.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-11-15
- Publication Date
- 2025-10-24
- Estimated Expiration
- 2034-11-15
AI Technical Summary
Because existing monitoring equipment uses non-metallic shells, the heat of the 5G communication module cannot be dissipated in time, affecting the normal operation of the internal components of the equipment.
The shell is made of metal, and a groove structure is set at the bottom of the shell. A protrusion is formed on the inside of the groove to contact the chip on the main control board. Combined with heat dissipation fins and heat dissipation glue, the good thermal conductivity of metal is used to quickly dissipate heat.
The heat dissipation performance of the monitoring equipment is improved, local high temperature caused by chip heating is avoided, and the normal operation of the equipment is ensured.
Smart Images

Figure CN223472473U_ABST
Abstract
Description
TECHNICAL FIELD
[0001] The utility model relates to power distribution network inspection technical field especially relates to a kind of high-performance monitoring equipment. BACKGROUND
[0002] With the development of 5G communication technology, the existing monitoring equipment also gradually applies 5G communication module. However, the heat generation of the module related to 5G communication is large, and since the metal shell shields 5G signal, the shell of the monitoring equipment usually needs to use a non-metallic shell in some application scenarios, which causes the heat of the device to not be dissipated in time, greatly affecting the normal operation of the internal components of the device. SUMMARY
[0003] The technical problem to be solved by the utility model is to provide a kind of high-performance monitoring equipment, improve the heat dissipation performance of monitoring equipment.
[0004] To solve the above technical problem, the technical scheme adopted by the utility model is:
[0005] A kind of monitoring equipment of high heat dissipation, including main control board and the shell of metal material of bottom;The outer side of the bottom of the shell is provided with sink, and the sink forms protrusion in the inner side of the shell;The main control board is set in the shell, and the side of the main control board towards the bottom of the shell is provided with chip;The chip and the protrusion formed by the sink abut.
[0006] Further, the bottom of the sink is provided with heat dissipation fin.
[0007] Further, the chip and the protrusion formed by the sink are provided with heat dissipation glue or heat dissipation pad.
[0008] Further, at least two chips are provided on the main control board, and the chips are arranged at different positions;The same number of sinks as the number of chips is provided on the outer side of the bottom of the shell;Each sink corresponds to the position of one chip.
[0009] Further, it further includes the fixing frame of metal material;The inner bottom surface of the shell is provided with the fixing frame;Camera is provided on the fixing frame, and the camera is connected with the main control board.
[0010] Further, at least two cameras are provided on the fixing frame.
[0011] Further, the shell comprises an upper shell of non-metallic material and a lower shell of metallic material; the upper shell and the lower shell are detachably connected, and the upper shell and the lower shell form a first cavity and a second cavity isolated from each other respectively; the first cavity formed by the upper shell is used for placing an antenna module; and the main control board is arranged in the second cavity formed by the lower shell.
[0012] Further, the outer wall of the lower shell is provided with a positioning protrusion, and the outer wall of the upper shell is provided with a positioning notch arranged opposite to the positioning protrusion.
[0013] Further, the lower shell is provided with a locking protrusion close to the end face of the upper shell, and the locking protrusion is arranged on the inner side of the end face of the lower shell; and a fixing hole is arranged in the locking protrusion and used for connecting with the upper shell.
[0014] Further, the lower shell is provided with a sealing groove on the end face close to the upper shell; the sealing groove is arranged on the outer side of the end face of the lower shell, and the locking protrusion is arranged on the outer side of the sealing groove.
[0015] The utility model discloses beneficial effect lies in: setting the sink structure in the shell bottom, and the sink structure contacts the chip on the main control board, utilizes the characteristic that metal has good heat conduction performance, makes the sink structure can export the heat generated by the high heat chip contacted with it to the outside of the shell quickly, avoids the local high temperature caused by the chip heating, thereby improves the heat dissipation performance of equipment. BRIEF DESCRIPTION OF DRAWINGS
[0016] Figure 1 It is the sectional view of A-A plane of the monitoring equipment of high heat dissipation property in the utility model embodiment;
[0017] Figure 2 It is the sectional view of B-B plane of the monitoring equipment of high heat dissipation property in the utility model embodiment; Figure 1 It is the structure enlarged view of A portion in the utility model embodiment;
[0018] Figure 3 It is the plan view of the monitoring equipment of high heat dissipation property in the utility model embodiment;
[0019] Figure 4 It is the sectional view of A-A plane of the monitoring equipment of high heat dissipation property in the utility model embodiment;
[0020] Figure 5 It is the shell structure diagram of the monitoring equipment of high heat dissipation property in the utility model embodiment;
[0021] Figure 6 It is the internal structure diagram of the lower shell of the monitoring equipment of high heat dissipation property in the utility model embodiment;
[0022] Label explanation:
[0023] 1, shell; 11, sink; 111, protrusion; 12, heat dissipation fin; 13, upper shell; 131, positioning notch; 14, lower shell; 141, positioning bump; 142, locking bump; 143, sealing groove;
[0024] 2, main control board; 21, chip; 3, antenna module; 4, fixing frame; 5, camera. DETAILED DESCRIPTION
[0025] To illustrate the technical content of the utility model, the purposes and effects achieved, the following will be described in conjunction with the embodiments and the accompanying drawings.
[0026] A kind of high heat dissipation monitoring equipment, including main control board and the shell with metal material bottom;The outside of the shell bottom is provided with sink, and the sink forms protrusion in the inside of the shell;The main control board is set in the shell, and the main control board is provided with chip towards the bottom of the shell;Chip and the protrusion formed by sink abut.
[0027] From the above description, the beneficial effects of the utility model are that: by setting sink structure in the bottom of shell, and the chip on main control board is contacted;By the characteristics that metal has good heat conduction performance, the heat generated by high heat chip contacted with sink structure can be quickly conducted out of the shell, avoid local high temperature caused by chip heating, so as to improve the heat dissipation performance of equipment.
[0028] Further, the bottom of the sink is provided with heat dissipation fin.
[0029] From the above description, by setting heat dissipation fin in the bottom of sink, the contact area of sink structure and air is increased, and the heat dissipation efficiency of sink is improved, so that the heat generated by high heat chip can be quickly conducted out of the shell through sink and heat dissipation fin.
[0030] Further, the chip and the protrusion formed by sink abut.
[0031] From the above description, by setting heat dissipation glue or heat dissipation pad between sink structure and high heat chip, the heat generated by high heat chip can be transmitted to sink structure more quickly, and conducted to the outside of shell through sink structure, so as to improve the heat dissipation performance of equipment.
[0032] Further, at least two chips are provided on the main control board, and the chips are arranged at different positions;The same number of sinks as the number of chips is provided on the outside of the bottom of the shell;Each sink corresponds to the position of one chip.
[0033] From the above description, by setting the corresponding sink structure for each high-heat chip, the heat generated by each high-heat chip on the main control board can be quickly conducted to the outside of the shell through the sink structure, thereby improving the heat dissipation performance of the device.
[0034] Further, a fixed frame of metal material is further included; the fixed frame is arranged on the inner bottom surface of the shell; a camera is arranged on the fixed frame, and the camera is connected with the main control board.
[0035] From the above description, by installing the camera with the fixed frame of metal material, and arranging the fixed frame on the inner bottom surface of the shell, the heat on the camera driving board can be guided to the fixed frame, and then the heat is transmitted to the lower shell for heat dissipation, thereby avoiding local high temperature.
[0036] Further, at least two cameras are arranged on the fixed frame.
[0037] From the above description, by arranging multiple cameras on the same fixed frame, the tolerance accumulation problem caused by independent installation of multiple cameras can be avoided.
[0038] Further, the shell includes an upper shell of non-metal material and a lower shell of metal material; the upper shell and the lower shell are detachably connected, and the upper shell and the lower shell form a first cavity and a second cavity isolated from each other, respectively; the first cavity formed by the upper shell is used for placing an antenna module; and the main control board is arranged in the second cavity formed by the lower shell.
[0039] From the above description, the upper shell and the lower shell are used to constitute the shell structure, and the upper shell and the lower shell form the first cavity and the second cavity isolated from each other, respectively, for setting the antenna module and other main control driving, thereby avoiding the problem that the antenna module cannot be accurately positioned due to the influence of the electronic device on the main control board.
[0040] Further, a positioning protrusion is arranged on the outer wall of the lower shell; and a positioning notch is arranged on the outer wall of the upper shell and is arranged opposite to the positioning protrusion.
[0041] From the above description, by arranging the positioning protrusion on the lower shell and the positioning notch on the upper shell, the positioning protrusion and the positioning notch can be used to quickly complete the positioning installation of the shell.
[0042] Further, a locking protrusion is arranged on the end surface of the lower shell close to the upper shell, and the locking protrusion is arranged on the inner side of the end surface of the lower shell; and a fixing hole is arranged in the locking protrusion and is used for connecting with the upper shell.
[0043] From the above description, by setting the locking protrusion on the lower shell, and setting the fixing hole in the locking protrusion, so that the lower shell and the upper shell are fixedly connected through the screw structure, the stability of the equipment is improved.
[0044] Further, the lower shell is provided with a sealing groove on the end face close to the upper shell; the sealing groove is arranged on the inner side of the end face of the lower shell, and the locking protrusion is arranged on the outer side of the sealing groove.
[0045] From the above description, by setting the locking protrusion on the outer side of the sealing groove, the influence of the locking protrusion on the sealing performance of the equipment can be avoided, thereby improving the sealing performance of the equipment.
[0046] The high-heat-dissipation monitoring device provided by the utility model can be applied to the scene of monitoring landslides, landslides, debris flows, ground subsidence and the like.
[0047] Embodiment one
[0048] Please refer to Figure 1 and Figure 2 A kind of high-heat-dissipation monitoring device, including main control board 2 and the shell 1 of metal material of bottom;The outer side of the bottom of the shell 1 is provided with groove 11, and the groove 11 forms protrusion 111 on the inner side of the shell 1;The main control board 2 is set in the shell 1, and the main control board 2 is provided with chip 21 towards the side of the bottom of the shell 1;Chip 21 and the protrusion 111 formed by groove 11 abut;Specifically, heat dissipation glue or heat dissipation pad can be further provided between chip 21 and the protrusion 111 formed by groove 11, so that the heat generated by chip 21 is quickly exported to groove 11.
[0049] Please refer to Figure 3 and Figure 4 The main control board 2 is provided with at least two chip 21, and the chip 21 is arranged at different positions;The outer side of the bottom of the shell 1 is provided with the same number of groove 11 as the number of chip 21;Each groove 11 corresponds to the position of one chip 21;For example, two chip 21 are provided in this embodiment, and two groove 11 are arranged on the bottom of the shell 1, which correspond to one chip 21 respectively.
[0050] Please refer to Figure 1 and Figure 5The shell 1 comprises an upper shell 13 of non-metallic material and a lower shell 14 of metallic material; the upper shell 13 is made of non-metallic material to meet the 5G requirement of the antenna module 3; the upper shell 13 is detachably connected with the lower shell 14, and the upper shell 13 and the lower shell 14 form a first cavity and a second cavity, respectively; the first cavity formed by the upper shell 13 is used for placing the antenna module 3; the main control board 2 is arranged in the second cavity formed by the lower shell 14. In an optional embodiment, the cavities formed by the upper shell 13 and the lower shell 14 can be separated into the first cavity and the second cavity by a separation plate or the like. The outer wall of the lower shell 14 is provided with a positioning protrusion 141, and the outer wall of the upper shell 13 is provided with a positioning notch 131 arranged opposite to the positioning protrusion 141.
[0051] The end surface of the lower shell 14 close to the upper shell 13 is provided with a locking protrusion 142 arranged inside the end surface of the lower shell 14, and the locking protrusion 142 is provided with a fixing hole for connecting with the upper shell 13. Meanwhile, the end surface of the lower shell 14 close to the upper shell 13 is provided with a sealing groove 143; the sealing groove 143 is arranged around the inside of the end surface of the lower shell 14, and the locking protrusion 142 is arranged outside the sealing groove 143, so as to isolate the screw fastening part outside the equipment and improve the sealing performance of the equipment.
[0052] Please refer to Figure 6 The device further comprises a fixing frame 4 of metallic material; the fixing frame 4 is arranged on the inner bottom surface of the shell 1; a camera 5 is arranged on the fixing frame 4, and the camera 5 is connected with the main control board 2; as shown in Figure 6 Two fixing members are arranged opposite to each other in the lower shell 14, and two adjacent cameras 5 are fixed on the same fixing frame 4; by using the fixing frame 4 of metallic material, the heat on the driving board of the camera 5 can be guided to the fixing frame 4, and the heat can be transmitted to the lower shell 14 through the fixing frame 4 for heat dissipation to avoid local high temperature; the camera 5 is a wide-angle camera 5, and the cameras 5 are arranged around the equipment to collect images for panoramic stitching; meanwhile, a camera 5 can be arranged at the bottom of the lower shell 14 to monitor the space at the bottom of the equipment.
[0053] The above is only an embodiment of the present application, and does not limit the patent range of the present application, and any equivalent transformation or direct or indirect application in the related technical field according to the content of the present application is also included in the patent protection range of the present application.
Claims
1. A monitoring device with high heat dissipation, characterized in that, The shell comprises a main control board and a bottom shell made of metal material; A sunken groove is formed on the outer side of the bottom shell, and a protrusion is formed on the inner side of the bottom shell; The main control board is arranged in the shell, and the chip is arranged on the side of the main control board facing the bottom of the shell; The chip is in abutment with the protrusion formed by the sunken groove.
2. The monitoring device of claim 1, wherein, A heat dissipation fin is arranged in the bottom of the sunken groove.
3. The monitoring device of claim 1, wherein, A heat dissipation glue or a heat dissipation pad is arranged between the chip and the protrusion formed by the sunken groove.
4. The monitoring device of claim 1, wherein, At least two chips are arranged on the main control board, and the chips are arranged at different positions; The same number of sunken grooves as the number of chips are formed on the outer side of the bottom of the shell; Each sunken groove corresponds to the position of one chip.
5. The monitoring device of claim 1, wherein, A fixing frame made of metal material is further included; The fixing frame is arranged on the inner bottom surface of the shell; A camera is arranged on the fixing frame, and the camera is connected with the main control board.
6. The monitoring device of claim 5, wherein, At least two cameras are arranged on the fixing frame.
7. The monitoring device of claim 1, wherein, The shell comprises an upper shell made of non-metal material and a lower shell made of metal material; The upper shell and the lower shell are detachably connected, and the upper shell and the lower shell form a first cavity and a second cavity, respectively, which are isolated from each other; The first cavity formed by the upper shell is used for placing an antenna module; The main control board is arranged in the second cavity formed by the lower shell.
8. The monitoring device of claim 7, wherein, A positioning protrusion is arranged on the outer wall of the lower shell; A positioning notch is arranged on the outer wall of the upper shell, and the positioning notch is arranged opposite to the positioning protrusion.
9. The monitoring device of claim 7, wherein the heat sink is made of a material selected from the group consisting of aluminum, copper, and alloys thereof. A locking protrusion is arranged on the end surface of the lower shell close to the upper shell, and the locking protrusion is arranged on the inner side of the end surface of the lower shell; A fixing hole is arranged in the locking protrusion for connecting with the upper shell.
10. The monitoring device of claim 9, wherein, A sealing groove is formed on the end surface of the lower shell close to the upper shell; The sealing groove is arranged on the inner side of the end surface of the lower shell, and the locking protrusion is arranged on the outer side of the sealing groove.