Circuit board structure and therapeutic instrument host

Abstract

The utility model discloses a circuit board structure and therapeutic instrument host, relates to electronic equipment technical field, the circuit board structure includes circuit board, radiator, snap spring and electronic device, the radiator is provided on the circuit board, the radiator includes main part and fin, the fin is provided on the main part, the fin and the main part cooperate to form the card slot, snap spring is clamped in the card slot, and the electronic device is fixed on the main part. The circuit board is arranged in the main body and detachably connected with the main body, a clamping space is defined by the clamping spring and the main body, and the electronic device is arranged in the clamping space and electrically connected with the circuit board. According to the technical scheme provided by the utility model, the problem that the existing electronic device fixing mode is complicated to operate is solved.

Description

TECHNICAL FIELD

[0001] The utility model relates to electronic equipment technical field, especially a kind of circuit board structure and therapy instrument mainframe. BACKGROUND

[0002] In the related art, PCB board plug-in electronic device is fixed on the heat sink by spring, but the fixing mode of the spring is to open a notch on the heat sink, and the spring is clamped on the notch to connect the spring. This method needs to open a slot on the heat sink, which is complex to operate. SUMMARY

[0003] The main purpose of the utility model is to provide a kind of circuit board structure and therapy instrument mainframe, to solve the problem of complex operation of the existing electronic device fixing mode.

[0004] To achieve the above purpose, the utility model provides a kind of circuit board structure, the circuit board structure includes: circuit board;Heat sink, the heat sink is located on the circuit board, the heat sink includes main body and fin, the fin is located on the main body, the fin cooperates with the main body to form a clamping groove;Clamp spring, the clamp spring is clamped in the clamping groove, and is detachably connected with the main body, and the clamp spring and the main body form a clamping space;And electronic device, the electronic device is located in the clamping space, and is electrically connected with the circuit board.

[0005] In an embodiment, the main body is provided with an anti-falling buckle, the anti-falling buckle is located in the clamping groove, one end of the clamp spring is bent and forms a holding part, and the holding part holds the anti-falling buckle;The fin is provided with a protrusion, the protrusion is located in the clamping groove, and the protrusion holds the surface of the clamp spring.

[0006] In an embodiment, the main body includes a fixed part and an extension part, the extension part is located at the top of the fixed part, the circumferential dimension of the fixed part is greater than the circumferential dimension of the extension part, the fin is located in the extension part, and the clamping groove is formed between the fin and the fixed part. The other end of the clamp spring and the fixed part form the clamping space.

[0007] In an embodiment, the fin is provided with a plurality of fins, and the plurality of fins are connected to the extension part;The opposite sides of the extension part form a first connecting surface and a second connecting surface, the plurality of fins are arranged to extend outward from the first connecting surface and the second connecting surface, and the clamping space is formed in the first connecting surface. The fin closest to the fixed part among the plurality of fins forms the clamping groove between the fixed part.

[0008] In an embodiment, the fin is provided with a plurality of fins connected to the extension; the opposite sides of the extension form a third connecting surface and a fourth connecting surface, and the plurality of fins are arranged to extend outward from the third connecting surface and the fourth connecting surface, and the third connecting surface and the fourth connecting surface are respectively provided with the clamping space, and the two fins closest to the fixed part on the third connecting surface and the fourth connecting surface are respectively provided with a clamping groove between the fixed part.

[0009] In an embodiment, the fin extends along the length direction of the main body to form the clamping groove in cooperation with the fixed part; the clamping spring is provided with a plurality of clamping springs mounted in the clamping groove along the length direction.

[0010] In an embodiment, the heat sink further comprises a heat-conducting ceramic sheet arranged in the clamping space and attached to the surface of the main body.

[0011] In an embodiment, the two opposite surfaces of the heat-conducting ceramic sheet are respectively provided with a heat-conducting silicone grease layer.

[0012] In an embodiment, the bottom of the main body is provided with a threaded groove, and the circuit board is provided with a threaded hole matched with the threaded groove.

[0013] In an embodiment, the electronic device is a MOS tube, the MOS tube is mounted in the clamping space, the clamping spring abuts against the surface of the MOS tube, and the pin of the MOS tube is welded to the circuit board.

[0014] The utility model also provides a therapeutic instrument host computer, including power module, the power module includes the circuit board structure as above.

[0015] Compared with the prior art, the circuit board structure and the therapeutic instrument host computer provided by the utility model have the following beneficial effects:

[0016] The utility model technical scheme utilizes the structural characteristics of the heat sink itself, forms a clamping groove between the fin and the main body of the heat sink, and the clamping spring is clamped in the clamping groove to provide reliable fixation for the clamping spring, and the clamping spring and the main body form a clamping space to clamp the electronic device; when installing the electronic device, the clamping spring clamps the electronic device, which can provide reliable fixation for the electronic device in a small space without occupying a large installation space of the circuit board, and the fin and the main body simultaneously dissipate heat for the electronic device, which can effectively expand the heat exchange area, accelerate the heat transfer speed, and further improve the heat dissipation efficiency. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the embodiments of the present application or the prior art, the following will briefly introduce the drawings needed to be used in the description of the embodiments or the prior art. Obviously, the drawings described below are only some of the embodiments of the present application, and for those skilled in the art, other drawings can also be obtained from the structures shown in these drawings without creative labor.

[0018] Figure 1 A side view of an embodiment of the circuit board structure of the present application;

[0019] Figure 2 A structure schematic view of an embodiment of the radiator of the present application;

[0020] Figure 3 A side view of another embodiment of the circuit board structure of the present application;

[0021] Figure 4 A structure schematic view of another embodiment of the radiator of the present application.

[0022] Explanation of reference numerals:

[0023] 100, circuit board structure; 101, clamping space; 10, circuit board; 20, radiator; 21, main body; 211, anti-tripping; 212, fixed part; 213, extension part; 2131, first connecting surface; 2132, second connecting surface; 2133, third connecting surface; 2134, fourth connecting surface; 214, threaded groove; 22, fin; 221, protruding block; 23, clamping groove; 30, clamping spring; 31, abutting part; 40, electronic device; 41, MOS tube; 50, heat-conducting ceramic sheet; 60, screw.

[0024] The realization, functional features and advantages of the present application will be further described with reference to the embodiments and the accompanying drawings. DETAILED DESCRIPTION

[0025] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only some of the embodiments of the present application, but not all the embodiments. Based on the embodiments in the present application, all the other embodiments obtained by those skilled in the art without creative labor fall within the scope of protection of the present application.

[0026] It should be noted that all the directionality indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present application are only used to explain the relative positional relationship, movement condition, etc. between the components in a certain specific posture (as shown in the drawings). If the specific posture changes, the directionality indications also change accordingly.

[0027] In addition, the description of "first", "second" and the like in the present application is only for the purpose of description, and cannot be understood as indicating or implying the relative importance of the indicated technical features or implying the number of the indicated technical features. Therefore, the features limited by "first" and "second" can be explicitly or implicitly included at least one of the features. In addition, the technical solutions of various embodiments can be combined with each other, but it must be based on the realization of ordinary skilled in the art, when the combination of technical solutions appears contradictory or unachievable, it should be considered that the combination of technical solutions does not exist, and is not within the protection scope required by the present application.

[0028] Please refer to Figures 1 to 4 The utility model provides a kind of circuit board structure 100, the circuit board structure 100 includes: circuit board 10;Radiator 20, the radiator 20 is located on the circuit board 10, the radiator 20 includes main body 21 and fin 22, the fin 22 is located on the main body 21, the fin 22 is formed with the main body 21 cooperation clamping groove 23;Spring 30, the spring 30 is clamped in the clamping groove 23, and with the main body 21 detachable connection, and the spring 30 and the main body 21 enclosed formation clamping space 101;And electronic device 40, the electronic device 40 is located in the clamping space 101, and with the circuit board 10 electric connection.

[0029] Specifically, circuit board structure 100 includes circuit board 10, radiator 20, spring 30 and electronic device 40, radiator 20 is installed on circuit board 10, electronic device 40 is installed on radiator 20 by spring 30, and electronic device 40 is cooled by radiator 20.Electronic device 40 such as MOS tube 41, rectifier bridge etc.

[0030] The structure of radiator 20 is set as main body 21 and fin 22, the clamping groove 23 is formed by cooperation of main body 21 and fin 22, which can be set as right-angle groove on main body 21, and fin 22 extends outward from one side of main body 21 and forms right angle with main body 21, so as to form clamping groove 23 between them;It can also be set as L-shaped groove on main body 21, and fin 22 extends outward from one side of main body 21 to form clamping groove 23 between them;The specific cooperation mode can be selected according to actual needs.

[0031] By designing radiator 20 into the form of containing main body 21 and fin 22, and using the cooperation between them to form clamping groove 23 to fix spring 30, not only reliable fixing point is provided for electronic device 40, but also heat dissipation area is increased;Fin 22 can effectively increase air circulation and promote rapid heat dissipation, so as to improve overall heat dissipation efficiency.

[0032] The clamping spring 30 is clamped in the clamping groove 23. The clamping spring 30 can be directly inserted into the clamping groove 23 at one end, or the end of the clamping spring 30 can be designed in the shape of a hook or a clasp to be hooked on the edge or a specific position of the clamping groove 23, or the end of the clamping spring 30 can be designed as a spring piece with elasticity to be elastically clamped in the clamping groove 23, or the end of the clamping spring 30 can be designed in the shape of an embedded type to be embedded in the clamping groove 23. The specific design can be set according to actual needs, and details are not described here.

[0033] The clamping spring 30 is detachably connected to the main body 21. The detachable design allows users to select different types of clamping springs according to actual needs to adapt to electronic devices 40 of different sizes and shapes, so that the heat sink 20 can be applied to various application scenarios. When the clamping spring 30 is damaged or worn out, the user can only replace the clamping spring 30 without replacing the entire heat sink 20, reducing the cost of maintenance and replacement.

[0034] The structure of the clamping spring 30 can be selected according to the way the clamping spring 30 is clamped in the clamping groove 23. The clamping spring 30 can be designed in a straight bar shape with one end straight and the other end bent, or in an L shape with one end straight and the other end bent or with a hook, or composed of multiple segments, each of which can be a straight bar, an L shape, or a V shape, etc.

[0035] The clamping spring 30 is directly fixed by using the structural characteristics of the heat sink 20 (i.e., the clamping groove 23 formed by the main body 21 and the fins 22), avoiding additional processing steps and simplifying the installation process. The electronic device 40 is clamped in the clamping space 101 by the clamping spring 30, and the installation and disassembly are very convenient, only need to insert or pull out the electronic device 40 from the clamping space 101. Since the clamping spring 30 is directly installed in the clamping groove 23 on the heat sink 20 without occupying the space of the circuit board 10, more electronic components can be arranged more compactly in a limited space, which helps to design small-sized products. At the same time, the clamping space 101 formed by the close cooperation of the clamping spring 30 and the main body 21 of the heat sink 20 can ensure that the electronic device 40 can maintain a stable position when subjected to vibration or impact, enhancing the overall reliability of the equipment.

[0036] The utility model discloses technical scheme through utilize the structural features of radiator 20, form the clamping groove 23 in the fin 22 and main part 21 cooperation of radiator 20, and the clamping spring 30 is clamped in the clamping groove 23, and the clamping spring 30 provides reliable fixation for clamping spring 30, and the clamping spring 30 and main part 21 cooperation form the clamping space 101, and the electronic device 40 is clamped, when installing electronic device 40, through the clamping spring 30 clamping electronic device 40, can provide reliable fixation for electronic device 40 in small space, need not occupy the larger installation space of circuit board 10, and through the fin 22 and main part 21 heat dissipation to electronic device 40 simultaneously, can effectively expand the heat exchange area, accelerate the heat transfer speed, and then improve the heat dissipation efficiency.

[0037] In the embodiment of the utility model, the main part 21 is provided with anti -trip 211, the anti -trip 211 is located in the clamping groove 23, one end of the clamping spring 30 is bent and is formed with the resistance holding portion 31, and the resistance holding portion 31 is in contact with the anti -trip 211, the fin 22 is provided with lug 221, the lug 221 is located in the clamping groove 23, and the lug 221 is in contact with the surface of the clamping spring 30.

[0038] In detail, as Figure 1 And Figure 2 The design of the anti -trip 211 on the main part 21 makes the resistance holding portion 31 of one end of the clamping spring 30 tightly contact with the anti -trip 211, thereby effectively preventing the clamping spring 30 from falling off during use, and ensuring the stable fixation of the electronic device 40. Meanwhile, the lug 221 on the fin 22 is located in the clamping groove 23 and in contact with the surface of the clamping spring 30, which can further limit the movement of the clamping spring 30 and prevent it from being displaced due to external factors, thereby affecting the fixation effect of the electronic device 40. Through the design of the anti -trip 211 and the lug 221, the stability and reliability of the clamping spring 30 can be significantly improved, the risk caused by the loosening or falling off of the clamping spring 30 can be reduced, the fixation of the electronic device 40 is more stable, and the reliability of equipment use is enhanced.

[0039] In the embodiment of the utility model, the main part 21 includes a fixed part 212 and an extension part 213, the extension part 213 is located at the top of the fixed part 212, the circumferential dimension of the fixed part 212 is greater than the circumferential dimension of the extension part 213, the fin 22 is located at the extension part 213, the clamping groove 23 is formed between the fin 22 and the fixed part 212, and the other end of the clamping spring 30 and the fixed part 212 form the clamping space 101.

[0040] It is worth noting that the circumferential dimension of the fixed part 212 is larger than the extension part 213, and the L-shaped slot can be formed on the fixed part 212, and the fin 22 extends outward from one side of the extension part 213, and the clamping slot 23 is formed between the two. The fixed part 212 provides a more stable foundation, and the extension part 213 is connected to the top of the fixed part 212, which provides a support point for the fin 22.

[0041] The combined design of the fixed part 212 and the extension part 213 provides more heat dissipation paths, and heat can be quickly conducted through the fixed part 212 and the extension part 213 to the fin 22, and then dissipated by the fin 22, and the clamping slot 23 design between the fin 22 and the fixed part 212 allows the fin 22 to be arranged more densely, increasing the heat dissipation area and further improving the heat dissipation efficiency, making the entire circuit board structure 100 more compact and efficient.

[0042] In an embodiment, the main body 21 and the fin 22 are integrated, and the integrated design can simplify the manufacturing process, reduce production costs, and at the same time allow heat to be quickly transferred from the main body 21 to the fin 22, improving heat conduction efficiency.

[0043] In the embodiment of the utility model, the fin 22 is provided with a plurality of, a plurality of the fin 22 is connected to the extension part 213, the extension part 213 opposite both sides form first connecting surface 2131 and second connecting surface 2132, a plurality of the fin 22 by first connecting surface 2131 and second connecting surface 2132 towards the outside extension setting, simultaneously in first connecting surface 2131 form the clamping space 101. Among them, a plurality of the fin 22 in first connecting surface 2131 on the fin 22 closest to the fixed part 212 and the fixed part 212 between the formation clamping slot 23.

[0044] In the embodiment of the utility model, the fin 22 is provided with a plurality of, a plurality of the fin 22 is connected to the extension part 213, the extension part 213 opposite both sides form third connecting surface 2133 and fourth connecting surface 2134, a plurality of the fin 22 by third connecting surface 2133 and fourth connecting surface 2134 towards the outside extension setting, and respectively with third connecting surface 2133 and fourth connecting surface 2134 form the clamping space 101. Among them, a plurality of the fin 22 in third connecting surface 2133 on and fourth connecting surface 2134 on the two fins 22 closest to the fixed part 212 and the fixed part 212 between the formation clamping slot 23.

[0045] Specifically, the number of fins 22 can be set to one or multiple. When the number of fins 22 is set to multiple, the multiple fins 22 are arranged in a stacked manner in the height direction of the extension part 213, and the bottommost fin 22 cooperates with the fixed part 212 to form a clamping groove 23. The bottommost fin 22 is the fin 22 closest to the fixed part 212. One clamping groove 23 can clamp multiple clamping springs 30. Specifically, multiple clamping springs 30 are sequentially clamped in the clamping groove 23 along the length direction of the clamping groove 23, and correspondingly, multiple electronic devices 40 can be clamped.

[0046] The multiple fins 22 can significantly increase the heat dissipation area, and each fin 22 can effectively conduct heat from the electronic device 40 to the air, accelerate heat dissipation, and improve heat dissipation efficiency.

[0047] In an embodiment, as shown in FIG. 1, Figure 2 The fins 22 extend outward from the first connecting surface 2131 and the second connecting surface 2132 of the extension part 213, respectively, and both sides of the heat sink 20 can dissipate heat. The double-sided heat dissipation design makes the heat dissipation more uniform, further improving the heat dissipation efficiency. The clamping space 101 is formed on the first connecting surface 2131, the fins 22 close to the first connecting surface 2131 are shorter than the fins 22 away from the first connecting surface 2131, the short fins provide more operation space for the clamping space 101 near the first connecting surface 2131, making the installation and disassembly of the electronic device 40 more convenient, and the long fins can provide a larger heat dissipation area, improving the heat dissipation efficiency, thereby improving the overall heat dissipation effect.

[0048] In another embodiment, as shown in FIG. 2, Figure 4 The clamping space 101 is formed on the third connecting surface 2133 and the fourth connecting surface 2134 of the extension part 213, providing more fixing points to fix more electronic devices 40, and the fins 22 of the two connecting surfaces can simultaneously dissipate heat, so that the heat sink 20 can provide a larger heat dissipation area in a limited space, optimizing the space utilization and improving the heat dissipation efficiency. In addition, the lengths of the multiple fins 22 gradually increase from the clamping space 101 to the direction away from the clamping space 101, the short fins provide more operation space for the clamping space 101, and the operation space is more spacious when installing and disassembling each electronic device 40, and the long fins can sufficiently increase the heat dissipation area.

[0049] In the embodiment of the utility model, the fin 22 is arranged along the length direction of the main body 21 to extend to form a plurality of clamping grooves 23 or a longer clamping groove 23 in cooperation with the fixed part 212; the clamping spring 30 is provided with a plurality of clamping springs 30, each of which is installed in the clamping groove 23 or a plurality of clamping springs 30 are arranged along the length direction of the longer clamping groove 23, and a plurality of clamping springs 30 form a plurality of clamping spaces 101 in cooperation with the fixed part 212.

[0050] In detail, the length direction of the main body 21 is the direction A as indicated in the figure. Figure 2 The fin 22 is arranged along the length direction of the main body 21 to extend to form a plurality of clamping grooves 23 or a longer clamping groove 23, so that a plurality of clamping springs 30 are clamped along the length direction of the clamping groove 23, a plurality of clamping spaces 101 are provided in cooperation with the fixed part 212, the heat sink 20 can fix more electronic devices 40, a plurality of electronic devices 40 such as MOS tubes 41, rectifier bridges and the like are installed on the same heat sink 20, and the plurality of clamping spaces 101 can adapt to a plurality of different types of electronic devices 40.

[0051] When the electronic device 40 is installed and removed, each clamping space 101 can be operated individually without affecting other electronic devices 40, thereby simplifying the operation steps and providing more flexibility.

[0052] In the embodiment of the utility model, the heat sink 20 further comprises a heat-conducting ceramic sheet 50, which is arranged in the clamping space 101 and is attached to the surface of the main body 21.

[0053] It is worth noting that the heat-conducting ceramic sheet 50 has high thermal conductivity and can quickly conduct the heat generated by the electronic device 40 to the main body 21 of the heat sink 20, thereby improving the heat dissipation efficiency. At the same time, the heat-conducting ceramic sheet 50 can protect the electronic device 40, effectively isolate the electrical connection between the electronic device 40 and the main body 21 of the heat sink 20, prevent the electronic device 40 from directly contacting the metal heat sink 20, prevent short circuit between the two to cause circuit failure, low cost, and ensure long-term reliable insulation.

[0054] In the embodiment of the utility model, the heat-conducting ceramic sheet 50 is provided with a heat-conducting silicone grease layer on both opposite surfaces.

[0055] In detail, the heat-conductive silicon grease layer is arranged on both sides of the heat-conductive ceramic sheet 50, fills the tiny gap between the heat-conductive ceramic sheet 50 and the surface of the main body 21, can effectively reduce the thermal resistance and improve the heat conduction efficiency, so that the heat generated by the electronic device 40 can be rapidly transmitted to the main body 21 of the heat sink 20, thereby improving the overall heat dissipation effect; meanwhile, the heat-conductive silicon grease layer fills the tiny gap between the heat-conductive ceramic sheet 50 and the electronic device 40, can reduce the contact thermal resistance between the interfaces, ensures that the electronic device 40 and the heat-conductive ceramic sheet 50 have good thermal contact, helps to reduce the working temperature of the electronic device 40 and prolong the service life.

[0056] In the embodiment of the utility model, the bottom of main body 21 is equipped with thread groove 214, the circuit board 10 is equipped with thread hole (not marked in the drawing) matched with thread groove 214.

[0057] It is worth noting that, as Figure 2 , the thread groove 214 extends along the length direction (direction A) of the main body 21, provides multiple fixing points, and the heat sink 20 can be fixed in the thread holes of the circuit board 10 through multiple screws 60, so that stronger fixing force can be provided, and the connection of the heat sink 20 is more stable. This design makes the heat sink 20 can adapt to different installation structures, such as circuit board 10, case, shell, etc., and appropriate installation mode can be selected according to specific needs. Through the threaded connection mode, the heat sink 20 can be more easily disassembled and reinstalled, and maintenance and repair can be facilitated without damaging other components.

[0058] In the embodiment of the utility model, the electronic device 40 is a MOS tube 41, the MOS tube 41 is installed in the clamping space 101, the snap spring 30 abuts against the surface of the MOS tube 41, and the pin of the MOS tube 41 is welded on the circuit board 10.

[0059] Specifically, as Figure 3 , the electronic device 40 selects the MOS tube 41, the design of the clamping space 101 and the snap spring 30 makes the installation and disassembly of the MOS tube 41 more convenient, the MOS tube 41 is installed in the clamping space 101, the abutting action of the snap spring 30 can provide continuous pressure, the contact between the MOS tube 41 and the heat sink 20 is more closely, the thermal resistance is reduced, the heat conduction efficiency is improved, and thus the heat dissipation effect is improved; the pin of the MOS tube 41 is welded on the circuit board 10, and the welding connection provides reliable electrical connection, so as to ensure the stable signal transmission between the MOS tube 41 and the circuit board 10.

[0060] The utility model also provides a kind of therapeutic instrument main machine (not shown in the drawing), including power module, and the power module includes the circuit board structure as described above.

[0061] Specifically, the power module is arranged in the host of the therapeutic instrument, the circuit board structure 100 is applied to the power module of the host of the therapeutic instrument, the heat dissipation efficiency can be improved, the fixing stability is enhanced, the electrical connection reliability is improved, the space utilization is optimized, and the use experience of the user is improved.

[0062] Specifically, the specific structure of the circuit board structure 100 refers to the above-mentioned embodiments, since the host of the therapeutic instrument adopts all the technical solutions of the above-mentioned embodiments, at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments are possessed, and here, the beneficial effects are not repeated.

[0063] The preferred embodiments of the utility model are described above, and the patent range of the utility model is not limited by this, any equivalent structural transformation made by using the utility model specification and the attached drawings, or direct / indirect application in other related technical fields is included in the patent protection range of the utility model.

Claims

1. A circuit board structure, characterized by, The circuit board structure includes: circuit boards; A heat sink is provided on the circuit board, and comprises a main body and fins, wherein the fins are provided on the main body, and the fins cooperate with the main body to form a slot; A clamping spring, which is clamped in the clamping slot and detachably connected to the main body, and the clamping spring and the main body enclose a clamping space; and An electronic device is arranged in the clamping space and electrically connected to the circuit board.

2. The circuit board structure of claim 1, wherein, An anti-dropout buckle is convexly provided on the main body, and the anti-dropout buckle is located in the clamping groove. One end of the clamping spring is bent to form a supporting portion, and the supporting portion supports the anti-dropout buckle; A convex block is protruded from the fin, the convex block is located in the clamping groove, and the convex block is pressed against the surface of the clamping spring.

3. The circuit board structure of claim 1, wherein, The main body includes a fixed portion and an extension portion, the extension portion is located at the top of the fixed portion, the circumferential size of the fixed portion is larger than the circumferential size of the extension portion, the fin is located at the extension portion, the slot is formed between the fin and the fixed portion, and the other end of the retaining spring is enclosed with the fixed portion to form the clamping space.

4. The circuit board structure of claim 3, wherein, There are a plurality of fins, and the plurality of fins are connected to the extension portion; A first connecting surface and a second connecting surface are formed on opposite sides of the extension portion, and the plurality of fins are extended outward from the first connecting surface and the second connecting surface, and the clamping space is formed on the first connecting surface. The slot is formed between the fin closest to the fixed portion on the first connecting surface among the plurality of fins and the fixed portion.

5. The circuit board structure of claim 3, wherein, There are a plurality of fins, and the plurality of fins are connected to the extension portion; A third connecting surface and a fourth connecting surface are formed on opposite sides of the extension portion, and the plurality of fins are extended outward from the third connecting surface and the fourth connecting surface, and respectively form the clamping space with the third connecting surface and the fourth connecting surface. Among the plurality of fins, two fins closest to the fixing portion on the third connecting surface and the fourth connecting surface respectively form a slot with the fixing portion.

6. The circuit board structure of claim 4 or 5, wherein The fin is extended along the length direction of the main body to cooperate with the fixing portion to form the slot; There are multiple clamping springs, and the multiple clamping springs are installed in the clamping slot along the length direction.

7. The circuit board structure of claim 1, wherein, The heat sink further comprises a heat-conducting ceramic sheet, which is arranged in the clamping space and adheres to the surface of the main body.

8. The circuit board structure of claim 7, wherein, Two opposite surfaces of the thermally conductive ceramic sheet are both provided with thermally conductive silicone grease layers.

9. The circuit board structure of claim 1, wherein, A thread groove is provided at the bottom of the main body, and a thread hole matching the thread groove is provided on the circuit board.

10. The circuit board structure of claim 1, wherein, The electronic device is a MOS tube, which is installed in the clamping space. The clamping spring abuts against the surface of the MOS tube, and the pins of the MOS tube are welded on the circuit board.

11. A therapeutic instrument main unit, characterized by comprising: It comprises a power supply module, and the power supply module comprises the circuit board structure according to any one of claims 1-10.

Images