Anti-toppling device for testing silicon carbide substrate slice

Abstract

The utility model discloses an anti-toppling device for testing a silicon carbide substrate slice, which comprises a carrying table, a support column, an obstacle detection sensor, a negative pressure mechanism and a microcontroller, and is characterized in that the carrying table is arranged in a test bin of a flatness measuring instrument through the support column; the at least three supporting columns are uniformly distributed on the carrying table by taking the center of circle borne by the substrate sheet as an original point, are used for supporting the substrate sheet and are of hollow structures, and vent holes are formed in the upper parts of the supporting columns; the obstacle detection sensor is mounted on the upper surface of the carrying table; the negative pressure mechanism communicates with the interior of the supporting column and is used for vacuumizing the interior of the supporting column. The microcontroller is installed in the test bin, and the obstacle detection sensor and the negative pressure mechanism are electrically connected with the microcontroller. The utility model can effectively solve the technical problem that the substrate slice is inclined or scratched out of the test bin.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to an anti-tipping device for testing silicon carbide substrates. Background Technology

[0002] Related technologies indicate that the flatness of silicon carbide substrates is a crucial parameter in semiconductor manufacturing, directly impacting the performance and reliability of semiconductor devices. Therefore, to ensure semiconductor device performance, improve manufacturing efficiency, and enhance device reliability, it is necessary to test the flatness of silicon carbide substrates. Generally, a flatness tester is used to test the surface flatness of silicon carbide substrates. The silicon carbide substrate is placed horizontally in the test chamber of the tester, and surface data is collected by a camera. After processing by the tester, a three-dimensional image of the substrate surface flatness is displayed on a monitor. However, existing flatness measuring instruments sometimes experience substrate tilting or slipping out of the test chamber, preventing normal testing and thus affecting testing efficiency. Summary of the Invention

[0003] The present invention aims to at least solve one of the technical problems existing in the prior art. Therefore, the present invention provides an anti-tipping device for testing silicon carbide substrates, which can effectively solve the technical problem of substrates tilting or slipping out of the testing chamber.

[0004] To achieve the above objectives, this utility model provides an anti-tipping device for testing silicon carbide substrates, comprising a platform, support columns, an obstacle detection sensor, a negative pressure mechanism, and a microcontroller. The platform is installed inside the test chamber of a flatness measuring instrument via the support mechanism. At least three support columns are evenly distributed on the platform with the center of the substrate as the origin, serving to support the substrate. Each support column is a hollow structure with ventilation holes at the top. The obstacle detection sensor is installed on the upper surface of the platform. The negative pressure mechanism is connected to the interior of the support columns and is used to evacuate the interior of the support columns. The microcontroller is installed inside the test chamber, and the obstacle detection sensor and the negative pressure mechanism are electrically connected to the microcontroller.

[0005] In the above solution, this invention uses an obstacle detection sensor to detect whether a substrate sheet is approaching the support column, and uses negative pressure to firmly adsorb the substrate sheet onto the support column. Specifically, this invention uses an obstacle detection sensor to detect whether a substrate sheet is approaching. If a substrate sheet (obstacle) is detected approaching the support column, the microcontroller controls the vacuum pump to work. When the substrate sheet is about to be placed on the support column, under the action of negative pressure, the substrate sheet is directly adsorbed onto the support column. Even if the substrate sheet is tilted during placement, it will be adsorbed onto the support column as a whole due to the negative pressure, which has high stability and effectively avoids the substrate sheet tilting or slipping out of the test chamber, thus ensuring testing efficiency.

[0006] Preferably, in some embodiments, the negative pressure mechanism of this invention includes a branch negative pressure pipeline, a main negative pressure pipeline, and a vacuum pumping device. One end of the branch negative pressure pipeline passes through the platform and communicates with the interior of the support column, and the other end of the branch negative pressure pipeline communicates with the main negative pressure pipeline. The outlet end of the main negative pressure pipeline is connected to the vacuum pumping device, and the vacuum pumping device is electrically connected to the microcontroller. In this embodiment, the substrate is adsorbed onto the support column through vacuum pumping and the negative pressure pipeline.

[0007] Preferably, in some embodiments, the upper longitudinal section of the support column of this invention gradually decreases from bottom to top to reduce the contact area with the substrate and further reduce damage to the substrate.

[0008] Furthermore, in some embodiments, the present invention also includes a negative pressure ring, which is installed on the upper part of the support column and communicates with the interior of the support column. The upper surface of the negative pressure ring has suction holes. This embodiment uses a negative pressure ring to adsorb the substrate, enhancing the adsorption force and further preventing the substrate from tilting or slipping out of the test chamber when placed on the support column.

[0009] Furthermore, in some embodiments, the inner and outer edges of the upper surface of the negative pressure ring of this invention are provided with annular sealing strips, and the air suction hole is disposed between the two annular sealing strips. This embodiment provides two annular sealing strips, which on the one hand reduces the contact area between the negative pressure ring and the substrate, reducing damage to the substrate surface caused by the negative pressure ring; on the other hand, it further enhances the adsorption force of the negative pressure.

[0010] Preferably, in some embodiments, the obstacle detection sensor of this invention is an ultrasonic sensor. Ultrasonic sensors are highly sensitive, compact, easy to install, and low in cost.

[0011] Additional aspects and advantages of this invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0012] Figure 1 This is a schematic diagram of the anti-tipping device for testing silicon carbide substrates according to an embodiment of the present invention;

[0013] Figure 2 This is a schematic diagram of the anti-tipping device for testing silicon carbide substrates according to an embodiment of the present invention;

[0014] Figure 3 This is a schematic diagram of the anti-tipping device for testing silicon carbide substrates according to an embodiment of the present invention;

[0015] Figure 4 This is a schematic diagram of the negative pressure ring structure of an anti-tipping device for testing silicon carbide substrates according to an embodiment of the present invention.

[0016] Figure label:

[0017] 10: Flatness measuring instrument; 20: Test chamber; 30: Substrate; 40: Support column; 50: Stage; 501: Support mechanism; 60: Obstacle detection sensor; 70: Negative pressure mechanism; 71: Main negative pressure pipeline; 72: Branch negative pressure pipeline; 80: Vacuum pump; 90: Negative pressure ring; 91: Suction hole; 92: Annular sealing strip. Detailed Implementation

[0018] The embodiments of this utility model are described in detail below. Examples of these embodiments are shown in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this utility model, and should not be construed as limiting this utility model.

[0019] The following disclosure provides numerous different embodiments or examples for implementing various structures of the present invention. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of the invention. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, examples of various specific processes and materials are provided in this invention; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0020] Example 1

[0021] The following is for reference. Figure 1 and Figure 2This invention describes an anti-tipping device for testing silicon carbide substrates according to an embodiment of the present invention. The device includes a stage 50, support columns 40, an obstacle detection sensor 60, a negative pressure mechanism 70, and a microcontroller. The stage 50 is installed in the test chamber 20 of a flatness measuring instrument 10 via a support mechanism 501. Three support columns 40 are evenly distributed on the stage 50 with the center of the substrate 30 as the origin, to support the substrate 30. The distance from the support column 40 to the center of the stage 50 is L. The diameter of the 6-inch substrate 30 is d, and L = 1 / 2d. Alternatively, L = 1 / 3d can be used, but considering compatibility with 8-inch or even larger substrates 30, L = 1 / 2d is preferred in this embodiment. In this embodiment, the support column 40 is a hollow structure with a ventilation hole at the top. An obstacle detection sensor 60 is mounted on the upper surface of the platform 50. A negative pressure mechanism 70 communicates with the interior of the support column 40 to create a vacuum inside the column. A microcontroller is installed inside the test chamber 20, and the obstacle detection sensor 60 and the negative pressure mechanism 70 are electrically connected to the microcontroller. The obstacle detection sensor 60 is preferably an ultrasonic sensor, which is highly sensitive, compact, easy to install, and low in cost. In this embodiment, the microcontroller is an 8051 microcontroller.

[0022] refer to Figure 1 and Figure 2 As shown, in some embodiments, the negative pressure mechanism 70 of this invention includes a branch negative pressure pipeline 72, a main negative pressure pipeline 71, and a vacuum pumping device 80. One end of the branch negative pressure pipeline 72 passes through the platform 50 and communicates with the interior of the support column 40, and the other end of the branch negative pressure pipeline 72 is connected to the main negative pressure pipeline 71. The outlet end of the main negative pressure pipeline 71 is connected to the vacuum pumping device 80, and the vacuum pumping device 80 is electrically connected to a microcontroller. In this embodiment, the substrate 30 is adsorbed onto the support column 40 through vacuum pumping and the negative pressure pipeline.

[0023] First, a distance threshold D is preset in the microcontroller. Let the height of the support column 40 be H, then H≤D≤H+0.5mm. During operation, the obstacle detection sensor 60 continuously monitors for obstacles above. If an obstacle is detected, the data is transmitted to the microcontroller. The microcontroller compares the received data with the threshold D. If the received data is within the threshold, it indicates that the robotic arm is placing the gripped substrate 30 onto the support column 40. At this time, the microcontroller activates the vacuum device 80. The vacuum device 80 works, drawing a vacuum from the support column 40 through the secondary negative pressure pipe 72 and the main negative pressure pipe 71. This allows the substrate 30 to adhere to the support column 40 through the ventilation holes, effectively preventing the substrate 30 from tilting or slipping out of the test chamber 20 after being placed on the support column 40, thus ensuring testing efficiency.

[0024] After the test is completed, the robotic arm will pick up the substrate 30 and remove it. Once the obstacle detection sensor 60 can no longer detect the obstacle, the microcontroller will control the vacuum pumping device 80 to stop working.

[0025] refer to Figure 2 As shown, as an improvement of the above solution by this utility model, the upper longitudinal section of the support column 40 in this embodiment gradually decreases from bottom to top (forming a conical structure) to reduce the contact area with the substrate 30 and further reduce damage to the substrate 30.

[0026] Example 2

[0027] refer to Figure 3 and Figure 4 As shown, the structure is largely the same as in Embodiment 1, except that Embodiment 1 also includes a negative pressure ring 91. The negative pressure ring 91 is installed on the upper part of the support column 40 and communicates with the interior of the support column 40. An air suction hole 91 is provided on the upper surface of the negative pressure ring 91. In this embodiment, the negative pressure ring 91 is used to adsorb the substrate 30, increasing the adsorption area. When the vacuum device 80 is activated, the vacuum device 80 adsorbs the substrate 30 through the negative pressure pipeline, the support column 40, and the air suction hole 91 on the negative pressure ring 91. The use of the negative pressure ring 91 enhances the adsorption force on the substrate 30, further preventing the substrate 30 from tilting or slipping out of the test chamber 20 when placed on the support column 40.

[0028] refer to Figure 4 As shown, as an improvement to the above solution, in some embodiments, the negative pressure ring 91 of this invention is provided with annular sealing strips 92 on both the inner and outer edges of its upper surface, and the suction hole 91 is disposed between the two annular sealing strips 92. This embodiment provides two annular sealing strips 92, which on the one hand reduces the contact area between the negative pressure ring 91 and the substrate 30, reducing damage to the surface of the substrate 30 caused by the negative pressure ring 91; on the other hand, the use of sealing strips further enhances the adsorption force of the negative pressure.

[0029] Other components of the anti-tipping device for testing silicon carbide substrates according to embodiments of the present invention, such as the stage 50, the vacuum device 80, and the negative pressure pipeline, as well as their operation, are known to those skilled in the art and will not be described in detail here.

[0030] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like to indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation to the present invention.

[0031] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0032] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "linking," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a communication connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0033] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0034] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0035] Although the embodiments of the present invention have been shown and described, those skilled in the art will appreciate that various changes, modifications, substitutions and variations may be made to the embodiments without departing from the principles and purpose of the present invention, and that the scope of the present invention is defined by the claims and their equivalents.

Claims

1. An anti-tipping device for testing silicon carbide substrates, comprising: A platform, which is installed in the test chamber of the flatness measuring instrument by a support mechanism; At least three support columns are provided, evenly distributed on the platform with the center of the circle supported by the substrate as the origin, for supporting the substrate. The support columns are hollow structures with ventilation holes at the top. An obstacle detection sensor is mounted on the upper surface of the platform. A negative pressure mechanism, which is connected to the inside of the support column, is used to evacuate the inside of the support column; A microcontroller is installed inside the test chamber, and the obstacle detection sensor and the negative pressure mechanism are electrically connected to the microcontroller.

2. The anti-tipping device for testing silicon carbide substrates according to claim 1, characterized in that, The negative pressure mechanism includes a branch negative pressure pipeline, a main negative pressure pipeline, and a vacuum pumping device. One end of the branch negative pressure pipeline passes through the platform and communicates with the inside of the support column. The other end of the branch negative pressure pipeline is connected to the main negative pressure pipeline. The air outlet of the main negative pressure pipeline is connected to the vacuum pumping device. The vacuum pumping device is electrically connected to the microcontroller.

3. The anti-tipping device for testing silicon carbide substrates according to claim 2, characterized in that, The longitudinal section of the upper part of the support column gradually decreases from bottom to top.

4. The anti-tipping device for testing silicon carbide substrates according to claim 2, characterized in that, It also includes a negative pressure ring, which is installed on the upper part of the support column and communicates with the inside of the support column. The upper surface of the negative pressure ring is provided with an air intake hole.

5. The anti-tipping device for testing silicon carbide substrates according to claim 4, characterized in that, The negative pressure ring has annular sealing strips on both its inner and outer edges, and the air intake hole is located between the two annular sealing strips.

6. The anti-tipping device for testing silicon carbide substrates according to claim 1, characterized in that, The obstacle detection sensor is an ultrasonic sensor.

Images