Multi-size compatible wafer platform for mercury CV doping concentration detection

Abstract

The utility model discloses a multi-size compatible wafer platform for mercury CV doping concentration detection, comprising an object carrying platform which is provided with a plurality of annular grooves which are concentrically arranged, each annular groove is corresponding to the size of a to-be-detected wafer with a specification size, and each annular groove is internally provided with a plurality of blind holes along the circumferential direction; and the plurality of wafer bearing columns are detachably embedded into the blind holes of the annular grooves with the same specification and size as the to-be-detected wafers, the top ends of the wafer bearing columns are higher than the upper surface of the carrying platform, and the wafer bearing columns are used for bearing the to-be-detected wafers. When to-be-detected wafers with different specifications and sizes are switched and tested, the platform does not need to be disassembled and replaced, and only the wafer bearing columns need to be disassembled and moved, so that time and labor are saved, platforms with multiple sizes do not need to be prepared, the cost is saved, and the test efficiency is improved. And the to-be-detected wafer can be supported through the wafer bearing columns, so that contact between the front surface of the wafer and the carrying platform is reduced, and defects, caused by contact, of the surface of the wafer are reduced.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor manufacturing technology, and more specifically, it relates to a compatible multi-size wafer platform for mercury CV doping concentration detection. Background Technology

[0002] Mercury CV (Capacitance-Voltage) doping concentration detection is a technique that utilizes the CV characteristic of the Schottky barrier capacitance to measure doping concentration, providing crucial information about the doping concentration of semiconductor materials. Currently, mercury CV doping concentration testing equipment operates in two modes: top-out mercury mode and bottom-out mercury mode. In the bottom-out mercury mode, the wafer being tested must be placed face down. To reduce contact between the wafer face and the platform, a common method is to hollow out the area below where the wafer is placed on the platform. However, this method requires replacing the platform every time a wafer of a different size is tested, resulting in very low efficiency. Summary of the Invention

[0003] This invention aims to solve at least one of the technical problems existing in the prior art. To this end, this invention provides a multi-size compatible wafer platform for mercury CV doping concentration detection, designed to allow testing of wafers of different sizes and specifications using only one wafer platform.

[0004] To achieve the above objectives, the present invention adopts the following technical solution: a compatible multi-size wafer platform for mercury CV doping concentration detection, comprising: a carrier platform, wherein a plurality of concentrically arranged annular grooves are formed on the carrier platform, and each annular groove corresponds to the size of a wafer to be tested, and a plurality of blind holes are formed in the circumferential direction of each annular groove; wafer support pillars, wherein a plurality of wafer support pillars are detachably embedded in the blind holes of the annular grooves of the same size as the wafer to be tested, and the top of the wafer support pillars is higher than the upper surface of the carrier platform, and the wafer support pillars are used to support the wafer to be tested.

[0005] Preferably, the width of the annular groove is 3.5 mm.

[0006] Preferably, each of the annular grooves has six blind holes evenly spaced at a 60° angle.

[0007] Preferably, the blind hole is a circular hole with a diameter of 3 mm.

[0008] Preferably, the wafer support pillar is a cylinder.

[0009] Preferably, after the wafer support post is embedded in the blind hole, the top of the wafer support post protrudes 1 mm above the upper surface of the loading platform.

[0010] This utility model has the following advantages due to the adoption of the above technical solution:

[0011] 1. When switching between testing wafers of different sizes, this utility model does not require disassembling and replacing the platform; only the wafer support pillar needs to be removed, which saves time and effort and eliminates the need to prepare multiple platforms of different sizes, thus saving costs.

[0012] 2. This utility model uses wafer support pillars to support the wafer to be tested, thereby reducing the contact between the front side of the wafer and the carrier platform, and reducing defects on the wafer surface caused by contact. Attached Figure Description

[0013] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the scope of the invention. Throughout the drawings, the same reference numerals denote the same parts. In the drawings:

[0014] Figure 1 A three-dimensional structural schematic diagram of a multi-size wafer platform provided in an embodiment of this utility model;

[0015] Figure 2 This is a schematic diagram of the planar structure of a multi-size wafer platform provided in this embodiment of the present invention;

[0016] Figure 3 This is a usage diagram of the multi-size wafer platform provided in this embodiment of the present invention.

[0017] The labels for the attached figures are as follows:

[0018] 1-Platform; 2-Wafer support pillar; 3-Annular groove; 4-Blind via; 5-Wafer to be tested. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of this utility model clearer, the specific embodiments of this utility model will be further described below with reference to the accompanying drawings. Although exemplary embodiments of this utility model are shown in the drawings, it should be understood that this utility model can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided to enable a more thorough understanding of this utility model and to fully convey the scope of this utility model to those skilled in the art.

[0020] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0021] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this utility model, "a plurality of" means two or more, unless otherwise explicitly specified.

[0022] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0023] In the present invention, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediary. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0024] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0025] This invention provides a multi-size compatible wafer platform for mercury CV doping concentration detection, comprising: a platform with several concentrically arranged annular grooves, each corresponding to a wafer of a specific size to be tested, and several blind vias circumferentially formed within each annular groove; and wafer support pillars, multiple wafer support pillars detachably embedded in the blind vias of the annular grooves of the same size as the wafer to be tested, with the top of the wafer support pillars extending above the upper surface of the platform, and used to support the wafer to be tested. This invention eliminates the need to disassemble and replace the platform when switching between testing wafers of different sizes; only the wafer support pillars need to be removed, saving time and effort. It also eliminates the need for multiple platforms of different sizes, reducing costs. Furthermore, the wafer support pillars support the wafer to be tested, reducing contact between the wafer's front side and the platform, thus minimizing surface defects caused by contact.

[0026] The following is a detailed description, with reference to the accompanying drawings, of the compatible multi-size wafer platform for mercury CV doping concentration detection provided by the embodiments of this utility model.

[0027] Please see Figures 1 to 3 The multi-size compatible wafer platform for mercury CV doping concentration detection provided in this embodiment includes a platform 1 and wafer support pillars 2. The platform 1 has several concentrically arranged annular grooves 3, each corresponding to a wafer 5 of a specific size to be tested. Each annular groove 3 has several blind holes 4 circumferentially arranged within it for fixing the wafer support pillars 2. Multiple wafer support pillars 2 are detachably embedded in the blind holes 4 of the annular grooves 3 of the same size as the wafer 5 to be tested, with the top of each wafer support pillar 2 higher than the upper surface of the platform 1. The wafer support pillars 2 support the wafer 5 to be tested. Thus, the wafer 5 to be tested can be supported by the wafer support pillars 2 to reduce contact between the front of the wafer and the platform 1. Furthermore, when changing to test wafers of different sizes, it is only necessary to remove and move the wafer support pillars 2 to the corresponding annular groove 3.

[0028] In the above embodiments, preferably, the width of the annular groove 4 is 3.5 mm.

[0029] In the above embodiments, preferably, each annular groove 4 has 6 blind holes 5 evenly spaced at a 60° angle.

[0030] In the above embodiments, preferably, the blind hole 5 is a circular hole with a diameter of 3 mm.

[0031] In the above embodiments, preferably, the wafer support pillar 2 is a cylinder.

[0032] In the above embodiments, preferably, after the wafer support post 2 is embedded in the blind via 4, the top of the wafer support post 2 protrudes 1 mm above the upper surface of the loading platform 1.

[0033] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. These modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application, and they should all be covered within the scope of the claims and specification of this application. In particular, as long as there is no structural conflict, the various technical features mentioned in the embodiments can be combined in any way. This application is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A compatible multi-size wafer platform for mercury CV doping concentration detection, characterized in that, include: The platform has several concentrically arranged annular grooves, and each annular groove corresponds to the size of a wafer to be tested. Several blind holes are formed in the circumferential direction of each annular groove. A wafer carrier post, wherein multiple wafer carrier posts are detachably embedded in blind holes of the annular groove of the same size and specifications as the wafer to be tested, and the top of the wafer carrier post is higher than the upper surface of the loading platform, and the wafer carrier post is used to support the wafer to be tested.

2. The multi-size compatible wafer platform according to claim 1, characterized in that, The width of the annular groove is 3.5 mm.

3. The multi-size compatible wafer platform according to claim 1, characterized in that, Each of the aforementioned annular grooves has six blind holes evenly spaced at a 60° angle.

4. The multi-size compatible wafer platform according to claim 3, characterized in that, The blind hole is a circular hole with a diameter of 3 mm.

5. The multi-size compatible wafer platform according to claim 4, characterized in that, The wafer support pillar is a cylinder.

6. The multi-size compatible wafer platform according to any one of claims 1 to 5, characterized in that, After the wafer support post is embedded in the blind via, the top of the wafer support post protrudes 1 mm above the upper surface of the platform.

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