Feeding mechanism and die bonding equipment

Abstract

The utility model provides a feeding mechanism and a die bonding device. The feeding mechanism comprises a mounting structure, a clamping device, a relay device and an inductor. The clamping device and the sensor are arranged on the mounting structure; a plurality of clamping devices are arranged; any one clamping device comprises a driving source and two chucks which are oppositely arranged; the relay device is in communication connection with the inductor; the relay device is configured to trigger the driving source when the sensor senses the lead frame, and the driving source further drives the chuck to clamp the lead frame. According to the utility model, various lead frames can be clamped, the operation requirements of equipment are met, the alarm risk of the equipment is reduced, the operation efficiency is greatly improved, and the labor cost is reduced.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor technology, and in particular to a feeding mechanism and a die bonding device. Background Technology

[0002] A die bonder is a crucial piece of equipment used in the packaging process to achieve precise alignment and secure bonding between components and lead frames (LF), ensuring stable adhesion and reliable connection of the components. The loading mechanism is a vital component of the die bonder, typically operating in vacuum adsorption mode. During operation, the loading mechanism uses vacuum adsorption to pick up and place the lead frames. However, existing loading mechanisms cannot vacuum-lift heavy lead frames or those with densely spaced lead frames, causing frequent alarms and failing to meet operational requirements, severely limiting the equipment's performance. Current solutions involve manually placing the lead frames into the feed hopper and then transporting them from the hopper to the machine's feed area. This method not only reduces efficiency but also increases labor costs and introduces other risks. Therefore, a new loading mechanism and die bonder are needed to address these issues. Utility Model Content

[0003] The purpose of this utility model is to provide a feeding mechanism and a die bonding device to solve the problems of limited operation performance, frequent equipment alarms, low work efficiency and high labor costs of the feeding mechanism of the existing die bonding machine.

[0004] To achieve the above objectives, this utility model provides a feeding mechanism for use in die bonding equipment, comprising: a mounting structure, a clamping device, a relay device, and a sensor;

[0005] Both the clamping device and the sensor are mounted on the mounting structure; there are multiple clamping devices; each clamping device includes a drive source and two oppositely arranged clamps; the relay device is communicatively connected to the sensor; the relay device is configured to trigger the drive source when the sensor senses the lead frame, so that the drive source drives the clamps to clamp the lead frame.

[0006] Optionally, the relay device includes a logic relay and a time relay connected in communication; the time relay is configured to start timing when the sensor senses the lead frame; the logic relay is configured to trigger the drive source when the timing time of the time relay reaches a preset timing time.

[0007] Optionally, the system also includes a valve, which is communicatively connected to the logic relay; the logic relay is configured to trigger the valve to open when the timing of the time relay reaches a preset timing time, so as to output a working medium to the drive source.

[0008] Optionally, the valve is a solenoid valve, and the driving source is a cylinder.

[0009] Optionally, the clamps are provided with bevels, and the bevels of the two clamps of any one of the clamping devices are distributed in a figure-eight shape.

[0010] Optionally, the bevel is formed by chamfering the bottom of the chuck, or the bevel is formed by tilting the chuck as a whole.

[0011] Optionally, when the chamfer is formed by the overall tilting of the chuck, the chuck is provided with a thread, and the pitch of the thread matches the thickness of the lead frame; or, when the chamfer is formed by the bottom of the chuck through a chamfer, the minimum thickness of the chamfer matches the thickness of the lead frame.

[0012] Optionally, the sensor is a non-contact sensor and has a probe and an indicator light; the probe is located at the bottom of the sensor and the height of the probe is higher than the clamp; the indicator light is configured to light up when the sensor senses the lead frame.

[0013] Optionally, the feeding mechanism further includes a fixed bracket, which is fixed to one side of the drive source, and the sensor is mounted on the fixed bracket; or, it further includes an auxiliary bracket, which is connected to the mounting structure and located on one side of the mounting structure, and the sensor is mounted on the auxiliary bracket; and / or, the mounting structure includes a mounting block and a crossbeam, the mounting block is locked to the crossbeam and is used for detachable connection with the motion mechanism of the die bonding equipment, and a clamping device is provided at each end of the crossbeam.

[0014] To achieve the above objectives, this utility model also provides a die bonding device, which includes the feeding mechanism described in any one of the above embodiments.

[0015] Compared with the prior art, the technical solution provided by this utility model has at least the following beneficial effects:

[0016] The feeding mechanism provided by this utility model uses a clamping device to clamp various lead frames, enabling die bonding equipment to pick up and put down lead frames that are heavy and have dense gaps, thus meeting the equipment's operational needs, reducing the risk of equipment alarms, greatly saving equipment maintenance time, significantly improving operational efficiency, increasing equipment capacity, and avoiding the manual placement of lead frames into the material box, thereby saving additional time spent on manual placement of lead frames and significantly reducing labor costs. Attached Figure Description

[0017] Those skilled in the art will understand that the accompanying drawings are provided to better understand the present invention and do not constitute any limitation on the scope of the present invention.

[0018] Figure 1 This is a schematic diagram of the left front structure of the feeding mechanism in a preferred embodiment of this utility model.

[0019] Figure 2 This is a schematic diagram of the front right side of the feeding mechanism in a preferred embodiment of this utility model.

[0020] Figure 3 yes Figure 1 A partially enlarged schematic diagram of the feeding mechanism.

[0021] Figure 4 This is a front view structural schematic diagram of the feeding mechanism of a preferred embodiment of this utility model.

[0022] Figure 5 This is a schematic diagram of the circuit structure of a preferred embodiment of the present invention.

[0023] In the attached image:

[0024] 100-Feeding mechanism, 110-Mounting structure, 111-Mounting block, 112-Crossbeam, 120-Clamping device, 121-Drive source, 122-Chuck, 123-Slider, 130-Relay device, 131-Logic relay, 132-Time relay, 140-Sensor, 141-Probe, 150-Valve, 160-Power supply, 170-Fixed bracket, 180-Auxiliary bracket, 200-Discharge area, 210-Limit post. Detailed Implementation

[0025] The present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments. The advantages and features of the present invention will become clearer from the following description. It should be noted that the drawings are all in a very simplified form and use non-precise proportions, and are only used to facilitate and clarify the illustration of the embodiments of the present invention.

[0026] The directional terms such as above, below, up, down, upward, downward, left, right, etc., described in this application are used relative to exemplary embodiments as they are shown in the figures, with upward or up direction pointing towards the top of the corresponding figure, and downward or down direction pointing towards the bottom of the corresponding figure.

[0027] The purpose of this utility model is to provide a feeding mechanism and a die bonding device to solve the problems of limited operation performance, frequent equipment alarms, low work efficiency and high labor costs of the feeding mechanism of the existing die bonding machine.

[0028] The die bonding equipment provided by this utility model is also called a chip mounter or die bonder. It can place components at high speed and high precision, and realize steps such as positioning, alignment, flip mounting, and continuous mounting.

[0029] The die bonding equipment provided by this utility model can be applied to the packaging of various components such as semiconductor chips, modules, devices, and sensors. When packaging components, a lead frame is used as the carrier. It should be understood that a lead frame is a key structural component that uses bonding materials (gold wire, aluminum wire, copper wire) to achieve electrical connection between the internal circuit leads of the component and the external leads, forming an electrical circuit. It acts as a bridge connecting to external wires.

[0030] The feeding mechanism provided by this utility model is used to pick up and put out lead frames. This feeding mechanism can clamp various lead frames, reduce the risk of equipment alarms, meet the needs of equipment operation, greatly improve equipment efficiency, and significantly reduce labor costs.

[0031] The following description refers to the accompanying drawings.

[0032] like Figures 1 to 5 As shown, this utility model provides a feeding mechanism 100 for a die bonding equipment, which includes: a mounting structure 110, a clamping device 120, a relay device 130, and a sensor 140. The clamping device 120 and the sensor 140 are both disposed on the mounting structure 110; the relay device 130 may be disposed on the mounting structure 110 or separately from it, and this application does not limit this.

[0033] Mounting structure 110 is used for connection with existing mechanical structures on the die bonding equipment, preferably a detachable connection. Optionally, such as... Figure 1 and Figure 2 As shown, the mounting structure 110 is equipped with a mounting block 111, which is locked to the die bonding equipment by bolts. Generally, the mounting block 111 is mounted on the motion mechanism of the die bonding equipment, and the motion mechanism drives the entire mounting structure 110 to move and adjust its position. In this embodiment, the mounting structure 110 is hoisted. Of course, it is not limited to hoisting in practice. In fact, the installation method of the mounting structure 110 can be adjusted according to the structure of the die bonding equipment itself.

[0034] There are multiple gripping devices 120, meaning two or more. In this embodiment, using two gripping devices 120 is sufficient to meet practical needs and ensure the stability and reliability of gripping. Figures 1 to 3 As shown, any one of the clamping devices 120 includes a drive source 121 and a chuck 122; there are two chucks 122 arranged opposite to each other; the drive source 121 is used to control the two chucks 122 to clamp or release the lead frame 10 (see... Figure 1(Simplified illustration with dashed lines). The drive source 121 can be various power devices, such as motors, cylinders, or hydraulic cylinders. As shown in the figure, the drive source 121 is preferably a cylinder, which has a simple structure, low cost, and convenient subsequent maintenance.

[0035] like Figure 5 As shown, relay device 130 is at least communicatively connected to sensor 140. Relay device 130 is an electrical control device that can directly or indirectly control the state of drive source 121 based on the sensing of sensor 140. The state of drive source 121 includes starting and stopping. Specifically, relay device 130 is configured to trigger drive source 121 when sensor 140 senses lead frame 10, and drive source 121 further drives clamp chuck 122 to clamp lead frame 10. In this embodiment, drive source 121 is a cylinder, and relay device 130 is also communicatively connected to valve 150, so that when sensor 140 senses lead frame 10, it directly triggers valve 150 to open, thereby outputting compressed gas (i.e., working medium) to drive source 121. Valve 150 is typically a solenoid valve, and the solenoid valve is normally closed. Valve 150 is generally not installed on mounting structure 110.

[0036] With this configuration, the feeding mechanism 100 provided by this utility model can clamp various lead frames 100 through the clamping device 120, breaking through the limitations of existing die bonding equipment. This allows the die bonding equipment to handle lead frames 10, which are heavy and have dense gaps, enabling normal operation, meeting equipment operation requirements, and reducing the risk of equipment alarms. On the other hand, the vacuum nozzle of the original feeding mechanism frequently failed to pick up the lead frames 10, causing them to fall and affecting equipment operating efficiency. However, after the improvement, the feeding mechanism 100 provided by this utility model can greatly save equipment maintenance time. For example, it can save about 5 hours of equipment maintenance time per day. Based on an hourly output (UPH) of 10K (K refers to thousands of units), this translates to an increase of approximately 5 * 10K = 50K in output per day, thereby significantly improving operating efficiency and increasing equipment capacity. On the other hand, the feeding mechanism 100 provided by this utility model avoids the manual placement of the lead frame 10 into the material box, thereby saving the time of manual placement of the lead frame 10. For example, if the processing time of a single device is about 10 minutes, and the daily output is 180K, then the daily labor time saved is about 11.16 hours, thereby greatly reducing labor costs.

[0037] like Figure 5As shown, in this embodiment, the relay device 130 includes a logic relay 131 and a time relay 132 that communicate with each other. In one embodiment, the logic relay 131 communicates with the sensor 140, while the time relay 132 does not communicate with the sensor 140. In another embodiment, both the logic relay 131 and the time relay 132 communicate with the sensor 140.

[0038] Accordingly, the time relay 132 is configured to start timing when the sensor 140 senses the lead frame 10, and the logic relay 131 is configured to trigger the drive source 121 when the timing of the time relay 132 reaches a preset timing time. Here, "trigger" should be understood as direct or indirect triggering. In this embodiment, the time relay 132 provides a time buffer for clamping, making clamping more stable and reliable. The time relay 132 is typically a digital display time relay with adjustable timing. The timing of the time relay 132 is generally in the tens of milliseconds, such as 10ms, 20ms, 30ms, etc., and the specific timing time can be reasonably set according to actual needs. Furthermore, in other cases, the time relay 132 may not be set, and the logic relay 131 may directly trigger the drive source 121 based on the information sensed by the sensor 140.

[0039] It should be noted that the original vacuum and air blowing mechanisms could not automatically switch states when contacting the lead frame 10. That is, the original vacuum suction feeding mechanism was in a normally open vacuum state when vacuum adsorbing the lead frame 10. Therefore, this embodiment adds a logic relay 131 to control the state of the clamping device 120, so that the clamping device 120 can switch between open and closed.

[0040] In this embodiment, when the sensor 140 senses the lead frame 10, it sends a sensing signal to the logic relay 131. After receiving the sensing signal, the logic relay 131 also starts timing. When the timing of the time relay 132 reaches the preset timing time, the logic relay 131 considers that a clamping action is needed. Therefore, after the preset timing time is reached, the logic relay 131 directly triggers the valve 150 to open. After the valve 150 opens, it connects the air source and the cylinder, outputs compressed gas to the cylinder, thereby driving the chuck 122 to clamp the lead frame 10.

[0041] It should be understood that when the drive source 121 is a cylinder, the drive source 121 is connected to an air supply line, which in turn is connected to an air source. The air source supplies compressed gas, and a valve 150 is installed on the air supply line to control the connection and disconnection between the cylinder and the air source. Multiple clamping devices 120 can be supplied with and cut off air simultaneously; only a single multi-way valve is needed to connect all cylinders. For example, two cylinders can be used, controlled by a single three-way solenoid valve (i.e., valve 150). Of course, multiple clamping devices 120 can also be supplied with and cut off air independently. In other cases, the cylinder can be replaced with a hydraulic cylinder. Similarly, when valve 150 is open, the working medium is output to the hydraulic cylinder, causing the clamp 122 to clamp the lead frame 10. It should also be understood that when the drive source 121 is a motor, the motor can be started directly according to the signal sent by the logic relay 131. In this case, valve 150 can be omitted.

[0042] Continue to refer to Figure 5 Both logic relay 131 and time relay 132 are powered by power supply 160, which is typically a 24V DC power supply. Since the existing die bonding equipment itself is equipped with a DC power supply box, the DC power supply box can be used directly to power the relay device 130.

[0043] Furthermore, sensor 140 can be either a contact sensor or a non-contact sensor, the specific type of which is not limited. More preferably, sensor 140 uses a non-contact sensor, such as a photoelectric sensor, infrared sensor, ultrasonic sensor, laser sensor, or other non-contact sensor. Preferably, sensor 140 is an inductive proximity switch. When the lead frame 10 approaches or moves away from the proximity switch, the signal automatically changes, thereby achieving the detection purpose. The inductive proximity switch has a detection distance of 4mm and features stable detection distance, high repeatability, low temperature drift, strong anti-interference, longer service life, fast response speed, and high temperature resistance. It can accurately detect and identify the lead frame 10, ensuring reliability and effectiveness, and has low maintenance costs.

[0044] Furthermore, there may be one or more sensors 140. In this embodiment, there is only one sensor 140, thereby reducing costs. The sensor 140 is mainly disposed above the feeding area 200 and is used to sense the lead frame 10 of the feeding area 200. Once the sensor 140 descends to a suitable height, it can sense the lead frame 10. Figure 4 As shown, the sensor 140 is set to have a suitable sensing distance d, within which the lead frame 10 can be sensed. The sensing distance d should not be too large or too small. If it is too large, the accuracy of sensing will be reduced; if it is too small, it will be easy to touch the lead frame 10. The specific sensing distance d can be reasonably set according to actual needs.

[0045] Optionally, the sensor 140 can be disposed around any of the gripping devices 120, either near or away from the gripping device 120.

[0046] Specifically, sensor 140 includes probe 141 and indicator light; probe 141 is located at the bottom of sensor 140, and the height of probe 141 is higher than that of clamp 122, see... Figure 4 The indicator light is configured to illuminate when the sensor 140 detects the lead frame 10; otherwise, the indicator light is off. The specific location of the indicator light on the sensor 140 is not limited. Optionally, the indicator light can be located at the top of the sensor 140. The color of the indicator light is not limited, but red is preferred.

[0047] Optionally, the feeding mechanism 100 in this embodiment also includes a fixed bracket 170 (see details). Figure 3 The mounting bracket 170 is fixed around the drive source 121, for example, directly to one side of the cylinder, and the sensor 140 is directly mounted on the mounting bracket 170. As shown in the figure, the sensor 140 is arranged side by side with the cylinder. Optionally, the mounting bracket 170 is provided with a through hole, through which the sensor 140 passes for vertical installation, and then the sensor 140 is locked in place by nuts. In this case, the sensor 140 has external threads for easy installation and fixation.

[0048] Refer to Figure 1 and Figure 2 Optionally, the mounting structure 110 also includes a crossbeam 112, on which the mounting block 111 mentioned above is locked. For example, the mounting block 111 is locked to the crossbeam 112 by several screws, and a clamping device 120 is provided at each end of the crossbeam 112. This structure is simple, small in size, and easy to install and use.

[0049] In addition, the feeding mechanism 100 in this embodiment also includes an auxiliary support 180 (see Figure 2 The auxiliary bracket 180 is detachably connected to the mounting structure 110 and is located on one side of the mounting structure 110. For example, optionally, the auxiliary bracket 180 and the mounting block 111 are fixed by bolts. The auxiliary bracket 180 and the mounting block 111 are distributed on two opposite sides of the crossbeam 112. The auxiliary bracket 180 can be equipped with a structure originally used by the die bonding equipment to sense the paper suction function. It should be noted that some lead frames 10 have paper spacers between them, and this structure is used to sense the paper spacers, thereby retaining the original sensing function of the equipment.

[0050] In other embodiments, one end of the auxiliary support 180 is provided with a structure for sensing the paper suction function, and the other end is provided with a sensor 140, that is, the sensor 140 is mounted on the auxiliary support 180.

[0051] On another front, in this embodiment, the two clamps 122 in any one of the clamping devices 120 can be driven by the drive source 121 to make linear movements that move away from or towards each other. When they move towards each other, they can clamp the lead frame 10, and when they move away from each other, they can release the lead frame 10. However, in other embodiments, the two clamps 122 can be driven to make rotational movements.

[0052] Those skilled in the art should know that opening and closing clamping is a common mechanical structure. Therefore, based on the disclosure of this application, those skilled in the art can easily understand that there are many other mechanical structures to control the two clamps 122 to clamp or loosen the lead frame 10. Therefore, in addition to the mechanical structures listed in the accompanying drawings, those skilled in the art can find other alternative ways to achieve the functions / effects described in this application based on the description of this application, and not just the solutions disclosed in this embodiment.

[0053] The following is a illustrative example. For example... Figures 1 to 4 As shown, when the drive source 121 is a cylinder, the cylinder push rod is connected to two sliders 123, and each slider 123 is connected to a chuck 122. In this way, the up-and-down movement of the piston push rod in the cylinder is converted into the relative movement of the two sliders 123 in the horizontal direction, thereby controlling the two chucks 122 to move away from or closer to each other. The sliders 123 can be L-shaped or other suitable shapes.

[0054] In a further improvement, the chuck 122 is provided with an angled edge, which should face the lead frame 10. Specifically, the angled edge approaches the lead frame 10 from the bottom to the top, so that the angles of the two chucks 122 of any one gripping device 120 are distributed in a V-shape. In this way, when the chuck 122 grips the lead frame 10, it can prevent the accidental suction of excess lead frames 10, avoid frequent suction of multiple lead frames 10, thereby reducing maintenance time and further improving work efficiency.

[0055] As shown in the figure, the angle is formed by the overall tilt of the clamp 122, that is, the entire clamp 122 is installed tilted towards the lead frame 10. As a result, the lead frames 10 that were originally stacked together will automatically fall off due to the angle of the clamp 122, preventing other lead frames 10 from being accidentally sucked up.

[0056] In other alternative embodiments, the chamfer is formed directly from the bottom of the chuck 122 by chamfering. In this case, the entire chuck 122 can be set to a right angle and then chamfered.

[0057] The tilt angle of the chuck 122 is preferably 30°-60°, and more preferably 45°.

[0058] In some embodiments, when the angle is formed by the overall tilting of the chuck 122, the chuck 122 is preferably provided with threads, and the thread pitch is preferably matched with the thickness of the lead frame 10, so as to more stably pick up the single lead frame 10.

[0059] In other embodiments, when the chamfer is formed by beveling the bottom of the chuck 122, the minimum thickness of the chamfer is preferably matched to the thickness of the lead frame 10, so that the chuck 122 can more securely hold the single lead frame 10.

[0060] In illustrative terms, the working principle of the feeding mechanism 100 in this embodiment is as follows: Several lead frames 10 are pre-placed in the feeding area 200 of the existing die bonding equipment, and the lead frames 10 are stacked sequentially; the mounting structure 110 is driven to descend, causing the chuck 122 to enter the clamping position. At the same time, the sensor 140 senses the lead frame 10 after descending to a certain distance, indicating that the chuck 122 is in place, and the indicator light illuminates. The logic relay 131 and the time relay 132 start working; after the timing time is reached, the chuck 122 moves to clamp the lead frame 10; after successful clamping, the mounting structure 110 is driven to rise by the motion mechanism and leaves the feeding area 200; after moving to the designated position in the feeding area, the clamping device 120 releases the lead frame 10 onto the feeding guide rail, then leaves the feeding area and returns to the feeding area 200, and repeats the same steps.

[0061] The feeding area 200 is typically equipped with several limit posts 210 to limit the position of the lead frame 10. Generally, the die bonding equipment has incoming material monitoring in the feeding area. When incoming material is detected at a designated position, the relay device 130 is notified to trigger the drive source 121, causing the drive source 121 to drive the chuck 122 to release the lead frame 10. Taking a cylinder as an example, after the clamping device 120 clamps the lead frame 10, it places the lead frame 10 at the designated position. When it reaches the designated position, the die bonding equipment detects the incoming material and shuts off the valve 150, cutting off the air supply. This causes the chuck 122 to release the lead frame 10 onto the feeding guide rail, thus completing a normal material handling cycle.

[0062] Therefore, this utility model can replace the feeding mechanism on the existing die bonding equipment with the feeding mechanism 100 provided in this embodiment. However, the original feeding mechanism can also be reused if needed in subsequent use. Compared with the prior art, the feeding mechanism 100 provided by this utility model can clamp various lead frames 10 through the clamping device 120, which better meets the equipment operation requirements and reduces the risk of equipment alarms. On the other hand, the feeding mechanism 100 provided by this utility model can also greatly save equipment maintenance time, significantly improve operation efficiency, increase equipment capacity, and avoid the manual placement of lead frames 10 into the material box, thereby saving additional time for manual placement of lead frames 10 and greatly reducing labor costs.

[0063] Furthermore, it is understood that although the present invention has been disclosed above with reference to preferred embodiments, these embodiments are not intended to limit the present invention. For any person skilled in the art, many possible variations and modifications can be made to the present invention's technical solutions using the disclosed technical content, or equivalent embodiments can be modified accordingly, without departing from the scope of the present invention's technical solutions. Therefore, any simple modifications, equivalent changes, and modifications made to the above embodiments based on the technical essence of the present invention, without departing from the content of the present invention's technical solutions, shall still fall within the protection scope of the present invention's technical solutions.

[0064] Furthermore, it should be understood that this invention is not limited to the specific methods, compounds, materials, manufacturing techniques, uses, and applications described herein, which can vary. It should also be understood that the terminology described herein is used only to describe particular embodiments and not to limit the scope of this invention. It must be noted that the singular forms “a,” “an,” and “the” used herein and in the appended claims include plural bases unless the context clearly indicates otherwise. Thus, for example, a reference to “a step” means a reference to one or more steps, and may include secondary steps. All conjunctions used should be understood in the broadest sense. Therefore, the word “or” should be understood to have the definition of logical “or” rather than logical “exclusive”, unless the context clearly indicates otherwise. The structures described herein will be understood to also refer to functional equivalents of that structure. Language that can be interpreted as approximate should be understood in that way, unless the context clearly indicates otherwise.

Claims

1. A feeding mechanism, applied in a die bonding equipment, characterized in that, include: Mounting structure, clamping device, relay device and sensor; Both the clamping device and the sensor are mounted on the mounting structure. The clamping device is multiple; each clamping device includes a drive source and two oppositely arranged clamps; the relay device is communicatively connected to the sensor; the relay device is configured to trigger the drive source when the sensor senses the lead frame, so that the drive source drives the clamps to clamp the lead frame.

2. The feeding mechanism according to claim 1, characterized in that, The relay device includes a logic relay and a time relay connected in communication; the time relay is configured to start timing when the sensor senses the lead frame; the logic relay is configured to trigger the drive source when the timing time of the time relay reaches a preset timing time.

3. The feeding mechanism according to claim 2, characterized in that, It also includes a valve, which is communicatively connected to the logic relay; the logic relay is configured to trigger the valve to open when the timing of the time relay reaches a preset timing time, so as to output working medium to the drive source.

4. The feeding mechanism according to claim 3, characterized in that, The valve is a solenoid valve, and the driving source is a cylinder.

5. The feeding mechanism according to claim 1, characterized in that, The clamps are provided with bevels, and the bevels of the two clamps of any one clamping device are distributed in a figure-eight shape.

6. The feeding mechanism according to claim 5, characterized in that, The bevel angle is formed by chamfering the bottom of the chuck, or the bevel angle is formed by tilting the chuck as a whole.

7. The feeding mechanism according to claim 6, characterized in that, When the chamfer is formed by the overall tilting of the chuck, the chuck is provided with a thread, and the pitch of the thread matches the thickness of the lead frame; or, when the chamfer is formed by the bottom of the chuck through a chamfer, the minimum thickness of the chamfer matches the thickness of the lead frame.

8. The feeding mechanism according to claim 1, characterized in that, The sensor is a non-contact sensor and has a probe and an indicator light; the probe is located at the bottom of the sensor and the height of the probe is higher than the clamp; the indicator light is configured to light up when the sensor senses the lead frame.

9. The feeding mechanism according to claim 1, characterized in that, It also includes a fixed bracket, which is fixed to one side of the drive source, and the sensor is mounted on the fixed bracket; or, it also includes an auxiliary bracket, which is connected to the mounting structure and located on one side of the mounting structure, and the sensor is mounted on the auxiliary bracket; and / or, the mounting structure includes a mounting block and a crossbeam, the mounting block is locked to the crossbeam and is used for detachable connection with the motion mechanism of the die bonding device, and a clamping device is provided at each end of the crossbeam.

10. A die bonding apparatus, characterized in that, Includes the feeding mechanism as described in any one of claims 1-9.

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