Substrate holding member and substrate processing system

Abstract

The utility model provides a substrate holding member and a substrate processing system which can selectively receive substrates from a plurality of substrates which are arranged along the horizontal direction and are in a vertical posture. The substrate holding member according to one embodiment of the present utility model comprises: a main body having a first arm portion and a second arm portion, the front end portions of which are spaced apart and the root end portions of which are connected; a first holding guide which is fixed to the tip of the first arm and holds the peripheral edge of the substrate; and a second holding guide fixed to the front end portion of the second arm portion for holding the peripheral edge portion of the substrate, the length between the first holding guide and the second holding guide being shorter than the diameter of the substrate, and in the same plane as the first arm portion and the second arm portion, the distance between the first holding guide and the second holding guide is smaller than the diameter of the substrate. The first arm portion, the second arm portion, the first holding guide, and the second holding guide are positioned radially outward of the substrate in a state where the substrate is positioned closer to the base end than the position held by the first holding guide and the second holding guide.

Description

Technical Field

[0001] This utility model relates to a substrate holding component and a substrate processing system. Background Technology

[0002] Substrate transport devices are known for removing and conveying (i.e., handling) substrates held in a vertical position (see, for example, Patent Documents 1 and 2). Transport robots are known for using pushers to clamp and hold substrates placed on a hand (see, for example, Patent Document 3).

[0003] Prior art literature

[0004] Patent Literature

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-57798

[0006] Patent Document 2: Japanese Patent Application Publication No. 9-162157

[0007] Patent Document 3: Japanese Patent Application Publication No. 2009-200476 Utility Model Content

[0008] Technical problem to be solved by the utility model

[0009] This invention provides a technique for selectively receiving substrates from multiple substrates arranged in a vertical orientation along a horizontal direction.

[0010] Technical solutions for solving technical problems

[0011] One embodiment of the substrate holding member of this utility model includes: a main body having a first arm and a second arm spaced apart at their front ends and connected at their root ends; a first holding guide fixed to the front end of the first arm for holding a peripheral portion of the substrate; and a second holding guide fixed to the front end of the second arm for holding the peripheral portion of the substrate. The length between the first holding guide and the second holding guide is shorter than the diameter of the substrate. In the same plane as the first arm and the second arm, when the substrate is located closer to the root end than the position held by the first holding guide and the second holding guide, the first arm, the second arm, the first holding guide, and the second holding guide are located radially outward from the substrate.

[0012] Utility model effect

[0013] According to this invention, substrates can be selectively received from multiple substrates arranged in a vertical orientation along a horizontal direction. Attached Figure Description

[0014] Figure 1 This is a schematic top view illustrating the substrate processing system of the implementation method.

[0015] Figure 2 This is a schematic perspective view (1) of the second interface section.

[0016] Figure 3 This is a schematic perspective view (2) of the second interface section.

[0017] Figure 4 This is a flowchart illustrating the substrate processing method of the implementation method.

[0018] Figure 5 This is a three-dimensional view showing the third conveyor arm.

[0019] Figures 6(a), 6(b), and 6(c) illustrate the end-position holding position.

[0020] Figures 7(a), 7(b), and 7(c) illustrate the position of the back side.

[0021] Figures 8(a) and 8(b) illustrate the positions through which the substrate passes.

[0022] Figures 9(a) and 9(b) are diagrams (1) illustrating the substrate receiving operation.

[0023] Figures 10(a) and 10(b) are diagrams (2) illustrating the substrate receiving operation.

[0024] Figures 11(a) and 11(b) are diagrams (3) illustrating the substrate receiving operation.

[0025] Figure 12 Figure (4) shows the substrate receiving operation.

[0026] Figure 13 Figure (5) shows the substrate receiving operation.

[0027] Figure 14 This is a diagram (1) showing the substrate handover process.

[0028] Figure 15 Figure (2) shows the substrate handover process.

[0029] Figure 16 Figure (3) shows the substrate handover process.

[0030] Figure 17 Figure (4) shows the substrate handover operation.

[0031] Figure 18 Figure (5) shows the substrate handover process.

[0032] Explanation of reference numerals in the attached figures

[0033] 53a Third Conveyor Arm

[0034] 110 Main Body

[0035] 111 First Arm

[0036] 111a Front end

[0037] 112 Second Arm

[0038] 112a Front end

[0039] 120 First retaining guide

[0040] 130 Second retaining guide

[0041] W substrate. Detailed Implementation

[0042] Hereinafter, non-limiting illustrative embodiments of the present invention will be described with reference to the accompanying drawings. In all the drawings, the same or corresponding parts or components are labeled with the same or corresponding reference numerals, and repeated descriptions are omitted. In this specification, the X-axis, Y-axis, and Z-axis are mutually perpendicular directions. The X-axis and Y-axis are horizontal directions, and the Z-axis is a vertical direction.

[0043] [Substrate Processing System]

[0044] Reference Figures 1 to 3 The substrate processing system of the implementation method will be described. For example... Figure 1 As shown, the substrate processing system 1 includes an infeed / outfeed unit 2, a first interface unit 3, a batch processing unit 4, a second interface unit 5, a single-chip processing unit 6, and a control device 9.

[0045] The loading and unloading section 2 serves as both a loading section and an unloading section. Therefore, the substrate processing system 1 can be miniaturized. The loading and unloading section 2 has a loading port 21, a stocker 22, a loader 23, and a box conveyor 24.

[0046] Loading ports 21 are located on the negative side of the loading / unloading section 2 in the X-axis direction. Multiple loading ports 21 (e.g., four) are arranged along the Y-axis direction. However, the number of loading ports 21 is not particularly limited. A box C is placed in the loading port 21. Box C houses multiple (e.g., 25) substrates W, which are loaded and unloaded relative to the loading ports 21. Inside box C, the substrates W are held horizontally and vertically at a second spacing P2 (P2 = N × P1) that is N times the first spacing P1. N is a natural number greater than or equal to 2; in this embodiment, it is 2, but it can also be 3 or greater.

[0047] Multiple (e.g., four) storage containers 22 are arranged along the Y-axis direction at the center of the X-axis direction of the loading / unloading section 2. Multiple (e.g., two) storage containers 22 are arranged adjacent to the first interface section 3 along the Y-axis direction on the positive side of the loading / unloading section 2 in the X-axis direction. Multiple storage containers 22 may also be arranged vertically. The storage containers 22 temporarily store and hold boxes C containing substrates W before cleaning, boxes C empty after substrates W are removed, etc. Furthermore, the number of storage containers 22 is not particularly limited.

[0048] The loader 23 is adjacent to the first interface section 3 and is positioned on the positive side of the loading / unloading section 2 in the X-axis direction. The loader 23 can hold the box C. The loader 23 is provided with a cover opening / closing mechanism (not shown) for opening and closing the cover of the box C. Multiple loaders 23 may be used. Multiple layers of loaders 23 may also be arranged in the vertical direction.

[0049] The box conveyor 24 is, for example, a multi-joint conveyor robot. The box conveyor 24 conveys boxes C between the loading port 21, the storage container 22, and the loader 23.

[0050] The first interface section 3 is located on the positive side of the infeed / outfeed section 2 in the X-axis direction. The first interface section 3 transports the substrate W between the infeed / outfeed section 2, the batch processing section 4, and the single-wafer processing section 6. The first interface section 3 includes a substrate transfer device 31, a lot forming section 32, and a first transfer station 33.

[0051] The substrate transfer device 31 transports substrates W between the cassette C placed in the loader 23, the batch forming section 32, and the first transfer station 33. The substrate transfer device 31 is composed of a multi-axis (e.g., 6-axis) arm robot with a substrate holding arm 31a at its front end. The substrate holding arm 31a has multiple holding claws (not shown) capable of holding multiple (e.g., 25) substrates W. The substrate holding arm 31a can assume any position and orientation in three-dimensional space while holding the substrates W using the holding claws.

[0052] The batch forming unit 32 is disposed on the positive side of the first interface unit 3 in the X-axis direction. The batch forming unit 32 holds multiple substrates W with a first spacing P1 to form a batch L.

[0053] The first transfer station 33 is adjacent to the single-chip processing unit 6 and is located on the positive side of the Y-axis direction of the first interface unit 3. The first transfer station 33 receives the substrate W from the fourth conveying device 61 and temporarily stores it until it is handed over to the transfer-in / transfer-out unit 2.

[0054] The batch processing unit 4 is positioned on the positive side of the first interface unit 3 in the X-axis direction. That is, the loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4 are arranged in this order from the negative side of the X-axis direction to the positive side. The batch processing unit processes a batch L together, which contains multiple (e.g., 50 or 100) substrates W at a first interval P1. One batch L is, for example, composed of M substrates W in a box C. M is a natural number of 2 or more. M can be the same as N or a different natural number than N. The batch processing unit 4 includes a medicine tank 41, a rinsing liquid tank 42, a first conveying device 43, a processing tool 44, and a drive device 45.

[0055] The chemical solution tank 41 and the rinsing solution tank 42 are arranged along the X-axis. For example, the chemical solution tank 41 and the rinsing solution tank 42 are arranged sequentially from the positive side of the X-axis to the negative side. Furthermore, the chemical solution tank 41 and the rinsing solution tank 42 are collectively referred to as treatment tanks. The number of chemical solution tanks 41 and rinsing solution tanks 42 is not limited. Figure 1 For example, the medicine tank 41 and the rinsing fluid tank 42 are in Figure 1 There can be one group, but there can also be multiple groups.

[0056] The chemical solution tank 41 stores the chemical solution for impregnation batch L. The chemical solution is, for example, an aqueous phosphoric acid solution (H3PO4). The aqueous phosphoric acid solution selectively etches and removes the silicon nitride film from the silicon oxide film and the silicon nitride film. The chemical solution is not limited to an aqueous phosphoric acid solution. For example, it can also be DHF (dilute hydrofluoric acid), BHF (a mixture of hydrofluoric acid and ammonium fluoride), dilute sulfuric acid, SPM (a mixture of sulfuric acid, hydrogen peroxide, and water), SC1 (a mixture of ammonia, hydrogen peroxide, and water), SC2 (a mixture of hydrochloric acid, hydrogen peroxide, and water), TMAH (a mixture of tetramethylammonium hydroxide and water), plating solution, etc. The chemical solution can be used for stripping or plating. The quantity of chemical solution is not particularly limited and multiple solutions can be used.

[0057] The rinsing solution tank 42 stores the first rinsing solution for batch immersion of L. The first rinsing solution is pure water, such as DIW (deionized water), used to remove the chemical solution from the substrate W.

[0058] The first conveying device 43 has a guide rail 43a and a first conveying arm 43b. The guide rail 43a is positioned on the negative side of the Y-axis direction relative to the processing tank. The guide rail 43a extends from the first interface portion 3 along the horizontal direction (X-axis direction) toward the batch processing portion 4. The first conveying arm 43b moves along the guide rail 43a in the horizontal direction (X-axis direction). The first conveying arm 43b can move in the vertical direction and rotate about the vertical axis. The first conveying arm 43b conveys a batch L together between the first interface portion 3 and the batch processing portion 4.

[0059] The processor 44 receives and holds a batch L from the first conveying arm 43b. The processor 44 holds a plurality of substrates W in the Y-axis direction at a first spacing P1, and holds the plurality of substrates W vertically.

[0060] The drive unit 45 moves the processing unit 44 in the X-axis and Z-axis directions. The processing unit 44 immerses the batch L in the medicine solution stored in the medicine solution tank 41, then immerses the batch L in the first rinsing solution stored in the rinsing solution tank 42, and then delivers the batch L to the first conveying unit 43.

[0061] In this embodiment, the number of units for the processing apparatus 44 and the drive device 45 is one, but it can also be multiple. In the latter case, one unit immerses batch L in the medicine solution stored in the medicine solution tank 41, and another unit immerses batch L in the first rinsing solution stored in the rinsing solution tank 42. In this case, the drive device 45 only needs to move the processing apparatus 44 along the Z-axis direction, or it may not need to move the processing apparatus 44 along the X-axis direction.

[0062] The second interface section 5 is located on the positive side of the batch processing section 4 in the Y-axis direction. The second interface section 5 transports the substrate W between the batch processing section 4 and the single-piece processing section 6. The second interface section 5 includes an impregnation tank 51, a second conveying device 52, a third conveying device 53, a second transfer platform 54, and a pushing member 55.

[0063] The impregnation tank 51 is positioned outside the travel range of the first conveying arm 43b. For example, the impregnation tank 51 is positioned offset to the positive side in the Y-axis direction relative to the processing tank. The impregnation tank 51 stores a second rinsing solution for immersing batch L therein. The second rinsing solution is, for example, DIW (deionized water). The substrate W is held in the second rinsing solution until it is lifted from the second rinsing solution by the third conveying device 53. Since the substrate W is below the surface of the second rinsing solution, the surface tension of the second rinsing solution does not act on the substrate W, preventing the collapse of the uneven pattern of the substrate W. The impregnation tank 51 can also be configured to be movable in the X-axis direction. In this case, when immersing batch L in the impregnation tank 51, the positional offset in the X-axis direction between the impregnation tank 51 and the batch L can be corrected. An X-axis drive device (not shown) for moving the impregnation tank 51 in the X-axis direction is mounted, for example, on the lower surface of the impregnation tank 51.

[0064] The second conveying device 52 has a Y-axis drive device 52a, a Z-axis drive device 52b, and a second conveying arm 52c.

[0065] Y-axis drive unit 52a is disposed on the positive side of the second interface portion 5 in the X-axis direction. Y-axis drive unit 52a extends from the second interface portion 5 in the horizontal direction (Y-axis direction) toward the batch processing portion 4. Y-axis drive unit 52a moves Z-axis drive unit 52b and second conveyor arm 52c in the Y-axis direction. Y-axis drive unit 52a may include a ball screw. Y-axis drive unit 52a is an example of a horizontal drive unit.

[0066] Z-axis drive unit 52b is movably mounted on Y-axis drive unit 52a. Z-axis drive unit 52b moves the second conveying arm 52c in the Z-axis direction. Z-axis drive unit 52b may include a ball screw. Z-axis drive unit 52b is an example of a vertical drive unit.

[0067] The second conveying arm 52c is movably mounted on the Z-axis drive device 52b. The second conveying arm 52c is configured to hold multiple substrates W spaced apart from each other. The second conveying arm 52c receives and holds a batch L from the first conveying arm 43b. The second conveying arm 52c holds multiple substrates W at a first distance P1 in the Y-axis direction. The second conveying arm 52c holds each of the multiple substrates W in a vertical orientation. The second conveying arm 52c is an example of a vertical holding member. The second conveying arm 52c moves in the Y-axis and Z-axis directions via the Y-axis drive device 52a and the Z-axis drive device 52b. The second conveying arm 52c is configured to move between multiple positions, including a junction position, an immersion position, and a standby position. The second conveying arm 52c can also be configured to move in the X-axis direction. In this case, when immersing the batch L in the immersion tank 51, the positional offset in the X-axis direction between the immersion tank 51 and the batch L can be corrected. An X-axis drive device (not shown) that moves the second conveying arm 52c in the X-axis direction is movably mounted, for example, on a Z-axis drive device 52b. In this case, the second conveying arm 52c is movably mounted on the X-axis drive device.

[0068] The handover position is the location where batch L is handed over between the first conveyor arm 43b and the second conveyor arm 52c. The handover position is on the negative side of the Y-axis and the positive side of the Z-axis.

[0069] The immersion position is the location where batch L is immersed in the immersion tank 51. The immersion position is located on the positive side of the Y-axis and on the negative side of the Z-axis, compared to the junction position.

[0070] The standby position is the position where the second conveyor arm 52c is idle when there is no handover of batch L or no immersion of batch L into the immersion tank 51. The standby position is directly below the handover position (negative side in the Z-axis direction), a position that does not obstruct the movement of the first conveyor arm 43b. In this case, because the second conveyor arm 52c can move to the handover position simply by moving upwards (positive side in the Z-axis direction), productivity is increased. The standby position can also be the same as the immersion position. In this case, it is possible to prevent particles that may be generated during the operation of the first conveyor 43 from adhering to the second conveyor arm 52c. The standby position can also be directly above the immersion position (positive side in the Z-axis direction). Thus, by setting the standby position to a position different from the handover position, it is possible to prevent contact between the first conveyor arm 43b and the second conveyor arm 52c.

[0071] During the operation of the first conveying device 43, the second conveying device 52 moves the second conveying arm 52c to the immersion position or the standby position. In this case, it is possible to prevent the first conveying arm 43b from contacting the second conveying arm 52c.

[0072] The third conveying device 53 is composed of a multi-axis (e.g., 6-axis) arm robot. The third conveying device 53 has a third conveying arm 53a at its front end. The third conveying arm 53a is configured to hold the substrate W. The third conveying arm 53a can take any position and orientation in three-dimensional space while holding the substrate W. The third conveying device 53 conveys the substrate W between the second conveying arm 52c located at the immersion position and the second transfer platform 54. Specifically, firstly, as... Figure 2 As shown, the third conveying arm 53a receives the substrate W, which is held vertically by the second conveying arm 52c located in the immersion position. Then, as... Figure 3 As shown, the third conveying arm 53a changes the substrate W from a vertical to a horizontal position. Then, the third conveying arm 53a transfers the horizontally positioned substrate W to the second transfer station 54. At this time, since the impregnation tank 51 is located outside the movement range of the first conveying arm 43b, the first conveying arm 43b and the third conveying arm 53a do not interfere with each other. Therefore, one of the first conveying device 43 and the third conveying device 53 can operate independently without depending on the operating state of the other. Thus, because the first conveying device 43 and the third conveying device 53 can be operated at any time, the time required for transporting the substrate W can be shortened. As a result, the productivity of the substrate processing system 1 is increased.

[0073] The second transfer station 54 is adjacent to the single-piece processing unit 6 and is located on the negative side of the X-axis direction of the second interface unit 5. The second transfer station 54 receives the substrate W from the third conveying device 53 and temporarily holds it until it is transferred to the single-piece processing unit 6. The substrate W taken out from the impregnation tank 51 is placed on the second transfer station 54. The second transfer station 54 holds the substrate W in a horizontal position. The second transfer station 54 is an example of a horizontal holding member. The substrate W placed on the second transfer station 54 is preferably in a state where its surface is wetted by the second rinsing liquid. In this case, the surface tension of the second rinsing liquid does not act on the substrate W, and the collapse of the uneven pattern of the substrate W can be suppressed. The second transfer station 54 may also be arranged in multiple layers (e.g., two layers) in the vertical direction.

[0074] The second receiving platform 54 has a mounting plate 54a and three pins 54b. The mounting plate 54a is, for example, rectangular. The mounting plate 54a may also be circular. The pins 54b are disposed on the mounting plate 54a. In this embodiment, there are three pins 54b, but there may also be four or more. The three pins 54b are arranged to form an equilateral triangle when viewed from above. The pins 54b support the substrate W from below above the mounting plate 54a.

[0075] A push-abutment member 55 is provided at each of the second transfer stations 54. The push-abutment member 55 is positioned above each mounting plate 54a and on the negative side of the X-axis direction of each mounting plate 54a. In this case, the travel distance of the third conveyor arm 53a from the position where it pushes the substrate W against the push-abutment member 55 to the position where it transfers the substrate W to the second transfer station 54 is shortened. The position of the push-abutment member 55 is not limited to this. The push-abutment member 55 can be provided at any position that the third conveyor arm 53a can reach, or it can be provided at other positions. For example, the push-abutment member 55 can also be provided between adjacent second transfer stations 54 in the vertical direction and on the positive side of the X-axis direction than the second transfer station 54. In this case, the number of push-abutment members 55 can be reduced compared to the case where the push-abutment member 55 is provided at each of the second transfer stations 54. The push-abutment member 55 contacts the substrate W held by the third conveyor arm 53a, causing the substrate W to move horizontally relative to the third conveyor arm 53a.

[0076] The single-wafer processing unit 6 is located on the negative side of the second interface unit 5 in the X-axis direction and on the positive side of the loading / unloading unit 2, the first interface unit 3, and the batch processing unit 4 in the Y-axis direction. The single-wafer processing unit 6 processes substrates W one by one. The single-wafer processing unit 6 includes a fourth conveying device 61, a liquid treatment device 62, and a drying device 63.

[0077] The fourth conveying device 61 has a guide rail 61a and a fourth conveying arm 61b. The guide rail 61a is disposed on the negative side of the single-wafer processing unit 6 in the Y-axis direction. The guide rail 61a extends horizontally (X-axis direction) in the single-wafer processing unit 6. The fourth conveying arm 61b moves along the guide rail 61a in the horizontal (X-axis direction) and vertical directions and rotates about the vertical axis. The fourth conveying arm 61b conveys the substrate W between the second transfer station 54, the liquid treatment device 62, the drying device 63, and the first transfer station 33. The number of fourth conveying arms 61b can be one or more; in the latter case, the fourth conveying device 61 conveys multiple (e.g., five) substrates W simultaneously.

[0078] The liquid treatment device 62 is positioned on both the positive side of the X-axis and the positive side of the Y-axis of the single-piece processing unit 6. The liquid treatment device 62 is a single-piece type, treating each substrate W individually with the treatment liquid. The liquid treatment device 62 has multiple layers (e.g., 3 layers) arranged in the vertical direction (Z-axis direction). Therefore, multiple substrates W can be treated simultaneously using the treatment liquid. The treatment liquid can be various, such as pure water (DIW) and a drying liquid with a lower surface tension than pure water. The drying liquid can be, for example, an alcohol such as IPA (isopropanol).

[0079] The drying device 63 is arranged adjacent to the liquid treatment device 62 on the negative side of the X-axis. In this case, the end face of the single-piece processing unit 6 on the positive side of the Y-axis and the end face of the second interface unit 5 on the positive side of the Y-axis can be arranged to be flush or approximately flush. Therefore, since almost no dead zone is generated, the area occupied by the substrate processing system 1 can be reduced. In contrast, when the drying device 63 is arranged adjacent to the liquid treatment device 62 on the positive side of the Y-axis, the end face of the single-piece processing unit 6 on the positive side of the Y-axis protrudes beyond the end face of the second interface unit 5 on the positive side of the Y-axis, which may generate a dead zone. The drying device 63 is a single-piece type, which dries the substrates W one by one using supercritical fluid. The drying device 63 is arranged in multiple layers (e.g., 3 layers) in the vertical direction. As a result, multiple substrates W can be dried simultaneously.

[0080] Alternatively, the liquid treatment device 62 and the drying device 63 may not be single-piece units, or the liquid treatment device 62 may be single-piece units while the drying device 63 is batch units. The drying device 63 may also utilize supercritical fluid to dry multiple substrates W simultaneously. The number of substrates W processed simultaneously in the drying device 63 may be greater than, but less than, the number processed simultaneously in the liquid treatment device 62. Alternatively, devices other than the liquid treatment device 62 and the drying device 63 may be arranged in the single-piece processing unit 6.

[0081] The control device 9 is, for example, a computer. The control device 9 includes a CPU (Central Processing Unit) 91 and a recording medium 92 such as memory. The recording medium 92 stores programs for controlling various processes executed in the substrate processing system 1. The control device 9 controls the operation of the substrate processing system 1 by causing the CPU 91 to execute the programs stored in the recording medium 92. The control device 9 includes an input interface 93 and an output interface 94. The control device 9 receives signals from the outside through the input interface 93 and sends signals to the outside through the output interface 94.

[0082] The aforementioned program is stored, for example, on a computer-readable recording medium, and installed from that recording medium onto the recording medium 92 of the control device 9. Examples of computer-readable recording media include hard disks (HD), floppy disks (FD), optical disks (CD), magneto-optical disks (MO), and memory cards. Alternatively, the program can be downloaded from a server via the Internet and installed onto the recording medium 92 of the control device 9.

[0083] In the substrate processing system 1, the substrate W is transported from the loading / unloading section 2 in the order of the first interface section 3, the batch processing section 4, the second interface section 5, and the single-chip processing section 6, and then returned to the loading / unloading section 2.

[0084] [Substrate processing system operations]

[0085] Reference Figure 4 The operation of the substrate processing system 1 in the embodiment, i.e. the substrate processing method, will be explained. Figure 4 The process shown is carried out under the control of control device 9.

[0086] First, the box C, containing multiple substrates W, is moved into the loading / unloading section 2 and placed in the loading port 21. Inside the box C, the substrates W are held horizontally and vertically at a second spacing P2 (P2 = N × P1). N is a natural number greater than or equal to 2, which is 2 in this embodiment, but can also be 3 or greater.

[0087] Next, the box conveying device 24 transports box C from loading port 21 to loader 23. The box C delivered to loader 23 has its cover opened by the cover opening and closing mechanism.

[0088] Next, the substrate W (received by the substrate transfer device 31 receiving box C) Figure 4 (S101), and then transport it to the batch forming section 32.

[0089] Next, the batch forming unit 32 holds multiple substrates W with a first spacing P1 (P1 = P2 / N) to form a batch L ( Figure 4(S102). A batch L consists of, for example, M substrates W of boxes C. Since the spacing of the substrates W narrows from the second spacing P2 to the first spacing P1, the number of substrates W processed at the same time can be increased.

[0090] Next, the first conveying device 43 receives batch L from the batch forming unit 32 and conveys it to the processing device 44.

[0091] Next, the processor 44 descends from above the liquid tank 41, immersing the batch L in the liquid to perform liquid treatment. Figure 4 (S103). Then, the processor 44 rises and lifts the batch L from the liquid, and then moves horizontally (towards the negative X-axis) above the rinsing liquid tank 42.

[0092] Next, the processing device 44 descends from above the rinsing liquid tank 42, immersing the batch L in the first rinsing liquid to perform rinsing liquid treatment. Figure 4 (S103). Then, the processing device 44 rises to lift the batch L from the first rinsing fluid. Next, the first conveying device 43 receives the batch L from the processing device 44 and transfers it to the second conveying device 52.

[0093] Next, the second conveying arm 52c of the second conveying device 52 moves horizontally (towards the positive side of the Y-axis) and descends from above the immersion tank 51, immersing the batch L in the second rinsing liquid ( Figure 4 (S104). Multiple substrates W in batch L are held in the second rinsing liquid until they are lifted out of the second rinsing liquid by the third conveying device 53. Since the substrates W are below the surface of the second rinsing liquid, the surface tension of the second rinsing liquid does not act on the substrates W, thus preventing the collapse of the uneven pattern of the substrates W.

[0094] Next, the third conveying device 53 conveys the batch of substrates W held by the second conveying arm 52c in the second rinsing liquid to the second transfer station 54. The third conveying device 53 conveys the substrates W one by one to the second transfer station 54.

[0095] Next, the fourth conveying device 61 receives the substrate W from the second transfer station 54 and conveys it to the liquid treatment device 62.

[0096] Next, the liquid treatment device 62 treats the substrates W one by one with liquid. Figure 4 (S105). The liquid can be of various types, such as pure water (DIW) and a drying solution with a lower surface tension than pure water. The drying solution can be, for example, an alcohol (IPA). The liquid treatment device 62 sequentially supplies pure water and drying solution to the upper surface of the substrate W to form a liquid film of drying solution.

[0097] Next, the fourth conveying device 61 receives the substrate W from the liquid treatment device 62, holding the substrate W horizontally with the liquid film of the drying liquid facing upwards. The fourth conveying device 61 then conveys the substrate W from the liquid treatment device 62 to the drying device 63.

[0098] Next, the drying apparatus 63 uses supercritical fluid to dry the substrates W one by one. Figure 4 (S105). It can replace the drying liquid with supercritical fluid, and can suppress the collapse of the uneven pattern of the substrate W caused by the surface tension of the drying liquid. Supercritical fluid requires a pressure vessel, so in order to miniaturize the pressure vessel, batch processing is not performed, but single-wafer processing is performed.

[0099] Furthermore, the drying device 63 is a single-piece type in this embodiment, but as described above, it can also be a batch type. The batch drying device 63 uses supercritical fluid to dry multiple substrates W on which a liquid film has been formed simultaneously. The single-piece drying device 63 has a conveying arm for holding the substrate W, while the batch drying device 63 has multiple conveying arms.

[0100] Next, the fourth conveying device 61 receives the substrate W from the drying device 63 and conveys it to the first transfer station 33.

[0101] Next, the substrate transfer device 31 receives the substrate W from the first transfer station 33 and stores it in the box C. Figure 4 (S106). Box C is moved out from the loading / unloading section 2 while containing multiple substrates W.

[0102] [Third Conveyor Arm]

[0103] Reference Figures 5 to 8(b) The third conveyor arm 53a will be described. Figure 5 This is a perspective view of the third conveying arm 53a. Figures 6(a), 6(b), and 6(c) illustrate the end-holding position. Figure 6(a) is a top view perpendicular to the front (surface) Wa of the substrate W. Figure 6(b) is a cross-sectional view viewed in the direction of arrows 6B-6B in Figure 6(a).

[0104] Figure 6(c) is an enlarged perspective view of the first retaining guide 120. Figures 7(a), 7(b), and 7(c) illustrate the rear retaining position. Figure 7(a) is a top view perpendicular to the front surface Wa of the substrate W. Figure 7(b) is a cross-sectional view viewed in the direction of arrows 7B-7B in Figure 7(a). Figure 7(c) is an enlarged perspective view of the first retaining guide 120. Figures 8(a) and 8(b) illustrate the substrate passing position. Figure 8(a) is a top view perpendicular to the front surface Wa of the substrate W. Figure 8(b) is a cross-sectional view viewed in the direction of arrows 8B-8B in Figure 8(a).

[0105] The third conveying arm 53a is an example of a substrate holding member. The third conveying arm 53a has a body 110, a first holding guide 120, a second holding guide 130, a first clamping member 140, a second clamping member 150, and a back-side holding mechanism 160.

[0106] The main body 110 has a generally U-shaped form. The main body 110 has a first surface 110a and a second surface 110b. The second surface 110b is the surface opposite to the first surface 110a. The main body 110 has a first arm portion 111 and a second arm portion 112. The first arm portion 111 includes a front end portion 111a and a root end portion 111b. The second arm portion 112 includes a front end portion 112a and a root end portion 112b. The front end portion 111a of the first arm portion 111 and the front end portion 112a of the second arm portion 112 are spaced apart from each other. The root end portion 111b of the first arm portion 111 and the root end portion 112b of the second arm portion 112 are connected to each other.

[0107] The first retaining guide 120 is fixed to the inner side of the front end portion 111a of the first arm portion 111. The first retaining guide 120 retains the peripheral portion of the substrate W. The first retaining guide 120 has a first surface 120a and a second surface 120b. The second surface 120b is the surface opposite to the first surface 120a. The first retaining guide 120 has a support groove 121 and a support surface 122. The support groove 121 supports the peripheral portion of the substrate W from both the front surface Wa and the back surface Wb of the substrate W. The support groove 121 widens (expands) from the bottom towards the opening. In this case, the peripheral portion of the substrate W can easily enter the support groove 121. The support surface 122 is located closer to the center of the substrate W than the support groove 121. The support surface 122 supports the peripheral portion of the substrate W from the back surface Wb of the substrate W. The support surface 122 is inclined from the first surface 120a side to the second surface 120b side away from the support groove 121.

[0108] The second retaining guide 130 is fixed to the inner side of the front end portion 112a of the second arm portion 112. The second retaining guide 130 retains the peripheral portion of the substrate W. The second retaining guide 130 has a first surface 130a and a second surface 130b. The second surface 130b is the surface opposite to the first surface 130a. The second retaining guide 130 has a support groove 131 and a support surface 132. The support groove 131 supports the peripheral portion of the substrate W from both the front surface Wa and the back surface Wb of the substrate W. The support groove 131 widens (expands) from the bottom towards the opening. In this case, the peripheral portion of the substrate W can easily enter the support groove 131. The support surface 132 is located closer to the center of the substrate W than the support groove 131. The support surface 132 supports the peripheral portion of the substrate W from the back surface Wb of the substrate W. The support surface 132 is inclined from the first surface 130a side to the second surface 130b side away from the support groove 131.

[0109] The length (distance) L1 between the first retaining guide 120 and the second retaining guide 130 is shorter than the diameter of the substrate W. The diameter of the substrate W is, for example, 300 mm.

[0110] A first clamping member 140 is provided at the root end 111b. The first clamping member 140 is configured to move between a closed position (the position shown by the dashed line in FIG. 6(a)) where the substrate W is clamped (held) and an open position (the position shown by the solid line in FIG. 6(a)) where the substrate W is released from clamping. The first clamping member 140 is driven by a first cylinder 141.

[0111] A second clamping member 150 is provided at the root end 112b. The second clamping member 150 is configured to move between a closed position that clamps the periphery of the substrate W (the position shown by the dashed line in FIG. 6(a)) and an open position that releases the clamping of the substrate W (the position shown by the solid line in FIG. 6(a)). The second clamping member 150 is driven by a second cylinder 151.

[0112] A back-end retaining mechanism 160 is provided at the root ends 111b and 112b. The back-end retaining mechanism 160 is located between the first clamping member 140 and the second clamping member 150. The back-end retaining mechanism 160 is configured to move between a closed position holding the substrate W (the position shown by the dashed line in FIG. 6(a)) and an open position radially outward from the substrate W (the position shown by the solid line in FIG. 6(a)). The back-end retaining mechanism 160 is driven by a cylinder 161.

[0113] The main body 110 is configured to move between an end-holding position, a back-holding position, and a substrate-passing position.

[0114] As shown in Figures 6(a), 6(b) and 6(c), the end holding position is the position where the support groove 121 of the first holding guide 120 and the support groove 131 of the second holding guide 130 support the periphery of the substrate W from both sides of the front side Wa and the back side Wb of the substrate W.

[0115] As shown in Figures 7(a), 7(b), and 7(c), the back-side holding position is the position where the support surface 122 of the first holding guide 120 and the support surface 132 of the second holding guide 130 support the periphery of the substrate W from the back side Wb of the substrate W. The back-side holding position is a position where the root ends 111b and 112b of the main body 110 are closer to the center of the substrate W by a first distance than the end-side holding position. This first distance is, for example, 10mm to 20mm, and in this embodiment, it is 12mm.

[0116] As shown in Figures 8(a) and 8(b), the substrate passing position is the position where the first retaining guide 120 and the second retaining guide 130 do not retain the substrate W. The substrate passing position is a position where the root ends 111b and 112b of the body 110 are closer to the center of the substrate W than the back-side retaining position. The substrate passing position is a position where the root ends 111b and 112b of the body 110 are a second distance closer to the center of the substrate W than the end retaining position. The second distance is, for example, 20mm to 40mm, and in this embodiment, 30mm. At the substrate passing position, in the same plane as the body 110, the first arm 111, the second arm 112, the first retaining guide 120, and the second retaining guide 130 are located radially outward from the substrate W. At the substrate passing position, when viewed from a direction perpendicular to the front surface Wa of the substrate W, the first arm 111, the second arm 112, the first retaining guide 120, and the second retaining guide 130 do not overlap with the substrate W. Therefore, at the substrate passage position, the main body 110 can move in a direction perpendicular to the front surface Wa of the substrate W without contacting the substrate W.

[0117] [Substrate Delivery Method]

[0118] The method describes a substrate transport method in which the third transport arm 53a receives the substrate W, which is held in a vertical position on the second transport arm 52c, changes the substrate W from a vertical position to a horizontal position, and transfers it to the second transfer platform 54, thereby transporting the substrate W from the second transport arm 52c to the second transfer platform 54.

[0119] (Baseboard receiving action)

[0120] Reference Figures 9(a) to 13 The operation of the third conveying arm 53a receiving a batch of substrates W held by the second conveying arm 52c in the second rinsing liquid (hereinafter referred to as the "substrate receiving operation") will be described. The substrate receiving operation is performed under the control of the control device 9. As shown in FIG9(b), the second conveying arm 52c alternately holds substrates W1 with the front side Wa facing the positive side in the Y-axis direction and substrates W2 with the back side Wb facing the positive side in the Y-axis direction at a first interval P1.

[0121] First, as shown in Figures 9(a) and 9(b), the main body 110 moves relative to the second conveying arm 52c to the substrate passing position on the negative side of the Y-axis direction with the first surface 110a parallel to the front Wa and back Wb of the substrates W1 and W2.

[0122] Next, as shown in Figures 10(a) and 10(b), the main body 110 moves laterally in the Y-axis direction and stops on the same plane as the substrate W1, which is the receiving object. In the substrate passing position, when viewed from above in the Y-axis direction, the first arm 111, the second arm 112, the first retaining guide 120, and the second retaining guide 130 do not overlap with the substrates W1 and W2. Therefore, in the substrate passing position, the main body 110 can move horizontally in the Y-axis direction without contacting the substrates W1 and W2 to the same plane as the substrate W1, which is the receiving object.

[0123] Next, as shown in Figures 11(a) and 11(b), the main body 110 moves to the positive side in the Z-axis direction and stops at the end position. As a result, the support groove 121 of the first retaining guide 120 and the support groove 131 of the second retaining guide 130 support the periphery of the substrate W1 from both sides of the front Wa and back Wb of the substrate W1.

[0124] Next, as Figure 12 As shown, the first clamping member 140 and the second clamping member 150 move from the open position (i.e., the open position) to the closed position, respectively. Thus, the periphery of the substrate W1 is clamped by the first clamping member 140 and the second clamping member 150. Furthermore, as... Figure 12 As shown, the back retaining mechanism 160 moves from the open position to the closed position.

[0125] Next, as Figure 13 As shown, the main body 110 moves to the positive side in the Z-axis direction. Consequently, the third conveying arm 53a receives the substrate W1 held on the second conveying arm 52c.

[0126] The substrate receiving operation for a substrate W1 is completed in the above manner. During the substrate receiving operation, the main body 110 moves to the desired position in the positive direction of the Y-axis from the substrate passing position, thereby enabling selective reception of any substrates W1 and W2 in the batch L held by the second conveying arm 52c.

[0127] (Substrate handover action)

[0128] Reference Figures 14 to 18 The action of the third conveying arm 53a transferring the substrate W to the second transfer station 54 (hereinafter referred to as the "substrate transfer action") will be described. The substrate transfer action is carried out under the control of the control device 9.

[0129] First, such as Figure 14As shown, the third conveying arm 53a changes the substrate W, which is in a vertical position, received from the second conveying arm 52c, to a horizontal position. At this time, the substrate W is supported by the support groove 121 of the first holding guide 120 and the support groove 131 of the second holding guide 130, and is clamped by the first clamping member 140 and the second clamping member 150. Therefore, even if the substrate W changes from a vertical position to a horizontal position, the substrate W will not fall off the main body 110.

[0130] Next, as Figure 15 As shown, the first clamping member 140 and the second clamping member 150 move from the closed position to the open position. This releases the clamping of the substrate W by the first clamping member 140 and the second clamping member 150. As a result, the periphery of the substrate W is supported by the support groove 121 of the first retaining guide 120 and the support groove 131 of the second retaining guide 130, and the substrate W is held from the back side by the back-side retaining mechanism 160.

[0131] Next, as Figure 16 As shown, the main body 110 moves towards the negative side of the X-axis direction, pushing the substrate W against the pushing member 55, thereby moving the substrate W from the position supported by the support grooves 121 and 131 to the position supported by the support surfaces 122 and 132. That is, the main body 110 moves from the end holding position to the back holding position. When the main body 110 moves at high speed, the substrate W supported by the support surfaces 122 and 132 is prone to positional displacement. Therefore, the main body 110 moves at a low speed when the substrate W is supported by the support surfaces 122 and 132. When the moving distance of the main body 110 from the position of pushing the substrate W against the pushing member 55 to the position of connecting to the second connecting platform 54 becomes shorter, the distance that the main body 110 moves at a low speed becomes shorter, thus shortening the transport time of the substrate W. Therefore, the pushing member 55 is preferably arranged above each mounting plate 54a and on the negative side of the X-axis direction of each mounting plate 54a.

[0132] Next, as Figure 17 As shown, the main body 110 moves to the positive side in the X-axis direction, causing the substrate W to move to a position directly above the second transfer platform 54. Then, the main body 110 moves to the negative side in the Z-axis direction. As a result, the substrate W, supported by the support surface 122, the support surface 132, and the back-side holding mechanism 160, is transferred to the three pins 54b of the second transfer platform 54.

[0133] Next, as Figure 18 As shown, the main body 110 moves to the positive side in the X-axis direction. Through this method, the substrate handover process for a substrate W is completed.

[0134] In the above-described substrate transport method, the case where the substrate W held by the main body 110 is pushed against the pushing member 55, thereby moving the substrate W from a position supported by the support grooves 121 and 131 to a position supported by the support surfaces 122 and 132, has been described, but it is not limited to this. For example, a suction line may be provided in the back-side holding mechanism 160 instead of the pushing member 55. In this case, by using the line to attract the substrate W, the substrate W can be moved from a position supported by the support grooves 121 and 131 to a position supported by the support surfaces 122 and 132.

[0135] The above-described substrate transport method describes a scenario where the third transport arm 53a has one main body 110 and transports substrates W one by one from the second transport arm 52c to the second transfer station 54, but it is not limited to this. For example, the third transport arm 53a may have multiple main bodies 110, and multiple substrates W may be transported simultaneously from the second transport arm 52c to the second transfer station 54.

[0136] The embodiments described in this specification should be considered illustrative rather than restrictive in all respects. The above-described embodiments may also be omitted, substituted, or modified in various ways without departing from the present invention and its spirit.

Claims

1. A substrate holding member, characterized in that, include: The main body has a first arm and a second arm that are spaced apart at their front ends and connected at their root ends; A first retaining guide is fixed to the front end of the first arm for retaining the periphery of the substrate; and A second retaining guide, fixed to the front end of the second arm, is used to retain the periphery of the substrate. The length between the first retaining guide and the second retaining guide is shorter than the diameter of the substrate. In the same plane as the first arm and the second arm, with the substrate located closer to the root end than the position held by the first retaining guide and the second retaining guide, the first arm, the second arm, the first retaining guide and the second retaining guide are located radially outward from the substrate.

2. The substrate holding member as claimed in claim 1, characterized in that: It has a clamping member provided at the root end. The clamping component is movable between a closed position that clamps the periphery of the substrate and an open position that releases the substrate from clamping.

3. The substrate holding member as described in claim 1, characterized in that: It has a back-side retaining mechanism provided at the root end. The back-side retaining mechanism is movable between a closed position that holds the substrate from the back and an open position that is radially outward from the substrate.

4. The substrate holding member according to any one of claims 1 to 3, characterized in that: The first retaining guide and the second retaining guide each have: Support grooves that support the periphery of the substrate from both the front and back sides; and A support surface is provided at a position closer to the center of the substrate than the support groove, and supports the periphery of the substrate from the back side of the substrate.

5. A substrate processing system, characterized in that, include: A vertical holding member that holds the substrate in a vertical position; The substrate is held horizontally by a horizontal holding member. and The substrate, held by the vertical holding member, is conveyed to the conveying device of the horizontal holding member. The conveying device has a substrate holding member for holding the substrate. The substrate holding member includes: The main body has a first arm and a second arm that are spaced apart at their front ends and connected at their root ends; A first retaining guide, fixed to the front end of the first arm, is used to retain the periphery of the substrate; and A second retaining guide, fixed to the front end of the second arm, is used to retain the periphery of the substrate. The length between the first retaining guide and the second retaining guide is shorter than the diameter of the substrate. In the same plane as the first arm and the second arm, with the substrate located closer to the root end than the position held by the first retaining guide and the second retaining guide, the first arm, the second arm, the first retaining guide and the second retaining guide are located radially outward from the substrate.

6. The substrate processing system as described in claim 5, characterized in that: It has a clamping member provided at the root end. The clamping component is movable between a closed position that clamps the periphery of the substrate and an open position that releases the substrate from clamping.

7. The substrate processing system as described in claim 5, characterized in that: It has a back-side retaining mechanism provided at the root end. The back-side retaining mechanism is movable between a closed position that holds the substrate from the back and an open position that is radially outward from the substrate.

8. The substrate processing system according to any one of claims 5 to 7, characterized in that: The first retaining guide and the second retaining guide each have: Support grooves that support the periphery of the substrate from both the front and back sides; and A support surface is provided at a position closer to the center of the substrate than the support groove, and supports the periphery of the substrate from the back side of the substrate.

9. The substrate processing system as described in claim 8, characterized in that: It includes a push-back component that contacts the end of the substrate held horizontally by the substrate holding member, causing the substrate to move from a position supported by the support groove to a position supported by the support surface.

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