Carrying device for wafer expansion chip

Abstract

The utility model discloses a carrying device for a wafer expansion chip, which comprises a carrying frame, a steel belt piece at least partially embedded in one side, close to a wafer expansion chip main body, of the carrying frame, and an adjusting assembly at least partially movably embedded in one side, far away from the wafer expansion chip main body, of the carrying frame, a containing lantern ring used for containing a wafer expanding chip body is defined between the carrying frame and the steel belt piece, the adjusting assembly is in transmission connection with part of the steel belt piece embedded in the carrying frame, the steel belt piece is driven by the adjusting assembly to move in the direction of being embedded into or stretching out of the carrying frame, and therefore the containing lantern ring is controlled to be close to or away from the wafer expanding chip body to be folded and unfolded. According to the wafer expanding chip main body grabbing device, self-adaptive adjustment can be conducted according to the outer diameter of the wafer expanding chip main body, grabbing of the wafer expanding chip main body is completed, then an operator can carry the grabbed wafer expanding chip main body through the handheld carrying frame, the operator is effectively prevented from making direct contact with the wafer expanding chip main body, and the effect of protecting the wafer expanding chip main body is achieved.

Description

Technical Field

[0001] This utility model relates to the field of chip handling technology, and in particular to a handling device for expanded die chips. Background Art

[0002] With the widespread application of display technology and the diversification of application scenarios, the application of LED display devices, a key component of displays, has become increasingly important. Therefore, the reliability requirements for LED chips are becoming higher and higher. Especially now that displays are gradually developing towards ultra-high pixel 4K and 8K, the requirements for display effect are also becoming higher and higher. As a result, the size of LED chips is becoming smaller and smaller, and the size of the chips is also becoming smaller. At the same time, the demand for LED chips is also gradually increasing. In order to improve efficiency, the number of chips occupied by the blue film is also increasing, and the area occupied by the blue film is also increasing. In the LED chip packaging process, the chip is expanded through the mother ring and daughter ring. The chip body is very close to the edge of the mother ring. Then it is manually transported and placed in the die bonding mechanism of the die bonding machine. After the chip is expanded, the chip also faces random inspection by employees to check whether the blue film chip has quality defects.

[0003] During the sampling inspection process, the expanded die chips are usually handled by hand. Since the surface of the expanded die chip is not protected, manual handling can easily touch the chip surface, which may cause contamination of the chip surface, resulting in poor soldering or failure to solder the wires. Moreover, the chip is extremely fragile and can easily fall off, causing chip malfunctions. In addition, because the human body carries static electricity, the chip can be affected by static electricity, resulting in chip burns and other issues. Utility Model Content

[0004] Therefore, the purpose of this utility model is to provide a handling device for expanded die chips, which aims to solve the problem that the chips are easily damaged when they are picked up manually during the sampling inspection of expanded die chips.

[0005] This utility model provides a handling device for expanding a die chip, used for handling the die chip body. The device includes a handling frame, a steel strip at least partially embedded in the handling frame near the die chip body, and an adjustment component at least partially movably embedded in the handling frame away from the die chip body. The handling frame and the steel strip form a receiving collar for accommodating the die chip body. The adjustment component is drively connected to the portion of the steel strip embedded in the handling frame.

[0006] The steel strip is driven by the adjustment component to move in the direction of embedding or extending from the transport frame, so that the steel strip located outside the transport frame moves towards or away from the die expansion chip body inside the receiving collar, thereby grasping the die expansion chip body.

[0007] As described above, this application uses an adjusting component to move the steel strip towards the direction of embedding or extending from the transport frame, thereby controlling the retraction and release of the receiving collar towards or away from the die-expanding chip body. It can adaptively adjust according to the outer diameter of the die-expanding chip body to complete the gripping of the die-expanding chip body. Afterwards, the operator can use a handheld transport frame to move the gripped die-expanding chip body, effectively isolating the operator from direct contact with the die-expanding chip body and protecting the die-expanding chip body. This solves the problem that existing methods of picking up and inspecting die-expanded chips manually can easily damage the chips.

[0008] In addition, the die-stretching chip handling device proposed according to the embodiments of this utility model may also have the following additional technical features:

[0009] Furthermore, the die-expanding chip body includes a mother ring disposed on the periphery and in contact with the steel strip, and a daughter ring, a blue film, and a chip disposed sequentially inside the mother ring.

[0010] Furthermore, it also includes a limiting component embedded in the transport frame for limiting the steel strip, and a handheld component extending outward along the side of the transport frame away from the die-expanding chip body.

[0011] Furthermore, the handheld assembly includes a grip portion and an insulating sleeve fitted over the outer surface of the grip portion.

[0012] Furthermore, the limiting component includes a first positioning post and a second positioning post arranged near both sides of the adjusting component, as well as a pulley group and steel balls movably embedded in the side of the transport frame near the die expansion chip body.

[0013] Furthermore, a first space for the steel belt to move is formed between the first positioning post and the second positioning post and the inner wall of the transport frame, and a second space for the steel belt to move is formed between the pulley block and the steel ball.

[0014] Furthermore, the adjustment assembly includes at least two drive gears embedded in the transport frame, and an adjustment knob embedded inward along both sides of the outer periphery of the transport frame and axially connected to the drive gears.

[0015] Furthermore, the steel strip includes a steel strip and transmission teeth disposed on both sides of the steel strip and connected to the drive gear. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the structure of a die-expanding chip handling device and a die-expanding chip body proposed in an embodiment of this utility model;

[0017] Figure 2This is a partial structural schematic diagram of a die-expanding chip handling device proposed in an embodiment of this utility model;

[0018] Figure 3 This is a partial structural diagram of the steel strip and drive gear in a die-expanding chip handling device proposed in this embodiment of the present invention;

[0019] Figure 4 This is a partial structural diagram of the main body of the expanded die chip in a transport device for expanded die chips proposed in an embodiment of this utility model.

[0020] Explanation of key component symbols:

[0021]

[0022] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this utility model. Detailed Implementation

[0023] To facilitate understanding of this utility model, a more complete description will be given below with reference to the accompanying drawings. Several embodiments of this utility model are shown in the drawings. However, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided so that the disclosure of this utility model will be more thorough and complete.

[0024] It should be noted that when a component is said to be "fixed to" another component, it can be directly on the other component or there may be an intervening component. When a component is said to be "connected to" another component, it can be directly connected to the other component or there may be an intervening component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this document are for illustrative purposes only.

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0026] Please see Figures 1 to 4The image shows a die-expanding chip handling device according to Embodiment 1 of this utility model, used for handling die-expanding chip body 1. The die-expanding chip handling device includes a handling frame 2, a steel strip 6 at least partially embedded in the side of the handling frame 2 near the die-expanding chip body 1, and an adjustment component 3 at least partially movably embedded in the side of the handling frame 2 away from the die-expanding chip body 1. The handling frame 2 and the steel strip 6 are enclosed to form a receiving collar for accommodating the die-expanding chip body 1. The adjustment component 3 is connected to the portion of the steel strip 6 embedded in the handling frame 2. The steel strip 6 is driven to move in the direction of embedding or extending out of the handling frame 2 by the adjustment component 3, so that the steel strip 6 located outside the handling frame 2 moves in the direction of approaching or moving away from the die-expanding chip body 1 inside the receiving collar, thereby realizing the gripping of the die-expanding chip body 1.

[0027] Furthermore, the die-expanding chip body 1 includes a mother ring 14 disposed on the periphery and in contact with the steel strip 6, and a daughter ring 13, a blue film 12, and a chip 11 sequentially disposed inside the mother ring 14. The die-expanding chip handling device also includes a limiting component embedded in the handling frame 2 for limiting the steel strip 6, and a handheld component extending outward along the side of the handling frame 2 away from the die-expanding chip body 11. The handheld component includes a gripping part 4 and an insulating sleeve 5 sleeved on the outer surface of the gripping part 4. The limiting component includes a first positioning post 7 and a second positioning post 8 disposed near both sides of the adjusting component 3, and a movable insert. A pulley group 9 and a steel ball 10 are provided on the side of the transport frame 2 near the die expansion chip body 1. A first positioning post 7 and a second positioning post 8 form a first space between the transport frame 2 and the inner wall for the movement of the steel strip 6. A second space is formed between the pulley group 9 and the steel ball 10 for the movement of the steel strip 6. The adjustment assembly 3 includes at least two drive gears 32 embedded in the transport frame 2, and an adjustment knob 31 embedded inward along both sides of the outer periphery of the transport frame 2 and axially connected to the drive gears 32. The steel strip 6 includes a steel strip 61 and transmission teeth 62 provided on both sides of the steel strip 61 and connected to the drive gears 32 for transmission.

[0028] In practice, the operator selects the sampled expansion chip body 1 and rotates any adjustment knob 31 counterclockwise according to the outer diameter of the new expansion chip body 1. This rotation of knob 31 drives the drive gear 32 to the transmission gear 62 on the steel strip 61, pushing the steel strip 61 embedded in the transport frame 2 outwards. This ensures that the outer diameter enclosed by the steel strip 61 outside the transport frame 2 is larger than the current expansion chip body 1. In some optional embodiments, to improve the operator's accuracy during the rotation of the adjustment knob 31, a scale can be added to the outer surface of the adjustment knob 31. The operator can determine the rotation angle of the adjustment knob 31 according to the scale and accurately determine the extension length of the steel strip 61, thus obtaining the current inner diameter of the receiving collar from the side. This allows for quick and precise adjustment. Afterwards, the operator can hold the gripping part 4 and place the receiving collar over the current expansion chip body 1, then rotate any adjustment knob clockwise. Adjust knob 31 to retract the drive receiving collar inward toward the die-expanding chip body 1 until it contacts the surface of the die-expanding chip body 1, completing the gripping operation. In addition, during the adjustment of the steel strip 6, the pulley group 9 and steel column 10 can improve the smoothness of the steel strip 6 during the adjustment process and reduce the contact between the steel strip 6 and the inner wall of the transport frame 2. At the same time, the first positioning column 7 and the second positioning column 8 can effectively restrict the end of the steel strip 61 to prevent it from coming off or misaligning with the adjustment component 3 during relative transmission. Finally, during the handling process, the operator can hold the grip part 4 to complete the handling operation of the die-expanding chip body 1. The process effectively isolates the operator from direct contact with the die-expanding chip body 1. In addition, the insulating sleeve 5 set on the outer surface of the grip part 4 further isolates the human body static electricity from being conducted to the die-expanding chip body 1 through the transport frame 2, so as to prevent damage to the die-expanding chip body 1.

[0029] In summary, this application uses the adjusting component 3 to move the steel strip 6 towards the direction of embedding or extending from the transport frame 2, thereby controlling the opening and closing of the receiving collar towards or away from the expanded die chip body 1. It can adaptively adjust according to the outer diameter of the expanded die chip body 1 to complete the gripping of the expanded die chip body 1. Afterwards, the operator can use the handheld transport frame 2 to transport the gripped expanded die chip body 1, effectively isolating the operator from direct contact with the expanded die chip body 1 and protecting the expanded die chip body 1. This solves the problem that existing methods of picking up and inspecting expanded die chips manually can easily damage the chips.

[0030] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0031] The embodiments described above are merely illustrative of several implementations of this utility model, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of this utility model patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this utility model, and these all fall within the protection scope of this utility model. Therefore, the protection scope of this utility model patent should be determined by the appended claims.

Claims

1. A handling device for die expansion chips, used for handling die expansion chip bodies, characterized in that, The device includes a transport frame, a steel strip at least partially embedded in the transport frame on the side near the die-expanding chip body, and an adjustment assembly at least partially movably embedded in the transport frame on the side away from the die-expanding chip body. The transport frame and the steel strip form an accommodating collar for accommodating the die-expanding chip body. The adjustment assembly is drively connected to a portion of the steel strip embedded in the transport frame. The steel strip is driven by the adjustment component to move in the direction of embedding or extending from the transport frame, so that the steel strip located outside the transport frame moves towards or away from the die expansion chip body inside the receiving collar, thereby grasping the die expansion chip body.

2. The die-expanding chip handling device according to claim 1, characterized in that, The expanded die chip body includes a mother ring disposed on the periphery and in contact with the steel strip, and a daughter ring, a blue film and a chip disposed sequentially on the inner side of the mother ring.

3. The die-expanding chip handling device according to claim 1, characterized in that, The device also includes a limiting component embedded in the transport frame for limiting the steel strip, and a handheld component extending outward along the side of the transport frame away from the die-expanding chip body.

4. The die-expanding chip handling device according to claim 3, characterized in that, The handheld assembly includes a grip portion and an insulating sleeve fitted over the outer surface of the grip portion.

5. The die-expanding chip handling device according to claim 3, characterized in that, The limiting component includes a first positioning post and a second positioning post arranged near both sides of the adjustment component, as well as a pulley group and steel balls movably embedded in the side of the transport frame near the main body of the expanded die chip.

6. The die-expanding chip handling device according to claim 5, characterized in that, The first positioning post and the second positioning post form a first space between themselves and the inner wall of the transport frame for the steel belt to move, and the pulley block and the steel ball form a second space for the steel belt to move.

7. The die-expanding chip handling device according to claim 1, characterized in that, The adjustment assembly includes at least two drive gears embedded in the transport frame, and an adjustment knob embedded inward along both sides of the outer periphery of the transport frame and axially connected to the drive gears.

8. The die-expanding chip handling device according to claim 7, characterized in that, The steel strip includes a steel strip and transmission teeth disposed on both sides of the steel strip and connected to the drive gear.

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