Packaging shell and functional module

Abstract

The utility model provides a packaging shell and a functional module. The packaging shell comprises a tube socket, a plurality of inner cover plates, an outer cover plate and a leading-out end, the tube base is provided with a plurality of first containing grooves and second containing grooves which are formed through separation of separation walls. The inner cover plate and the outer cover plate are matched to form a plurality of first cavities and second cavities. The first cavity is used for arranging a photoelectric coupling unit; the second chamber is used for arranging a processing circuit. An optocoupler mounting area and a plurality of optocoupler metallization areas are arranged in the first cavity; a plurality of processing circuit metallization areas are arranged in the second cavity and / or at the top of the peripheral isolation wall of the second cavity; part of the optocoupler metallization areas and part of the processing circuit metallization areas are electrically connected with each other, and part of the optocoupler metallization areas and part of the processing circuit metallization areas are electrically connected with the leading-out end. A plurality of mutually isolated cavities are formed in a tube shell, a coupling device and a front / rear-stage processing circuit are respectively arranged, and the coupling device and the front / rear-stage processing circuit are integrally arranged in one tube shell, so that the overall size is reduced, and the occupied space is reduced.

Description

Technical Field

[0001] This application relates to the field of optocoupler technology, and more specifically, to a package housing and functional module for integrating an optocoupler and its pre- or post-processing circuits. Background Technology

[0002] An optocoupler (OC), also known as an optical coupler, is an optoelectronic device that uses light as a medium to transmit electrical signals by achieving "electro-optical-electro-electrical" conversion.

[0003] Optocouplers typically encapsulate both the light-emitting device and the photosensitive device within the same sealed housing. When an electrical signal is applied to the input, the light-emitting device emits light, and the photosensitive device, upon successfully receiving the light, generates a current due to the photoelectric effect, which flows out from the output. Due to their strong anti-interference capabilities, high reliability, long lifespan, small size, and electrical insulation, optocouplers have been widely used in electrical insulation, interstage coupling, drive circuits, switching circuits, multivibrators, signal isolation, pulse amplifier circuits, digital instruments, long-distance signal transmission, solid-state relays (SSRs), communication equipment, and microcomputer interfaces.

[0004] Currently, optocouplers are generally integrated with a PCB board and a front-end processing circuit (the circuit part that connects the light-emitting device) or a back-end processing circuit (the circuit part that connects the photosensitive device) to form the required functional module for application in the system. However, this method has low integration and large module size, which limits its application. Utility Model Content

[0005] To address or improve the aforementioned problems in the prior art, embodiments of this application provide a packaging shell, which specifically includes:

[0006] Pipe seat, multiple inner cover plates, outer cover plate, and lead-out end;

[0007] The pipe seat has multiple first receiving grooves and multiple second receiving grooves formed by separation walls;

[0008] Multiple inner cover plates are sealed to the top of multiple first receiving grooves in a corresponding manner to form multiple first chambers. The first chambers are used to house photoelectric coupling units; the photoelectric coupling units specifically expose light-emitting devices and photosensitive devices.

[0009] The outer cover plate is sealed to the top of the tube seat and forms multiple second chambers with multiple second receiving slots. The second chambers are used to house the processing circuit.

[0010] The first chamber contains an optocoupler mounting area and multiple optocoupler metallization areas;

[0011] Multiple metallized processing circuit areas are provided inside the second chamber and / or on the top of the isolation wall surrounding the second chamber;

[0012] Multiple optocoupler metallization regions and multiple processing circuit metallization regions are partially electrically connected to each other and partially electrically connected to the leads.

[0013] In the aforementioned scheme, multiple isolated chambers are formed inside the casing, and coupling devices and pre- / post-processing circuits are respectively installed in each chamber. The coupling devices and pre- / post-processing circuits are integrated into one casing, which reduces the overall volume and space occupied.

[0014] Optionally, along the first direction, a plurality of first receiving grooves are disposed on one side of the tube seat, and a plurality of second receiving grooves are disposed on the other side of the tube seat;

[0015] The plurality of first receiving slots and the plurality of second receiving slots are all arranged along the second direction;

[0016] Preferably, the first direction is perpendicular to the second direction.

[0017] In the aforementioned scheme, the coupling devices and pre- and post-processing circuits can be centrally located at both ends of the tube socket and arranged in a uniform direction, which facilitates wiring. Simultaneously, it avoids electromagnetic interference and signal crosstalk between different chambers, improving the overall circuit performance and reliability.

[0018] The enclosures, separated by partition walls and arranged in the aforementioned manner, can provide a clearer and more independent operating environment for each functional module, facilitating subsequent maintenance and debugging.

[0019] Optionally, the optocoupler mounting area is located at the bottom of the first receiving groove and is used to mount light-emitting devices or photosensitive devices;

[0020] Multiple optocoupler metallization regions include:

[0021] A first optocoupler metallization region, a second optocoupler metallization region, and a third optocoupler metallization region are spaced apart at the bottom of the first receiving tank;

[0022] The second optocoupler metallization region is located between the first optocoupler metallization region and the third optocoupler metallization region.

[0023] Furthermore, the first optocoupler metallization region, the second optocoupler metallization region, and the third optocoupler metallization region are arranged sequentially along the second direction and are disposed at the bottom of the first receiving groove on one side near the plurality of second receiving grooves.

[0024] Along the direction close to the multiple second receiving slots, the spacing between adjacent optocoupler metallization regions increases.

[0025] Furthermore, along the direction close to the plurality of second receiving slots, at least a portion of the width of the first optocoupler metallization region, the second optocoupler metallization region, and the third optocoupler metallization region decreases.

[0026] In the aforementioned scheme, the setting of the spacing between adjacent metallized areas and the setting of the gradually changing width of the metallized areas help to reduce the coupling capacitance and mutual inductance between different signal lines, thereby reducing crosstalk and electromagnetic interference between signals. On the other hand, it also helps to improve the heat dissipation performance of the circuit board, because a larger spacing between metallized areas can reduce the accumulation and conduction of heat. In addition, during the processing, the above design avoids the soldering process from hitting the wall.

[0027] Optionally, the plurality of optocoupler metallization regions may also include a fourth optocoupler metallization region and a fifth optocoupler metallization region spaced apart in the inner cover plate;

[0028] The first receiving groove has a first step and a second step on both sides. The top of the first step and the second step are covered with conductors of electrical connection lead-out terminals, optocoupler metallization areas or processing circuit metallization areas, and are in contact with and electrically connected to the fourth optocoupler metallization area and the fifth optocoupler metallization area, respectively.

[0029] Furthermore, the height of the first and second steps is 0.6 mm to 2.0 mm.

[0030] In the aforementioned scheme, the first step and the second step help to form an airtight seal with the inner cover plate. At the same time, the conductors on them allow the metallized area on the inner cover plate to be indirectly electrically connected to the lead-out end, thereby realizing the electrical connection between the electrode of the optocoupler unit installed on the inner cover plate and the lead-out end.

[0031] Optionally, the metallized regions of the multiple processing circuits include one or more of the following:

[0032] The first processing circuit metallization area is located at the bottom of the second receiving slot and is used to mount electronic components or assemblies.

[0033] The metallized area of ​​the second processing circuit is located on top of the partition wall between adjacent second receiving tanks;

[0034] The third processing circuit metallization area is located on top of the partition wall between the multiple first receiving slots and the multiple second receiving slots.

[0035] Furthermore, along the second direction, a third step and a fourth step are respectively provided on the two outer sides of the second receiving groove; the top of the third step and the fourth step are covered with conductors of electrical connection lead-out terminals, optocoupler metallization areas or processing circuit metallization areas.

[0036] Optionally, in a plurality of second receiving slots, a fifth step is provided on the outer side of the second receiving slot located in the middle;

[0037] The multiple processing circuit metallization regions also include:

[0038] The fourth processing circuit metallization area is located at the top of the fifth step.

[0039] In the aforementioned alternative solutions, different types of pre- and post-processing circuits can be set in each second receiving tank / second chamber through the flexible setting of the metallized area of ​​the processing circuit, and the appropriate metallized area can be selected for electrical connection according to the actual circuit requirements.

[0040] This application embodiment also provides a functional module, which includes the packaging shell described in the foregoing technical solutions and any of their optional solutions, and,

[0041] Multiple optocoupler units, each including a light-emitting device and a photosensitive device, are respectively disposed in the multiple first chambers;

[0042] Electronic components and / or assemblies used to form a pre-processing circuit or a post-processing circuit are disposed in the plurality of second chambers.

[0043] In summary, by using the packaging housing provided in the embodiments of this application, the optocoupler can be integrated with the front-end and / or back-end processing circuits to form a compact and efficient circuit functional module. Compared with the PCB board integration method, the overall size of the circuit functional module can be significantly reduced, the space occupied is reduced, and it is easier to install in compact electronic devices. Furthermore, the integrated design also improves production efficiency and reliability. Attached Figure Description

[0044] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be described below.

[0045] Figure 1 This is a schematic diagram of the three-dimensional structure of the tube seat in the embodiments of this application;

[0046] Figure 2 This is a schematic diagram of the inner cover plate in an embodiment of this application, showing the inner side of the inner cover plate;

[0047] Figure 3 This is a schematic diagram of the outer cover plate in an embodiment of this application;

[0048] Figure 4 The illustration shows the receiving grooves, stepped structures, and metallized areas on the tube seat in the embodiments of this application.

[0049] The image is labeled as follows:

[0050] 100: Pipe seat, 200: Inner cover plate, 300: Outer cover plate;

[0051] 101: The isolation wall;

[0052] 110: First receiving tank; 120: Second receiving tank;

[0053] 111: Optocoupler mounting area; 112: Optocoupler metallization area;

[0054] 1121: First optocoupler metallization region; 1122: Second optocoupler metallization region; 1123: Third optocoupler metallization region; 1124: Fourth optocoupler metallization region; 1125: Fifth optocoupler metallization region.

[0055] 121: Metallized region of the first processing circuit; 122: Metallized region of the second processing circuit; 123: Metallized region of the third processing circuit; 124: Metallized region of the fourth processing circuit.

[0056] 131: First step, 132: Second step, 133: Third step, 134: Fourth step, 135: Fifth step. Detailed Implementation

[0057] In this specification, it will also be understood that when a component is referred to as being "connected to" other components relative to them, such as in relation to other components, the component may be directly connected to or directly coupled to the other components, or there may be an intermediary third component; in addition, in the embodiments of this application, "connection" may specifically be an electrical connection or a structural connection.

[0058] This application will now be described more fully below with reference to the accompanying drawings. However, this application can be implemented in many different ways and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided herein to make this application more detailed and complete, and to fully convey the scope of this application to those skilled in the art. The same reference numerals denote the same objects throughout the drawings.

[0059] Considering the current state of optocoupler products in the prior art, the embodiments of this application aim to provide a packaging shell that can integrate the optocoupler and its front-end and / or back-end processing circuits, thereby reducing the size of the functional module and improving its application prospects.

[0060] Based on this, the present application also provides a functional module, including a package housing and at least one optocoupler unit installed inside the package housing and its corresponding front-end or back-end processing circuit.

[0061] In embodiments of this application, the provided encapsulation housing includes, for example: Figure 1 The tube seat 100 and more shown are as follows: Figure 2 The inner cover plate 200 shown is as follows: Figure 3 The outer cover plate 300 and the lead-out end are shown (not shown in the attached figure).

[0062] In the embodiments, the leads include multiple pins, metallized areas, or similar conductors disposed outside the socket. These leads are electrically connected to the metallized areas within the socket via wires embedded in the socket, thereby electrically connecting the electronic components and assemblies within the package to external circuits, thus achieving the desired circuit structure. The specific form of the leads and their corresponding electrical connection methods are not limited in this application embodiment, as long as they meet the installation requirements of the package and the circuit structure requirements of the functional modules.

[0063] The tube seat 100 can be sealed to the outer cover plate 300 by a sealing ring set on its top surface. The sealing ring can generally be set in the top edge area of ​​the tube seat 100, which can be a metallized area or a non-metallized area (such as ceramic). In this way, the outer cover plate 300 and the tube seat 100 can be airtightly connected by welding or bonding. Of course, if the requirements are not high, the tube seat 100 and the outer cover plate 300 can also be non-airtightly connected, as long as the two are fixedly connected in the finished product.

[0064] This embodiment does not impose any particular limitation on the main materials of the encapsulation shell, such as the tube base 100 and the cover plate. Considering that ceramic materials have excellent high-temperature resistance, mechanical properties, and insulation properties, as well as a suitable coefficient of thermal expansion, the tube base 100 and the cover plate can be made of ceramic materials, preferably alumina ceramic materials or aluminum nitride ceramic materials.

[0065] like Figure 1 As shown, the tube seat 100 is provided with a partition wall 101. There are multiple partition walls 101, which are crisscrossed to divide the internal space of the tube seat 100 into multiple first receiving slots 110 and multiple second receiving slots 120.

[0066] The aforementioned multiple inner cover plates 200 are sealed one-to-one with the top of multiple first receiving grooves 110 to form multiple first chambers. The first chambers are used to set up optocoupler units. The optocoupler units specifically include light-emitting devices and photosensitive devices that are optically coupled. The light-emitting devices can be, for example, light-emitting diodes; the photosensitive devices can be, for example, photodiodes, photoresistors, photothyristors, etc.

[0067] In some implementations, the optocoupler unit may include a light-emitting device and a photosensitive device arranged in a one-to-one correspondence; it may also include a light-emitting device and a plurality of corresponding photosensitive devices. The specific form of the optocoupler unit can be determined according to the functional requirements of the functional module.

[0068] The aforementioned outer cover plate 300 is sealed to the top of the tube seat 100, and at the same time forms multiple second chambers with multiple second receiving grooves 120. The second chambers are used to set up processing circuits, which can be pre-stage or post-stage processing circuits, or both pre-stage and post-stage processing circuits.

[0069] The outer cover plate 300 may have a gap with the top of the isolation wall surrounding the second receiving groove 120, which means that the second chamber may be an open structure, or the outer cover plate 300 may be attached to or sealed with the top of the isolation wall surrounding the second receiving groove 120, making the second chamber a closed structure.

[0070] In this embodiment, the inner cover plate 200 is disposed inside the outer cover plate 300, and can be connected to the outer cover plate 300 or assembled separately from the outer cover plate 300 onto the tube seat 100.

[0071] like Figure 4 As shown, the pipe socket 100 is provided with multiple partition walls. Among them, the partition wall extending along the second direction divides the pipe socket 100 into two areas. For ease of explanation, the following will refer to... Figure 4 The area on the left is called the first region, and the area on the right is called the second region.

[0072] The first area on the left is further divided into a plurality of first receiving slots 110 by an isolation wall for setting one of the light-emitting device and the photosensitive device, and the inner cover plate 200 is used to set the other of the light-emitting device and the photosensitive device on the inner surface facing the first receiving slot 110.

[0073] The specific number of the first receiving slots 110 within the first region can be determined based on the actual product situation, such as the number of channels in the pre- or post-processing circuits. Figure 1 and Figure 4 In the middle, the first area is divided into four first receiving slots 110 by three isolation walls extending along the first direction, and the four first receiving slots 110 are arranged along the second direction.

[0074] The second area on the right is divided into multiple second receiving slots 120 by an isolation wall for setting up components and / or assemblies in the pre-stage or post-stage processing circuits.

[0075] The specific number and size of the second receiving slots 120 can be determined according to the actual situation of the pre-stage or post-stage processing circuit, for example... Figure 4 The second area is divided into three second receiving slots 120 by two isolation walls extending along the first direction. The three second receiving slots 120 are arranged along the second direction, with the middle second receiving slot 120 having a relatively large space.

[0076] like Figure 4 As shown, typically, the first direction is perpendicular to the second direction.

[0077] like Figure 1 and Figure 4 As shown, an optocoupler mounting area 111 and multiple optocoupler metallization areas 112 are provided in the first chamber. Multiple processing circuit metallization areas are provided in the second chamber and / or on the top of the isolation wall 101 surrounding the second chamber.

[0078] In the embodiment, portions of the plurality of optocoupler metallization regions 112 and portions of the plurality of processing circuit metallization regions are electrically connected to each other and to the leads, in order to form the specific circuit structure required for the functional module.

[0079] In a preferred embodiment, such as Figure 4 As shown, the optocoupler mounting area 111 is located at the bottom of the first receiving groove 110. The optocoupler mounting area 111 is used to mount light-emitting devices or photosensitive devices. Its size can be larger than the size of the mounted light-emitting devices or photosensitive devices to facilitate adjustment of the position of the mounted light-emitting devices or photosensitive devices on the optocoupler mounting area 111, thereby fine-tuning the coupling effect.

[0080] The light-emitting device or photosensitive device can be electrically connected to the optocoupler metallization region 112 via metal bonding wires; and the optocoupler metallization region 112 is connected to the pre-stage or post-stage processing circuit located in the second chamber / second receiving slot 120 or connected to the lead-out terminal via metal leads located in the isolation wall 101 and metal bonding wires.

[0081] The number of optocoupler metallization regions 112 can be set according to the optocoupler unit and circuit connection. Typically, for example... Figure 4 As shown, each first receiving groove 110 has three optical coupler metallization regions 112 spaced apart at its bottom, including: a first optical coupler metallization region 1121, a second optical coupler metallization region 1122 and a third optical coupler metallization region 1123; wherein the second optical coupler metallization region 1122 is disposed between the first optical coupler metallization region 1121 and the third optical coupler metallization region 1123.

[0082] In a typical embodiment, such as Figure 4 As shown, the first optocoupler metallization region 1121, the second optocoupler metallization region 1122 and the third optocoupler metallization region 1123 are arranged sequentially along the second direction and are disposed on the bottom of the first receiving groove 110 near the side of the plurality of second receiving grooves 120, that is, on the right side of the bottom of the first receiving groove 110 in the figure.

[0083] Along the direction approaching the second receiving groove 120, the spacing between the first optocoupler metallization region 1121, the second optocoupler metallization region 1122, and the third optocoupler metallization region 1123 increases progressively. This design helps reduce coupling capacitance and mutual inductance between different signal lines, thereby reducing crosstalk and electromagnetic interference. It also improves heat dissipation performance, as the larger spacing between the metallization regions reduces heat accumulation and conduction. Furthermore, this design prevents solder joint contact during manufacturing.

[0084] In practice, the preferred option is, for example... Figure 4 As shown, along the direction close to the plurality of second receiving slots 120, at least a portion of the width of the first optocoupler metallization region 1121, the second optocoupler metallization region 1122, and the third optocoupler metallization region 1123 decreases, for example... Figure 4 In the structure shown, the first optical coupler metallization region 1121 and the third optical coupler metallization region 1123 are approximately trapezoidal, and they are symmetrically arranged with respect to the second optical coupler metallization region 1122.

[0085] In a typical embodiment, such as Figure 2 and combined Figure 4 As shown, the plurality of optocoupler metallization regions 112 also include a fourth optocoupler metallization region 1124 and a fifth optocoupler metallization region 1125 disposed on the inner cover plate 200. Both are disposed on the side of the inner cover plate 200 facing the tube seat 100, in other words, disposed within the first cavity. For ease of explanation, the side with the metallization region will be referred to as the inner side of the inner cover plate 200 below.

[0086] like Figure 1 , Figure 2 and Figure 4 As shown, a first step 131 and a second step 132 are respectively provided on both sides of the first receiving groove 110, wherein the first step 131 is relatively farther away from the second receiving groove 120, and the second step 132 is relatively closer to the second receiving groove 120. The top of the first step 131 and the second step 132 are covered with conductors that are electrically connected to the lead-out end or other metallized areas. When the inner cover plate 200 is installed, the above-mentioned conductors contact and are electrically connected to the fourth optocoupler metallized area 1124 and the fifth optocoupler metallized area 1125, respectively. For example, the conductor located on the first step 131 is electrically connected to the fourth optocoupler metallized area 1124, and the conductor located on the second step 132 is electrically connected to the fifth optocoupler metallized area 1125. The specific connection relationship depends on the circuit function of the functional module and the type of light-emitting device or photosensitive device located on the inner cover plate 200.

[0087] In addition to being used for electrical connection with the conductors on the first / second step, the metallized area on the aforementioned inner cover plate 200 is also used for mounting light-emitting devices or photosensitive devices and other required circuit units.

[0088] In this embodiment, the specific number of metallized areas on the inner cover plate 200 can be determined according to circuit connection requirements. For example... Figure 2 In the inner cover plate 200, two T-shaped metallized areas are provided on the surface facing the first chamber. These two metallized areas are isolated from each other. One metallized area can be used to bond light-emitting devices or photosensitive devices and other required circuit units, while the other metallized area is used to bond with the electrodes of the light-emitting devices or photosensitive devices to form an electrical connection.

[0089] When one electrode of the light-emitting device or photosensitive device is located on the back of the chip and the other electrodes are located on the front of the chip, the back of the chip can be directly attached to the fourth optocoupler metallization region 1124 or the fifth optocoupler metallization region 1125 using a conductive medium (such as conductive adhesive), thus achieving electrical connection between the back electrode and the aforementioned metallization region while fixing the chip. The electrodes located on the front of the chip can be electrically connected to the fifth optocoupler metallization region 1125 or the fourth optocoupler metallization region 1124 via metal bonding wires.

[0090] Typically, the height of the aforementioned first / second step is lower than the depth of the first chamber, specifically, lower than the depth of the first receiving groove 110, such that the inner cover plate 200 is partially or completely embedded in the first receiving groove 110 and its two ends are respectively connected to the first / second step. At the same time, the conductor at the top of the step contacts the metallized area inside the inner cover plate 200 to form an electrical connection, thereby allowing the components installed and electrically connected to the metallized area inside the inner cover plate 200 to be connected to the circuit.

[0091] Typically, the inner cover plate 200 is attached to the first / second step via a conductive medium.

[0092] In a preferred embodiment, the dimensions at both ends of the inner cover plate 200 are slightly smaller than the corresponding dimensions of the first / second step. This ensures that the horizontal position of the inner cover plate 200 is adjustable, meaning that the distance between the light-emitting device and the photosensitive device can be finely adjusted during processing. This allows for the adjustment of the performance parameters of the functional module. For example, the voltage detection module can adjust the opening voltage and other performance parameters by adjusting the distance between the light-emitting device and the photosensitive device.

[0093] In a preferred embodiment, in order to both create spatial isolation between the first and second steps to meet the design requirements for functional module isolation characteristics, and to allow for simultaneous placement of the upper and lower steps with a suitable bonding height, the heights of the first step 131 and the second step 132 are preferably controlled within the range of 0.6mm to 2.0mm.

[0094] In this embodiment, the light-emitting device, the photosensitive device, and other electronic components can be unpackaged dies (also known as chips) or packaged chips. This embodiment does not impose any particular limitation.

[0095] In a preferred embodiment, such as Figure 4 As shown, depending on the actual situation of the pre-stage or post-stage processing circuit, the metallization areas of multiple processing circuits specifically include one or more of the following:

[0096] The first processing circuit metallization area 121 is located at the bottom of the second receiving groove 120 and is used to mount electronic components or assemblies, such as surface mount components.

[0097] The second processing circuit metallization region 122 is disposed on the top of the isolation wall 101 between adjacent second receiving slots 120;

[0098] The third processing circuit metallization region 123 is disposed on top of the isolation wall 101 between the plurality of first receiving slots 110 and the plurality of second receiving slots 120.

[0099] For example, Figure 4 The two second receiving slots 120 at the top and bottom are used to install surface-mount resistors (or surface-mount capacitors), and the bottom of the two second receiving slots 120 are respectively provided with the first processing circuit metallization area 121.

[0100] For example, Figure 4 The top surface of the partition wall between the upper and middle second receiving slots is provided with three second processing circuit metallization areas 122, the top surface of the partition wall between the middle and lower second receiving slots 120 is provided with two second processing circuit metallization areas 122, and the top surface of the partition wall between the first receiving slot 110 and the second receiving slot 120 is provided with five third processing circuit metallization areas 123, which are used to realize the electrical connection between the components (such as inverters or filter capacitors) or assemblies installed in the middle second receiving slot 120 and the electronic components or assemblies located in the first receiving slot 110 and other second receiving slots 120.

[0101] In a preferred embodiment, a third step 133 and a fourth step 134 are respectively provided on the outer side of the second receiving groove 120 located on both sides along the second direction; the top of the third step 133 and the fourth step 134 are covered with conductors of electrical connection leads or other metallized areas.

[0102] The height of the aforementioned third / fourth step can be determined based on the thickness of the components and assemblies installed in the second chamber. The components and assemblies can be electrically connected to the conductors at the top of the third step 133 and the fourth step 134 via metal bonding wires.

[0103] In a typical embodiment, such as Figure 4 As shown, among the plurality of second receiving slots 120, a fifth step 135 is provided on the outer side of the middle second receiving slot 120 (i.e., the side facing away from the first receiving slot 110); the plurality of processing circuit metallization regions also include a fourth processing circuit metallization region 124, which is disposed at the top of the fifth step 135. Components disposed in the second receiving slot 120 can be electrically connected to the fourth processing circuit metallization region 124 via metal bonding wires, and thus electrically connected to the lead-out terminals.

[0104] In the foregoing embodiments, the second processing circuit metallization region 122 and the third processing circuit metallization region 123 may optionally be electrically connected to one of the first optocoupler metallization regions 1121, the second optocoupler metallization region 1122 and the third optocoupler metallization region 1123, as well as the conductors at the top of the first step 131 and the second step 132, via metal leads (such as gold wires) disposed in the chamber.

[0105] This application also includes an embodiment of a functional module, comprising the encapsulation housing described in any of the foregoing embodiments, and: a plurality of optocoupler units respectively disposed in a plurality of first chambers, the optocoupler units including light-emitting devices and photosensitive devices; and electronic components and / or assemblies for constituting a front-end processing circuit or a back-end processing circuit disposed in a plurality of second chambers.

[0106] Furthermore, the pre-processing circuit or post-processing circuit in the functional module can be an amplifier, a circuit processing unit, etc.

[0107] In summary, the packaging housing and the functional modules based on the packaging housing provided in this application can integrate the optocoupler unit and the front / back stage circuit processing unit into a single housing, which greatly reduces the overall size of the functional modules, reduces the space occupied, simplifies the circuit layout, and reduces manufacturing costs and application complexity.

[0108] The above description is only a partial embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the embodiments of this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A packaging shell, characterized in that, Includes a tube seat (100), multiple inner cover plates (200), an outer cover plate (300), and an outlet end; The tube seat (100) has a plurality of first receiving grooves (110) and a plurality of second receiving grooves (120) formed by a partition wall (101); The plurality of inner cover plates (200) are sealed one-to-one with the top of the plurality of first receiving grooves (110) to form a plurality of first chambers. The first chambers are used to house photoelectric coupling units, and the photoelectric coupling units include light-emitting devices and photosensitive devices. The outer cover plate (300) is sealed to the top of the tube seat (100) and forms a plurality of second chambers with the plurality of second receiving grooves (120), the second chambers being used to house the processing circuit; The first cavity is provided with an optocoupler mounting area (111) and multiple optocoupler metallization areas (112); Multiple metallized processing circuit areas are provided inside the second chamber and / or on top of the isolation wall (101) surrounding the second chamber; The plurality of optocoupler metallization regions (112) and a portion of the plurality of processing circuit metallization regions are electrically connected to each other and a portion is electrically connected to the lead-out terminal.

2. The packaging shell according to claim 1, characterized in that, Along the first direction, the plurality of first receiving grooves (110) are disposed on one side of the tube seat (100), and the plurality of second receiving grooves (120) are disposed on the other side of the tube seat (100); The plurality of first receiving slots (110) and the plurality of second receiving slots (120) are all arranged along the second direction.

3. The packaging shell according to claim 1, characterized in that, The optocoupler mounting area (111) is located at the bottom of the first receiving groove (110) and is used to mount light-emitting devices or photosensitive devices; The plurality of optocoupler metallization regions (112) include: a first optocoupler metallization region (1121), a second optocoupler metallization region (1122) and a third optocoupler metallization region (1123) spaced apart at the bottom of the first receiving groove (110); the second optocoupler metallization region (1122) is disposed between the first optocoupler metallization region (1121) and the third optocoupler metallization region (1123).

4. The packaging shell according to claim 3, characterized in that, The first optocoupler metallization region (1121), the second optocoupler metallization region (1122), and the third optocoupler metallization region (1123) are arranged sequentially along the second direction and are disposed at the bottom of the first receiving groove (110) on one side close to the plurality of second receiving grooves (120). Along the direction close to the plurality of second receiving slots (120), the spacing between adjacent optocoupler metallization regions (112) increases.

5. The packaging shell according to claim 4, characterized in that, Along the direction close to the plurality of second receiving slots (120), at least a portion of the width of the first optocoupler metallization region (1121), the second optocoupler metallization region (1122), and the third optocoupler metallization region (1123) decreases.

6. The packaging housing according to any one of claims 1 to 5, characterized in that, The plurality of optocoupler metallization regions (112) further include a fourth optocoupler metallization region (1124) and a fifth optocoupler metallization region (1125) spaced apart from the inner cover plate (200); The first receiving groove (110) is provided with a first step (131) and a second step (132) on both sides. The top of the first step (131) and the second step (132) are covered with conductors that are electrically connected to the lead-out terminal or the metallized area of ​​the processing circuit. The conductors are in contact with and electrically connected to the fourth optocoupler metallized area (1124) and the fifth optocoupler metallized area (1125) respectively.

7. The packaging shell according to claim 2, characterized in that, The plurality of metallized regions of the processing circuits include one or more of the following: The first processing circuit metallization area (121) is disposed at the bottom of the second receiving groove (120) for mounting electronic components or assemblies; The second processing circuit metallization area (122) is disposed on the top of the isolation wall (101) between adjacent second receiving slots (120); The third processing circuit metallization region (123) is disposed on top of the isolation wall (101) between the plurality of first receiving slots (110) and the plurality of second receiving slots (120).

8. The packaging shell according to claim 7, characterized in that, Along the second direction, a third step (133) and a fourth step (134) are respectively provided on the two outer sides of the second receiving groove (120); the top of the third step (133) and the fourth step (134) are covered with conductors of electrical connection lead-out terminals, optocoupler metallization regions (112) or processing circuit metallization regions.

9. The packaging shell according to claim 1 or 2, characterized in that, In the plurality of second receiving slots, a fifth step (135) is provided on the outer side of the second receiving slot (120) located in the middle; The plurality of processing circuit metallization regions further include: a fourth processing circuit metallization region (124), which is disposed at the top of the fifth step (135).

10. A functional module, characterized in that, Including the encapsulation housing as described in any one of claims 1 to 9, and, Multiple optocoupler units, each optocoupler unit including a light-emitting device and a photosensitive device, are respectively disposed in the multiple first chambers; Electronic components and / or assemblies used to form a pre-processing circuit or a post-processing circuit are disposed in the plurality of second chambers.

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