Micro-channel semiconductor laser packaging clamp suitable for full-indium solder packaging

Abstract

The utility model discloses a micro-channel semiconductor laser packaging clamp suitable for all-indium solder packaging, which comprises a base, one side of the base is connected with a cantilever through a connecting plate, an elastic pressing block for pressing a chip is arranged between the cantilever and the base, the base is provided with a through hole, and a T-shaped pressure column is inserted into the through hole. The copper foil, the insulation pad and the micro-channel cooling fin are sequentially pressed on the base from top to bottom through the pressure column. Fixing the positions of the copper foil, the insulating pad and the micro-channel radiating fin by using a pressure column and providing pressure, so that the copper foil, the insulating pad and the micro-channel radiating fin do not move during sintering; the elastic pressing block is used for providing pressure during chip sintering, meanwhile, the copper foil, the chip and the micro-channel piece are welded together, the copper foil is connected with the negative electrode of the chip, the micro-channel cooling fin is connected with the positive electrode of the chip, one-time sintering success is guaranteed, and the influence of multiple times of sintering on the reliability of the chip is reduced.

Description

Technical Field

[0001] This utility model belongs to the field of semiconductor laser packaging fixture technology, specifically relating to a microchannel semiconductor laser packaging fixture suitable for all-indium solder packaging.

[0002] This utility model belongs to the category of Novel Components Semiconductor Laser Devices under the key direction of the core electronic industry in the new generation information technology industry, specifically under the category of No. 1 Strategic Emerging Industries Catalogue. Background Art

[0003] In some applications, semiconductor lasers require all-indium solder packaging. However, due to the special properties of indium solder, firstly, indium solder is relatively soft and sticky, making it difficult to process into thin solder sheets; secondly, indium has excellent fluidity after melting, so the all-indium solder packaging fixture must not be tilted.

[0004] like Figure 1 As shown, the semiconductor laser array module includes a microchannel heat sink 1, an insulating pad 2, a chip 3, and a conductive copper foil 4. For indium solder packaging, both the positive and negative sides of the chip 3 need to be soldered with indium. The chip 3 is very small and light, so it is easy to move during the packaging process. However, semiconductor laser packaging requires that the light-emitting surface of the chip must be aligned with the edge of the microchannel heat sink 1 without any misalignment. During packaging, the insulating pad 2 also needs to be precisely aligned, and both the positive and negative sides must be soldered with indium solder. The copper foil 4 is only 0.05mm thick, which is prone to deformation or misalignment during the packaging process, thus increasing the packaging difficulty. Summary of the Invention

[0005] To address the aforementioned problems in the existing technology, this utility model provides a microchannel semiconductor laser packaging fixture suitable for all-indium solder packaging.

[0006] The purpose of this utility model is achieved in the following way: a microchannel semiconductor laser packaging fixture suitable for all-indium solder packaging, including a base, a cantilever connected to one side of the base through a connecting plate, a spring pressure block for pressing the chip between the cantilever and the base, a through hole on the base, a T-shaped pressure column inserted into the through hole, and the pressure column pressing the copper foil, insulating pad and microchannel heat sink onto the base from top to bottom.

[0007] The elastic pressure block includes an upper connecting block and a lower connecting block. A telescopic guide post is provided between the upper connecting block and the lower connecting block. A compression spring is sleeved on the telescopic guide post. The elastic force of the compression spring causes the telescopic guide post to extend and press against the upper connecting block and the lower connecting block respectively.

[0008] There are two through holes.

[0009] A baffle is installed on the other side of the base, and the distance between the baffle and the connecting plate is the same as the length of the microchannel heat sink.

[0010] Compared to existing technologies, this invention uses pressure columns to fix the positions of the copper foil, insulating pad, and microchannel heat sink and provide pressure to prevent them from moving during sintering; it uses elastic pressure blocks to provide pressure during chip sintering, while simultaneously welding the copper foil, chip, and microchannel sheet together. The copper foil is connected to the negative electrode of the chip, and the microchannel heat sink is connected to the positive electrode of the chip, ensuring successful sintering in one go and reducing the impact of multiple sintering processes on chip reliability. Attached Figure Description

[0011] Figure 1 This is a schematic diagram of the structure of a semiconductor laser array module.

[0012] Figure 2 This is a schematic diagram of the structure of this utility model.

[0013] Figure 3 This is a structural diagram of the base.

[0014] Figure 4 This is a schematic diagram of the pressure column structure.

[0015] Figure 5 This is a schematic diagram of the elastic pressure block. DETAILED DESCRIPTION

[0016] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. It should be understood that these embodiments are only for illustrating the present invention and are not intended to limit the scope of the present invention. After reading the contents of the present invention, those skilled in the art can make various modifications or alterations to the present invention, and these equivalent forms also fall within the scope defined by the present invention.

[0017] like Figure 2-5 As shown, a microchannel semiconductor laser packaging fixture suitable for all-indium solder packaging includes a base 5. One side of the base 5 is connected to a cantilever 52 via a connecting plate 51. A spring-loaded pressure block 6 for pressing the chip is provided between the cantilever 52 and the base 5. A through hole 53 is provided on the base 5. A T-shaped pressure column 7 is inserted into the through hole 53. The pressure column 7 presses the copper foil 4, the insulating pad 2, and the microchannel heat sink 1 onto the base 5 from top to bottom.

[0018] Furthermore, the elastic pressure block 6 includes an upper connecting block 61 and a lower connecting block 62. A telescopic guide post 63 is provided between the upper connecting block 61 and the lower connecting block 62. A compression spring 64 is sleeved on the telescopic guide post 63. The elastic force of the compression spring 64 causes the telescopic guide post 63 to extend and press against the upper connecting block 61 and the lower connecting block 62 respectively.

[0019] There are two through holes 53. Two mounting holes are provided on the copper foil 4, the insulating pad 2, and the microchannel heat sink 1. The distance between the mounting holes and the two through holes 53 on the base 5 is the same, and the hole diameter is matched. After the pressure column 7 is inserted, it can effectively prevent the relative movement of the copper foil 4, the insulating pad 2, and the microchannel heat sink 1.

[0020] The elastic pressure block 6 provides a pressure of 10-100 g / cm² to the chip 3. 2 The pressure applied by the pressure column 7 to the insulating pad 2 and the microchannel heat sink 1 is 10-200 g / cm. 2 .

[0021] When forming a high-power semiconductor laser, it is necessary to... Figure 1 Multiple modules are stacked to form a stacked array. To prevent the chip from being squeezed, the thickness of the insulating pad 2 is greater than the thickness of the chip 3, so the cross-sectional shape of the copper foil 4 is bent from one end of the insulating pad 2 towards the chip end.

[0022] Furthermore, a baffle 54 is provided on the other side of the base 5. The distance between the baffle 54 and the connecting plate 51 is the same as the length of the microchannel heat sink. When placing the microchannel heat sink 1, the insulating pad 2, the copper foil 4 and the chip 3, the ends are placed against the baffle 54 or the connecting plate 51 on the side of the base, and the edge of the chip 3 and the edge of the microchannel heat sink 1 are automatically aligned.

[0023] Packaging process:

[0024] (1) Place the microchannel heat sink 1 on the base 5, and then place the insulating pad 2, ceramic plate 8 and chip 3 on the microchannel heat sink 1. The ceramic plate 8 is located between the insulating pad 2 and the chip 3. The ceramic plate 8 is movable and is used to align the edge of the chip 3 with the edge of the microchannel heat sink 1. The position of the chip 3 is adjusted by the ceramic plate 8 to prevent the laser from burning out due to chip movement during placement, thereby improving the yield of chip sintering.

[0025] (2) Place copper foil 4 on top of insulating pad 2, ceramic sheet 8 and chip 3. If the chip moves during the placement of copper foil 4, ceramic sheet 8 can be used to adjust the position of chip 3.

[0026] (3) After the copper foil 4 is placed, the pressure column 7 is passed through the holes on the copper foil 4, the insulating pad 2 and the microchannel heat sink 1. The pressure column 7 with a certain weight holds the copper foil 4, the copper foil insulating pad 2 and the microchannel heat sink 1 together. Since the pressure column 7 is T-shaped, the structure above it can prevent the pressure column 7 from falling out of the hole.

[0027] (4) Place the elastic pressure block 6 above the chip 3. When placing it, squeeze the upper connecting block 61 and the lower connecting block 62 by hand to retract the telescopic guide post 63. The upper connecting block 61 and the lower connecting block 62 move closer to each other. Place the elastic pressure block 6 between the chip 3 and the cantilever 52. First, release the upper connecting block 61 so that it presses against the cantilever 52. Then, release the lower connecting block 62. The telescopic guide post 63 extends under the elastic force of the compression spring 64 and continues to press the lower connecting block 62 downward, thereby pressing the chip 3 and the copper foil 4 on the chip tightly.

[0028] The copper foil 4, insulating pad 2, and microchannel heat sink 1 are fixed in position and pressure is provided by pressure column 7 to prevent them from moving during sintering. A spring-loaded pressure block 6 provides pressure for chip 3 during sintering and simultaneously welds the copper foil 4, chip 3, and microchannel heat sink 1 together. The copper foil 4 is connected to the negative electrode of chip 3, and the microchannel heat sink 1 is connected to the positive electrode of chip 3, ensuring successful sintering in one pass and reducing the impact of multiple sintering processes on chip reliability. A ceramic sheet 8 is used to adjust the position of chip 3 at any time. After sintering, the ceramic sheet 8 is removed to prevent laser burnout due to chip movement during placement, thus improving the yield rate of chip sintering.

[0029] The above description is only a preferred embodiment of the present utility model. It should be noted that those skilled in the art can make several changes and improvements without departing from the overall concept of the present utility model, and these should also be considered within the protection scope of the present utility model.

Claims

1. A microchannel semiconductor laser packaging fixture suitable for all-indium solder packaging, characterized in that: Includes a base (5), one side of which is connected to a cantilever (52) via a connecting plate (51). A spring-loaded pressure block (6) for pressing the chip is provided between the cantilever (52) and the base (5). A through hole (53) is provided on the base (5). A T-shaped pressure column (7) is inserted into the through hole (53). The pressure column (7) presses the copper foil (4), insulating pad (2), and microchannel heat sink (1) onto the base (5) from top to bottom.

2. The microchannel semiconductor laser packaging fixture suitable for all-indium solder packaging according to claim 1, characterized in that: The elastic pressure block (6) includes an upper connecting block (61) and a lower connecting block (62). A telescopic guide post (63) is provided between the upper connecting block (61) and the lower connecting block (62). A compression spring (64) is sleeved on the telescopic guide post (63). The elastic force of the compression spring (64) causes the telescopic guide post (63) to extend and press against the upper connecting block (61) and the lower connecting block (62) respectively.

3. The microchannel semiconductor laser packaging fixture suitable for all-indium solder packaging according to claim 1, characterized in that: There are two through holes (53).

4. The microchannel semiconductor laser packaging fixture suitable for all-indium solder packaging according to claim 1, characterized in that: A baffle (54) is provided on the other side of the base (5), and the distance between the baffle (54) and the connecting plate (51) is the same as the length of the microchannel heat sink (1).

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