Micro-magnetic induction dust adsorption device

Abstract

The utility model relates to the technical field of micro-magnetic induction dust adsorption, in particular to a micro-magnetic induction dust adsorption device, which is characterized in that a module IR (infrared) component emits specially modulated invisible infrared light to a shot object and simultaneously receives the invisible infrared light reflected back by the shot object; the module IR is used for receiving infrared light signals and obtaining space information of a shot object through calculation, the module IR converts the received infrared light signals into electric signals and transmits the electric signals to the chip assembly for processing, meanwhile, the dust collection assembly is powered on, the dust collection assembly conducts suction adsorption on dust, and therefore poor imaging of the module IR assembly is improved, and POG is reduced. Comprising a module IR assembly and a chip assembly, the module IR assembly is installed on the chip assembly, and the dust collection assembly is arranged between the module IR assembly and the chip assembly.

Description

Technical Field

[0001] This utility model relates to the technical field of micro-magnetic induction adsorption of dust, and in particular to a micro-magnetic induction dust adsorption device. Background Technology

[0002] The camera may include an IR module (infrared module), which plays an important role in the camera, especially in situations where infrared imaging or infrared-assisted functions are required. The IR module is assembled in a cleanroom and then cleaned and dried. A ring of dustproof adhesive is applied to the bottom of the lens mount for dust prevention.

[0003] If the dustproof adhesive is applied unevenly, resulting in poor sealing, dust from the air will enter. Due to the limitations of some lens back focal lengths, the lower surface of the glass plate may be too close to the upper surface of the chip during the module design process. As a result, dust can easily lead to poor image quality and excessively high POG during the imaging process. Utility Model Content

[0004] To solve the above-mentioned technical problems, this utility model provides a micro-magnetic induction dust adsorption device that increases the yield and reduces POG during the product manufacturing process.

[0005] This invention discloses a micro-magnetic induction dust adsorption device, comprising an IR module and a chip assembly. The IR module is mounted on the chip assembly. It also includes a dust collection component positioned between the IR module and the chip assembly. The IR module emits specially modulated invisible infrared light to the object being photographed, and simultaneously receives invisible infrared light reflected back from the object. It calculates and obtains the spatial information of the object. The IR module converts the received infrared light signal into an electrical signal and transmits it to the chip assembly for processing. Simultaneously, it powers the dust collection component, which then uses suction to adsorb dust, thereby improving the imaging performance of the IR module and reducing point-of-gauge (POG) errors.

[0006] Preferably, the IR module includes an IR module body and a glass plate, wherein the glass plate is disposed at the bottom of the IR module body; the IR module body emits specially modulated invisible infrared light to the object being photographed, and simultaneously receives invisible infrared light reflected back from the object being photographed; the glass plate effectively filters out infrared light, reducing color deviation and distortion of the image.

[0007] Preferably, the chip assembly includes a printed circuit board and a chip body. The chip body is disposed on the top of the printed circuit board, and the module IR body is mounted on the top of the printed circuit board. The module IR body is connected to the chip body through the printed circuit board, converting the received infrared light signal into an electrical signal and transmitting it to the chip body for processing. At the same time, the chip body also sends control signals to the module IR body to adjust its operating state and parameters.

[0008] Preferably, the dust collection component includes a magnetic coil, which is mounted on a printed circuit board, and the chip body is located inside the magnetic coil. When the module IR body is mounted on the printed circuit board, the magnetic coil is energized, and the magnetic coil generates magnetic attraction to attract dust that may be present inside the module IR, thereby increasing the yield and reducing POG during the product manufacturing process.

[0009] Preferably, the printed circuit board is an FPC board.

[0010] Preferably, it also includes a reinforcing plate, which is provided between the module IR body and the printed circuit board; the module IR body and the printed circuit board are strengthened by the reinforcing plate to improve the connection strength.

[0011] Compared with the prior art, the beneficial effects of this utility model are as follows: the module IR component emits specially modulated invisible infrared light to the object being photographed, and at the same time receives invisible infrared light reflected back from the object being photographed, and obtains the spatial information of the object being photographed through calculation. The module IR converts the received infrared light signal into an electrical signal and transmits it to the chip component for processing. At the same time, the dust collection component is powered on, and the dust collection component uses suction to adsorb dust, thereby improving the poor imaging of the module IR component and reducing POG. Attached Figure Description

[0012] Figure 1 This is an axonometric structural diagram of the utility model;

[0013] Figure 2 This is an exploded structural diagram of the present invention;

[0014] Figure 3 This is an enlarged structural diagram of the magnetic coil and the chip body, etc.

[0015] Figure 4 This is an enlarged structural diagram of the module's IR body and glass plate structure;

[0016] Figure 5 This is a cross-sectional structural diagram of the present invention.

[0017] The following are labels in the attached diagram: 1. IR module body; 2. Glass sheet; 3. Printed circuit board; 4. Chip body; 5. Magnetic coil; 6. Reinforcing plate. Detailed Implementation

[0018] To facilitate understanding of the present invention, a more comprehensive description of the present invention will be provided below with reference to the accompanying drawings. The present invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a more thorough and comprehensive understanding of the present invention.

[0019] Example 1

[0020] like Figures 1 to 5 As shown, the present invention provides a micro magnetic induction dust adsorption device, which includes an IR module and a chip module. The IR module is mounted on the chip module. The device also includes a dust collection component, which is disposed between the IR module and the chip module.

[0021] like Figure 2 and Figure 4 As shown, the module IR includes a module IR body 1 and a glass sheet 2, and the glass sheet 2 is disposed at the bottom of the module IR body 1.

[0022] like Figure 2 and Figure 3 As shown, the chip assembly includes a printed circuit board 3 and a chip body 4. The chip body 4 is disposed on the top of the printed circuit board 3, and the module IR body 1 is mounted on the top of the printed circuit board 3.

[0023] like Figure 3 As shown, the vacuuming assembly includes a magnetic coil 5, which is mounted on a printed circuit board 3, and the chip body 4 is located inside the magnetic coil 5.

[0024] In this embodiment, when the module IR body 1 is mounted on the printed circuit board 3, the module IR body 1 emits specially modulated invisible infrared light to the object being photographed, and simultaneously receives invisible infrared light reflected back from the object. The glass plate 2 effectively filters out the infrared light. 1 is connected to the chip body 4 through the printed circuit board 3, converting the received infrared light signal into an electrical signal and transmitting it to the chip body 4 for processing. Simultaneously, the chip body 4 also sends control signals to the module IR body 1 to adjust its operating state and parameters, energizing the magnetic coil 5. The magnetic coil 5 generates magnetic attraction to attract any dust that may be present inside the module IR, increasing the yield and reducing POG (Potentially Occurring Objects) during product manufacturing.

[0025] Example 2

[0026] like Figures 1 to 5 As shown, the present invention provides a micro magnetic induction dust adsorption device, which includes an IR module and a chip module. The IR module is mounted on the chip module. The device also includes a dust collection component, which is disposed between the IR module and the chip module.

[0027] like Figure 2 and Figure 4 As shown, the module IR includes a module IR body 1 and a glass sheet 2, and the glass sheet 2 is disposed at the bottom of the module IR body 1.

[0028] like Figure 2 and Figure 3 As shown, the chip assembly includes a printed circuit board 3 and a chip body 4. The chip body 4 is disposed on the top of the printed circuit board 3, and the module IR body 1 is mounted on the top of the printed circuit board 3.

[0029] like Figure 3 As shown, the vacuuming assembly includes a magnetic coil 5, which is mounted on a printed circuit board 3, and the chip body 4 is located inside the magnetic coil 5.

[0030] like Figure 1 Looking to the left, it also includes a reinforcing plate 6. The reinforcing plate 6 is provided between the module IR body 1 and the printed circuit board 3. The printed circuit board 3 is an FPC board.

[0031] In this embodiment, when the module IR body 1 is mounted on the printed circuit board 3, the module IR body 1 emits specially modulated invisible infrared light to the object being photographed, and simultaneously receives invisible infrared light reflected back from the object. The glass plate 2 effectively filters out the infrared light. 1 is connected to the chip body 4 through the printed circuit board 3, converting the received infrared light signal into an electrical signal and transmitting it to the chip body 4 for processing. At the same time, the chip body 4 also sends control signals to the module IR body 1 to adjust its working state and parameters, energizing the magnetic coil 5. The magnetic coil 5 generates magnetic attraction to attract dust that may be present inside the module IR, increasing the yield and reducing POG during product manufacturing. The module IR body 1 and the printed circuit board 3 are reinforced by a reinforcing plate 6.

[0032] The module IR body 1, chip body 4, and magnetic coil 5 of the micro magnetic induction dust adsorption device of this utility model are commercially available. Technical personnel in this industry only need to install and operate them according to the accompanying instruction manual, without requiring any creative work from those skilled in the art.

[0033] The above is only a preferred embodiment of the present invention. It should be pointed out that for ordinary technicians in this technical field, several improvements and modifications can be made without departing from the technical principles of the present invention. These improvements and modifications should also be regarded as the scope of protection of the present invention.

Claims

1. A micro-magnetic induction dust adsorption device, comprising an IR module assembly and a chip assembly, wherein the IR module assembly is mounted on the chip assembly, characterized in that, It also includes a dust collection component, which is disposed between the module IR component and the chip component.

2. The micro-magnetic induction dust adsorption device as described in claim 1, characterized in that, The module IR includes a module IR body (1) and a glass plate (2), wherein the bottom of the module IR body (1) is provided with the glass plate (2).

3. The micro-magnetic induction dust adsorption device as described in claim 2, characterized in that, The chip assembly includes a printed circuit board (3) and a chip body (4). The chip body (4) is disposed on the top of the printed circuit board (3), and the module IR body (1) is mounted on the top of the printed circuit board (3).

4. The micro-magnetic induction dust adsorption device as described in claim 3, characterized in that, The vacuuming assembly includes a magnetic coil (5) mounted on a printed circuit board (3), and the chip body (4) is located inside the magnetic coil (5).

5. The micro-magnetic induction dust adsorption device as described in claim 3, characterized in that, The printed circuit board (3) is an FPC board.

6. The micro-magnetic induction dust adsorption device as described in claim 3, characterized in that, It also includes a reinforcing plate (6), which is provided between the module IR body (1) and the printed circuit board (3).

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