Steel mesh for SMT (Surface Mount Technology) solder paste printing

Abstract

The embodiment of the utility model belongs to the technical field of steel meshes. The utility model further relates to the SMT solder paste printing steel mesh which comprises a steel mesh body, the steel mesh body is provided with a thickening area, a plurality of backlight FPC bonding pad holes are formed between the thickening area and the steel mesh body, and the steel mesh body is provided with an element bonding pad opening area located on one side of the thickening area. The thickened area and the backlight FPC bonding pad hole are formed between the steel mesh main bodies, and the element bonding pad opening area is directly formed in the steel mesh main bodies, so that the steel mesh main bodies at the positions of element bonding pads are kept thin to ensure that the amount of solder paste in the element bonding pad opening area is moderate; the problems of deviation, inclination and the like of the element in the SMT processing process are avoided, the tin amount in the backlight FPC bonding pad hole is increased, and the pressure welding effect is ensured.

Description

Technical Field

[0001] This utility model relates to the field of stencil technology, and more specifically, to a stencil for SMT solder paste printing. Background Technology

[0002] In the SMT (Surface Mount Technology) process, stencils play a crucial role. As the most popular technology and process in the electronics assembly industry, the quality of SMT directly affects the performance and reliability of electronic products. The main function of stencils is to ensure that solder paste is accurately and evenly applied to the component pads and backlight pads on the FPC (Flexible Printed Circuit) display screen during solder paste printing.

[0003] The openings on the stencil are precisely designed according to the dimensions of the components on the display FPC (Flexible Printed Circuit) and the backlight pads. The thickness of the stencil directly determines the amount of solder paste on the pad surface. Traditional stencil designs often use a uniform thickness, which leads to a series of problems. When the stencil is too thick, there will be too much solder paste on the pads. During SMT processing, excessive solder paste can easily cause component misalignment, tilting, arching, lifting, or even tipping, seriously affecting product quality and yield. Conversely, if the stencil is too thin, there will be too little solder paste on the backlight FPC pads, resulting in insufficient solder flow during soldering, which in turn affects the soldering effect and also reduces product quality and reliability. Therefore, we have improved this by proposing a stencil for SMT solder paste printing. Utility Model Content

[0004] The technical problem to be solved by this utility model embodiment is the uniform thickness of the stencil. When the stencil is thicker, there will be more solder paste on the pads. During the SMT process, too much solder paste can easily cause problems such as component misalignment, tilting, arching, or even flipping. If the stencil is thinner, there will be less solder paste on the pads of the backlight FPC, which will lead to insufficient solder flow during soldering.

[0005] To solve the above-mentioned technical problems, the present invention adopts the following technical solution:

[0006] A stencil for SMT solder paste printing includes: a stencil body with a thickened area, a plurality of backlight FPC pad holes formed between the thickened area and the stencil body, and a component pad opening area located on one side of the thickened area. This application achieves this by using a thickened area, with the backlight FPC pad holes formed between the stencil bodies, and the component pad opening area directly formed on the stencil body. This design keeps the stencil body at the component pad location relatively thin, ensuring an appropriate amount of solder paste in the component pad opening area and preventing component misalignment or tilting during SMT processing. The increased solder paste in the backlight FPC pad holes ensures a good soldering effect.

[0007] As an improvement of this utility model, the component pad opening area is composed of several component pad openings, all of which are opened on the main body of the steel mesh. The multiple component pad openings are set independently, and the independent component pad openings also facilitate individual troubleshooting and repair when problems occur, thereby improving production efficiency and maintenance convenience.

[0008] As an improvement of this utility model, the depth of the component pad opening is less than the depth of the backlight FPC pad opening.

[0009] As an improvement of this utility model, the inner walls of the component pad openings and the backlight FPC pad holes are both smooth. The smooth inner walls can greatly reduce solder residue, improve the accuracy and quality of solder paste printing, and reduce solder residue. This can prevent residual solder from affecting the accuracy of the next printing, thus reducing the defect rate. At the same time, reducing solder residue also helps to reduce production costs, because there is no need to spend extra time and resources to clean up residual solder. In addition, the smooth inner walls can make the solder flow more easily, improving the uniformity and consistency of printing.

[0010] As an improvement of this utility model, the thickened area and the main body of the steel mesh are integrally formed. The integrally formed structure enhances the overall strength and stability of the steel mesh, making it more durable during use and extending its service life. This structure can effectively resist the impact and vibration of external forces, reducing the risk of deformation and damage to the steel mesh during use.

[0011] As an improvement of this utility model, a reinforcing member is provided on the outer surface of the stencil body. The reinforcing member is used to strengthen the stencil body. The reinforcing member on the outer surface of the stencil body can significantly improve the strength and deformation resistance of the stencil, ensuring that the stencil can maintain a stable shape during use, thereby ensuring the accuracy of solder paste printing. The reinforcing member can disperse the external force on the stencil body, reduce local stress concentration, and reduce the risk of stencil damage.

[0012] As an improvement of this utility model, the reinforcing member is a reinforcing frame, which is fixedly connected to the outer periphery of the steel mesh body. The reinforcing frame can effectively protect the edge of the steel mesh body and prevent the edge from being hit and worn during transportation, installation and use.

[0013] As an improvement of this utility model, the surface of the thickened area is coated with an identification color, which is used to identify the position of the thickened area when the steel mesh body is installed.

[0014] As an improvement of this utility model, the stencil body is provided with mounting holes. The mounting holes are used to fix the stencil body on the printing equipment. The mounting holes ensure that the stencil is firmly and stably installed on the printing equipment, so that the stencil body will not move or shake during the printing process, thereby ensuring the accuracy of solder paste printing. The firm installation can also improve production efficiency and reduce downtime adjustment time caused by the instability of the stencil body.

[0015] As an improvement of this utility model, there are four mounting holes, which are located at the four corners of the steel mesh body.

[0016] Compared with the prior art, the embodiments of this utility model have the following main advantages:

[0017] To address the issue of inconsistent stencil thickness in existing technologies, where a thicker stencil results in excessive solder paste on the pads, leading to component misalignment, tilting, arching, or even flipping during SMT processing, and a thinner stencil results in insufficient solder paste on the backlight FPC pads, causing inadequate solder flow during bonding, this application addresses this problem by creating a thickened area. The backlight FPC pad holes are located between the main body of the stencil, while the component pad holes are directly on the main body of the stencil. This design keeps the stencil body at the component pad location relatively thin, ensuring a moderate amount of solder paste in the component pad holes and preventing component misalignment or tilting during SMT processing. The increased solder paste in the backlight FPC pad holes ensures a better bonding effect. Attached Figure Description

[0018] Figure 1 A schematic diagram of the stencil for SMT solder paste printing provided in this application;

[0019] Figure 2 A side view of the stencil structure for SMT solder paste printing provided in this application;

[0020] Figure 3 A three-dimensional structural diagram of the stencil for SMT solder paste printing provided in this application;

[0021] Figure 4 A three-dimensional structural diagram of the stencil for SMT solder paste printing provided in this application from another perspective;

[0022] Figure 5 A schematic diagram of the reinforcing frame of the stencil for SMT solder paste printing provided in this application.

[0023] The image shows:

[0024] 1. Steel mesh body; 2. Backlight FPC pad holes; 3. Thickened area; 4. Component pad opening area; 5. Reinforcing frame; 6. Mounting holes. Detailed Implementation

[0025] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The reference herein to "embodiment" means that a particular feature, structure, or characteristic described in connection with an embodiment may be included in at least one embodiment of the invention. The appearance of this phrase in various places in the specification does not necessarily refer to the same embodiment, nor is it a separate or alternative embodiment mutually exclusive with other embodiments. It will be explicitly and implicitly understood by those skilled in the art that the embodiments described herein can be combined with other embodiments.

[0026] As described in the background section, the openings in the stencil are precisely made according to the dimensions of the components on the display FPC and the backlight pads. The thickness of the stencil directly determines the amount of solder paste on the pad surface. Traditional stencil designs often use a uniform thickness, which leads to a series of problems. When the stencil is thicker, there will be more solder paste on the pads. During SMT processing, excessive solder paste can easily cause problems such as component misalignment, tilting, arching, lifting, or even tipping, seriously affecting product quality and yield. Conversely, if the stencil is thinner, there will be less solder paste on the backlight FPC pads, which will result in insufficient solder flow during soldering, thus affecting the soldering effect and also reducing product quality and reliability.

[0027] To solve this technical problem, this utility model provides a stencil for SMT solder paste printing.

[0028] For details, please refer to Figure 1-Figure 5 The stencil for SMT solder paste printing specifically includes:

[0029] The main body of the steel mesh is 1, and a thickened area 3 is provided on the main body of the steel mesh. Several backlight FPC pad holes 2 are opened between the thickened area 3 and the main body of the steel mesh. A component pad opening area 4 located on one side of the thickened area 3 is provided on the main body of the steel mesh.

[0030] The stencil for SMT solder paste printing provided by this utility model features a thickened area 3. The backlight FPC pad holes 2 are formed between the stencil body 1, while the component pad opening area 4 is directly formed on the stencil body 1. This arrangement keeps the stencil body 1 at the component pad position relatively thin, ensuring that the amount of solder paste in the component pad opening area 4 is moderate, and avoiding problems such as component misalignment or tilting during SMT processing. The increased amount of solder in the backlight FPC pad holes 2 ensures a good soldering effect.

[0031] To enable those skilled in the art to better understand the present invention, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings.

[0032] It should be noted that, unless otherwise specified, the embodiments and features and technical solutions in the present invention can be combined with each other.

[0033] It should be noted that similar reference numerals and letters denote similar items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further defined or explained in subsequent drawings.

[0034] Example 1 of the SMT solder paste printing stencil of this utility model

[0035] Please refer to Figure 1-Figure 5 This utility model discloses a stencil for SMT solder paste printing, comprising: a stencil body 1, a thickened area 3 on the stencil body 1, a plurality of backlight FPC pad holes 2 between the thickened area 3 and the stencil body 1, and a component pad opening area 4 located on one side of the thickened area 3. By setting the thickened area 3 and the backlight FPC pad holes 2 between the stencil bodies 1, while the component pad opening area 4 is directly on the stencil body 1, this arrangement keeps the stencil body 1 at the component pad position relatively thin, ensuring a moderate amount of solder paste in the component pad opening area 4 and preventing component misalignment or tilting during SMT processing. The increased solder paste in the backlight FPC pad holes 2 ensures a good soldering effect.

[0036] Further, such as Figure 1 As shown, the component pad opening area 4 consists of several component pad openings, all of which are opened on the stencil body 1. The multiple component pad openings are set independently, which also facilitates individual troubleshooting and repair when problems occur, thus improving production efficiency and maintenance convenience.

[0037] Example 2 of the SMT solder paste printing stencil of this utility model

[0038] Furthermore, in this utility model, the stencil for SMT solder paste printing has a component pad opening depth that is less than the backlight FPC pad opening depth. This design ensures that the solder thickness at the component pad location is less than the solder thickness at the backlight FPC pad location, guaranteeing a moderate solder thickness at the component pad location. This avoids affecting component mounting accuracy due to excessive solder thickness, allowing components to be accurately mounted on the pads and improving product reliability. At the same time, it ensures sufficient solder amount at the backlight FPC pad location to guarantee the pressure soldering effect, enhancing the connection strength between the backlight FPC and the stencil, and improving the overall stability of the product. This differentiated design can meet the soldering needs of different parts, improving production efficiency and product quality.

[0039] Furthermore, the inner walls of the component pad openings and the backlight FPC pad holes 2 are all smooth. The smooth inner walls can greatly reduce solder residue, improve the accuracy and quality of solder paste printing, and reduce solder residue. This can prevent residual solder from affecting the accuracy of the next printing, thus reducing the defect rate. At the same time, reducing solder residue also helps to reduce production costs, because there is no need to spend extra time and resources to clean up residual solder. In addition, the smooth inner walls can also make the solder flow more easily, improving the uniformity and consistency of printing.

[0040] Furthermore, the thickened area 3 and the main body of the steel mesh 1 are integrally formed. The integrally formed structure enhances the overall strength and stability of the steel mesh, making it more durable during use and extending its service life. This structure can effectively resist the impact and vibration of external forces, reducing the risk of deformation and damage to the steel mesh during use.

[0041] Example 3 of the SMT solder paste printing stencil of this utility model

[0042] The stencil for SMT solder paste printing of this utility model is further, such as Figure 5 As shown, the outer surface of the stencil body 1 is provided with reinforcing members. The reinforcing members are used to strengthen the stencil body 1. The reinforcing members on the outer surface of the stencil body 1 can significantly improve the strength and deformation resistance of the stencil, ensuring that the stencil can maintain a stable shape during use, thereby ensuring the accuracy of solder paste printing. The reinforcing members can disperse the external force on the stencil body 1, reduce local stress concentration, and reduce the risk of stencil damage.

[0043] Further, such as Figure 5 As shown, the reinforcing member is the reinforcing frame 5, which is fixedly connected to the outer periphery of the steel mesh body 1. The reinforcing frame 5 can effectively protect the edge of the steel mesh body 1, preventing the edge from being hit and worn during transportation, installation and use. The reinforcing frame 5 can also enhance the overall stability of the steel mesh body 1, making it more reliable during use.

[0044] Further, such as Figure 5 As shown, the surface of the thickened area 3 is coated with an identification color. The identification color is used to identify the position of the thickened area 3 when the stencil body 1 is installed. The identification color makes it easy for operators to quickly and accurately identify the position of the thickened area 3 when installing the stencil body 1, which greatly improves the installation efficiency. This can reduce the occurrence of installation errors, improve installation efficiency, and ensure that the stencil body 1 is installed in the correct position, thereby ensuring the accuracy of solder paste printing.

[0045] Example 4 of the SMT solder paste printing stencil of this utility model

[0046] The stencil for SMT solder paste printing of this utility model is further, such as Figure 5 As shown, the stencil body 1 is provided with mounting holes 6. The mounting holes 6 are used to fix the stencil body 1 on the printing equipment. The mounting holes 6 ensure that the stencil is firmly and stably installed on the printing equipment, so that the stencil body 1 will not move or shake during the printing process, thereby ensuring the accuracy of solder paste printing. The firm installation can also improve production efficiency and reduce downtime adjustment time caused by the instability of the stencil body 1.

[0047] Further, such as Figure 5 As shown, there are four mounting holes 6, which are located at the four corners of the steel mesh body 1. This makes the stress on the steel mesh body 1 more uniform, improves the stability of the installation, and reduces the risk of deformation and damage to the steel mesh body 1 during use, thus extending its service life. Furthermore, the uniformly distributed mounting holes 6 make the stress on various parts of the steel mesh body 1 more balanced after installation, reducing deformation or displacement caused by uneven stress and improving the stability of the installation.

[0048] Obviously, the embodiments described above are only some embodiments of this utility model, not all embodiments. The accompanying drawings show preferred embodiments of this utility model, but do not limit the patent scope of this utility model. This utility model can be implemented in many different forms; rather, the purpose of providing these embodiments is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Although this utility model has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing specific embodiments, or make equivalent substitutions for some of the technical features. Any equivalent structures made using the content of this utility model specification and drawings, directly or indirectly applied to other related technical fields, are similarly within the patent protection scope of this utility model.

Claims

1. A stencil for SMT solder paste printing, characterized in that, include: A steel mesh body (1) is provided with a thickened area (3), and a plurality of backlight FPC pad holes (2) are opened between the thickened area (3) and the steel mesh body (1). A component pad opening area (4) located on one side of the thickened area (3) is also provided on the steel mesh body (1). The component pad opening area (4) is composed of several component pad openings, and the several component pad openings are all opened on the steel mesh body (1); The depth of the component pad opening is less than the depth of the backlight FPC pad opening (2); The inner walls of the component pad openings and the backlight FPC pad openings (2) are all smooth. The thickened area (3) and the main body of the steel mesh (1) are integrally formed. The outer surface of the steel mesh body (1) is provided with reinforcing members, which are used to strengthen the steel mesh body (1); The reinforcing member is a reinforcing frame (5), which is fixedly connected to the outer periphery of the steel mesh body (1); The surface of the thickened area (3) is coated with an identification color, which is used to identify the position of the thickened area (3) when the steel mesh body (1) is installed.

2. The stencil for SMT solder paste printing according to claim 1, characterized in that, The steel mesh body (1) is provided with mounting holes (6), which are used to fix the steel mesh body (1) on the printing equipment.

3. The stencil for SMT solder paste printing according to claim 2, characterized in that, The number of mounting holes (6) is four, and the four mounting holes (6) are located at the four corners of the steel mesh body (1).

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