Radiator, radiating system and electronic equipment

Abstract

The utility model provides a radiator, a radiating system and electronic equipment. The radiator comprises a shell, the shell comprises an inlet, an outlet and a containing cavity, the containing cavity is located between the inlet and the outlet, and one side of the outlet is used for arranging a part to be cooled; a fluid flows into the accommodating cavity through the inlet and is discharged through the outlet; the elastic film allows the fluid to pass through and is arranged at the inlet; the vibrating piece is arranged on the surface of the elastic film and used for receiving an electric signal of a driving circuit to generate vibration; and the elastic film is continuously stretched or shrunk along with the vibration of the vibration piece so as to change the pressure in the accommodating cavity, so that the fluid enters the accommodating cavity and flows out of the accommodating cavity. The radiator has high heat dissipation efficiency and is suitable for being used on micro-miniature electronic equipment.

Description

Technical Field

[0001] This application relates to the field of heat dissipation, and more specifically, provides a heat sink, a heat dissipation system, and an electronic device. Background Technology

[0002] As the size of electronic devices decreases, their computing power continues to increase, making heat generation a growing concern.

[0003] Currently, air-cooled or liquid-cooled heat sinks used in micro and small electronic devices such as smartphones and wearable devices can provide good heat dissipation. However, these heat sinks have the problem of being large in size. For example, air-cooled heat sinks require fans, and liquid-cooled heat sinks require water pumps, making them unsuitable for use in micro and small electronic devices. Utility Model Content

[0004] In view of this, this application aims to provide a heat sink, a heat dissipation system and an electronic device, to provide a heat sink suitable for use in micro and small electronic devices.

[0005] In a first aspect, embodiments of this application provide a radiator, comprising: a housing including an inlet, an outlet, and a receiving cavity, the receiving cavity being located between the inlet and the outlet, the outlet side being used to dissipate a heat-dissipating component; fluid flowing into the receiving cavity through the inlet and discharging through the outlet; an elastic membrane allowing the fluid to pass through, disposed at the inlet; a vibrating element disposed on the surface of the elastic membrane, used to receive an electrical signal from a drive circuit to generate vibration; the elastic membrane continuously stretching or contracting with the vibration of the vibrating element to change the pressure within the receiving cavity, allowing the fluid to enter and exit the receiving cavity.

[0006] In this embodiment, the elastic membrane allows fluid to enter the receiving cavity and exit from the outlet. The vibrating element vibrates under the influence of the electrical signal of the drive circuit. The vibration causes the elastic membrane to stretch or contract continuously, which can change the pressure inside the receiving cavity. To balance the internal and external pressures, an increase in the pressure inside the receiving cavity will accelerate the fluid outflow from the receiving cavity, and a decrease in the pressure inside the receiving cavity will accelerate the fluid inflow into the receiving cavity. This improves the fluid exchange efficiency and thus improves the heat dissipation efficiency of the fluid on the heat sink, making the heat sink have a high heat dissipation efficiency. The above structure only requires a vibrating element and an elastic membrane, without the need for a water pump or fan, which helps to reduce the size of the heat sink and is suitable for use in micro and small electronic devices.

[0007] In one embodiment, the vibrating element is a block made of piezoelectric material, and the vibrating element is disposed within the electric field generated by the driving circuit to receive the electrical signal of the electric field.

[0008] In this embodiment, the piezoelectric material exhibits an inverse voltage effect, enabling it to vibrate under the influence of an electric field, thus functioning as a vibrating element. Compared to other vibrating elements, it eliminates the need for energization; simply placing the vibrating element in an electric field simplifies the complexity of the heat sink and helps reduce its size. Furthermore, this method allows the heat sink to utilize liquid as the heat dissipation fluid, improving heat dissipation performance.

[0009] In one embodiment, the vibrating element is a piezoelectric ceramic block made of piezoelectric ceramic.

[0010] In this embodiment, compared to piezoelectric crystals, piezoelectric ceramics have stronger piezoelectricity, higher dielectric constant, and can be processed into arbitrary shapes. They are easier to manufacture while still fulfilling the function of a vibrating element, thus helping to reduce the manufacturing difficulty and cost of heat sinks. Furthermore, when piezoelectric ceramics vibrate at high speed, they generate high-frequency eddies in the fluid, thereby increasing heat conduction between the fluid and the surface of the heat sink, thus improving heat dissipation efficiency.

[0011] In one embodiment, the radiator further includes a filter screen; the filter screen is disposed at the inlet.

[0012] In this embodiment of the application, a filter screen is provided at the inlet, which can filter impurities in the fluid to a certain extent, reduce the impact of impurities on the fluid flow of the elastic membrane, and reduce the possibility that impurities will affect the vibration capability of the vibrating element due to the electric field of the vibrating element, thereby improving the life of the radiator.

[0013] In one embodiment, the radiator further includes a heat dissipation base disposed on the outlet side and used for mounting on the surface of the component to be cooled.

[0014] In this embodiment, a heat dissipation substrate is provided at the outlet. On the one hand, this facilitates the installation of the heat sink on the surface of the component to be cooled. On the other hand, after the fluid flows out of the outlet, it first dissipates heat on the heat dissipation substrate, and then the heat dissipation substrate dissipates heat on the component to be cooled, which helps to improve the uniformity of heat dissipation.

[0015] In one embodiment, the heat dissipation base includes a heat spreader plate, which is used to contact the surface of the component to be cooled.

[0016] In this embodiment, the heat spreader has the functions of rapid heat conduction and heat diffusion, which allows the heat spreader to contact the surface of the component to be scald, thus helping to dissipate heat evenly on the surface to be scald. This allows the heat sink to not only dissipate heat in the area of ​​the component to be scald at the outlet, but also to diffuse heat to a larger area of ​​the component to be scald, reducing the impact of uneven heat dissipation on the performance of the component to be scald.

[0017] In one embodiment, the radiator further includes a one-way discharge structure disposed at the outlet, the one-way discharge structure allowing fluid to flow out from the cavity of the receiving cavity through the outlet and restricting fluid outside the outlet from flowing back into the cavity of the receiving cavity.

[0018] In this embodiment, a one-way discharge structure is provided to limit the backflow of hot fluid after the heat dissipation component has been cooled back into the receiving cavity, thereby reducing the mixing of hot and cold fluids in the receiving cavity, which would cause the fluid temperature in the receiving cavity to rise and reduce the heat dissipation effect of the fluid output from the receiving cavity.

[0019] In one embodiment, the unidirectional discharge structure includes: a pressure-sensitive film and a fixing member; both the pressure-sensitive film and the fixing member allow fluid to pass through; the pressure-sensitive film is used to deform in the event of a pressure change within the cavity; the fixing member is disposed on the side of the pressure-sensitive film near the receiving cavity, and the fixing member is used to limit the deformation of the pressure-sensitive module into the receiving cavity.

[0020] In this embodiment, the pressure-sensitive diaphragm and the fixing member allow fluid to pass through and flow out normally. When the metal diaphragm deforms into the receiving cavity, the pressure inside the cavity increases, causing the pressure-sensitive diaphragm to deform outward and discharge fluid. When the metal diaphragm contracts due to vibration, it recovers its deformation outward, and the pressure-sensitive diaphragm also recovers. However, due to the limitation of the fixing member, the deformation of the pressure-sensitive diaphragm is limited, resulting in a decrease in the pressure inside the receiving cavity. During the recovery process, to maintain the pressure inside the receiving cavity, the metal diaphragm will draw fluid in from the inlet to maintain pressure balance, thereby preventing the intake of hot fluid from the outlet and affecting the heat dissipation effect. Compared with unidirectional discharge structures such as one-way valves, the pressure-sensitive diaphragm and fixing member have a simple structure, are easy to implement, and do not require a more complex structure, which helps to achieve the unidirectional discharge function while miniaturizing the overall size of the radiator.

[0021] In one embodiment, the fastener includes a perforated plate or a plurality of fastening blocks arranged at a preset gap.

[0022] In this embodiment, the perforated plate or the multiple fixing blocks arranged at a preset gap allow fluid to pass through while minimizing deformation, thereby limiting further deformation of the pressure-sensitive diaphragm within the cavity and achieving the function of a fixing component. Furthermore, the perforated plate or the multiple fixing blocks arranged at a preset gap have a simple structure and low cost, helping to reduce the difficulty and cost of implementing the heat sink.

[0023] Secondly, embodiments of this application provide a heat dissipation system, including: a heat sink as described in the first aspect; and a drive circuit electrically connected to a vibrating element of the heat sink, used to provide an electrical signal to the vibrating element to cause it to vibrate.

[0024] In one embodiment, the heat dissipation system further includes a coolant reservoir for providing the fluid; the radiator is disposed within the coolant reservoir.

[0025] Thirdly, embodiments of this application provide an electronic device, the electronic device comprising: a heat-dissipating component; and a heat dissipation system as described in any of the second aspects; the heat dissipation system being used to dissipate heat from the heat-dissipating component. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a schematic diagram of a first structure of a heat sink according to an embodiment of this application;

[0028] Figure 2 This is a schematic diagram of the operation of a heat sink according to an embodiment of this application;

[0029] Figure 3 This is a schematic diagram of a second structure of a heat sink according to an embodiment of this application;

[0030] Figure 4 This application provides a schematic diagram of a third structure of a heat sink according to an embodiment of the present application;

[0031] Figure 5 This is a schematic diagram of the first position of pressure-sensitive film deformation provided in an embodiment of this application;

[0032] Figure 6 This is a schematic diagram of the second position of pressure-sensitive film deformation provided in an embodiment of this application.

[0033] Icons: Housing 100; Inlet 110; Outlet 120; Receiving cavity 130; Elastic membrane 200; Vibrating element 300; Filter screen 400; Heat dissipation base 500; One-way discharge structure; Fixing element 610; Pressure-sensitive membrane 620. Detailed Implementation

[0034] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0035] First, this application provides a heat sink, please refer to... Figure 1 , Figure 1 This is a first structural schematic diagram of a heat sink according to an embodiment of this application. The heat sink includes: a housing 100, an elastic membrane 200, and a vibrating element 300.

[0036] The housing 100 includes an inlet 110, an outlet 120, and a receiving cavity 130.

[0037] The receiving cavity 130 is located between the inlet 110 and the outlet 120, with the outlet 120 side used to house the component to be cooled. Fluid flows into the receiving cavity 130 through the inlet 110 and is discharged through the outlet 120. The fluid can be either gas or liquid; the fluid flowing into the inlet 110 is cold fluid, and the fluid at the outlet 120 after cooling the component is hot fluid. The terms "cold fluid" and "hot fluid" are relative and do not have a specific temperature limitation.

[0038] The inlet 110 of the housing 100 is used for the inflow of cold air, coolant, etc., and the outlet 120 dissipates heat from the heat-dissipating component. The dissipated fluid is discharged through both sides of the outlet 120.

[0039] In this embodiment, the housing 100 can be integrally formed or assembled from different structures, and no limitation is made here. There can be multiple receiving cavities 130. If multiple receiving cavities 130 share a common inlet 110 and an outlet 120, then the multiple receiving cavities 130 can be connected to each other. If there are multiple inlets 110 and multiple outlets 120, then each receiving cavity 130 can correspond to one inlet 110 and one outlet 120.

[0040] An elastic membrane 200, having the property of allowing fluid to pass through, is used to be disposed at the inlet 110 of the housing 100.

[0041] In this embodiment, the elastic film 200 has the characteristic of elastic deformation, which can deform under the action of external force and recover when the external force stops. Furthermore, fluid can normally pass through the elastic film 200 into the receiving cavity 130 and flow out through the outlet 120 of the housing 100 to dissipate heat from the heat sink.

[0042] In this embodiment, the elastic film 200 can be a semi-permeable membrane that allows fluid to pass through in one direction, or it can be an elastic film of other materials that can form a gap with the inlet after elastic deformation to allow fluid to pass through. No limitation is made here.

[0043] The vibrating element 300 is disposed on the surface of the elastic diaphragm 200 and is used to receive electrical signals from the drive circuit to generate vibration.

[0044] In the embodiments of this application, the vibrating element 300 may be disposed in the middle of the surface of the elastic film 200 so that the elastic film 200 can be more easily deformed.

[0045] In the embodiments of this application, when the vibrating element 300 vibrates, the elastic membrane 200 can also vibrate, thereby accelerating the flow of fluid, thus accelerating the efficiency of heat exchange and improving the heat dissipation efficiency.

[0046] In the embodiments of this application, the elastic film 200 is continuously stretched or contracted with the vibration of the vibrating member 300, which can change the pressure in the receiving cavity 130, so that the fluid can enter the receiving cavity 130 and flow out of the receiving cavity 130 more quickly.

[0047] Please see Figure 2 , Figure 2 This is a schematic diagram of the operation of a heat sink according to an embodiment of this application, as shown below. Figure 2 As shown, when the vibrating element 300 vibrates downwards, the elastic membrane 200 stretches, increasing the pressure inside the receiving cavity 130 and accelerating the discharge of fluid from the receiving cavity 130. Conversely, when the vibrating element 300 stops vibrating, the stretched elastic membrane 200 contracts and returns to its original shape, reducing the pressure inside the receiving cavity 130. This results in the pressure at the inlet being greater than the pressure inside the receiving cavity 130, causing the fluid to flow into the receiving cavity 130 more rapidly. This improves the fluid exchange efficiency, which in turn improves the heat dissipation efficiency.

[0048] The vibration element 300 can improve the fluid exchange efficiency, thereby improving the heat dissipation efficiency. Based on this, the heat sink does not need to be equipped with additional structures such as fans or water pumps to improve heat exchange, which can effectively reduce the size required by the heat sink and make it more suitable for use in some small electronic devices or components.

[0049] In the embodiments of this application, there may be multiple inlets 110 and multiple outlets 120. Accordingly, an elastic membrane 200 and a vibrating element 300 may be provided at each inlet 110.

[0050] In the embodiments of this application, the vibrating element 300 may be a vibrating plate, a motor, or other device that can vibrate under the drive of an electrical signal.

[0051] Furthermore, in some embodiments of this application, the vibrating element 300 may also be a block made of piezoelectric material, and the vibrating element 300 is disposed within the electric field generated by the driving circuit to receive the electrical signal of the electric field.

[0052] Piezoelectric materials exhibit an inverse voltage effect, enabling them to generate mechanical effects and produce mechanical vibrations in an electric field. Therefore, in the embodiments of this application, a vibrating element 300 made of piezoelectric material can be used.

[0053] The vibrating element 300 made of piezoelectric material can vibrate simply by being placed in an electric field, without needing to be connected to a circuit. This vibrating element 300 helps to simplify the structure of the radiator. Since there is no need to make an actual electrical connection between the vibrating element 300 and the drive circuit, the radiator can be used more easily with liquid as the fluid, without the vibration or heat dissipation being affected by the type and material of the liquid.

[0054] Piezoelectric materials include piezoelectric crystals and piezoelectric ceramics. Piezoelectric crystals can be lithium gallium oxide, lithium germanate, etc., while piezoelectric ceramics can be lead titanate, lead zirconate titanate, etc. Compared to piezoelectric crystals, piezoelectric ceramics have stronger piezoelectricity, higher dielectric constant, can be processed into arbitrary shapes, and are easier to fabricate on metal thin films. Therefore, in the embodiments of this application, the vibrating element 300 can be a piezoelectric ceramic block made of piezoelectric ceramics. While achieving the function of the vibrating element 300, it is easier to manufacture, which helps to reduce the manufacturing difficulty and cost of the heat sink.

[0055] In addition, when piezoelectric ceramics vibrate at high speed, they will form high-frequency eddies in the fluid, thereby increasing the heat conduction between the fluid and the surface of the component to be cooled, thus improving the heat dissipation efficiency.

[0056] In the embodiments of this application, a metal sheet (i.e., elastic film 200) can be deposited on a substrate by a microelectromechanical system, and then piezoelectric ceramic material can be sputtered on an electrode and photolithography can be performed to prepare an elastic film 200 with a vibrating element 300 mounted on it. Then, the vibrating element 300 and the elastic film 200 with the vibrating element 300 are disposed on the surface of the housing 100 to obtain the heat sink provided in the above embodiment.

[0057] Please see Figure 3 , Figure 3 This is a schematic diagram of a second structure of a radiator provided in one embodiment of this application. In some embodiments of this application, the radiator may further include a filter 400, which is disposed at the inlet 110.

[0058] In this embodiment, the filter 400 is used to filter impurities in the fluid, such as dust in the air or conductive impurities in the liquid that need to be cleaned and filtered, to reduce the impact of impurities on the vibrating element 300 and the elastic membrane 200. For example, it prevents impurities in the fluid from accumulating on the elastic membrane 200 and the vibrating element 300, affecting the fluid flow through the elastic membrane 200, and preventing a reduction in the amplitude of the vibrating element 300. When the vibrating element 300 is a piezoelectric material block, it can also reduce the impact of conductive impurities on the electric field, thereby reducing the reduction in the amplitude of the vibrating element 300 and the decrease in heat dissipation efficiency due to changes in the electric field.

[0059] In this embodiment, the type or pore size of the filter screen 400 can be selected according to the type of fluid and filtration requirements, and there are no restrictions.

[0060] like Figure 1 and Figure 3 As shown, the elastic membrane 200 and the inlet 110 of the housing 100 form a cavity, which can be referred to as the inlet 110 cavity. The elastic membrane 200 is disposed in the inlet 110 cavity near the receiving cavity 130, and the filter screen 400 is disposed in the inlet 110 cavity near the outer surface of the housing 100.

[0061] Please continue reading. Figure 3 In the embodiments of this application, a heat dissipation base 500 may also be provided at the outlet 120 of the housing 100. The heat dissipation base 500 is provided on one side of the outlet 120 and is used to be installed on the surface of the component to be dissipated.

[0062] In this embodiment of the application, by providing a heat dissipation base 500, the heat sink can be better installed on the surface of the component to be cooled and better fit the surface of the component to be cooled.

[0063] Furthermore, the heat dissipation base 500 serves as a device between the heat sink and the component to be cooled. The heat exchange of the fluid first takes place on the heat dissipation base 500 and is then conducted to the component to be cooled by the heat dissipation base 500. This allows for more uniform heat dissipation, reduces the temperature difference between the outlet 120 of the housing 100 and the surface to be cooled, and reduces the occurrence of situations where the performance of the component to be cooled is affected due to excessive temperature difference.

[0064] In the embodiments of this application, the heat dissipation base 500 may be made of metal material, which has good thermal conductivity and can improve heat exchange efficiency and heat dissipation efficiency.

[0065] In one embodiment of this application, the heat dissipation base 500 may be a heat spreader.

[0066] The vapor chamber has the function of rapid heat conduction and heat diffusion, which makes the vapor chamber contact the surface of the component to be cooled, helps to dissipate heat more evenly on the surface to be cooled, and reduces the impact of uneven heat dissipation on the performance of the component.

[0067] like Figure 1 and Figure 3 As shown, the heat dissipation substrate and the outlet 120 of the housing 100 form a cavity, which can be referred to as the outlet 120 cavity. The heat dissipation substrate is disposed on the side of the outlet 120 cavity near the outer surface of the housing 100. The outlet 120 cavity has outlets 120 (not shown in the figure) on both sides for discharging the fluid after heat dissipation.

[0068] Please see Figure 4 , Figure 4This is a schematic diagram of a third structure of a heat sink provided in an embodiment of this application.

[0069] In embodiments of this application, the radiator further includes a one-way discharge structure 600. The one-way discharge structure 600 is disposed at the outlet 120 of the housing 100, and is located on the side of the outlet 120 cavity near the receiving cavity 130.

[0070] In this embodiment, the one-way discharge structure 600 allows fluid to flow out of the cavity of the receiving chamber 130 through the outlet 120, and restricts the backflow of fluid outside the outlet 120 into the cavity of the receiving chamber 130. The one-way discharge structure 600 effectively reduces the backflow of hot fluid after heat dissipation, thereby reducing the mixing of hot fluid with the fluid inside the receiving chamber 130, which could lead to an increase in the fluid temperature inside the receiving chamber 130 and a decrease in heat dissipation efficiency.

[0071] In the embodiments of this application, the one-way discharge structure 600 may be a discharge valve that can be controlled electrically or by communication.

[0072] In one embodiment of this application, the vibrating element 300 stretches when energized and contracts when de-energized, thereby enabling the inflow and outflow of fluid. In this embodiment, the discharge valve can be closed synchronously after the vibrating element 300 is de-energized to prevent the hot fluid at the outlet 120 from flowing back.

[0073] In other embodiments, the vibration frequency of the vibrating element 300 can be determined, and the contraction time period of the elastic membrane 200 can be determined based on the vibration frequency. During this time period, the discharge valve can be controlled to close to prevent the hot fluid from flowing back. The above methods are merely examples and should not be construed as limiting the scope of this application.

[0074] In one embodiment of this application, the unidirectional discharge structure 600 may include a pressure-sensitive film 620 and a fixing member 610, wherein the pressure-sensitive film 620 is connected to the fixing member 610, and the fixing member 610 is disposed on the side near the receiving cavity 130. Both the pressure-sensitive film 620 and the fixing member 610 are disposed within the outlet 120 cavity.

[0075] In this embodiment, both the pressure-sensitive film 620 and the fixing member 610 allow fluid to pass through, so that the fluid can be discharged through the outlet 120. The pressure-sensitive film 620 can be an alloy thin film material or a semiconductor thin film material, and after deformation, it creates gaps to allow fluid to pass through. The fixing member 610 can be a perforated structure, which can be used to filter the fluid.

[0076] In this embodiment, the pressure-sensitive film 620 deforms when the environment changes, and the deformation direction is towards the side with lower pressure.

[0077] The pressure-sensitive film 620 can refer to existing pressure-sensing films, and will not be elaborated here. In the embodiments of this application, the pressure-sensitive film 620 may be provided with holes to allow fluid to flow normally.

[0078] In this embodiment, the fixing member 610 is used to limit the deformation of the pressure-sensitive module into the receiving cavity 130. Therefore, the fixing member 610 is a rigid structure and will not undergo significant deformation due to changes in pressure.

[0079] For example, in some embodiments of this application, the fastener 610 includes a perforated plate or a plurality of fastener blocks arranged at a preset gap.

[0080] Next, the principle by which the pressure-sensitive film 620 and the fixing member 610 provided in this application realize the function of the one-way discharge structure 600 will be explained:

[0081] In this embodiment, the pressure-sensitive film 620 is disposed at the outlet 120 of the receiving cavity 130, and it can deform in response to changes in pressure within the cavity. Please refer to... Figure 5 , Figure 5 This is a schematic diagram of the first deformation position of the pressure-sensitive film 620 provided in an embodiment of this application, as shown below. Figure 5 As shown, the elastic diaphragm 200 can be stretched into the receiving cavity 130 under the influence of the vibrating element 300, which increases the pressure in the receiving cavity 130. Correspondingly, due to the increase in pressure in the receiving cavity 130, the pressure-sensitive diaphragm 620 deforms downward.

[0082] Please see Figure 6 , Figure 6 This is a schematic diagram of the second deformation position of the pressure-sensitive film 620 provided in an embodiment of this application. After the drive circuit is de-energized, the vibrating element 300 stops vibrating and the deformation is restored. As a result, the elastic film 200 contracts and gradually returns to its original shape. During the recovery process, the capacity of the receiving cavity 130 increases, thereby reducing the pressure inside the receiving cavity 130. In order to keep the pressure constant, the pressure-sensitive film 620 also recovers.

[0083] During the recovery process, due to the restriction of the fixing member 610, the pressure-sensitive diaphragm 620 will be unable to continue deforming after a certain degree of deformation. At this time, the metal film has not yet returned to its initial position and will continue to recover upward. At this time, the pressure in the receiving cavity 130 will continue to decrease. In order to maintain the pressure in the receiving cavity 130 consistent with the outside, fluid will be drawn in from the inlet 110. However, due to the restriction of the fixing member 610, the pressure-sensitive diaphragm 620 cannot deform into the receiving cavity 130. Therefore, the pressure-sensitive diaphragm 620 cannot create a gap, and the fluid cannot pass through the pressure-sensitive diaphragm 620. Thus, fluid cannot be drawn in from the outlet 120.

[0084] The unidirectional discharge structure 600 described above ensures that the cold and hot fluids are completely separated during the heat dissipation process. That is, the cold fluid at the inlet 110 is drawn in during the intake process, and there will be no situation where hot fluid is drawn in from the exhaust port to cool the surface of the superheat source.

[0085] Furthermore, by changing the pressure within the receiving cavity 130, the flow of fluid can be accelerated, thereby improving heat dissipation efficiency.

[0086] Based on the same inventive concept, embodiments of this application also provide a heat dissipation system, which includes a heat sink and a drive circuit.

[0087] The heat sink can be any of the heat sinks provided in the foregoing embodiments, and specific details can be found in the foregoing embodiments, which will not be elaborated here.

[0088] The drive circuit is electrically connected to the vibrating element 300 of the heat sink and is used to provide an electrical signal to the vibrating element 300 to make it vibrate.

[0089] In the embodiments of this application, the electrical connection between the drive circuit and the vibrating element 300 includes, but is not limited to, electrical connection via wires, or placing the vibrating element 300 within the electric field generated by the drive circuit.

[0090] In one embodiment of this application, the heat dissipation system may further include a coolant reservoir for providing fluid, and a radiator is disposed within the coolant reservoir.

[0091] In this embodiment, the coolant reservoir can provide coolant to the radiator as a fluid for heat dissipation, thereby improving the efficiency of heat dissipation.

[0092] Based on the same inventive concept, embodiments of this application also provide an electronic device, which may include a heat-dissipating component and a heat dissipation system.

[0093] In the embodiments of this application, the heat dissipation system may be a heat dissipation system including the heat sink provided in any of the foregoing embodiments. For details, please refer to the foregoing content, which will not be elaborated here.

[0094] In the embodiments of this application, the electronic device may be a smartphone, mobile phone, tablet, all-in-one computer, ultra-thin laptop, wearable electronic device, etc. The component to be heat-suppressed may be a chip, module, etc., within the electronic device.

[0095] The above description is merely an embodiment of this application and is not intended to limit the scope of protection of this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A radiator, characterized in that, include: The housing includes an inlet, an outlet, and a receiving cavity, the receiving cavity being located between the inlet and the outlet, and the outlet side being used to house the heat dissipation component; fluid flows into the receiving cavity through the inlet and is discharged through the outlet; An elastic membrane that allows the fluid to pass through is disposed at the inlet; A vibrating element, disposed on the surface of the elastic film, is used to receive electrical signals from the drive circuit to generate vibration; The elastic membrane stretches or contracts continuously with the vibration of the vibrating element, thereby changing the pressure inside the receiving cavity and allowing the fluid to enter and exit the receiving cavity.

2. The radiator according to claim 1, characterized in that, The vibrating element is a block made of piezoelectric material, and it is placed within the electric field generated by the driving circuit to receive the electrical signal of the electric field.

3. The radiator according to claim 2, characterized in that, The vibrating element is a piezoelectric ceramic block made of piezoelectric ceramic.

4. The radiator according to claim 1, characterized in that, The radiator also includes a filter screen; the filter screen is disposed at the inlet.

5. The radiator according to claim 1, characterized in that, The radiator also includes a heat dissipation base, which is disposed on the outlet side and is used to be mounted on the surface of the component to be cooled.

6. The radiator according to claim 5, characterized in that, The heat dissipation base includes a heat spreader plate, which is used to contact the surface of the component to be cooled.

7. The radiator according to any one of claims 1-6, characterized in that, The radiator also includes a one-way discharge structure disposed at the outlet. The one-way discharge structure allows fluid to flow out of the cavity of the receiving cavity through the outlet and restricts fluid outside the outlet from flowing back into the cavity of the receiving cavity.

8. The radiator according to claim 7, characterized in that, The unidirectional discharge structure includes: a pressure-sensitive diaphragm and a fixing member; both the pressure-sensitive diaphragm and the fixing member allow fluid to pass through. The pressure-sensitive film is used to deform in response to changes in pressure within the cavity; The fixing member is disposed on the side of the pressure-sensitive film near the receiving cavity, and the fixing member is used to limit the deformation of the pressure-sensitive module into the receiving cavity.

9. The radiator according to claim 8, characterized in that, The fastener includes a perforated plate or multiple fastening blocks arranged at preset intervals.

10. A heat dissipation system, characterized in that, include: The heat sink as described in any one of claims 1-9; The drive circuit is electrically connected to the vibrating element of the heat sink and is used to provide an electrical signal to the vibrating element to cause it to vibrate.

11. The heat dissipation system according to claim 10, characterized in that, The heat dissipation system also includes a coolant reservoir for supplying the fluid; The radiator is located inside the coolant reservoir.

12. An electronic device, characterized in that, The electronic device includes: Components to be cooled; The heat dissipation system as described in claim 10 or 11; The heat dissipation system is used to dissipate heat from the component to be cooled.

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