Sputtering cathode, cathode mechanism and magnetron sputtering device

Abstract

The utility model relates to a sputtering cathode, a cathode mechanism and a magnetron sputtering device. The sputtering cathode comprises a target tube, and a sputtering target material is arranged on the outer surface of the target tube; the tube sealing body is arranged in the target tube; the magnetic bar is arranged in the sealing pipe body; the multiple adjusting assemblies are sequentially arranged on the sealing pipe body at intervals in the axial direction of the sealing pipe body, and the multiple adjusting assemblies are connected with the magnetic bar and used for adjusting the distance between at least part of the magnetic bar and the sputtering target material; the adjusting assembly comprises a mounting base, a first mounting part and a lifting unit, the mounting base is arranged on the sealing pipe body and located on the side, back to the sputtering target, of the magnetic bar, a mounting space is formed in the mounting base, the first mounting part is arranged in the mounting space, and the lifting unit is arranged on the first mounting part and connected with the magnetic bar; the lifting unit is used for driving the magnetic bar to lift relative to the sputtering target. The adjusting assembly of the sputtering cathode is compact in structure, the distance between every two adjacent adjusting assemblies can be shortened, and the adjusting precision of the sputtering cathode is improved.

Description

Technical Field

[0001] This application relates to the field of magnetron sputtering technology, and in particular to sputtering cathodes, cathode mechanisms and magnetron sputtering apparatus. Background Technology

[0002] In magnetron sputtering, the uniformity of the film layer is typically adjusted by regulating the magnetic field strength on the target surface. A common method for adjusting the magnetic field strength is to adjust the distance between the magnet and the target surface. However, in current magnetron sputtering devices, the adjustment method used to regulate the distance between the magnet and the target surface is difficult to improve in terms of accuracy. Low accuracy affects the overall sputtering performance of the magnetron sputtering device. Utility Model Content

[0003] Therefore, it is necessary to provide a sputtering cathode, a cathode mechanism, and a magnetron sputtering device to address the aforementioned problem of difficulty in improving adjustment accuracy.

[0004] The target tube has a sputtering target material on its outer surface;

[0005] The sealing tube body is disposed inside the target tube;

[0006] A magnetic rod is disposed inside the sealing tube body; and,

[0007] Multiple adjustment components are sequentially and spaced apart along the axial direction of the sealing tube body. Each adjustment component is connected to the magnetic rod and is used to adjust the distance between at least a portion of the magnetic rod and the sputtering target. Each adjustment component includes a mounting base, a first mounting member, and a lifting unit. The mounting base is disposed on the sealing tube body and located on the side of the magnetic rod facing away from the sputtering target. The mounting base has an installation space. The first mounting member is disposed in the installation space. The lifting unit is disposed on the first mounting member and connected to the magnetic rod. The lifting unit is used to drive the magnetic rod to move up and down relative to the sputtering target.

[0008] In one embodiment, the magnetic rod includes a plurality of magnetic elements, which are sequentially disposed inside the sealing tube body along the axial direction of the sealing tube body; a plurality of adjustment components are connected to the plurality of magnetic elements in a one-to-one correspondence, and the adjustment components are capable of adjusting the distance between the corresponding magnetic element and the sputtering target.

[0009] In one embodiment, the adjustment assembly further includes a first connector detachably disposed on the side of the magnetic rod facing the adjustment assembly and connected to the lifting unit.

[0010] In one embodiment, the first mounting member has a first mounting groove, and the first mounting member has a first through hole on the side facing the first connector, the first through hole communicating with the first mounting groove; the lifting unit includes a driving member, a reducing member, and a lifting member, the driving member and the reducing member are both disposed in the first mounting groove, the output end of the driving member is connected to the reducing member, the lifting member is inserted into the first through hole, one end of the lifting member is connected to the reducing member, and the other end of the lifting member is connected to the first connector.

[0011] In one embodiment, the adjustment assembly further includes a position sensor and a controller disposed in the first mounting slot. The position sensor is located on one side of the lifting member, and the position sensor is communicatively connected to the controller and is used to monitor the position of the lifting member in real time and transmit real-time data to the controller. The controller is communicatively connected to the drive member and is used to receive the real-time data and control the movement of the drive member.

[0012] In one embodiment, the adjustment assembly further includes a first guide member disposed on the side of the first connector opposite to the magnetic rod; the first mounting member is correspondingly provided with a first guide channel for sliding the first guide member, the first guide channel being disposed along the direction in which the lifting unit drives the magnetic rod to rise and fall relative to the sputtering target.

[0013] In one embodiment, the mounting base has a second guide channel, which is arranged along the direction in which the lifting unit drives the magnetic rod to rise and fall relative to the sputtering target; the adjustment assembly further includes a second guide member, which includes a first end and a second end arranged opposite to each other, the first end being connected to the magnetic rod, and the second end being slidably disposed within the second guide channel.

[0014] In one embodiment, the sealing tube body has multiple mounting holes, which are spaced apart sequentially along the axial direction of the sealing tube body and correspond one-to-one with multiple mounting seats. The mounting seat includes a second mounting member and a third mounting member. The third mounting member is disposed inside the sealing tube body, and the second mounting member is disposed outside the sealing tube body and connected to the third mounting member. The second mounting member has a second mounting groove communicating with the mounting holes, and the third mounting member has a second through hole communicating with the mounting holes. The mounting space is formed by the second mounting groove, the second through hole, and the mounting holes.

[0015] A cathode mechanism includes an end, a support, and a sputtering cathode as described above. The sputtering cathode includes a third end and a fourth end disposed opposite to each other. The third end is detachably connected to the end and the fourth end is detachably connected to the support.

[0016] A magnetron sputtering apparatus includes a vacuum chamber and a cathode mechanism as described above, wherein the sputtering cathode of the cathode mechanism is disposed within the vacuum chamber.

[0017] The aforementioned sputtering cathode is equipped with multiple adjustment components, which are sequentially spaced along the axial direction of the sealing tube body and connected to a magnetic rod. These components are used to adjust the distance between at least a portion of the magnetic rod and the sputtering target. By integrating the lifting unit into the first mounting component, the space wasted due to component dispersion can be reduced, and the compactness of the adjustment components can be improved. The compact structure of the adjustment components reduces the space occupied and improves space utilization, thereby reducing the distance between two adjacent adjustment components. More adjustment components can be installed in the limited space inside the target tube, improving the adjustment accuracy of the sputtering cathode, enabling fine adjustment of the magnetic field strength on the outer surface of the target tube, improving the quality and uniformity of the thin film, and meeting more complex and variable production needs. Attached Figure Description

[0018] Figure 1 This is a schematic diagram of the structure of a sputtering cathode provided in an embodiment of this application.

[0019] Figure 2 This is a cross-sectional schematic diagram of a sputtering cathode provided in an embodiment of this application.

[0020] Figure 3 for Figure 2 Enlarged diagram of point A in the middle.

[0021] Figure 4 This is a schematic diagram of the structure of the adjustment component in a sputtering cathode provided in an embodiment of this application.

[0022] Figure 5 This is a schematic diagram of the sealing tube in a sputtering cathode according to an embodiment of this application.

[0023] Figure 6 This is a schematic diagram of the cathode mechanism provided in one embodiment of this application.

[0024] Reference numerals: 10, target tube; 20, sealing tube; 21, sealing tube body; 211, mounting hole; 212, mounting groove; 213, first chamber; 214, second chamber; 215, third chamber; 22, side tube; 221, base; 222, protrusion; 223, drainage hole; 30, magnetic rod; 31, magnetic component; 40, adjustment assembly; 41, mounting base; 412, second mounting component; 4123, second mounting groove; 413, third mounting component; 4131, Main body; 4132, Insertion part; 42, First mounting component; 421, First mounting groove; 422, First through hole; 423, First guide channel; 43, Lifting unit; 431, Driving component; 432, Speed ​​reducer; 433, Lifting component; 44, First connecting component; 45, First guide component; 46, Second guide component; 47, Position sensor; 50, Second connecting component; 100, End; 200, Sputtering cathode; 300, Support base. Detailed Implementation

[0025] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the specific embodiments of this application are described in detail below with reference to the accompanying drawings. Many specific details are set forth in the following description to provide a thorough understanding of this application. However, this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar modifications without departing from the spirit of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0026] In the description of this application, it should be understood that if terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential" appear, these terms indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0027] Furthermore, where the terms "first" and "second" appear, these terms are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this application, where the term "multiple" appears, "multiple" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0028] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise expressly limited. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0029] In this application, unless otherwise expressly specified and limited, the use of descriptions such as "above" or "below" the second feature indicates that the first and second features are in direct contact or indirect contact via an intermediate medium. Furthermore, "above," "on top of," and "over" the second feature can mean that the first feature is directly above or diagonally above the second feature, or simply that the first feature is at a higher horizontal level than the second feature. Similarly, "below," "below," and "under" the second feature can mean that the first feature is directly below or diagonally below the second feature, or simply that the first feature is at a lower horizontal level than the second feature.

[0030] It should be noted that if an element is referred to as being "fixed to" or "set on" another element, it can be directly on the other element or there may be an intervening element. If an element is considered to be "connected to" another element, it can be directly connected to the other element or there may be an intervening element. If so, the terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used in this application are for illustrative purposes only and do not represent the only possible implementation.

[0031] Please see Figure 1 and Figure 2 , Figure 1 This paper shows a schematic diagram of the structure of a sputtering cathode 200 provided in one embodiment of the present application. Figure 2A cross-sectional schematic diagram of a sputtering cathode 200 provided in one embodiment of this application is shown. The sputtering cathode 200 provided in one embodiment of this application includes a target tube 10, a sealing tube 20, a magnetic rod 30, and a plurality of adjustment components 40. A sputtering target material (not shown) is disposed on the outer surface of the target tube 10. The sealing tube 20 is disposed inside the target tube 10, and the magnetic rod 30 is disposed inside the sealing tube 20. The plurality of adjustment components 40 are sequentially and spaced apart along the axial direction of the sealing tube 20. Each adjustment component 40 is connected to the magnetic rod 30 and is used to adjust the distance between at least a portion of the magnetic rod 30 and the sputtering target material. The plurality of adjustment components 40 in the sputtering cathode 200 can collectively adjust the distance between the magnetic rod 30 and the sputtering target material. Simultaneously, each adjustment component 40 can independently adjust the position of the magnetic rod 30 relative to the sputtering target material, improving adjustment accuracy, precisely controlling the magnetic field strength on the target surface, helping to ensure the uniformity of the sputtering process, and improving the quality of the thin film.

[0032] In some embodiments, the sputtering cathode 200 further includes two second connectors 50, which are respectively disposed at both ends of the sealing tube 20, which facilitates the rapid installation and disassembly of the sputtering cathode 200 and the external structure.

[0033] In some embodiments, the magnetic rod 30 includes a plurality of magnetic elements 31, which are sequentially arranged inside the sealing tube 20 along the axial direction of the sealing tube 20. A plurality of adjustment components 40 are connected one-to-one with the plurality of magnetic elements 31 to adjust the distance between the plurality of magnetic elements 31 and the sputtering target. Each adjustment component 40 is used to adjust the distance between a corresponding magnetic element 31 and the sputtering target. Each magnetic element 31 can be independently adjusted in position, allowing for more flexible adaptation to different materials and process requirements. For example, under different sputtering target and atmosphere conditions, the position of each magnetic element 31 can be individually adjusted as needed to obtain the optimal sputtering effect. Furthermore, compared to a continuous magnetic rod 30 structure, the independent magnetic elements 31 are not constrained or interfered with by adjacent magnetic elements 31 when adjusting their position, allowing for a larger adjustment range. During sputtering, local fine-tuning of the magnetic field can be performed for different targets or different sputtering areas, precisely controlling the sputtering rate during the sputtering process, ensuring uniform deposition of the thin film throughout the entire area, and reducing problems such as uneven thickness.

[0034] Please refer to the following: Figure 3 and Figure 4 , Figure 3 It shows Figure 2 Enlarged diagram of point A in the middle. Figure 4A schematic diagram of the structure of the adjustment component 40 in the sputtering cathode 200 provided in one embodiment of this application is shown. In some embodiments, the adjustment component 40 includes a mounting base 41, a first mounting member 42, a lifting unit 43, and a first connecting member 44. The mounting base 41 is disposed on the sealing tube 20 and located on the side of the magnetic rod 30 facing away from the sputtering target. The mounting base 41 has an installation space. The first mounting member 42 is disposed in the installation space. The first connecting member 44 is disposed on the side of the magnetic rod 30 facing the adjustment component 40. The lifting unit 43 is disposed on the first mounting member 42 and connected to the first connecting member 44, and is used to drive the magnetic rod 30 to move up and down relative to the sputtering target.

[0035] In some embodiments, the first mounting member 42 has a first mounting groove 421 and a first through hole 422 on the side of the first mounting member 44 facing the first connector 44. The first through hole 422 communicates with the first mounting groove 421. The lifting unit 43 includes a driving member 431, a reducing member 432 and a lifting member 433. The driving member 431 and the reducing member 432 are both disposed in the first mounting groove 421. The output end of the driving member 431 is connected to the reducing member 432. The lifting member 433 is inserted into the first through hole 422. One end of the lifting member 433 is connected to the reducing member 432 and the other end of the lifting member 433 is connected to the first connector 44. In some embodiments, the drive component 431 is a motor, the output shaft of the motor is connected to the reducer 432, the reducer 432 is connected to the lifting component 433, the speed of the motor can be effectively reduced by the reducer 432, the speed of the lifting component 433 can be controlled by setting the reduction ratio, so as to ensure that the lifting action of the lifting component 433 is smooth and the lifting action of the lifting component 433 is precisely controlled, thereby precisely controlling the lifting of the magnetic rod 30 relative to the sputtering target and improving the adjustment accuracy.

[0036] In some embodiments, the adjustment assembly 40 further includes a position sensor 47 and a controller, both of which are disposed within the first mounting slot 421. The position sensor 47 is located on one side of the lifting member 433, and is communicatively connected to the controller, used to monitor the position of the lifting member 433 in real time and transmit real-time data to the controller. The controller is communicatively connected to the drive member 431, used to receive real-time data from the position sensor 47 and control the movement of the drive member 431. In some embodiments, the controller is used to control the start, stop, acceleration, or deceleration of the drive member 431. In some embodiments, the position sensor 47 includes, but is not limited to, a photoelectric sensor or a potentiometer sensor. By setting the position sensor 47 and the controller, precise control of the distance between the magnetic rod 30 and the sputtering target can be achieved, ensuring stability and efficiency during the sputtering process.

[0037] It is understandable that integrating the drive component 431, reducer 432, and lift component 433 of the lifting unit 43, as well as the position sensor 47 and controller, into the first mounting slot 421 of the first mounting component 42 can reduce the size of the external structure, avoid space waste caused by component dispersion, and thus improve the overall compactness of the adjustment assembly 40. The compact structure of the adjustment assembly 40 reduces the space occupied and improves space utilization. It can reduce the distance between two adjacent adjustment assemblies 40, allowing more adjustment assemblies 40 to be installed in the limited space inside the target tube 10, improving the adjustment accuracy of the sputtering cathode 200, realizing fine adjustment of the magnetic field strength on the outer surface of the target tube 10, improving the quality and uniformity of the thin film, and meeting more complex and variable production needs.

[0038] In some embodiments, the adjustment assembly 40 further includes a first guide 45, which is disposed on the side of the first connector 44 facing away from the magnetic rod 30. The first mounting member 42 is provided with a corresponding first guide channel 423, which is disposed along the direction in which the lifting unit 43 drives the magnetic rod 30 to rise and fall relative to the sputtering target. The position and shape of the first guide channel 423 are adapted to the first guide 45 for sliding of the first guide 45.

[0039] In some embodiments, the mounting base 41 has a second guide channel, which is arranged along the direction in which the lifting unit 43 drives the magnetic rod 30 to rise and fall relative to the sputtering target. The adjustment assembly 40 also includes a second guide member 46, which has a first end and a second end disposed opposite to each other. The first end is connected to the magnetic rod 30, and the second end is slidably disposed within the second guide channel. The first guide member 45 and the second guide member 46 of the adjustment assembly 40 ensure that the adjustment assembly 40 can achieve high-precision and high-stability control during the rising and falling of the magnetic rod 30, thereby maintaining a stable magnetic field strength and a uniform sputtering area.

[0040] Please refer to the following: Figure 5 , Figure 5 The diagram shows a schematic of the structure of the sealing tube 20 in the sputtering cathode 200 provided in one embodiment of the present application. In some embodiments, the sealing tube 20 includes a sealing tube body 21 and two side tubes 22. The two side tubes 22 are detachably disposed on both sides of the sealing tube body 21 for passing through cooling fluid, thereby effectively removing the heat from the sealing tube body 21. A magnetic rod 30 is disposed inside the sealing tube body 21, and multiple adjustment components 40 are sequentially and spaced apart along the axial direction of the sealing tube body 21.

[0041] In some embodiments, the sealing tube body 21 is recessed towards the interior of the sealing tube body 21 on the side near the side tube 22 to form a mounting groove 212, and the inner cavity of the sealing tube body 21 forms a first chamber 213, a second chamber 214, and a third chamber 215 arranged radially along the sealing tube body 21, the first chamber 213, the second chamber 214, and the third chamber 215 being interconnected. The side tube 22 includes a base portion 221 and a protrusion 222, wherein the base portion 221 has a first cooling channel (not shown) for cooling fluid to pass through, and the base portion 221 has a drainage hole 223 communicating with the first cooling channel for introducing cooling fluid from the target tube 10 into the cooling channel to remove heat from the sealing tube body 21. The protrusion 222 is located on the side of the base 221 near the sealing tube body 21. The side tube 22 and the sealing tube body 21 are connected by the protrusion 222 and the mounting groove 212. The protrusion 222 has a second cooling channel (not shown) for the cooling fluid to pass through. The second cooling channel is connected to the first cooling channel, which can remove the heat of the sealing tube body 21 more quickly and improve the heat dissipation efficiency.

[0042] In some embodiments, the sealing tube body 21 has a plurality of mounting holes 211, which are arranged sequentially at intervals along the axial direction of the sealing tube body 21 and correspond one-to-one with a plurality of mounting seats 41. The mounting seat 41 includes a second mounting member 412 and a third mounting member 413. The third mounting member 413 is disposed inside the sealing tube body 21, and the second mounting member 412 is disposed outside the sealing tube body 21 and connected to the third mounting member 413. The second mounting member 412 has a second mounting groove 4123 that communicates with the mounting holes 211. The third mounting member 413 has a second through hole that communicates with the mounting holes 211. The mounting space of the mounting seat 41 is formed by the second mounting groove 4123, the second through hole, and the mounting holes 211.

[0043] In some embodiments, the third mounting member 413 includes a main body 4131 and two insertion parts 4132. The main body 4131 is disposed in the second chamber 214 and the third chamber 215 of the sealing tube body 21. The two insertion parts 4132 are respectively disposed on the side of the main body 4131 near the inner wall of the sealing tube body 21. The third mounting member 413 and the sealing tube body 21 are connected by the insertion parts 4132 and the third chamber 215, which facilitates the quick installation and disassembly of the mounting base 41 and the sealing tube body 21.

[0044] The sputtering cathode 200 provided in this application is equipped with multiple compact adjustment components 40, reducing the space occupied and narrowing the distance between adjacent adjustment components 40. This allows for the installation of more adjustment components 40 within the limited space inside the target tube 10, thereby improving the adjustment accuracy of the sputtering cathode 200 and enabling fine adjustment of the magnetic field strength on the outer surface of the target tube 10. Furthermore, the magnetic rod 30 is composed of multiple magnetic elements 31 arranged sequentially, with each adjustment component 40 connected to a corresponding magnetic element 31. This allows each magnetic element 31 to be independently adjusted, providing greater flexibility to accommodate different materials and process requirements.

[0045] Please refer to the following: Figure 6 , Figure 6 A schematic diagram of a cathode mechanism according to an embodiment of this application is shown. The cathode mechanism includes an end 100, a support 300, and a sputtering cathode 200 as described above. The sputtering cathode 200 includes a third end and a fourth end disposed opposite to each other. The third end is detachably connected to the end 100, and the fourth end is detachably connected to the support 300. The end 100 is connected to an external high-voltage power supply or power system to provide a negative voltage to the sputtering cathode 200. The support 300 provides stable support for the sputtering cathode 200 to ensure that it does not shift during sputtering, thus ensuring the stability of the sputtering process. During magnetron sputtering, the end 100 transmits a negative voltage to the sputtering cathode 200 via an electrical connection, attracting positive ions in the gas and accelerating them to collide with the surface of the sputtering cathode 200. Under the action of the negative voltage, the positive ions are accelerated and collide with the sputtering target of the sputtering cathode 200, causing the sputtering target to be sputtered and deposited onto the substrate.

[0046] This application also provides a magnetron sputtering apparatus, which includes a vacuum chamber and a cathode mechanism as described above. The sputtering cathode 200 of the cathode mechanism is disposed within the vacuum chamber. The magnetron sputtering apparatus provided by this application can improve the sputtering process, making the sputtering process more stable and uniform, thereby improving the quality and consistency of thin film deposition, ensuring uniform film thickness, strong adhesion, and improving sputtering efficiency. In addition, the finely adjusted magnetic field can adapt to the sputtering characteristics of different materials, improving the flexibility and controllability of the process.

[0047] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0048] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this patent application should be determined by the appended claims.

Claims

1. A sputtering cathode, characterized in that, The sputtering cathode includes: The target tube has a sputtering target material on its outer surface; The sealing tube body is disposed inside the target tube; A magnetic rod is disposed inside the sealing tube body; and, Multiple adjustment components are sequentially and spaced apart along the axial direction of the sealing tube body. Each adjustment component is connected to the magnetic rod and is used to adjust the distance between at least a portion of the magnetic rod and the sputtering target. Each adjustment component includes a mounting base, a first mounting member, and a lifting unit. The mounting base is disposed on the sealing tube body and located on the side of the magnetic rod facing away from the sputtering target. The mounting base has an installation space. The first mounting member is disposed in the installation space. The lifting unit is disposed on the first mounting member and connected to the magnetic rod. The lifting unit is used to drive the magnetic rod to move up and down relative to the sputtering target.

2. The sputtering cathode according to claim 1, characterized in that, The magnetic rod includes multiple magnetic elements, which are sequentially arranged inside the sealing tube body along the axial direction of the sealing tube body; multiple adjustment components are connected to the multiple magnetic elements in a one-to-one correspondence, and the adjustment components can adjust the distance between the corresponding magnetic element and the sputtering target.

3. The sputtering cathode according to claim 1, characterized in that, The adjustment assembly further includes a first connector, which is detachably disposed on the side of the magnetic rod facing the adjustment assembly and connected to the lifting unit.

4. The sputtering cathode according to claim 3, characterized in that, The first mounting component has a first mounting groove, and the first mounting component has a first through hole on the side facing the first connector, the first through hole communicating with the first mounting groove; the lifting unit includes a driving component, a reducing component, and a lifting component, the driving component and the reducing component are both disposed in the first mounting groove, the output end of the driving component is connected to the reducing component, the lifting component is inserted into the first through hole, one end of the lifting component is connected to the reducing component, and the other end of the lifting component is connected to the first connector.

5. The sputtering cathode according to claim 4, characterized in that, The adjustment assembly further includes a position sensor and a controller disposed in the first mounting slot. The position sensor is located on one side of the lifting component and is communicatively connected to the controller. The position sensor is used to monitor the position of the lifting component in real time and transmit real-time data to the controller. The controller is communicatively connected to the drive component and is used to receive the real-time data and control the movement of the drive component.

6. The sputtering cathode according to claim 3, characterized in that, The adjustment assembly further includes a first guide member disposed on the side of the first connector opposite to the magnetic rod; the first mounting member is provided with a first guide channel for sliding the first guide member, and the first guide channel is disposed along the direction in which the lifting unit drives the magnetic rod to rise and fall relative to the sputtering target.

7. The sputtering cathode according to claim 1, characterized in that, The mounting base has a second guide channel, which is arranged along the direction in which the lifting unit drives the magnetic rod to rise and fall relative to the sputtering target. The adjustment component also includes a second guide member, which includes a first end and a second end that are arranged opposite to each other. The first end is connected to the magnetic rod, and the second end is slidably disposed in the second guide channel.

8. The sputtering cathode according to claim 1, characterized in that, The sealing tube body has multiple mounting holes, which are spaced apart sequentially along the axial direction of the sealing tube body and correspond one-to-one with multiple mounting seats. Each mounting seat includes a second mounting member and a third mounting member. The third mounting member is disposed inside the sealing tube body, and the second mounting member is disposed outside the sealing tube body and connected to the third mounting member. The second mounting member has a second mounting groove communicating with the mounting holes, and the third mounting member has a second through hole communicating with the mounting holes. The mounting space is formed by the second mounting groove, the second through hole, and the mounting holes.

9. A cathode mechanism, characterized in that, The cathode mechanism includes an end head, a support base, and a sputtering cathode as described in any one of claims 1-8. The sputtering cathode includes a third end and a fourth end disposed opposite to each other. The third end is detachably connected to the end head, and the fourth end is detachably connected to the support base.

10. A magnetron sputtering apparatus, characterized in that, The magnetron sputtering apparatus includes a vacuum chamber and a cathode mechanism as described in claim 9, wherein the sputtering cathode of the cathode mechanism is disposed within the vacuum chamber.

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