Multi-dimensional movement device for adjusting position of wafer in vacuum cavity

Abstract

The utility model discloses a multi-dimensional movement device for adjusting the position of a wafer in a vacuum cavity. Comprising a central shaft, the top of the central shaft extends into a vacuum cavity and is connected with a tray for placing wafers, and a vacuum inner cavity locking plate is arranged right above the tray in the vacuum cavity; the lifting support plate is mounted outside the vacuum cavity; the lifting mechanism is arranged on the lifting supporting plate; the fine adjustment mechanism comprises a fine adjustment supporting plate and a fine adjustment assembly connected with the fine adjustment supporting plate, and the fine adjustment assembly is connected with the center shaft; the lifting mechanism is connected with the fine adjustment supporting plate; the rotating mechanism is connected with the lower end of the central shaft; and the locking feedback assembly is used for detecting whether the tray is in contact locking with the vacuum inner cavity locking plate or not. According to the device provided by the utility model, multiple functions are integrated, the position of the tray in the vacuum cavity can be adjusted in multiple dimensions, functional choices are provided for different processes, and the functions of up-and-down movement, rotary movement, tray position locking, tray position micro adjustment and the like of a wafer in the cavity can be realized.

Description

Technical Field

[0001] This utility model relates to the field of wafer processing equipment technology, and more specifically, to a multi-dimensional motion device for adjusting the position of a wafer in a vacuum cavity. Background Technology

[0002] Wafer deposition is a key technology in semiconductor manufacturing, which involves depositing thin films of different materials on the surface of a wafer. These films can be metals, dielectrics, or semiconductor materials.

[0003] Wafer coating is usually carried out in a high vacuum environment because the vacuum environment can reduce collisions of gas molecules, thereby avoiding the incorporation of gas impurities into the film and ensuring the quality and purity of the film.

[0004] Existing vacuum coating equipment has a simple structure and cannot achieve multi-dimensional movement. Most of them suffer from poor uniformity of wafer coating. In addition, some processes require placing the wafer in a vacuum cavity for coating, and it is not possible to intuitively determine whether the tray has been locked. Utility Model Content

[0005] In view of this, the purpose of this utility model is to provide a multi-dimensional motion device for adjusting the position of a wafer in a vacuum cavity. The device provided by this utility model integrates multiple functions and can adjust the position of the tray in the vacuum cavity in multiple dimensions, providing functional options for different processes. It can enable the wafer to move up and down, rotate, lock the tray position, and make minor adjustments to the tray position in the cavity.

[0006] To achieve the above objectives, the technical solution of this utility model is as follows:

[0007] A multi-dimensional motion device for adjusting the position of a wafer within a vacuum cavity includes:

[0008] A central shaft, the top of which extends into a vacuum chamber and connects to a tray for placing wafers, wherein a vacuum chamber locking plate is provided directly above the tray.

[0009] The lifting support plate is installed outside the vacuum chamber;

[0010] The lifting mechanism is mounted on the lifting support plate;

[0011] The fine-tuning mechanism includes a fine-tuning support plate and a fine-tuning component connected to the fine-tuning support plate. The fine-tuning component is connected to the central shaft and is used to adjust the position of the central shaft. The lifting mechanism is connected to the fine-tuning support plate and is used to drive the fine-tuning support plate to move up and down, thereby driving the central shaft to move up and down.

[0012] A rotating mechanism, connected to the lower end of the central shaft, is used to drive the central shaft to rotate;

[0013] A locking feedback component, connected to the fine-tuning component, is used to detect whether the tray is in contact with and locked by the vacuum cavity locking plate;

[0014] When the lifting mechanism drives the central axis to move upward, causing the tray to contact and lock with the vacuum cavity locking plate, the tray is subjected to a downward force, which acts on the fine-tuning component and the locking feedback component in sequence through the central axis.

[0015] Furthermore, the fine-tuning component includes an adjustment plate connected to the fine-tuning support plate, a movable plate connected to the adjustment plate, and an adjustment base connected to the movable plate, wherein the central axis is connected to the adjustment base;

[0016] The adjustment plate is provided with multiple sets of knob mechanisms. Driving the knob mechanisms can cause the moving plate to move in the horizontal direction, thereby causing the adjustment base and the central shaft to move in the corresponding directions.

[0017] Furthermore, the knob mechanism is provided in three sets. The lifting mechanism is distributed on one side of the adjustment plate, and the knob mechanism is provided on the other three sides respectively. Taking the side where the lifting mechanism is located as the rear side, the knob mechanisms on the left and right sides of the adjustment plate are all located close to the side of the lifting mechanism.

[0018] The knob mechanism includes a mounting block disposed on the side of the adjustment plate. An adjustment groove is provided on the adjustment plate corresponding to the front end of the mounting block. A fixing block connected to the moving plate is disposed in the adjustment groove. A screw is movably disposed in the mounting block. One end of the screw extends into the adjustment groove and is connected to a top block for pushing the fixing block. The other end is connected to a knob handle.

[0019] Furthermore, adjustment screws are provided at the four corners of the lower end of the adjustment base, and the upper ends of the adjustment screws pass through the four corners of the adjustment base and contact the bottom of the movable plate.

[0020] Furthermore, the locking feedback component includes a feedback plate, which is connected to the adjustment plate via a connector, and the feedback plate is provided with a probe for detecting the position information of the feedback plate.

[0021] Furthermore, the feedback plate is positioned above the adjustment plate, the connector moves through the fine-tuning support plate and connects to the adjustment plate, and a spring is also fitted onto the connector.

[0022] Furthermore, three connectors are provided, arranged in a triangular pattern on the feedback plate.

[0023] Furthermore, the rotating mechanism includes a rotary motor and a motor mounting plate. The motor mounting plate is connected to the adjusting base, and the rotary motor is mounted on the motor mounting plate, with its output end connected to the bottom of the central shaft via a transmission connection.

[0024] Furthermore, a vacuum bellows and a magnetic fluid are also provided on the central shaft between the lifting support plate and the fine-tuning mechanism; the upper end of the vacuum bellows is sealed to the lifting support plate, and the lower end is sealed to the magnetic fluid.

[0025] The upper end of the adjustment base passes through the moving plate and the adjustment plate, and then is sealed to the lower end of the magnetic fluid through a transition plate.

[0026] Furthermore, the lifting mechanism includes a slide rail disposed on the lifting support plate, a slider slidably connected on the slide rail, a lifting drive component being drivenly connected to the slider, the fine-tuning support plate being connected to the slider through a slider connecting plate, and the lifting drive component being used to drive the slider to move up and down along the slide rail, thereby driving the fine-tuning support plate to move up and down.

[0027] The beneficial effects of this utility model are as follows:

[0028] The device provided by this invention integrates multiple functions, allowing for multi-dimensional adjustment of the tray position within the vacuum chamber and providing functional options for different processes. It enables the wafer to move vertically and rotate within the chamber, lock the tray position, and perform minute adjustments to the tray position. This improves process efficiency and film uniformity; optimizes the wafer transport method during the process; enhances the overall wafer coating process; and significantly increases production efficiency. Attached Figure Description

[0029] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained based on these drawings.

[0030] Figure 1 This is a schematic diagram of the three-dimensional structure of this utility model. Figure 1 .

[0031] Figure 2 This is a schematic diagram of the three-dimensional structure of this utility model. Figure 2 .

[0032] Figure 3 This is a cross-sectional structural diagram of the present invention.

[0033] Figure 4This is a schematic diagram of the micro-adjustment mechanism of this utility model, omitting some components. Figure 1 .

[0034] Figure 5 This is a schematic diagram of the micro-adjustment mechanism of this utility model, omitting some components. Figure 2 .

[0035] Explanation of reference numerals in the attached figures:

[0036] 1. Vacuum chamber; 2. Tray; 3. Central shaft; 4. Lifting support plate; 5. Lifting mechanism; 5a. Slide rail; 5b. Slider; 5c. Lifting drive component;

[0037] 6. Vacuum bellows; 7. Magnetofluid; 8. Slider connecting plate; 9. Fine-tuning support plate; 10. Adjustment plate; 11. Moving plate; 12. Adjustment base; 13. Probe; 14. Feedback plate; 15. Shaft gear; 16. Motor gear; 17. Rotary motor; 18. Vacuum inner cavity locking plate; 19. Transition plate; 20. Knob mechanism; 20a. Mounting block; 20b. Adjustment groove; 20c. Fixing block; 20d. Screw; 20e. Top block; 20f. Knob handle;

[0038] 21. Adjusting screw; 22. Connector; 23. Spring; 24. Motor mounting plate; 25. Set screw; 26. Positioning washer; 27. Locking screw. Detailed Implementation

[0039] The structure provided by this utility model will be explained and described in detail below with reference to the accompanying drawings.

[0040] refer to Figures 1 to 5 As shown, this embodiment specifically discloses a multi-dimensional motion device for adjusting the position of a wafer within a vacuum cavity, comprising:

[0041] The central shaft 3 extends to the vacuum chamber 1 and is connected to the tray 2 for placing the wafer. A vacuum chamber locking plate 18 is provided in the vacuum chamber 1 directly above the tray 2.

[0042] The lifting support plate 4 is installed outside the vacuum chamber 1;

[0043] The lifting mechanism 5 is mounted on the lifting support plate 4;

[0044] The fine-tuning mechanism includes a fine-tuning support plate 9 and a fine-tuning component connected to the fine-tuning support plate 9. The fine-tuning component is connected to the central shaft 3 and is used to adjust the position of the central shaft 3. The lifting mechanism 5 is connected to the fine-tuning support plate 9 and is used to drive the fine-tuning support plate 9 to move up and down, thereby driving the central shaft 3 to move up and down.

[0045] A rotating mechanism, connected to the lower end of the central shaft 3, is used to drive the central shaft 3 to rotate;

[0046] A locking feedback component, connected to the fine-tuning component, is used to detect whether the tray 2 is in contact with and locked by the vacuum cavity locking plate 18;

[0047] When the lifting mechanism 5 drives the central shaft 3 to move upward, so that the tray 2 contacts and locks with the vacuum inner cavity locking plate 18, the tray 2 is subjected to a downward force, which acts on the fine-tuning component and the locking feedback component in sequence through the central shaft 3.

[0048] The tray 2 is used to place the wafer, and the lifting support plate 4 is used to install the lifting mechanism 5. The lifting mechanism 5 is used to drive the fine-tuning mechanism to move up and down, which in turn drives the central rod 3 connected to the fine-tuning component to move up and down. This allows the wafer to move to the top of the vacuum inner cavity locking plate 18 during the process (coating, etc.) to achieve a vacuum inner cavity environment. After the process is completed, the tray 2 can be moved down, which facilitates automated operation and improves vacuum coating efficiency.

[0049] The fine-tuning component can be used to adjust the position of the center rod 3, and thus the position of the tray 2, so that the tray 2 is always located at the center of the vacuum chamber 1, ensuring coating uniformity. The rotating mechanism can also solve the problem of wafer coating uniformity; it can effectively solve the non-uniformity phenomenon in the gas deposition process.

[0050] In the illustrated embodiment, the lifting mechanism 5 includes a slide rail 5a mounted on the lifting support plate 4, a slider 5b slidably connected to the slide rail 5a, and a lifting drive component 5c drivingly connected to the slider 5b. The fine-tuning support plate 9 is connected to the slider 5b via a slider connecting plate 8. The lifting drive component 5c is used to drive the slider 5b to move up and down along the slide rail 5a, thereby driving the fine-tuning support plate 9 to move up and down, and thus driving the fine-tuning component, the central shaft 3, and the tray 2 to move up and down. The lifting drive component 5c can be implemented by a lifting motor combined with a transmission component and a lead screw, or it can be a structure such as an electric push rod, as long as it can drive the slider 5b to move up and down along the slide rail 5a.

[0051] The lifting mechanism 5 and the fine-tuning mechanism can accurately position the tray 2 and lock the tray 2 in contact with the vacuum inner cavity locking plate 18.

[0052] During the locking process, the tray 2 will be subjected to a downward force. The tray 2 is connected to the central shaft 3, the central shaft 3 is connected to the fine-tuning component, and the fine-tuning component is connected to the locking feedback component. Therefore, the downward force on the tray 2 can be transmitted to the locking feedback component in sequence through the central shaft and the fine-tuning component, so that the locking feedback component can detect the downward force and thus determine that the tray 2 is locked in the vacuum chamber 1.

[0053] Continue to refer to Figures 1 to 3In this embodiment, the fine-tuning component includes an adjustment plate 10 connected to the fine-tuning support plate 9, a movable plate 11 connected to the adjustment plate 10, and an adjustment base 12 connected to the movable plate 11. The central shaft 3 is connected to the adjustment base 12.

[0054] The adjustment plate 10 is provided with multiple sets of knob mechanisms 20. Driving the knob mechanism 20 can drive the moving plate 11 to move in the horizontal direction, thereby driving the adjustment base 12 and the central shaft 3 to move in the corresponding direction.

[0055] In this embodiment, the fine-tuning component mainly consists of a three-layer structure. The edge of the moving plate 11 is connected and fixed to the adjusting plate 10 by a positioning washer 26 and a locking screw 27. The moving plate 11 has a through hole at the position corresponding to the positioning washer 26. The locking screw 27 passes through the through hole and is connected to the adjusting plate 10. The diameter of the through hole is larger than the outer diameter of the locking screw 27 and smaller than the outer diameter of the positioning washer 26, so that after the locking screw 27 is loosened, the moving plate 11 can move back and forth and left and right relative to the locking screw 27 without restricting it.

[0056] In the illustrated embodiment, three sets of positioning pads 26 and locking screws 27 are provided, arranged in a triangular pattern to ensure connection stability.

[0057] When the position of the tray 2 is finely adjusted in all directions, the fine-adjustment support plate 9 is a fixed plate and does not move; the adjustment plate 10 is also a fixed plate and does not move; the movable plate 11 can move under the action of the knob mechanism 20. Since the movable plate 11 is connected to the adjustment base 12 and the central shaft 3 is connected to the adjustment base 12, the movable plate 11 can drive the adjustment base 12 to move, thereby moving the central shaft 3 and finally realizing the movement and adjustment of the tray 2.

[0058] In the illustrated embodiment, the adjustment base 12 has a base plate, and a set screw 25 is provided at each of the four corners of the base plate. The base plate is connected to the movable plate 11 through the four set screws 25. At the same time, the adjustment base 12 is also provided with adjustment screws 21 at the four corners of the base plate. The upper end of the adjustment screw 21 passes through the base plate of the adjustment base 12 and contacts the bottom of the movable plate 11.

[0059] When it is necessary to fine-tune the vertical angle of the central axis 3, the set screw 25 can be loosened first, and the tilt angle of the base 12 can be adjusted using the four adjusting screws 21. This can offset the error in the assembly process and keep the tray 2 horizontal in the vacuum chamber 1. After the adjustment is completed, the set screw 25 can be tightened.

[0060] In some embodiments, the adjusting base 12 further has a cylindrical portion protruding upward along the center of the substrate, and a vacuum bellows 6 and a magnetic fluid 7 are also provided on the central shaft 3 between the lifting support plate 4 and the cylindrical portion; the upper end of the vacuum bellows 6 is sealed to the lifting support plate 4, and the lower end is sealed to the magnetic fluid 7.

[0061] The upper end of the adjusting base 12, i.e., the cylindrical part, passes through the moving plate 11, the adjusting plate 10 and the fine-tuning support plate 9 in sequence, and then is sealed to the lower end of the magnetic fluid 7 through the transition plate 19. It can be understood that the cylindrical part is fixedly sleeved on the outer periphery of the central shaft 3, and a gap space is formed between the outer wall of the cylindrical part and the adjusting plate 10 and the fine-tuning support plate 9, so that when fine-tuning, the adjusting base 12 can drive the central shaft 3 to move back and forth and left and right relative to the adjusting plate 10 and the fine-tuning support plate 9.

[0062] By setting up the vacuum bellows 6, the magnetic fluid 7, and the cylindrical part, the sealing performance at the connection between the central shaft 3 and the vacuum chamber 1 can be improved, ensuring the vacuum level inside the vacuum chamber 1. Of course, in some other embodiments, the magnetic fluid 7 can also be set below the fine-tuning component, that is, at the lower end of the base plate of the adjustment base 12. In this case, the upper end of the cylindrical part can be connected to the lower end of the vacuum bellows 6.

[0063] Continue to combine Figure 4 and Figure 5 In some embodiments, the knob mechanism 20 is provided in three sets around the adjustment plate 10, with the lifting mechanism 5 distributed on one side and a set of knob mechanisms 20 provided on the other three sides respectively; with the side where the lifting mechanism 5 is located as the rear side, the knob mechanisms 20 located on the left and right sides of the adjustment plate 10 are all set close to the side of the lifting mechanism 5, that is, off the center position of the adjustment plate 10.

[0064] The knob mechanism 20 includes a mounting block 20a disposed on the side of the adjustment plate 10. In this embodiment, the mounting block 20a and the adjustment plate 10 are a machined part, that is, the mounting block 20a is integrally formed on the adjustment plate 10, which makes the structure more stable. An adjustment groove 20b is provided on the adjustment plate 10 corresponding to the front end of the mounting block 20a. A fixing block 20c fixedly connected to the moving plate 11 is disposed in the adjustment groove 20b. A screw 20d is movably passed through the mounting block 20a, that is, the screw 20d and the mounting block 20a are in a smooth rod fit. One end of the screw 20d extends into the adjustment groove 20b and is connected to a top block 20e for pushing the fixing block 20c. The other end is connected to a knob handle 20f.

[0065] During the specific adjustment, first loosen the three locking screws 27, and then adjust the knob handle 20f. This will push the fixed block 20c fixed on the moving plate 11 through the top block 20e to adjust the base 12 to move in the specified direction, thereby driving the central shaft 3 and the tray 2 to move in the corresponding direction, so as to achieve fine adjustment of the tray in the horizontal direction within the vacuum chamber 1.

[0066] By setting the knob mechanisms 20 on the left and right sides eccentrically, the knob mechanisms 20 on the left and right sides can cooperate with each other to not only adjust the moving plate 11 left and right, but also drive the moving plate 11 to move in a direction away from the lifting mechanism 5, without having to set the knob mechanism 20 on the side close to the lifting mechanism 5.

[0067] Furthermore, the adjusting groove 20b has a straight segment extending linearly relative to the corresponding mounting block 20a and an inclined segment at a certain angle to the corresponding mounting block 20a. The inclined segment and the straight segment are interconnected, and the inclined direction of the inclined segment is inclined toward the side away from the lifting mechanism 5. The fixing block 20c is located in the inclined segment, that is, the fixing block 20c is inclinedly set in the adjusting groove 20b, and the front end of the top block 20e has an inclined surface adapted to the inclined angle of the fixing block 20c.

[0068] Continue to refer to Figures 1 to 3 The locking feedback component includes a feedback plate 14, which is connected to an adjustment plate 10 via a connector 22. The feedback plate 14 is equipped with a probe 13 for detecting its position. The connector 22 can be a screw. The edge of the feedback plate 14 is supported above a fine-tuning support plate 9 via the connector 22, and there is a certain distance between the feedback plate 14 and the fine-tuning support plate 9. The lower end of the connector 22 passes through the fine-tuning support plate 9 and connects to the adjustment plate 10. A spring 23 is also fitted onto the connector 22 between the fine-tuning support plate 9 and the feedback plate 14, providing a buffering effect. In the illustrated embodiment, three connectors 22 are also provided, arranged in a triangular pattern, ensuring stable connection while minimizing the number of connectors 22 and reducing manufacturing costs.

[0069] During the locking process, tray 2 is subjected to a downward force, which acts on the magnetofluid 7, adjustment base 12, moving plate 11, and adjustment plate 10 through the central shaft 3. Because the feedback plate 14 is connected to the adjustment plate 10 through three connectors 22, i.e. screws, the feedback plate 14 tends to move downward. This causes the probe 13 in contact with it to detect the change in position, and the reading of the probe 13 will change. Therefore, when the change in the probe reading is observed, it means that the wafer has been locked in the vacuum cavity, realizing a direct judgment of the locking of tray 2.

[0070] In some embodiments, the rotating mechanism includes a rotary motor 17 and a motor mounting plate 24. The motor mounting plate 24 is connected to the adjustment base 12. The rotary motor 17 is mounted on the motor mounting plate 24, and its output end is connected to the bottom of the central shaft 3 via a transmission connection.

[0071] Specifically, a motor gear 16 is connected to the output end of the rotary motor 17, and a shaft gear 15 that meshes with the motor gear is provided at the bottom of the central shaft 3. The rotary motor 17 drives the motor gear 16, the shaft gear 15, and the central shaft 3 to rotate in sequence, so as to achieve the effect of the tray 2 driving the wafer to rotate in the vacuum chamber 1.

[0072] In some embodiments, the motor mounting plate 24 and the adjustment base 12 can be integrally molded, which can reduce assembly time, reduce additional connecting parts, and make the overall structure more compact.

[0073] In the description of this utility model, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc., indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the accompanying drawings, and are only for the convenience of describing this utility model and simplifying the description, and are not intended to indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this utility model.

[0074] In this utility model, unless otherwise explicitly specified and limited, the terms "installation," "connection," "joining," and "fixing," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication of two components or the interaction between two components, unless otherwise explicitly limited. Those skilled in the art can understand the specific meaning of the above terms in this utility model according to the specific circumstances.

[0075] In the description of this specification, the references to terms such as "this embodiment," "an embodiment," "some embodiments," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in a suitable manner in any at least one embodiment or example. Moreover, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0076] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of indicated technical features. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of that feature. In the description of this utility model, "a plurality of" means at least two, such as two, three, etc., unless otherwise explicitly specified.

[0077] The above description is only a preferred embodiment of the present utility model and is not intended to limit the present utility model. Any modifications, equivalent substitutions and simple improvements made on the substantive content of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A multi-dimensional motion device for adjusting the position of a wafer within a vacuum cavity, characterized in that, include: A central shaft (3) extends to the top of a vacuum chamber (1) and is connected to a tray (2) for placing wafers. A vacuum chamber locking plate (18) is provided in the vacuum chamber (1) directly above the tray (2). The lifting support plate (4) is installed outside the vacuum chamber (1); The lifting mechanism (5) is mounted on the lifting support plate (4); The fine-tuning mechanism includes a fine-tuning support plate (9) and a fine-tuning component connected to the fine-tuning support plate (9). The fine-tuning component is connected to the central shaft (3) and is used to adjust the position of the central shaft (3). The lifting mechanism (5) is connected to the fine-tuning support plate (9) and is used to drive the fine-tuning support plate (9) to move up and down, thereby driving the central shaft (3) to move up and down. A rotating mechanism is connected to the lower end of the central shaft (3) and is used to drive the central shaft (3) to rotate; A locking feedback component, connected to the fine-tuning component, is used to detect whether the tray (2) is in contact with and locked by the vacuum cavity locking plate (18); When the lifting mechanism (5) drives the central shaft (3) to move upward, so that the tray (2) contacts and locks with the vacuum cavity locking plate (18), the tray (2) is subjected to a downward force, which acts on the fine-tuning component and the locking feedback component in sequence through the central shaft (3).

2. The multi-dimensional motion device for adjusting the position of a wafer within a vacuum cavity according to claim 1, characterized in that, The fine-tuning assembly includes an adjustment plate (10) connected to the fine-tuning support plate (9), a movable plate (11) connected to the adjustment plate (10), and an adjustment base (12) connected to the movable plate (11), wherein the central shaft (3) is connected to the adjustment base (12); The adjustment plate (10) is provided with multiple sets of knob mechanisms (20). Driving the knob mechanism can drive the moving plate (11) to move in the horizontal direction, thereby driving the adjustment base (12) and the central shaft (3) to move in the corresponding direction.

3. The multi-dimensional motion device for adjusting the position of a wafer within a vacuum cavity according to claim 2, characterized in that, The knob mechanism (20) is provided in three sets. The lifting mechanism (5) is distributed on one side of the adjustment plate (10), and the knob mechanism (20) is provided on the other three sides respectively. Taking the side where the lifting mechanism (5) is located as the rear side, the knob mechanisms (20) located on the left and right sides of the adjustment plate (10) are all located close to the side of the lifting mechanism (5). The knob mechanism (20) includes a mounting block (20a) disposed on the side of the adjustment plate (10). An adjustment groove (20b) is provided on the adjustment plate (10) corresponding to the front end of the mounting block (20a). A fixing block (20c) connected to the moving plate (11) is disposed in the adjustment groove (20b). A screw (20d) is movably inserted in the mounting block (20a). One end of the screw (20d) extends into the adjustment groove (20b) and is connected to a top block (20e) for pushing the fixing block (20c). The other end is connected to a knob handle (20f).

4. The multi-dimensional motion device for adjusting the position of a wafer within a vacuum cavity according to claim 2, characterized in that, Adjusting screws (21) are also provided at the four corners of the lower end of the adjusting base (12). The upper ends of the adjusting screws (21) pass through the four corners of the adjusting base (12) and contact the bottom of the moving plate (11).

5. The multi-dimensional motion device for adjusting the position of a wafer within a vacuum cavity according to claim 2, characterized in that, The locking feedback component includes a feedback plate (14), which is connected to the adjustment plate (10) via a connector (22). The feedback plate (14) is provided with a probe (13) for detecting the position information of the feedback plate (14).

6. The multi-dimensional motion device for adjusting the position of a wafer within a vacuum cavity according to claim 5, characterized in that, The feedback plate (14) is positioned above the adjustment plate (10), and the connector (22) is movably connected to the adjustment plate (10) through the fine-tuning support plate (9). A spring (23) is also sleeved on the connector (22).

7. The multi-dimensional motion device for adjusting the position of a wafer within a vacuum cavity according to claim 6, characterized in that, Three connectors (22) are provided, arranged in a triangular pattern on the feedback plate (14).

8. The multi-dimensional motion device for adjusting the position of a wafer within a vacuum cavity according to claim 2, characterized in that, The rotating mechanism includes a rotary motor (17) and a motor mounting plate (24). The motor mounting plate (24) is connected to the adjusting base (12). The rotary motor (17) is mounted on the motor mounting plate (24), and its output end is connected to the bottom of the central shaft (3) via a transmission connection.

9. The multi-dimensional motion device for adjusting the position of a wafer within a vacuum cavity according to claim 2, characterized in that, The central shaft (3) is also provided with a vacuum bellows (6) and a magnetic fluid (7) located between the lifting support plate (4) and the fine adjustment mechanism; the upper end of the vacuum bellows (6) is sealed to the lifting support plate (4), and the lower end is sealed to the magnetic fluid (7); The upper end of the adjustment base (12) passes through the moving plate (11), the adjustment plate (10) and the fine-tuning support plate (9) and is then sealed to the lower end of the magnetic fluid (7) via the transition plate (19).

10. The multi-dimensional motion device for adjusting the position of a wafer within a vacuum cavity according to claim 1, characterized in that, The lifting mechanism (5) includes a slide rail (5a) mounted on the lifting support plate (4), a slider (5b) slidably connected to the slide rail (5a), a lifting drive component (5c) being driven by the slider (5b), and the fine-tuning support plate (9) being connected to the slider (5b) via a slider connecting plate (8). The lifting drive component (5c) is used to drive the slider (5b) to move up and down along the slide rail (5a), thereby driving the fine-tuning support plate (9) to move up and down.

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