Current measuring device for a power module
By setting independently grounded shielding structures and transmission components on the upper and lower surfaces of the Rogowski coil, the problem of inductive coupling interference between multiple Rogowski coils is solved, and the accuracy and real-time performance of current measurement are achieved.
Patent Information
- Application Number
- CN202422584774.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Utility models(China)
- Current Assignee / Owner
- Filing Date
- 2024-10-24
- Publication Date
- 2025-10-31
- Estimated Expiration
- 2034-10-24
AI Technical Summary
In the case of multiple Rogowski coils, inductive coupling interference exists between adjacent Rogowski coils, leading to inaccurate current measurement results.
Independent first and second shielding structures are used to cover the upper and lower surfaces of the Rogowski coil, respectively, and these shielding layers are grounded to avoid inductive coupling interference between adjacent Rogowski coils. At the same time, current signals are transmitted through cables and signal processing devices to achieve real-time detection.
It effectively suppresses capacitive and inductive coupling interference, ensuring the accuracy and real-time performance of current measurement.
Smart Images
Figure CN223501067U_ABST
Abstract
Description
Technical Field
[0001] This utility model relates to the field of semiconductor technology, and more specifically, to a current measuring device for a power module. Background Technology
[0002] Electrostatic shielding is a widely used structure for Rogowski coils. Rogowski coils are used to measure changing currents, which generate time-varying electric and magnetic fields in space, potentially leading to measurement errors. For a single Rogowski coil, inductive coupling interference can be suppressed by introducing a return line, while capacitive coupling interference can be suppressed by electrostatic shielding. Taking a Rogowski coil on a PCB as an example, the electrostatic shielding structure involves introducing grounded copper layers above and below the Rogowski coil to guide the capacitive coupling interference current into the ground, thus suppressing capacitive coupling interference.
[0003] However, in the case of multiple Rogowski coils in the electrostatic shielding of related technologies, inductive coupling interference will occur between two adjacent Rogowski coils, which will lead to interference during Rogowski coil measurement and result in inaccurate current measurement results. Utility Model Content
[0004] This invention provides a current measuring device for power modules to solve the problem in related technologies where, in the presence of multiple Rogowski coils in an electrostatic shield, inductive coupling interference occurs between adjacent Rogowski coils, leading to inaccurate current measurement results due to interference during Rogowski coil measurement.
[0005] This utility model provides a current measuring device for a power module. The current measuring device for a power module includes: a PCB board, comprising a first shielding structure, a Rogowski coil layer, and a second shielding structure. The Rogowski coil layer is disposed between the first shielding structure and the second shielding structure. Multiple Rogowski coils corresponding to multiple chips within the power module are disposed within the Rogowski coil layer, with each Rogowski coil corresponding to one of the multiple chips. The first shielding structure has multiple independent first shielding layers corresponding to the multiple Rogowski coils, and the second shielding structure has multiple independent second shielding layers corresponding to the multiple Rogowski coils. Both the first and second shielding layers are grounded. A transmission component includes a cable and a signal processing component. A first end of the cable is connected to the PCB board, and a second end of the cable is connected to the signal processing component.
[0006] Furthermore, the Rogowski coil layer includes a detection board segment and a connection board segment. The detection board segment is provided with multiple Rogowski coils, and the connection board segment is provided with multiple pin pads. The multiple Rogowski coils and the multiple pin pads are arranged in a one-to-one correspondence.
[0007] Furthermore, the Rogowski coil has a first input terminal and a first output terminal, and the pin pad has a second input terminal and a second output terminal. The first input terminal and the second input terminal are electrically connected through a first connecting line, and the first output terminal and the second output terminal are electrically connected through a second connecting line.
[0008] Furthermore, the first shielding structure covers the first surface of the Rogowski coil layer, and the second shielding structure covers the second surface of the Rogowski coil layer.
[0009] Furthermore, both the first and second shielding layers have a first clearance hole corresponding to the pin pads and a second clearance hole corresponding to the Rogowski coil.
[0010] Furthermore, both the first and second shielding layers are made of copper sheets.
[0011] Furthermore, the signal processing unit includes an integrator.
[0012] Furthermore, the cable has an inner conductor and an outer conductor, the inner conductor being electrically connected to the second input terminal and the outer conductor being electrically connected to the second output terminal.
[0013] Furthermore, a connector is provided on the connecting plate segment, and the first end of the cable is electrically connected to the connector.
[0014] Furthermore, the Rogowski coil layers are multi-layered, with an insulating layer between each adjacent Rogowski coil layer.
[0015] The present invention provides a current measuring device for a power module, comprising a PCB board and a transmission component. The PCB board includes a first shielding structure, a Rogowski coil layer, and a second shielding structure. The Rogowski coil is disposed between the first and second shielding structures. The Rogowski coil is used to detect the current magnitude of the chips within the power module. The power module contains multiple chips. To facilitate the detection of the current magnitude of the multiple chips within the power module, multiple Rogowski coils are disposed within the Rogowski coil layer, thereby enabling current detection of multiple chips using the multiple Rogowski coils. To prevent mutual interference (inductive coupling interference) between multiple Rogowski coils during current measurement, a first shielding structure is used to shield the upper surface of the Rogowski coil layer, and a second shielding structure is used to shield the lower surface of the Rogowski coil layer. The multiple first shielding layers of the first shielding structure are independent of each other, ensuring that adjacent first shielding layers are not connected. Similarly, the multiple second shielding layers of the second shielding structure are independent of each other, ensuring that adjacent second shielding layers are not connected. This allows each Rogowski coil to have a corresponding first shielding layer on its upper surface and a corresponding second shielding layer on its lower surface, both of which are grounded. The first and second shielding layers effectively prevent interference between adjacent Rogowski coils, thus avoiding inaccurate current measurement results. A cable is then connected from one end to the PCB board and from the other end to the signal processing unit, ensuring that the detected current signal is transmitted to the signal processing unit for real-time current detection of the chip. This allows the current measuring device for power modules in this application to have both capacitive and inductive interference resistance capabilities when measuring the chip current using a Rogowski coil, thanks to the first and second shielding structures. This solves the problem in related technologies where inductive coupling interference occurs between adjacent Rogowski coils, leading to inaccurate current measurement results due to interference during Rogowski coil measurement. Attached Figure Description
[0016] The accompanying drawings, which form part of this application, are used to provide a further understanding of the present invention. The illustrative embodiments of the present invention and their descriptions are used to explain the present invention and do not constitute an undue limitation of the present invention. In the drawings:
[0017] Figure 1 A top view of the PCB board of the current measuring device provided in an embodiment of the present invention is shown;
[0018] Figure 2 An exploded view of the PCB board of the current measuring device provided in an embodiment of the present invention is shown.
[0019] The above figures include the following reference numerals:
[0020] 10. PCB board; 11. First shielding structure; 111. First shielding layer; 12. Rogowski coil layer; 121. Rogowski coil; 122. Detection board segment; 123. Connecting board segment; 124. Pin pads; 13. Second shielding structure; 131. Second shielding layer;
[0021] 21. First input terminal; 22. First output terminal; 23. Second input terminal; 24. Second output terminal; 25. First connecting line; 26. Second connecting line. Detailed Implementation
[0022] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. The following description of at least one exemplary embodiment is merely illustrative and is in no way intended to limit the present utility model or its application or use. All other embodiments obtained by those skilled in the art based on the embodiments of the present utility model without creative effort are within the scope of protection of the present utility model.
[0023] like Figure 1 and Figure 2 As shown, this utility model embodiment provides a current measuring device for a power module. The current measuring device for a power module includes a PCB board 10 and a transmission component. The PCB board 10 includes a first shielding structure 11, a Rogowski coil layer 12, and a second shielding structure 13. The Rogowski coil layer 12 is disposed between the first shielding structure 11 and the second shielding structure 13. Multiple Rogowski coils 121 corresponding to multiple chips in the power module are disposed within the Rogowski coil layer 12. The multiple Rogowski coils 121 are disposed one-to-one with the multiple chips. The first shielding structure 11 is provided with multiple independent first shielding layers 111 corresponding to the multiple Rogowski coils 121. The second shielding structure 13 is provided with multiple independent second shielding layers 131 corresponding to the multiple Rogowski coils 121. Both the first shielding layers 111 and the second shielding layers 131 are grounded. The transmission component includes a cable and a signal processing component. The first end of the cable is connected to the PCB board 10, and the second end of the cable is connected to the signal processing component.
[0024] The current measuring device for a power module provided in this embodiment includes a PCB board 10 and a transmission component. The PCB board 10 includes a first shielding structure 11, a Rogowski coil layer 12, and a second shielding structure 13. A Rogowski coil 121 is disposed between the first shielding structure 11 and the second shielding structure 13. The Rogowski coil 121 is used to detect the current magnitude of the chips in the power module. The power module contains multiple chips. In order to facilitate the detection of the current magnitude of the multiple chips in the power module, multiple Rogowski coils 121 are disposed in the Rogowski coil layer 12, thereby enabling the current detection of multiple chips using multiple Rogowski coils 121. To prevent mutual interference (i.e., inductive coupling interference) between multiple Rogowski coils 121 during current measurement, a first shielding structure 11 shields the upper surface of the Rogowski coil layer 12, and a second shielding structure 13 shields the lower surface of the Rogowski coil layer 121. The multiple first shielding layers 111 of the first shielding structure 11 are independent of each other, ensuring that adjacent first shielding layers 111 are not connected. Similarly, the multiple second shielding layers 131 of the second shielding structure 13 are independent of each other, ensuring that adjacent second shielding layers 131 are not connected. This ensures that the upper surface of each Rogowski coil 121 is shielded. The device is equipped with a first shielding layer 111 and a second shielding layer 131 on the lower surface of each Rogowski coil 121. Both the first and second shielding layers 111 and 131 are grounded. This design prevents interference between adjacent Rogowski coils 121, thus avoiding inaccurate current measurements. A cable is connected from one end to the PCB board 10 and from the other end to a signal processing unit, ensuring the detected current signal is transmitted to the signal processing unit for real-time current detection of the chip. Therefore, the current measuring device for power modules in this application, when measuring the chip current using the Rogowski coils 121, possesses both capacitive and inductive interference resistance capabilities thanks to the first and second shielding structures 111 and 131. This solves the problem in related technologies where adjacent Rogowski coils 121 experience inductive coupling interference, leading to inaccurate current measurements.
[0025] like Figure 1 and Figure 2As shown, the Rogowski coil layer 12 includes a detection board segment 122 and a connection board segment 123. Multiple Rogowski coils 121 are provided on the detection board segment 122, and multiple pin pads 124 are provided on the connection board segment 123. The multiple Rogowski coils 121 and the multiple pin pads 124 are arranged in a one-to-one correspondence. Using the above structure, by setting up a detection board segment 122 and a connecting board segment 123, multiple Rogowski coils 121 are correspondingly arranged on the detection board segment 122, and multiple pin pads 124 are provided on the connecting board segment 123. The multiple pin pads 124 are arranged one-to-one with the multiple Rogowski coils 121, so that each Rogowski coil 121 is provided with a corresponding pin pad 124, which facilitates the transmission of the chip current signal detected by the Rogowski coil 121 to the pin pad 124. The first end of the cable is connected to the PCB board 10, which facilitates the transmission of the current signal to the signal processing unit through the cable. This makes it easy to use the Rogowski coil layer 12 to detect the chip current in real time, and the signal processing unit can then easily determine the magnitude of the chip's real-time current.
[0026] like Figure 1 As shown, the Rogowski coil 121 has a first input terminal 21 and a first output terminal 22, and the pin pad 124 has a second input terminal 23 and a second output terminal 24. The first input terminal 21 and the second input terminal 23 are electrically connected through a first connecting line 25, and the first output terminal 22 and the second output terminal 24 are electrically connected through a second connecting line 26. With this structure, by connecting the Rogowski coil 121 and the pin pad 124 through the first connecting line 25 and the second connecting line 26, it is convenient to connect the first input terminal 21 and the second input terminal 23 using the first connecting line 25, and to connect the first output terminal 22 and the second output terminal 24 using the second connecting line 26. This facilitates the transmission of the current signal detected by the chip from the Rogowski coil 121 to the pin pad 124, making signal transmission convenient.
[0027] like Figure 2 As shown, a first shielding structure 11 covers the first surface of the Rogowski coil layer 12, and a second shielding structure 13 covers the second surface of the Rogowski coil layer 12. By covering the first surface of the Rogowski coil layer 12 with the first shielding structure 11 and the second surface with the second shielding structure 13, both capacitive and inductive coupling interference can be resisted, preventing inaccurate current measurement results due to interference during the measurement of the Rogowski coil 121.
[0028] In this embodiment, both the first shielding layer 111 and the second shielding layer 131 have a first clearance hole corresponding to the pin pad 124 and a second clearance hole corresponding to the Rogowski coil 121. With this structure, the first clearance hole on the first shielding layer 111 and the second clearance hole on the second shielding layer 131 allow for clearance of the pin pad 124, facilitating electrical connection between the cable and the pin pad 124.
[0029] In this embodiment, both the first shielding layer 111 and the second shielding layer 131 are copper sheets. This structure facilitates the shielding effect of both the first shielding layer 111 and the second shielding layer 131.
[0030] In this embodiment, the signal processing unit includes an integrator. With the signal processing unit employing the above structure, a cable is connected to the integrator, which allows the signal indicating the current magnitude of each detected chip to be transmitted to the integrator. This enables the integrator to receive the detection signal from the Rogowski coil 121, facilitating signal processing.
[0031] In this embodiment, the cable has an inner conductor and an outer conductor. The inner conductor is electrically connected to the second input terminal 23, and the outer conductor is electrically connected to the second output terminal 24. Using this cable structure facilitates electrical connection between the cable and the pin pads 124 of the connecting board segment 123, thereby facilitating signal transmission to the signal processing unit via the cable.
[0032] It should be noted that the inner conductor of the cable forms the positive terminal and the outer conductor forms the negative terminal, which facilitates the electrical connection between the inner conductor and the second input terminal 23, and the connection between the outer conductor and the second output terminal 24. This makes it easier for the second input terminal 23 to form the positive terminal and the second output terminal 24 to become the negative terminal, thereby facilitating the connection between the PCB board 10 and the cable.
[0033] In this embodiment, a connector is provided on the connecting plate segment 123, and the first end of the cable is electrically connected to the connector. With the above structure, by providing a connector on the connecting plate segment 123, it is easier for the cable to be electrically connected to the connecting plate segment 123 through the connector.
[0034] In this embodiment, the Rogowski coil layers 12 are multi-layered, and an insulating layer is provided between each adjacent Rogowski coil layer 12. By employing the above structure, the insulating layer between adjacent Rogowski coil layers 12 achieves insulation between adjacent Rogowski coil layers 12.
[0035] It should be noted that in this embodiment, the PCB board 10 has a six-layer structure, namely, the first shielding structure 11 is the first layer, the Rogowski coil layer 12 is the second to fifth layer, and the second shielding structure 13 is the sixth layer. The shapes of the first shielding structure 11 and the second shielding structure 13 are consistent.
[0036] It should be noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to limit the exemplary embodiments according to this application. As used herein, the singular form is intended to include the plural form as well, unless the context clearly indicates otherwise. Furthermore, it should be understood that when the terms "comprising" and / or "including" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0037] Unless otherwise specifically stated, the relative arrangement, numerical expressions, and values of the components and steps described in these embodiments do not limit the scope of this invention. It should also be understood that, for ease of description, the dimensions of the various parts shown in the drawings are not drawn to actual scale. Techniques, methods, and devices known to those skilled in the art may not be discussed in detail, but where appropriate, such techniques, methods, and devices should be considered part of the specification. In all examples shown and discussed herein, any specific values should be interpreted as merely exemplary and not as limitations. Therefore, other examples of exemplary embodiments may have different values. It should be noted that similar reference numerals and letters in the following drawings denote similar items; therefore, once an item is defined in one drawing, it need not be further discussed in subsequent drawings.
[0038] In the description of this utility model, it should be understood that the directional terms such as "front, back, up, down, left, right", "horizontal, vertical, horizontal" and "top, bottom" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the convenience of describing this utility model and simplifying the description. Unless otherwise stated, these directional terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the scope of protection of this utility model. The directional terms "inner" and "outer" refer to the inner and outer contours of each component itself.
[0039] For ease of description, spatial relative terms such as "above," "on top of," "on the upper surface of," "above," etc., are used herein to describe the spatial positional relationship of a device or feature as shown in the figures to other devices or features. It should be understood that spatial relative terms are intended to encompass different orientations in use or operation beyond the orientation of the device as described in the figures. For example, if the device in the figures were inverted, a device described as "above" or "on top of" other devices or structures would subsequently be positioned as "below" or "under" other devices or structures. Thus, the exemplary term "above" can include both "above" and "below." The device may also be positioned in other different ways (rotated 90 degrees or in other orientations), and the spatial relative descriptions used herein will be interpreted accordingly.
[0040] Furthermore, it should be noted that the use of terms such as "first" and "second" to define components is merely for the purpose of distinguishing the corresponding components. Unless otherwise stated, the above terms have no special meaning and therefore cannot be construed as limiting the scope of protection of this utility model.
[0041] The above description is merely a preferred embodiment of this utility model and is not intended to limit the utility model. Various modifications and variations can be made to this utility model by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this utility model should be included within the protection scope of this utility model.
Claims
1. A current measuring device for a power module, characterized in that, The current measuring device for the power module includes: The PCB board (10) includes a first shielding structure (11), a Rogowski coil layer (12), and a second shielding structure (13). The Rogowski coil layer (12) is disposed between the first shielding structure (11) and the second shielding structure (13). The Rogowski coil layer (12) is provided with multiple Rogowski coils (121) corresponding to multiple chips in the power module. The multiple Rogowski coils (121) are provided in a one-to-one correspondence with the multiple chips. The first shielding structure (11) is provided with multiple independent first shielding layers (111) corresponding to the multiple Rogowski coils (121). The second shielding structure (13) is provided with multiple independent second shielding layers (131) corresponding to the multiple Rogowski coils (121). Both the first shielding layer (111) and the second shielding layer (131) are grounded. The transmission component includes a cable and a signal processing unit, wherein a first end of the cable is connected to the PCB board (10) and a second end of the cable is connected to the signal processing unit.
2. The current measuring device for a power module according to claim 1, characterized in that, The Rogowski coil layer (12) includes a detection board segment (122) and a connection board segment (123). The detection board segment (122) is provided with a plurality of Rogowski coils (121), and the connection board segment (123) is provided with a plurality of pin pads (124). The plurality of Rogowski coils (121) and the plurality of pin pads (124) are arranged in a one-to-one correspondence.
3. The current measuring device for a power module according to claim 2, characterized in that, The Rogowski coil (121) has a first input terminal (21) and a first output terminal (22), and the pin pad (124) has a second input terminal (23) and a second output terminal (24). The first input terminal (21) and the second input terminal (23) are electrically connected by a first connecting line (25), and the first output terminal (22) and the second output terminal (24) are electrically connected by a second connecting line (26).
4. The current measuring device for a power module according to claim 1, characterized in that, The first shielding structure (11) covers the first surface of the Rogowski coil layer (12), and the second shielding structure (13) covers the second surface of the Rogowski coil layer (12).
5. The current measuring device for a power module according to claim 2, characterized in that, Both the first shielding layer (111) and the second shielding layer (131) have a first clearance hole corresponding to the pin pad (124) and a second clearance hole corresponding to the Rogowski coil (121).
6. The current measuring device for a power module according to claim 1, characterized in that, Both the first shielding layer (111) and the second shielding layer (131) are copper sheets.
7. The current measuring device for a power module according to claim 1, characterized in that, The signal processing unit includes an integrator.
8. The current measuring device for a power module according to claim 3, characterized in that, The cable has an inner conductor and an outer conductor, the inner conductor being electrically connected to the second input terminal (23) and the outer conductor being electrically connected to the second output terminal (24).
9. The current measuring device for a power module according to claim 2, characterized in that, A connector is provided on the connecting plate segment (123), and the first end of the cable is electrically connected to the connector.
10. The current measuring device for a power module according to claim 1, characterized in that, The Rogowski coil layer (12) is multi-layered, and an insulating layer is provided between each adjacent Rogowski coil layer (12).