Detection device and chuck assembly

Abstract

The utility model provides a detection device, a chuck comprises a top plate and a plurality of clamping assemblies, one side of the top plate is used for placing a wafer, the clamping assemblies penetrate through the top plate, and the clamping assemblies are configured to clamp and loosen the wafer through movement; the detection device comprises at least one detection unit which is located on the side, away from the wafer, of the top plate, and the detection unit comprises a light blocking part which is connected with the clamping assembly and moves synchronously with the clamping assembly; the light source and the light signal receiver are arranged on the two sides of the light blocking part respectively, the light source is used for emitting light signals to the light signal receiver, and the light signal receiver is used for receiving the light signals emitted by the light source and emitting light intensity signals. The utility model further provides a chuck assembly. According to the detection device and the chuck assembly provided by the invention, the placement state of the wafer is detected, and meanwhile, the detection light is prevented from irradiating the wafer.

Description

Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and in particular to a detection device and a clamping plate assembly. Background Technology

[0002] The chip manufacturing process involves many wafer cleaning processes. Typically, when cleaning wafers are cleaned, the wafers are clamped onto chucks using fixtures. During the cleaning process, the chucks rotate the wafers at high speed, causing the waste liquid generated during cleaning to leave the wafer surface under centrifugal force.

[0003] Before each cleaning, it is necessary to ensure that the wafer is placed in the set position of the chuck, so that the clamping parts of the chuck can hold the wafer in place and prevent the wafer from being thrown out and broken during rotation.

[0004] Currently, the horizontal through-beam fiber optic sensor is used to detect whether the wafer is properly positioned within the cavity of a single-wafer cleaning machine. (Reference) Figure 1 and Figure 2 The horizontal through-beam fiber optic sensor detection device includes an infrared light emitting device 20 and an infrared light receiving device 30 arranged radially opposite each other along the clamp 10, and a signal amplifier 40 connected to the infrared light receiving device 30. When the wafer 50 is clamped by the clamp's fixing components, the infrared light emitting device 20 emits infrared light. If the wafer 50 is in the set position and horizontal, without obstructing the infrared light, the infrared light receiving device 30 can receive most of the infrared light. However, if the position of the wafer 50 deviates from the set position, some infrared light will be blocked by the wafer 50 and cannot be received by the infrared light receiving device 30. The signal amplifier 40 can read the light intensity received by the infrared light receiving device 30. When the light intensity is greater than or equal to the alarm value (AlarmSpec), for example, 150 Lx, it means that the wafer 50 is in the set position and the cleaning process can be started. When the light intensity is less than the alarm value, it means that the wafer 50 is not in the set position and the process needs to be stopped and the wafer 50 repositioned.

[0005] However, in the back-end processes of semiconductors, it is necessary to avoid light shining on the wafer, and the above-mentioned horizontal through-beam fiber optic sensor detection device is not suitable for the process chambers in the back-end processes.

[0006] To prevent wafer breakage due to misalignment during downstream processes, a detection device and chuck assembly are needed that can detect wafer misalignment without emitting light signals that could affect the wafer. Utility Model Content

[0007] The purpose of this application is to provide a detection device and a clamping assembly that can detect whether there is a deviation in the wafer placement position without emitting light signals that would affect the wafer.

[0008] In a first aspect, this application provides a detection device, wherein the clamping plate includes a top plate, one side of which is used to place the wafer, and a plurality of clamping components, the clamping components extending through the top plate, the clamping components being configured to clamp and release the wafer through movement; the detection device includes: at least one detection unit located on the side of the top plate away from the wafer, the detection unit including: a light-blocking part connected to the clamping components and moving synchronously with the clamping components; and a light source and a light signal receiver respectively disposed on both sides of the light-blocking part, the light source being used to emit a light signal to the light signal receiver, the light signal receiver being used to receive the light signal emitted by the light source and emit a light intensity signal; wherein, the movement of the light-blocking part causes a change in the signal received by the light signal receiver.

[0009] In some embodiments, the detection unit further includes a judgment device for issuing an alarm when the light intensity value of the light intensity signal is outside a preset range.

[0010] In some embodiments, the light-blocking part can completely block the light signal emitted by the light source toward the light signal receiver.

[0011] In some embodiments, the light source includes an infrared light source.

[0012] In some embodiments, the detection unit further includes a signal amplifier, which is electrically connected to the optical signal receiver to receive and amplify the light intensity signal.

[0013] The beneficial effects of the detection device provided in this application include, but are not limited to, the following:

[0014] The detection device provided in this application includes a light-blocking part and a light source and a light signal receiver located on both sides of the light-blocking part. The light-blocking part can block the light signal emitted by the light source to the light signal receiver. By judging whether the light intensity range of the light signal received by the light signal receiver is within a preset range, it can be determined whether the wafer is accurately placed on the chuck.

[0015] Secondly, embodiments of this application also provide a clamping plate assembly, including: a clamping plate and a detection device as described in the first aspect of this application.

[0016] In some embodiments, the detection unit and the clamping assembly are configured in a one-to-one correspondence.

[0017] In some embodiments, the chuck further includes circumferentially disposed side plates around the top plate, the side plates extending in a direction away from the wafer.

[0018] In some embodiments, the clamping assembly includes a columnar portion extending through the top plate, a first end of the columnar portion being connected to an eccentric portion for clamping the wafer, and a second end of the columnar portion of at least one of the clamping assemblies being connected to the light-blocking portion.

[0019] In some embodiments, the chuck assembly further includes a drive gear disposed on the side of the top plate away from the wafer; a toothed portion is connected between the first end and the second end of the columnar portion, the toothed portion is disposed around the columnar portion, and the toothed portion meshes with the drive gear to cause the columnar portion to rotate under the drive of the drive gear.

[0020] In some embodiments, the transmission gear includes: an inner gear that is matched with a motor; and an outer gear that is coaxially arranged with the outer gear and engages with the teeth of all the clamping components.

[0021] In some embodiments, a limiting mechanism is provided on the side of the top plate away from the wafer to limit the rotation of the transmission gear.

[0022] The beneficial effects of the clamping assembly provided in this application embodiment include, but are not limited to, the following:

[0023] The clamping assembly provided in this application includes a clamping plate and a detection device. The clamping plate includes a top plate for placing a wafer, and the detection device is disposed on the side of the top plate away from the wafer, which can prevent the light signal emitted by the light source from affecting the wafer.

[0024] Furthermore, the chuck also includes a side plate arranged circumferentially around the top plate. The side plate and the top plate form a cavity with one open side. The light source is located inside the cavity. When the detection device detects the wafer placement state, the light emitted by the light source will not enter the process chamber, thus meeting the requirements of semiconductor back-end processes. Attached Figure Description

[0025] The following accompanying drawings describe in detail the exemplary embodiments disclosed in this application. The same reference numerals denote similar structures in several views of the drawings. Those skilled in the art will understand that these embodiments are non-limiting and exemplary, and the drawings are for illustrative purposes only and are not intended to limit the scope of this application. Other embodiments may similarly fulfill the inventive intent of this application. It should be understood that the drawings are not drawn to scale.

[0026] in:

[0027] Figures 1-2 This is a schematic diagram of the structure of a detection device in the prior art;

[0028] Figure 3This is a schematic diagram of the detection device and clamp assembly according to some embodiments of this application;

[0029] Figure 4 This is a schematic diagram of the columnar portion according to some embodiments of this application;

[0030] Figure 5 This is a schematic diagram of the structure of another columnar portion according to some embodiments of this application;

[0031] Figure 6 This is a structural schematic diagram of the first surface of the top plate according to some embodiments of this application;

[0032] Figure 7 for Figure 6 Enlarged view of the area within the dashed box; and

[0033] Figure 8 This is a structural schematic diagram of the second side of the top plate according to some embodiments of this application. Detailed Implementation

[0034] The following description provides specific application scenarios and requirements for this application, intended to enable those skilled in the art to make and use the content of this application. Various partial modifications to the disclosed embodiments will be apparent to those skilled in the art, and the general principles defined herein can be applied to other embodiments and applications without departing from the spirit and scope of this application. Therefore, this application is not limited to the embodiments shown, but rather to the widest scope consistent with the claims.

[0035] This application provides a detection device for detecting the placement state of a wafer on a chuck. The chuck includes a top plate, one side of which is used to place the wafer, and multiple clamping assemblies extending through the top plate. The clamping assemblies are configured to clamp and release the wafer through movement. The detection device includes: at least one detection unit located on the side of the top plate away from the wafer; the detection unit includes: a light-blocking part connected to the clamping assemblies and moving synchronously with them; and a light source and a light signal receiver respectively disposed on both sides of the light-blocking part. The light source is used to emit a light signal to the light signal receiver, and the light signal receiver is used to receive the light signal emitted by the light source and emit a light intensity signal.

[0036] The movement of the light-blocking part causes a change in the signal received by the optical signal receiver.

[0037] The light source and optical signal receiver of the detection device provided in this application are both located on the side of the top plate away from the wafer. The light emitted by the light source will not affect the wafer, thus meeting the requirements of semiconductor back-end processes.

[0038] The detection device provided in this application will be described in detail below with reference to the embodiments and accompanying drawings.

[0039] refer to Figure 3 This application provides a detection device for detecting the placement state of a wafer 11 on a chuck 400. The detection of the placement state of the wafer 11 described in this application refers to detecting whether the wafer 11 is properly placed when it is placed on the chuck 400.

[0040] The chuck 400 is typically located in a process chamber used for semiconductor process fabrication and is used to hold the wafer 11 to be processed.

[0041] The chuck 400 provided in this application includes a top plate 401, the first surface of which is used to place the wafer 11. In some embodiments, the chuck 400 further includes a side plate 402, which is disposed along the circumferential edge of the second surface of the top plate 401, extends in a direction away from the wafer 11, and forms a cavity with the top plate 401 that has one open side.

[0042] The clamping plate 400 also includes a plurality of clamping components 500 for clamping the wafer 11, the clamping components 500 extending through the top plate 401, and the clamping components 500 being configured to clamp and release the wafer 11 by means of movement.

[0043] The detection device provided in this application includes at least one detection unit 100.

[0044] In some embodiments, the detection unit 100 includes a light-blocking portion 101a and a light source 101b and a light signal receiver 101c respectively disposed on both sides of the light-blocking portion 101a. The detection unit 100 is located on the second surface of the top plate 401 to prevent the light signal emitted by the light source 101b from affecting the wafer 101. In some embodiments, the detection unit 100 is located inside the cavity formed by the top plate 401 and the side plate 402 to further prevent the light signal from affecting the wafer 101.

[0045] In some embodiments, the light-blocking part 101a is connected to the clamping assembly 500 and moves synchronously with the clamping assembly 500.

[0046] When the chuck 400 is not holding the wafer 11, the light blocking part 101a can completely block the light signal emitted by the light source 101b, preventing the light signal from shining on the light signal receiver 101c;

[0047] When the wafer 11 is placed on the chuck 400, the clamping assembly 500 rotates and the light-blocking part 101a moves synchronously, blocking only part of the light signal so that the light signal can partially illuminate the light signal receiver 101c and be received by the light signal receiver 101c.

[0048] In some embodiments, the area of ​​the light-blocking portion 101a facing the light signal receiver 101c is greater than or equal to the area of ​​the light signal receiver 101c facing the light-blocking portion 101a, so that the light-blocking portion 101a can block all the light signals emitted by the light source 101b towards the light signal receiver 101c. The shape of the light-blocking portion 101a is not limited, as long as it meets the light-blocking requirements. In some embodiments, the light-blocking portion 101a is elongated.

[0049] In some embodiments, the material of the light-blocking portion 101a includes at least one of soluble polytetrafluoroethylene (PFA), polytetrafluoroethylene (PTFE), or polyvinylidene chloride (PVDF).

[0050] The light source 101b is used to transmit light signals to the light signal receiver 101c. In some embodiments, the light source 101b includes an infrared light source.

[0051] In some embodiments, the light source 101b is turned on when the wafer 11 is to be placed on the chuck 400, and emits a light signal to the light signal receiver 101c; the light source 101b is in the on state during the placement of the wafer 11 and the processing of the wafer 11.

[0052] The optical signal receiver 101c is used to receive the optical signal emitted by the light source 101b and emit a light intensity signal. In some embodiments, the optical signal receiver 101c is turned on when preparing to place the wafer 11 onto the chuck 400 to receive the optical signal emitted by the optical signal receiver 101c; the optical signal receiver 101c is in the on state during the placement of the wafer 11 and the processing of the wafer 11.

[0053] In some embodiments, the light source 101b and the light signal receiver 101c are fixedly connected.

[0054] In some embodiments, the light source 101b or the light signal receiver 101c is connected to the support base 300 for supporting the clamp 400 via a support rod 301.

[0055] In some embodiments, the number of detection units 100 is one, and a single detection unit 100 includes two light-blocking parts 101a. The two light-blocking parts 101a are respectively connected to a clamping assembly 500 that is centrally symmetrical about the center of the top plate 401 to ensure the balance of centrifugal force when the clamping plate 400 rotates. The light source 101b and the light signal receiver 101c are located on both sides of one of the light-blocking parts 101a.

[0056] refer to Figure 3 In other embodiments, there are multiple detection units 100, each of which includes a light-blocking portion 101a, and the multiple detection units 100 are centrally symmetrically distributed about the center of the top plate 401. The number of detection units 100 can be two, three, or four, etc.

[0057] In other embodiments, the detection unit 100 may also be matched one-to-one with the clamping assembly 500.

[0058] In some embodiments, the detection unit 100 further includes at least one signal amplifier 102, which is used to receive and amplify the light intensity signal. In some embodiments, the signal amplifier 102 is also used to display the light intensity value corresponding to the light intensity signal.

[0059] In some embodiments, the signal amplifier 102 is turned on when the wafer 11 is to be placed onto the chuck 400, and the signal amplifier 102 remains on during the placement and processing of the wafer 11.

[0060] The number of signal amplifiers 102 matches the number of detection units 100.

[0061] In some embodiments, the detection unit 100 further includes at least one judgment device 103. In some embodiments, the judgment device 103 is connected to the optical signal receiver 101c. In other embodiments, the judgment device 103 is connected to the signal amplifier 102. The judgment device 103 is used to issue an alarm when the light intensity value of the light intensity signal is outside a preset range.

[0062] In some embodiments, when the light intensity value is within a preset range, the judgment device 103 indicates that the wafer 11 is placed accurately; and when the light intensity value is outside the preset range, the judgment device 103 indicates that the wafer 11 is placed incorrectly and issues an alarm to remind the operator.

[0063] When the clamping tray 400 is ready to place the wafer 11, the light source 101b emits a light signal to the light signal receiver 101c. At this time, the light-blocking part 101a can completely block the light signal emitted by the light source 101b, and the light intensity value of the light signal received by the light signal receiver 101c is zero. When the wafer 11 is placed on the clamping tray 400 and clamped by the clamping assembly 500, the light-blocking part 101a moves synchronously with the clamping assembly 500. The light signal not blocked by the light-blocking part 101a is received by the light signal receiver 101c, and the light signal receiver 101c emits a light intensity signal. The judging device 103 judges whether the light intensity value of the light intensity signal is within a preset range. When the intensity value is within the preset range, the judging device 103 indicates that the wafer 11 is placed accurately; and when the light intensity value is outside the preset range, the judging device 103 indicates that the wafer 11 is placed incorrectly and issues an alarm to remind the operator.

[0064] The beneficial effects of the detection device provided in this application include, but are not limited to, the following:

[0065] The detection device provided in this application includes a light-blocking part and a light source and a light signal receiver located on both sides of the light-blocking part. The light-blocking part can block the light signal emitted by the light source to the light signal receiver. By judging whether the light intensity range of the light signal received by the light signal receiver is within a preset range, it can be determined whether the wafer is accurately placed on the chuck.

[0066] Both the light source and the optical signal receiver are located inside the clamping cavity, so the light emitted by the optical signal receiver will not enter the process chamber, thus meeting the requirements of semiconductor back-end processes.

[0067] This application also provides a clamping plate assembly, including a clamping plate 400 and a detection device provided in the technical solution of this application.

[0068] The clamping plate assembly provided in this application will be described in detail below with reference to the embodiments and accompanying drawings.

[0069] refer to Figure 3 This application provides a clamping plate assembly, including a clamping plate 400 and a detection device.

[0070] The clamp 400 includes a top plate 401 and a side plate 402. The side plate 402 is arranged circumferentially around the top plate 401 and extends away from the wafer 11, forming a cavity with the top plate 401 with one open side. The first side of the top plate 401 is located outside the cavity and is used to place the wafer 11.

[0071] The clamping plate 400 provided in this application also includes a plurality of clamping components 500 for clamping the wafer 11. The clamping components 500 penetrate the top plate 401 and are capable of rotating when clamping the wafer 11.

[0072] refer to Figure 4 and Figure 5 In some embodiments, the plurality of clamping assemblies 500 are symmetrically distributed about the center of the top plate 401. In some embodiments, the number of clamping assemblies 500 is 6, 8, or 10.

[0073] In some embodiments, the clamping assembly 500 includes a columnar portion 501 that extends through the top plate 401 of the cavity.

[0074] In some embodiments, an eccentric portion 502 is connected to the first end of the columnar portion 501, the eccentric portion 502 being used to clamp the wafer 11. In some embodiments, the eccentric portion 502 is conical, the cross-sectional area of ​​the eccentric portion 502 near the end face of the columnar portion 501 is smaller than the cross-sectional area of ​​the end face of the eccentric portion 502 away from the columnar portion 501, and the distance between the axis of the eccentric portion 502 and the axis of the columnar portion 501 is 1 to 3 mm.

[0075] When the chuck 400 is not holding the wafer 11, the distance between the eccentric portion 502 and the axis of the top plate 401 is less than the radius of the wafer 11; when the wafer 11 needs to be placed on the chuck 400, the columnar portion 501 drives the eccentric portion 502 to move, making the distance between the eccentric portion 502 and the axis of the top plate 401 greater than the radius of the wafer 11, thereby creating a space among the plurality of eccentric portions 502 that can accommodate the wafer 11; and reference Figure 6 and Figure 7 When the wafer 11 is placed on the chuck 400, the eccentric part 502 contacts the wafer 11 under the action of the columnar part 501, thereby clamping the wafer 11.

[0076] In some embodiments, reference Figure 4 The second end of the columnar portion 501 of the clamping assembly 500 is connected to the light-blocking portion 101a. In some embodiments, there are multiple clamping assemblies 500 connected to the light-blocking portion 101a, and the multiple clamping assemblies 500 are symmetrically distributed about the center of the top plate 401 to balance the centrifugal force of the clamping plate 400 during rotation.

[0077] In some embodiments, the diameter of the first end of the columnar portion 501 is greater than the diameter of the second end of the columnar portion 501.

[0078] In some embodiments, a toothed portion 503 is connected between the first end and the second end of the columnar portion 501, and the toothed portion 503 is disposed around the columnar portion 501.

[0079] In some embodiments, the detection unit 100 and the clamping assembly 500 are configured in a one-to-one correspondence.

[0080] In some embodiments, reference Figure 8 The clamping plate assembly also includes a transmission gear 600 disposed in the cavity and meshing with the toothed portion 503 to drive the columnar portion 501 to rotate.

[0081] In some embodiments, when the transmission gear 600 rotates clockwise, the toothed portion 503 rotates counterclockwise under the drive of the transmission gear 600, thereby causing the columnar portion 501 to drive the eccentric portion 502 to move away from the top plate 401 along an axis, so as to form a space between the eccentric portions 502 that can accommodate the wafer 11; and when the transmission gear 600 rotates counterclockwise, the toothed portion 503 rotates clockwise under the drive of the transmission gear 600, thereby causing the columnar portion 501 to drive the eccentric portion 502 to move closer to the top plate 401 along an axis, so as to clamp the wafer 11 with the eccentric portion 502.

[0082] In some embodiments, the transmission gear 600 includes an inner gear 601 and an outer gear 602 coaxially arranged. The inner gear 601 is matched with a motor and can drive the transmission gear 600 to rotate under the drive of the motor; the outer gear 602 meshes with all the toothed portions 503 to drive the toothed portions 503 to rotate.

[0083] In some embodiments, the inner wheel 601 and the outer wheel 602 are connected by a plurality of connecting rods 603. Specifically, the first end of the connecting rod 603 is connected to the inner wheel 601, and the second end of the connecting rod 603 is connected to the outer wheel 602.

[0084] In some embodiments, the inner wheel 601, the outer wheel 602, and the connecting rod 603 are integrally connected.

[0085] In some embodiments, reference Figure 8The clamping assembly further includes an elastic element 700. The first end of the elastic element 700 is connected to the second surface of the top plate 401, and the second end of the elastic element 700 is connected to the connecting rod 603. When the motor stops driving the transmission gear 600 to rotate, the elastic element 700 can elastically contract to drive the transmission gear 600 to rotate. In some embodiments, when the motor drives the transmission gear 600 to rotate clockwise to a first limit position, a space is formed between the eccentric portions 502 to accommodate the wafer 11. After the wafer 11 is placed between the eccentric portions 502, the motor stops driving the transmission gear 600, and the transmission gear 600 rotates counterclockwise under the action of the elastic element 700, causing the eccentric portions 502 to clamp the wafer 11.

[0086] In some embodiments, the number of elastic elements 700 is multiple. In some embodiments, the number of elastic elements 700 is two, and the two elastic elements 700 are centrally symmetrically distributed about the center of the top plate 401.

[0087] In some embodiments, the elastic element 700 includes a spring.

[0088] In some embodiments, a limiting mechanism is provided on the second surface of the top plate 401 to limit the rotation of the transmission gear, for example, referring to... Figure 8 The limiting mechanism includes at least one positioning groove 800 on the second surface of the top plate 401 and a positioning pin 801 adapted to the positioning groove 100. The positioning pin 801 is connected to the connecting rod 603 and can slide along the positioning groove 800.

[0089] In some embodiments, when the wafer 11 is not placed on the chuck 400, the positioning pin 801 is located at the first end of the positioning groove 800, and at this time, the transmission gear 600 is located at the second limit position; when it is necessary to place the wafer 11 on the chuck 400, the positioning pin 801 slides along the positioning groove 800 to move towards the second end of the positioning groove 800, so that the transmission gear 600 reaches the first limit position.

[0090] In some embodiments, the process of placing the wafer 11 using the clamp 400 and detecting whether the placement of the wafer 11 is accurate is as follows:

[0091] When the chuck 400 is not in place and the wafer 11 is about to be placed, the positioning pin 801 is located at the first end of the positioning groove 800; the transmission gear 600 is located at the second limit position; the distance between the eccentric part 502 and the axis of the top plate 401 is less than the radius of the wafer 11; the light source 101b, the optical signal receiver 101c and the signal amplifier 102 are turned on, and the light source 101b emits the optical signal to the optical signal receiver 101c.

[0092] During the process of placing the wafer 11 into the chuck 400, the motor drives the transmission gear 600 to rotate clockwise. During this period, the positioning pin 801 moves towards the second end of the positioning groove 800, the eccentric part 502 moves away from the axis of the top plate 401, and the elastic element 700 extends under the action of the connecting rod 603. When the positioning pin 801 moves towards the second end of the positioning groove 800, causing the transmission gear 600 to move to the first limit position, and the distance between the eccentric part 502 and the axis of the top plate 401 is greater than the radius of the wafer 11, the wafer 11 is placed on the first surface of the top plate 401 of the chuck 400.

[0093] After the wafer 11 is placed on the clamping plate 400, the motor is turned off. Under the action of elastic contraction force, the elastic element 700 drives the transmission gear 600 to rotate counterclockwise, thereby causing the eccentric part 502 to move towards the axis of the top plate 401 and contact the wafer 11, thus achieving clamping of the wafer 11.

[0094] The beneficial effects of the clamping assembly provided in this application embodiment include, but are not limited to, the following:

[0095] The clamping assembly provided in this application includes a clamping plate and a detection device. The clamping plate includes a top plate for placing a wafer, and the detection device is disposed on the side of the top plate away from the wafer, which can prevent the light signal emitted by the light source from affecting the wafer.

[0096] Furthermore, the chuck also includes a side plate arranged circumferentially around the top plate. The side plate and the top plate form a cavity with one open side. The light source is located inside the cavity. When the detection device detects the wafer placement state, the light emitted by the light source will not enter the process chamber, thus meeting the requirements of semiconductor back-end processes.

[0097] It should be noted that different embodiments may produce different beneficial effects. In different embodiments, the beneficial effects may be any one or a combination of the above, or any other possible beneficial effects.

[0098] The basic concepts have been described above. Obviously, for those skilled in the art, the detailed disclosure above is merely illustrative and does not constitute a limitation of this specification. Although not explicitly stated herein, those skilled in the art may make various modifications, improvements, and corrections to this application. Such modifications, improvements, and corrections are suggested in this specification, and therefore remain within the spirit and scope of the exemplary embodiments of this application.

[0099] It should be noted that, in the description of this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "linking," and "fixing" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; a mechanical connection or an electrical connection; a rotating connection or a sliding connection; a direct connection or an indirect connection through an intermediate medium; or the internal communication of two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application in light of the specific circumstances.

[0100] Furthermore, when the terms "first," "second," "third," etc., are used in this application specification to describe various features, these terms are only used to distinguish these features and should not be construed as indicating or implying the correlation or relative importance between features or implicitly indicating the number of features indicated.

[0101] In addition, this application specification describes exemplary embodiments by referring to idealized exemplary cross-sectional views and / or plan views and / or perspective views. Therefore, differences from the illustrated shapes are foreseeable due to factors such as manufacturing techniques and / or tolerances. Therefore, exemplary embodiments should not be construed as limited to the shapes of the regions shown herein, but should include deviations in shape caused, for example, by manufacturing processes. Thus, the regions shown in the figures are substantially schematic, and their shapes are not intended to illustrate the actual shapes of the regions of the device, nor to limit the scope of the exemplary embodiments.

[0102] Furthermore, this application uses specific terms to describe embodiments of this specification. For example, "an embodiment," "one embodiment," and / or "some embodiments" refer to a particular feature, structure, or characteristic related to at least one embodiment of this application. Therefore, it should be emphasized and noted that "an embodiment," "one embodiment," or "an alternative embodiment" mentioned twice or more in different locations in this application do not necessarily refer to the same embodiment. In addition, certain features, structures, or characteristics in one or more embodiments of this application can be appropriately combined.

[0103] Similarly, it should be noted that, in order to simplify the description of the present application and thus aid in the understanding of one or more embodiments of the invention, the foregoing description of the embodiments of the present application sometimes combines multiple features into a single embodiment, drawing, or description thereof. However, this disclosure method does not imply that the subject matter of the application requires more features than those mentioned in the claims. In fact, the embodiments contain fewer features than all the features of the single embodiments disclosed above.

[0104] Finally, it should be understood that the embodiments described in this application are merely illustrative of the principles of the embodiments of this application. Other modifications may also fall within the scope of this application. Therefore, alternative configurations of the embodiments of this application are considered as examples and not limitations, and are regarded as consistent with the teachings of this application. Accordingly, the embodiments of this application are not limited to the embodiments explicitly described and illustrated in this application.

Claims

1. A detection device for detecting the placement state of a wafer on a chuck, the chuck including a top plate, one side of the top plate for placing the wafer, and a plurality of clamping assemblies extending through the top plate, the clamping assemblies being configured to clamp and release the wafer by movement; Its features are, The detection device includes: At least one detection unit is located on the side of the top plate away from the wafer. The detection unit includes: a light-blocking part connected to the clamping assembly and moving synchronously with the clamping assembly; and a light source and a light signal receiver, respectively disposed on both sides of the light-blocking part. The light source is used to emit a light signal to the light signal receiver, and the light signal receiver is used to receive the light signal emitted by the light source and emit a light intensity signal. The movement of the light-blocking part causes a change in the signal received by the optical signal receiver.

2. The detection device according to claim 1, characterized in that, The detection unit also includes a judgment device for issuing an alarm when the light intensity value of the light intensity signal is outside a preset range.

3. The detection device according to claim 1, characterized in that, The light-blocking part can completely block the light signal emitted by the light source toward the light signal receiver.

4. The detection device according to claim 1, characterized in that, The light source includes an infrared light source.

5. The detection device according to claim 1, characterized in that, The detection unit further includes a signal amplifier, which is electrically connected to the optical signal receiver to receive and amplify the light intensity signal.

6. A clamping plate assembly, characterized in that, include: The clamping plate and the detection device according to any one of claims 1 to 5.

7. The clamping plate assembly according to claim 6, characterized in that, The detection unit and the clamping component are configured in a one-to-one correspondence.

8. The clamping plate assembly according to claim 6, characterized in that, The chuck also includes circumferentially arranged side plates surrounding the top plate, the side plates extending away from the wafer.

9. The clamping plate assembly according to claim 6, characterized in that, The clamping assembly includes a columnar portion that penetrates the top plate, a first end of the columnar portion being connected to an eccentric portion for clamping the wafer, and at least one second end of the columnar portion of the clamping assembly being connected to the light-blocking portion.

10. The clamping plate assembly according to claim 9, characterized in that, It also includes a transmission gear, disposed on the side of the top plate away from the wafer; A toothed portion is connected between the first and second ends of the columnar portion. The toothed portion is arranged around the columnar portion and meshes with the transmission gear so that the columnar portion rotates under the drive of the transmission gear.

11. The clamping assembly according to claim 10, characterized in that, The transmission gear includes an inner gear, which is matched with the motor; The outer wheel is coaxially arranged with the outer wheel and engages with the teeth of all the clamping components.

12. The clamping plate assembly according to claim 10, characterized in that, A limiting mechanism is also provided on the side of the top plate away from the wafer to limit the rotation of the transmission gear.

Images