Full-automatic wafer slicing and cleaning all-in-one machine

Abstract

The utility model relates to a full-automatic wafer slicing and cleaning all-in-one machine, which effectively solves the problems that the existing cleaning equipment is always far away from drying equipment and needs to be transferred manually, however, a large amount of manpower and time are consumed in the long-distance transferring process, and the working efficiency is high. And impurity particles are easily introduced in the transfer process, so that the surface of the wafer is polluted. According to the full-automatic wafer slicing and cleaning all-in-one machine, through cooperative arrangement of a limiting rod and a base plate, wafer slices needing to be cleaned can be placed in a separated mode, then a cleaning solution can make full contact with the wafer slices, the cleaning effect is improved, and through cooperative arrangement of a driving disc and a tray, the wafer slices can be cleaned under rotation of a motor; and the installed wafer slice is rotated, so that it is guaranteed that the wafer slice rotates in the cleaning solution, it is guaranteed that the wafer slice makes full contact with the cleaning solution, and the cleaning effect is further improved.

Description

Technical Field

[0001] This utility model belongs to the field of wafer cleaning technology, specifically relating to a fully automatic integrated wafer slicing and cleaning machine. Background Technology

[0002] In the semiconductor manufacturing field, wafer slicing and cleaning are extremely critical processes. With the rapid development of semiconductor technology and the continuous improvement of chip integration, the requirements for wafer processing precision and quality are becoming increasingly stringent. Wafer cleaning is an indispensable part of the semiconductor manufacturing process. During the slicing process, impurities such as cutting debris, cutting fluid, and metal particles will remain on the wafer surface. If these impurities are not thoroughly removed, they will have a serious impact on subsequent semiconductor manufacturing processes. For example, in the photolithography process, impurity particles can cause defects in the photolithography pattern, leading to errors in the chip's circuit structure. In the etching process, impurities may cause uneven etching, affecting the chip's performance and dimensional accuracy.

[0003] During the cleaning process, chemical cleaning utilizes chemical solutions to react with impurities on the wafer surface, dissolving or transforming the impurities into easily removable substances. For example, hydrofluoric acid (HF) can remove the silicon oxide layer and some metal oxide impurities on the wafer surface, while a mixed solution of ammonia, hydrogen peroxide, and water can effectively remove organic impurities and particles. The advantage of chemical cleaning is that it can specifically remove specific types of impurities. However, after cleaning, the cleaned wafer slices need to be placed in drying equipment. However, existing cleaning equipment is often far from drying equipment, requiring manual transfer. This long-distance transfer consumes a lot of manpower and time, and impurity particles are easily introduced during the transfer process, leading to wafer surface contamination. Utility Model Content

[0004] In view of the above situation and to overcome the defects of the prior art, this utility model provides a fully automatic wafer slicing and cleaning integrated machine. This fully automatic wafer slicing and cleaning integrated machine can clean and dry wafer slices. The closer distance can reduce the occurrence of secondary contamination of wafer slices during transportation. In addition, it can also speed up the flow rate of the cleaning solution during the cleaning process. Furthermore, in conjunction with the rotation of the wafer slices, it can more thoroughly clean the impurities on the surface of the wafer slices.

[0005] A fully automatic wafer slicing and cleaning integrated machine includes a mounting base. A motor is fixedly mounted on one side of the top of the mounting base. The output end of the motor is connected to a drive disk via a key drive. A protective shell is bolted to the top of the mounting base. A mounting groove is formed on one side of the top of the protective shell. A tray is rotatably connected to the inner wall of the mounting groove. A limit rod is threaded to the top of the tray. A pad is detachably connected to the outer wall of the limit rod. A limit seat is detachably connected to the top of the protective shell on one side of the mounting groove. A slot is formed on the inner wall of the limit seat. A flow guide tube is fixedly mounted on the inner wall of the mounting groove on one side of the tray. Multiple spray holes are formed on the outer surface of the flow guide tube.

[0006] Preferably, a guide groove is provided below the end of the mounting base, and a storage box is slidably connected to the inner side wall of the guide groove. A water inlet is provided on one side of the top of the storage box, and a drain outlet is provided on the top of the mounting base on the side of the motor. The inner wall of the drain outlet and the inner wall of the water inlet are connected through each other.

[0007] Preferably, both the storage box and the protective shell have drain pipes inserted into their outer surfaces, and the outer surfaces of the drain pipes are threaded with sealing caps.

[0008] Preferably, the outer surface of the limiting rod is fitted with a limiting sleeve on the top of the pad, a wafer slab is placed on the top of the pad, and a limiting ring is threaded to one end of the limiting rod that protrudes from the pad.

[0009] Preferably, a locking block is fixedly connected to the bottom of the tray, and the outer wall of the locking block is connected to the top of the drive disk in a transmission manner.

[0010] Preferably, the top of the protective shell has a slot on one side of the mounting groove, and the inner wall of the slot is slidably connected to the outer surface of the limiting seat.

[0011] Preferably, the top of the protective shell is connected to a cover plate via a hinge on one side of the mounting groove. A heating wire is fixedly installed on the top of the cover plate, and an air guide tube is fixedly connected to the top of the cover plate. A fan is fixedly installed at the end of the air guide tube.

[0012] Preferably, a mounting plate is fixedly connected to the top of the drainage tube, a water pump is fixedly installed on the top of the mounting plate, and a protective cover is connected to the top of the protective shell above the drainage tube via a hinge.

[0013] The beneficial effects of the above technical solution are as follows:

[0014] (1) The fully automatic wafer slicing and cleaning integrated machine, through the combination of the limiting rod and the pad, can separate and place the wafer slices to be cleaned, which is more conducive to the full contact between the cleaning solution and the wafer slices, thus improving the cleaning effect. Through the combination of the drive plate and the tray, the installed wafer slices can be rotated under the rotation of the motor to ensure that the wafer slices rotate in the cleaning solution and ensure that the wafer slices are in full contact with the cleaning solution, further improving the cleaning effect. Through the combination of the guide tube and the spray hole, the cleaning solution can be powered to flow on the surface of the wafer slices, further improving the cleaning effect.

[0015] (2) The fully automatic wafer slicing and cleaning integrated machine, through the combination of the limiting seat and the slot, can store and drain the cleaned wafer slices, and drain the excess cleaning solution, which is more conducive to drying the wafer slices. In addition, the distance between the limiting seat and the pad is very close, and the staff can take it out from one side and put it into the other side to complete the transfer operation, thereby reducing the pollution that occurs during the long-term transfer process. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of the overall installation structure of this utility model;

[0017] Figure 2 This is an exploded view of the mounting base of this utility model;

[0018] Figure 3 This is a schematic diagram of the explosion structure of the protective shell of this utility model;

[0019] Figure 4 This is a schematic diagram of the exploded structure of the pad of this utility model;

[0020] Figure 5 This is a schematic diagram of the bottom structure of the tray of this utility model;

[0021] Figure 6 This is a schematic diagram of the limiting seat structure of this utility model;

[0022] Figure 7 This is a schematic diagram of the air duct installation structure of this utility model;

[0023] Figure 8 This is a schematic diagram of the drainage tube structure of this utility model.

[0024] In the diagram: 1. Mounting base; 2. Motor; 3. Drive plate; 4. Guide groove; 5. Storage box; 6. Water inlet; 7. Drain outlet; 8. Protective shell; 9. Drain pipe; 10. Sealing cover; 11. Mounting groove; 12. Tray; 13. Limiting rod; 14. Pad; 15. Limiting cylinder; 16. Wafer slice; 17. Limiting ring; 18. Locking block; 19. Locking slot; 20. Limiting seat; 21. Slot; 22. Cover plate; 23. Heating wire; 24. Air guide tube; 25. Fan; 26. Drain tube; 27. Mounting plate; 28. Water pump; 29. ​​Spray hole; 30. Protective cover. Detailed Implementation

[0025] The foregoing and other technical contents, features and effects of this utility model are described in conjunction with the appendix below. Figures 1 to 8 The embodiments are described in detail below.

[0026] This embodiment provides a fully automatic wafer slicing and cleaning integrated machine, as shown in the attached figure. It includes a mounting base 1, a motor 2 fixedly mounted on one side of the top of the mounting base 1, and a drive disk 3 connected to the output end of the motor 2 via a key drive. A guide groove 4 is provided at the lower end of the mounting base 1, and a storage box 5 is slidably connected to the inner side wall of the guide groove 4. A water inlet 6 is provided on one side of the top of the storage box 5, and a drain outlet 7 is provided on the top of the mounting base 1 on the side of the motor 2. The inner wall of the drain outlet 7 is connected to the inner wall of the water inlet 6. The mounting base 1 serves as the basic support structure of the entire integrated machine, supporting other components such as the motor 2, protective shell 8, and storage box 5, and providing them with a stable mounting platform. This ensures that the relative positions of each component remain stable during operation, guarantees the stability of the overall structure of the equipment, and prevents equipment deformation or component misalignment caused by vibration or external interference during component operation. This ensures the normal operation of cleaning and drying processes and improves the reliability and stability of equipment operation.

[0027] Motor 2 provides power to drive disk 3. The rotational motion of motor 2 is transmitted to drive disk 3 through key transmission, causing drive disk 3 to rotate at a predetermined speed and direction. This, in turn, drives the connected tray 12 and the wafer slab 16 placed on the tray 12 to rotate, realizing the rotational motion of wafer slab 16 in the cleaning solution. This increases the contact opportunity and relative motion speed between wafer slab 16 and cleaning solution, promotes the rinsing and chemical reaction of impurities on the surface of wafer slab 16 by the cleaning solution, effectively improves the cleaning effect, and ensures that all parts of wafer slab 16 can be cleaned more uniformly. Water inlet 6 and water outlet 7 can guide the waste liquid generated in the protective shell 8 during the cleaning process to the storage tank 5. Their position and structural design must ensure that the waste liquid can flow out of the protective shell 8 smoothly and accurately into the water inlet 6 of the storage tank.

[0028] A protective shell 8 is bolted to the top of the mounting base 1. Drain pipes 9 are inserted into the outer surfaces of both the storage box 5 and the protective shell 8. A sealing cap 10 is threaded onto the outer surface of the drain pipe 9. A mounting groove 11 is provided on one side of the top of the protective shell 8. A tray 12 is rotatably connected to the inner wall of the mounting groove 11. A limit rod 13 is threaded onto the top of the tray 12. A pad 14 is detachably connected to the outer wall of the limit rod 13. A limit sleeve 15 is fitted onto the top of the pad 14 on the outer surface of the limit rod 13. A wafer slab 16 is placed on top of the tray 4. A limiting rod 13 extends out of the pad 14 and is threaded to a limiting ring 17. A locking block 18 is fixedly connected to the bottom of the tray 12. The outer wall of the locking block 18 is connected to the top of the drive plate 3. Two drain pipes 9 connect the storage tank 5 and the mounting slot 11. When it is necessary to discharge the waste liquid in the storage tank 5 and the mounting slot 11 or to clean the equipment, the sealing cover 10 on the drain pipe can be opened to allow the waste liquid to be discharged through the drain pipe, which facilitates the cleaning and maintenance of the storage tank.

[0029] The pad 14 is installed on the limiting rod 13 to provide a support surface for the wafer slice 16, reducing the potential damage caused by direct contact between the wafer slice 16 and the limiting rod 13. At the same time, the presence of the pad 14 creates a certain gap between the wafer slice 16 and the cleaning solution, which is conducive to the flow of the cleaning solution under the wafer slice 16, promoting the cleaning effect, protecting the surface of the wafer slice 16 from mechanical damage, improving product quality, optimizing the flow path of the cleaning solution around the wafer slice 16, and enabling the cleaning solution to more fully contact all parts of the wafer slice 16, especially the bottom and edge areas, further improving the cleaning effect and ensuring the comprehensiveness and thoroughness of the cleaning of the wafer slice 16. The limiting ring 17 is threaded to one end of the limiting rod 13 that protrudes from the pad 14, locking the positions of components such as the limiting cylinder 15, the wafer slice 16, and the pad 14 on the limiting rod 13, preventing these components from loosening or falling off due to vibration or other reasons during equipment operation.

[0030] The top of the protective shell 8 has a slot 19 on one side of the mounting groove 11. The inner wall of the slot 19 is slidably connected to the outer surface of the limiting seat 20. The top of the protective shell 8 is detachably connected to the limiting seat 20 on one side of the mounting groove 11. The inner wall of the limiting seat 20 has a slot 21. The slot 19 provides a sliding track for the limiting seat 20, allowing the limiting seat 20 to slide along the slot 19 on the top of the protective shell. After cleaning, the limiting seat 20 stores and drains the wafer slab 16 through the slot 21 on its inner wall, allowing excess cleaning solution on the wafer slab 16 to drip naturally or be discharged through a specific drainage method. This achieves temporary storage and preliminary drying of the wafer slab 16 after cleaning, reducing the amount of cleaning solution remaining on the surface of the wafer slab 16 and preparing it for the subsequent drying process.

[0031] The top of the protective shell 8 is connected to a cover plate 22 via a hinge on one side of the mounting groove 11. A heating wire 23 is fixedly installed on the top of the cover plate 22, and an air guide duct 24 is fixedly connected to the top of the cover plate 22. A fan 25 is fixedly installed at the end of the air guide duct 24. After cleaning, the cover plate 22 can be placed over the mounting groove 11 to provide a relatively enclosed drying space for the wafer slab 16. The heating wire 23 installed on the top of the cover plate 22 is used to generate heat to dry the wafer slab 16. The cooperation of the air guide duct 24 and the fan 25 can accelerate the circulation of hot air in the drying space, improve the drying efficiency, and the fan 25 generates airflow by rotating, which disperses the heat generated by the heating wire 23 and forms circulating air, enhances the airflow speed and heat transfer efficiency in the drying space, promotes the evaporation and drying of moisture on the surface of the wafer slab 16, accelerates the heat exchange speed in the drying process, and enables the wafer slab 16 to reach a dry state in a shorter time, thereby improving the drying efficiency of the equipment.

[0032] A guide tube 26 is fixedly installed on the inner wall of the mounting slot 11 on one side of the tray 12. Multiple spray holes 29 are opened on the outer surface of the guide tube 26. A mounting plate 27 is fixedly connected to the top of the guide tube 26. A water pump 28 is fixedly installed on the top of the mounting plate 27. A protective cover 30 is connected to the top of the protective shell 8 above the guide tube 26 via a hinge. The guide tube 26 serves as a spraying device for the cleaning solution. Through the multiple spray holes 29 opened on its outer surface, the cleaning solution is evenly sprayed onto the surface of the wafer slice 16. The water pump 28 installed on the top provides power for the cleaning solution, enabling the cleaning solution to be sprayed out from the spray holes at a certain pressure and flow rate. This enhances the scouring effect of the cleaning solution on the surface of the wafer slice 16. With the rotation of the wafer slice 16, the cleaning solution can fully and deeply contact the surface of the wafer slice 16, effectively removing various impurities and significantly improving the cleaning effect. The evenly distributed spray hole design ensures that the cleaning solution is evenly sprayed on the surface of the wafer slice 16, avoiding local insufficient or excessive cleaning.

[0033] In summary, the operating steps of this fully automatic wafer slicing and cleaning integrated machine are as follows:

[0034] 1. Place the wafer slicing 16 on the pad 14, install the pads 14 with the wafer slicing 16 on the limiting rods 13 in sequence, and separate the multiple pads 14 with the limiting tubes 15. Thread the limiting rod through the pad 14 to the limiting ring 17, thereby fixing the wafer slicing 16 in all directions. Place the tray 12 after installation into the mounting groove 11, so that the locking block 18 is locked above the drive disk 3.

[0035] 2. Start motor 2. The output end of motor 2 is connected to drive disk 3 via key transmission. Drive disk 3 drives the bottom locking block 18 of tray 12, which is connected to its top transmission, so that tray 12 and wafer slab 16 placed on it start to rotate. At the same time, start water pump 28 installed on the top mounting plate of the diversion tube 26. Water pump draws and pressurizes the cleaning solution in storage tank 5, so that it is evenly sprayed onto the surface of the rotating wafer slab 16 through multiple spray holes 29 opened on the outer surface of diversion tube 26, forming a high-speed flow of cleaning solution to flush and clean the impurities on the surface of wafer slab 16.

[0036] 3. After cleaning, turn off the water pump 28 and motor 2, open the protective cover 30, remove the cleaned wafer slab 16 from the tray 12 and insert it into the slot 21 on the inner wall of the limiting seat 20 for storage and drainage, allowing excess cleaning solution to drip off naturally. During the drainage process of the wafer slab, close the cover 22, and then start the fan 25 and heating wire 23 to dry the internal wafer slab 16.

[0037] 4. After drying, turn off the fan 25 and heating wire 23, open the cover plate 22, and take out the wafer slice 16.

[0038] The above description is only for illustrating the present utility model. It should be understood that the present utility model is not limited to the above embodiments, and various modifications that conform to the concept of the present utility model are within the protection scope of the present utility model.

Claims

1. A fully automatic wafer slicing and cleaning integrated machine, comprising a mounting base (1), characterized in that: A motor (2) is fixedly installed on one side of the top of the mounting base (1). The output end of the motor (2) is connected to a drive disk (3) via a key drive. A protective shell (8) is bolted to the top of the mounting base (1). A mounting groove (11) is provided on one side of the top of the protective shell (8). A tray (12) is rotatably connected to the inner wall of the mounting groove (11). A limit rod (13) is threaded to the top of the tray (12). A pad (14) is detachably connected to the outer wall of the limit rod (13). A limit seat (20) is detachably connected to the top of the protective shell (8) on one side of the mounting groove (11). A slot (21) is provided on the inner wall of the limit seat (20). A diversion tube (26) is fixedly installed on the inner wall of the mounting groove (11) on one side of the tray (12). Multiple spray holes (29) are provided on the outer surface of the diversion tube (26).

2. The fully automatic wafer slicing and cleaning integrated machine according to claim 1, characterized in that: A guide groove (4) is provided below the end of the mounting base (1). A storage box (5) is slidably connected to the inner side wall of the guide groove (4). A water inlet (6) is provided on one side of the top of the storage box (5). A drain outlet (7) is provided on the top of the mounting base (1) on the side of the motor (2). The inner wall of the drain outlet (7) and the inner wall of the water inlet (6) are connected through each other.

3. The fully automatic wafer slicing and cleaning integrated machine according to claim 2, characterized in that: Drain pipes (9) are inserted into the outer surfaces of both the storage box (5) and the protective shell (8), and a sealing cap (10) is threaded onto the outer surface of the drain pipe (9).

4. The fully automatic wafer slicing and cleaning integrated machine according to claim 1, characterized in that: The outer surface of the limiting rod (13) is fitted with a limiting sleeve (15) on the top of the pad (14). A wafer slice (16) is placed on the top of the pad (14). One end of the limiting rod (13) that passes through the pad (14) is threadedly connected to a limiting ring (17).

5. The fully automatic wafer slicing and cleaning integrated machine according to claim 1, characterized in that: The bottom of the tray (12) is fixedly connected to a locking block (18), and the outer wall of the locking block (18) is connected to the top of the drive disk (3) via a transmission connection.

6. The fully automatic wafer slicing and cleaning integrated machine according to claim 1, characterized in that: The top of the protective shell (8) is provided with a slot (19) on one side of the mounting groove (11), and the inner wall of the slot (19) is slidably connected to the outer surface of the limiting seat (20).

7. The fully automatic wafer slicing and cleaning integrated machine according to claim 1, characterized in that: The top of the protective shell (8) is connected to a cover plate (22) via a hinge on one side of the mounting groove (11). A heating wire (23) is fixedly installed on the top of the cover plate (22). An air guide tube (24) is fixedly connected to the top of the cover plate (22). A fan (25) is fixedly installed at the end of the air guide tube (24).

8. The fully automatic wafer slicing and cleaning integrated machine according to claim 1, characterized in that: The top of the drainage tube (26) is fixedly connected to an installation plate (27), and a water pump (28) is fixedly installed on the top of the installation plate (27). The top of the protective shell (8) is located above the drainage tube (26) and is connected to a protective cover (30) by a hinge.

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