High-heat-dissipation flanging type copper strip frame structure

Abstract

The utility model provides a high heat dissipation flanging type copper strip frame structure, comprising a frame main body, the surface of which is connected with frame carriers from left to right in sequence; the plurality of flanged copper strips are respectively arranged on the surfaces of the plurality of frame carriers, and a copper strip folding lug is arranged on one side of the surface of each flanged copper strip; the chip main body is arranged on the surface of the edge folding type copper strip and located on one side of the copper strip folding lug, a plurality of copper strip glue locking holes are transversely and longitudinally formed in the surface of the edge folding type copper strip, and a plurality of elastic piece supporting feet are sequentially arranged on the surface of the frame main body from left to right. The high-heat-dissipation flanging type copper strip frame structure provided by the utility model has the advantages that in the aspect of electrical performance, the resistance is reduced, the heat generation is reduced, and a relatively high packaging resistance value caused by metal wire connection can be avoided, so that the heat generated when current passes through is reduced, the performance and the stability of a chip are favorably improved, and the service life of the chip is prolonged. And the limitation of the conductive performance of the metal wire is broken through.

Description

Technical Field

[0001] This invention relates to the field of semiconductor packaging, and more particularly to a high heat dissipation folded copper strip frame structure. Background Technology

[0002] Copper strip bonding is a packaging process that uses solid copper bridges soldered to solder to connect chips and pins.

[0003] Limitations of traditional bonding packaging methods:

[0004] Electrical performance

[0005] In traditional chip packaging processes, standard wire bonding is often used between the chip and its pins. This method uses metal wires as the connection material, which usually results in a higher package resistance value. The higher resistance value will generate more heat when current passes through, affecting the chip's performance and stability. At the same time, due to the limited conductivity of the metal wires, the amount of current they can carry is also relatively limited, which cannot meet the needs of some chip applications with high current requirements.

[0006] Thermal conductivity

[0007] Traditional wire bonding also has shortcomings in thermal conductivity. The thermal conductivity of metal wires is relatively low, which is not conducive to the rapid dissipation of heat generated during chip operation. The heat accumulation inside the chip can lead to excessively high chip temperature, thereby affecting the chip's reliability and lifespan.

[0008] Cost

[0009] In traditional wire bonding processes, the solder joints of the leads typically require silver plating. This process not only increases production costs but is also complex and prone to defects. Poor silver plating leads to decreased soldering quality, affecting the chip's packaging quality and performance, further increasing production costs and product defect rates.

[0010] Therefore, it is necessary to provide a high-heat-dissipation folded-edge copper strip frame structure to solve the above-mentioned technical problems. Summary of the Invention

[0011] This invention provides a high-heat-dissipation folded copper strip frame structure, which solves the problems of poor electrical performance, poor thermal conductivity and high cost that are easily caused by traditional bonding and packaging methods.

[0012] To solve the above technical problems, the present invention provides a high heat dissipation folded-edge copper strip frame structure, comprising:

[0013] A frame body, the surface of which is connected to a frame carrier from left to right;

[0014] Multiple folded copper strips are respectively disposed on the surface of multiple frame carriers, and a copper strip folding lug is provided on one side of the surface of each folded copper strip.

[0015] The chip body is disposed on the surface of the folded copper strip and located on one side of the folded lug of the copper strip.

[0016] Preferably, the surface of the folded copper strip has multiple copper strip locking holes arranged horizontally and vertically.

[0017] Preferably, the surface of the frame body is provided with a plurality of spring support feet from left to right.

[0018] Preferably, the plurality of copper strip locking holes are used for bonding between the frame carrier and the folded copper strip.

[0019] Preferably, the surface of the frame body has a plurality of frame positioning holes arranged from left to right.

[0020] Preferably, the surface of the frame carrier is covered with a protective cover.

[0021] Preferably, the surface of the folded copper strip is provided with a plurality of separating components, the separating components including separating blocks, the bottom of the separating blocks being provided with adhesive strips, and the adhesive strips being adhered to the surface of the folded copper strip.

[0022] Preferably, a rubber pad is adhered to the surface of the separator block, and the separator block and the rubber pad are used for heat dissipation between the chip body and the folded copper strip.

[0023] Preferably, the surface of the folded copper strip is provided with a movable component, the movable component includes two rectangular blocks, each of the two rectangular blocks has a mounting groove on one side opposite to the other, the two mounting grooves are provided with mounting blocks, and the two mounting blocks are connected by a connecting block with a movable stop.

[0024] Preferably, the surface of the folded copper strip is provided with a fixing component, the fixing component includes a fixing frame, fixing strips are provided on both sides of the surface of the fixing frame, and an adhesive strip is provided between the fixing frame and the fixing strips.

[0025] Compared with related technologies, the high heat dissipation folded copper strip frame structure provided by the present invention has the following beneficial effects:

[0026] This invention provides a high-heat-dissipation folded-edge copper strip frame structure.

[0027] In terms of electrical performance: reducing resistance and heat generation can avoid high package resistance values ​​caused by the use of metal wire connections, thereby reducing the heat generated when current passes through, which helps to improve the performance and stability of the chip.

[0028] Improve current carrying capacity: Break through the limitations of metal wire conductivity to meet the needs of some chip application scenarios with high current requirements and ensure that the chip operates normally under high current conditions.

[0029] In terms of thermal conductivity: Enhanced heat dissipation, improved reliability, and improved thermal conductivity enable the heat generated during chip operation to be dissipated quickly, preventing heat from accumulating inside the chip, thereby improving the chip's reliability and lifespan.

[0030] In terms of cost: Reduce production costs by eliminating the need for silver plating at the lead solder joints, saving the cost of the silver plating process and avoiding additional costs caused by poor silver plating, including the increased costs due to packaging quality and performance issues caused by decreased soldering quality, thereby reducing the total cost of chip packaging. Attached Figure Description

[0031] Figure 1 This is a schematic diagram of the first embodiment of a high heat dissipation folded copper strip frame structure provided by the present invention;

[0032] Figure 2 for Figure 1 The diagram shows the structure of the spring support leg.

[0033] Figure 3 for Figure 1 The diagram shows the structural schematic of the frame carrier.

[0034] Figure 4 for Figure 1 The diagram shows the structural arrangement between the frame carrier and the chip body.

[0035] Figure 5 for Figure 1 A side view of the entire device shown;

[0036] Figure 6 for Figure 5 A three-dimensional structural diagram of the overall external structure of the device shown;

[0037] Figure 7 This is a schematic diagram of a second embodiment of a high heat dissipation folded copper strip frame structure provided by the present invention;

[0038] Figure 8 for Figure 7 The enlarged schematic diagram of part A shown below;

[0039] Figure 9 This is a schematic diagram of the third embodiment of a high heat dissipation folded copper strip frame structure provided by the present invention;

[0040] Figure 10 for Figure 9 The enlarged schematic diagram of section B is shown below;

[0041] Figure 11 This is a schematic diagram of the fourth embodiment of a high heat dissipation folded copper strip frame structure provided by the present invention;

[0042] Figure 12 for Figure 11 The enlarged schematic diagram of section C is shown.

[0043] The diagram labels are as follows: 1. Main frame; 2. Frame carrier; 3. Folded copper strip; 4. Copper strip folded lug; 5. Copper strip locking hole; 6. Spring support foot; 7. Frame positioning hole; 8. Chip body; 9. Protective cover;

[0044] 10. Separator assembly; 101. Separator block; 102. Adhesive strip; 103. Rubber pad;

[0045] 11. Movable component; 111. Rectangular block; 112. Mounting slot; 113. Mounting block; 114. Movable stop block;

[0046] 12. Fixing component; 121. Fixing frame; 122. Fixing strip; 123. Adhesive strip. Detailed Implementation

[0047] The present invention will be further described below with reference to the accompanying drawings and embodiments. Example

[0048] Please refer to the following: Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 and Figure 6 ,in, Figure 1 This is a schematic diagram of the first embodiment of a high heat dissipation folded copper strip frame structure provided by the present invention; Figure 2 for Figure 1 The diagram shows the structure of the spring support leg. Figure 3 for Figure 1 The diagram shows the structural schematic of the frame carrier. Figure 4 for Figure 1 The diagram shows the structural arrangement between the frame carrier and the chip body. Figure 5 for Figure 1 A side view of the entire device shown; Figure 6 for Figure 5 The diagram shows a three-dimensional structural representation of the overall external structure of the device. A high-heat-dissipation, folded-edge copper strip frame structure includes:

[0049] A frame body 1, on the surface of which frame carriers 2 are connected sequentially from left to right;

[0050] Multiple folded copper strips 3 are respectively disposed on the surface of multiple frame carriers 2, and a copper strip folded ear 4 is provided on one side of the surface of the folded copper strip 3.

[0051] The chip body 8 is disposed on the surface of the folded copper strip 3 and located on one side of the copper strip fold 4.

[0052] The surface of the folded copper strip 3 is provided with multiple copper strip locking holes 5 in both the horizontal and vertical directions.

[0053] The surface of the main frame 1 is provided with multiple spring support feet 6 from left to right.

[0054] The multiple copper strip locking holes 5 are used for bonding between the frame carrier 2 and the folded copper strip 3.

[0055] The surface of the frame body 1 has multiple frame positioning holes 7 arranged from left to right.

[0056] The surface of the frame carrier 2 is covered with a protective cover 9.

[0057] The newly designed copper strip folded edge structure, with its locking hole design, enhances the adhesion and locking strength between the injection-molded epoxy resin and the copper strip and chip. It also promotes the discharge of volatile gases from the contact surface between the copper strip and the chip, thus accelerating production efficiency.

[0058] The newly designed copper strip frame adopts a frame spring support foot design, which can effectively prevent the copper strip unit from being squeezed and deformed by external forces during the packaging process.

[0059] Compared to conventional flat designs, this design increases the area of ​​the sealant after molding and also increases the heat dissipation area. When the product is subjected to high voltage and current applications, it can effectively improve heat dissipation and enhance structural stability.

[0060] Compared with related technologies, the high heat dissipation folded copper strip frame structure provided by the present invention has the following beneficial effects:

[0061] This invention provides a high-heat-dissipation folded-edge copper strip frame structure.

[0062] In terms of electrical performance: reducing resistance and heat generation can avoid high package resistance values ​​caused by the use of metal wire connections, thereby reducing the heat generated when current passes through, which helps to improve the performance and stability of the chip.

[0063] Improve current carrying capacity: Break through the limitations of metal wire conductivity to meet the needs of some chip application scenarios with high current requirements and ensure that the chip operates normally under high current conditions.

[0064] In terms of thermal conductivity: Enhanced heat dissipation, improved reliability, and improved thermal conductivity enable the heat generated during chip operation to be dissipated quickly, preventing heat from accumulating inside the chip, thereby improving the chip's reliability and lifespan.

[0065] In terms of cost: Reduce production costs by eliminating the need for silver plating at the lead solder joints, saving the cost of the silver plating process and avoiding additional costs caused by poor silver plating, including the increased costs due to packaging quality and performance issues caused by decreased soldering quality, thereby reducing the total cost of chip packaging. Example

[0066] Please refer to the following: Figure 7 and Figure 8 Based on the high heat dissipation folded-edge copper strip frame structure provided in the first embodiment of this application, the second embodiment of this application proposes another high heat dissipation folded-edge copper strip frame structure. The second embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the second embodiment will not affect the separate implementation of the first embodiment.

[0067] Specifically, the difference in the high heat dissipation folded copper strip frame structure provided in the second embodiment of this application is that the folded copper strip 3 has a plurality of partition components 10 on its surface. Each partition component 10 includes a partition block 101. The bottom of the partition block 101 is provided with an adhesive strip 102, which is adhered to the surface of the folded copper strip 3.

[0068] A rubber pad 103 is adhered to the surface of the separator 101. The separator 101 and the rubber pad 103 are used for heat dissipation between the chip body 8 and the folded copper strip 3.

[0069] The rubber pad 103 is made of graphite and can conduct electricity. The use of the rubber pad 103 can provide cushioning and protection and increase friction when the chip body 8 is connected to the surface of the folded copper strip 3.

[0070] The working principle of the high heat dissipation folded copper strip frame structure provided by this invention is as follows:

[0071] In use, after the chip body 8 is installed between multiple partition blocks 101 on the surface of the folded copper strip 3, when the chip body 8 works for a long time and generates heat, the heat can flow through the gaps between the multiple partition blocks 101 and the folded copper strip 3.

[0072] Compared with related technologies, the high heat dissipation folded copper strip frame structure provided by the present invention has the following beneficial effects:

[0073] The present invention provides a high heat dissipation folded copper strip frame structure. Multiple partition blocks 101 with adhesive strips 102 and rubber pads 103 are provided on the surface of the folded copper strip 3. When the chip body 8 is mounted on the surface of the folded copper strip 3, the gap between the chip body 8 and the folded copper strip 3 can be reduced, thereby allowing heat to flow. Example

[0074] Please refer to the following: Figure 9 and Figure 10 Based on the high heat dissipation folded-edge copper strip frame structure provided in the first embodiment of this application, the third embodiment of this application proposes another high heat dissipation folded-edge copper strip frame structure. The third embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the third embodiment will not affect the separate implementation of the first embodiment.

[0075] Specifically, the difference in the high heat dissipation folded copper strip frame structure provided in the third embodiment of this application is that the surface of the folded copper strip 3 is provided with a movable component 11, the movable component 11 includes two rectangular blocks 111, each of the two rectangular blocks 111 has a mounting groove 112 on one side opposite to the other, the two mounting grooves 112 are provided with mounting blocks 113 inside, and the two mounting blocks 113 are connected by a connecting block with a movable stop 114.

[0076] The rectangular block 111 is connected to the surface of the folded copper strip 3. The use of the mounting groove 112 and the mounting block 113 facilitates the adjustment of the movable stop 114, which is a thin sheet.

[0077] The working principle of the high heat dissipation folded copper strip frame structure provided by this invention is as follows:

[0078] In use, after the chip body 8 is bonded to the surface of the folded copper strip 3, the movable stop 114 is pushed to move under the action of the mounting block 113 and the mounting groove 112 until it contacts one side of the chip body 8 for fixation.

[0079] Compared with related technologies, the high heat dissipation folded copper strip frame structure provided by the present invention has the following beneficial effects:

[0080] The present invention provides a high heat dissipation folded copper strip frame structure. The movable component 11 is provided on the surface of the folded copper strip 3 so that chip bodies 8 of different sizes can be squeezed and fixed after being installed on the surface of the folded copper strip 3. Example

[0081] Please refer to the following: Figure 11 and Figure 12Based on the high heat dissipation folded-edge copper strip frame structure provided in the first embodiment of this application, the fourth embodiment of this application proposes another high heat dissipation folded-edge copper strip frame structure. The fourth embodiment is merely a preferred embodiment of the first embodiment, and the implementation of the fourth embodiment will not affect the separate implementation of the first embodiment.

[0082] Specifically, the fourth embodiment of this application provides a high heat dissipation folded copper strip frame structure in that the folded copper strip 3 has a fixing component 12 on its surface. The fixing component 12 includes a fixing frame 121, and fixing strips 122 are provided on both sides of the surface of the fixing frame 121. An adhesive strip 123 is provided between the fixing frame 121 and the fixing strips 122.

[0083] The use of adhesive strip 123 facilitates the bonding of fixing strip 122 to the surface of fixing frame 121. The use of fixing strip 122 facilitates the prevention of chip body 8 from falling off after chip body 8 is installed inside fixing frame 121. Fixing frame 121 is connected to the surface of folded copper strip 3.

[0084] The working principle of the high heat dissipation folded copper strip frame structure provided by this invention is as follows:

[0085] In use, after the chip body 8 is bonded to the surface of the folded copper strip 3 and located inside the fixing frame 121, the fixing strip 122 is then bonded to the surface of the fixing frame 121 by the adhesive strip 123.

[0086] Compared with related technologies, the high heat dissipation folded copper strip frame structure provided by the present invention has the following beneficial effects:

[0087] The present invention provides a high heat dissipation folded copper strip frame structure. A fixing component 12 is provided between the folded copper strip 3 and the chip body 8 to facilitate the limiting function after the chip body 8 is installed inside the folded copper strip 3, and to prevent the chip body 8 from loosening.

[0088] The above description is merely an embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural or procedural transformations made based on the content of the present invention specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of the present invention.

Claims

1. A high-heat-dissipation folded-edge copper strip frame structure, characterized in that, include: A frame body, the surface of which is connected to a frame carrier from left to right; Multiple folded copper strips are respectively disposed on the surface of multiple frame carriers, and a copper strip folding lug is provided on one side of the surface of each folded copper strip. The chip body is disposed on the surface of the folded copper strip and located on one side of the folded lug of the copper strip.

2. The high heat dissipation folded-edge copper strip frame structure according to claim 1, characterized in that, The surface of the folded copper strip has multiple copper strip locking holes arranged horizontally and vertically.

3. The high heat dissipation folded-edge copper strip frame structure according to claim 1, characterized in that, The surface of the main frame body is provided with multiple spring-loaded support feet from left to right.

4. The high heat dissipation folded-edge copper strip frame structure according to claim 2, characterized in that, Multiple copper strip locking holes are used for bonding between the frame carrier and the folded copper strip.

5. The high heat dissipation folded-edge copper strip frame structure according to claim 1, characterized in that, The surface of the main frame body has multiple frame positioning holes from left to right.

6. The high heat dissipation folded-edge copper strip frame structure according to claim 1, characterized in that, The surface of the frame carrier is covered with a protective cover.

7. The high heat dissipation folded-edge copper strip frame structure according to claim 1, characterized in that, The surface of the folded copper strip is provided with multiple separating components, each separating component including a separating block, and the bottom of the separating block is provided with an adhesive strip, which is adhered to the surface of the folded copper strip.

8. The high heat dissipation folded-edge copper strip frame structure according to claim 7, characterized in that, A rubber pad is adhered to the surface of the separator block, and the separator block and the rubber pad are used for heat dissipation between the chip body and the folded copper strip.

9. The high heat dissipation folded-edge copper strip frame structure according to claim 1, characterized in that, The surface of the folded copper strip is provided with a movable component, which includes two rectangular blocks. Each of the two rectangular blocks has a mounting groove on one side opposite to the other. The two mounting grooves are provided with mounting blocks. The two mounting blocks are connected by a connecting block and a movable stop.

10. The high heat dissipation folded-edge copper strip frame structure according to claim 1, characterized in that, The surface of the folded copper strip is provided with a fixing component, the fixing component includes a fixing frame, fixing strips are provided on both sides of the surface of the fixing frame, and an adhesive strip is provided between the fixing frame and the fixing strips.

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