Heat dissipation device, motor and electronic equipment

Abstract

The embodiment of the utility model relates to the technical field of motor heat dissipation, and particularly discloses a heat dissipation device, a motor and electronic equipment, the heat dissipation device comprises a heat dissipation main body, the heat dissipation main body is provided with a through cavity, a liquid inlet channel and a liquid outlet channel, and the liquid inlet channel and the liquid outlet channel are communicated with the through cavity; a plurality of blocking walls are arranged on the inner wall of the heat dissipation body at intervals, a flow channel is formed between any two adjacent blocking walls, the liquid inlet channel is communicated with the flow channel located at one end of the inner wall of the heat dissipation body, and the liquid outlet channel is communicated with the flow channel located at the other end of the inner wall of the heat dissipation body; a communicating groove is formed between any two adjacent flow channels, the through cavity is used for containing a to-be-cooled part, and the openings of the flow channels are used for sealing the to-be-cooled part when the to-be-cooled part is contained in the through cavity. By means of the mode, when the part to be cooled is contained in the through cavity, the cooling medium can circulate in the flow channel, so that heat of the part to be cooled is absorbed, and the structure of an existing cooling device depending on the cooling medium is simplified.

Description

Technical Field

[0001] This utility model relates to the field of motor heat dissipation technology, and in particular to a heat dissipation device, motor and electronic equipment. Background Technology

[0002] As a device that converts electrical energy into mechanical energy, the electric motor is widely used in various fields such as industrial manufacturing, transportation, home appliances, aerospace, and medical equipment. During operation, the heat generated by internal losses (such as winding copper losses, stator and rotor iron losses, and mechanical losses) causes the temperature of various parts of the motor to rise. Excessive temperature will accelerate the aging of the motor's insulation materials and shorten the motor's service life; at the same time, the temperature rise may also cause changes in the internal magnetic field of the motor, thereby affecting the motor's operating performance.

[0003] In the process of realizing this utility model, the inventors discovered that: Currently, the main heat dissipation methods for motors include liquid cooling. Liquid cooling has high heat dissipation efficiency and is suitable for motors with large or medium power and high heat generation. However, the internal structure of a typical liquid-cooled motor is a hollow tubular structure used to contain the liquid cooling medium. Its internal flow channel structure is too complex, and the hollow tubular structure is difficult to process and has high manufacturing cost. Therefore, in the field of motor heat dissipation, there is a need for a heat dissipation device with a simple structure and high heat dissipation efficiency. Utility Model Content

[0004] This utility model provides a heat dissipation device, a motor, and an electronic device. The main technical problem it solves is that existing heat dissipation devices that rely on liquid cooling media have complex structures and high manufacturing costs.

[0005] To solve the above-mentioned technical problems, the present invention provides a heat dissipation device, including a heat dissipation body, which is provided with a through cavity, an inlet channel, and an outlet channel. The inlet channel and the outlet channel are both connected to the through cavity. The inner wall of the heat dissipation body is provided with multiple baffles, which are spaced apart. A flow channel is formed between any two adjacent baffles. The inlet channel is connected to the flow channel located at one end of the inner wall of the heat dissipation body, and the outlet channel is connected to the flow channel located at the other end of the inner wall of the heat dissipation body. A connecting groove is provided between any two adjacent flow channels. The through cavity is used to accommodate a component to be cooled, and the opening of the flow channel is used to close the component when it is accommodated in the through cavity.

[0006] Optionally, along the axial direction of the heat dissipation body, the projections of any two adjacent connecting slots are misaligned, and along the axial direction of the heat dissipation body, the projections of any two adjacent connecting slots are symmetrical to each other.

[0007] Optionally, the heat dissipation device further includes a first sealing element and a second sealing element. The first sealing element is located at one end of the inner wall of the heat dissipation body, and the second sealing element is located at the other end of the inner wall of the heat dissipation body. The liquid inlet channel and the liquid outlet channel are located between the second sealing element and the first sealing element. The first sealing element and the second sealing element are used to cover both ends of the component to be dissipated, thereby sealing both ends of the component to be dissipated and the inner wall of the heat dissipation body.

[0008] Optionally, one end of the inner wall of the heat dissipation body is provided with a first sealing groove, a portion of the first sealing member is received in the first sealing groove, and a portion protrudes from the first sealing groove, the portion of the first sealing member protruding from the first sealing groove is used to abut against the component to be cooled; and / or the other end of the inner wall of the heat dissipation body is provided with a second sealing groove, a portion of the second sealing member is received in the second sealing groove, and a portion protrudes from the second sealing groove, the portion of the second sealing member protruding from the second sealing groove is used to abut against the component to be cooled.

[0009] Optionally, the outer wall of the heat dissipation body is provided with an annular groove; the heat dissipation body includes an annular groove segment and a main body segment, and along the radial direction of the heat dissipation body, the cross-sectional area of ​​the annular groove segment is smaller than the transverse area of ​​the main body segment.

[0010] Optionally, the bottom of the annular groove has multiple protrusions extending in a direction away from the axis of the heat dissipation body.

[0011] Optionally, the liquid inlet channel includes a liquid inlet located on the inner wall of the heat dissipation body; a flow divider is provided in the flow channel at one end of the heat dissipation body, one end of the flow divider is fixed to a baffle wall of the flow channel at one end of the heat dissipation body, the other end of the flow divider is fixed to another baffle wall of the flow channel at one end of the heat dissipation body, and the flow divider spans the liquid inlet.

[0012] Optionally, along the axis parallel to the heat dissipation body, a baffle is provided at the bottom of the connecting groove, one end of the baffle extends out of the connecting groove, the other end of the baffle extends out of the connecting groove, and the end of the baffle away from the inner wall of the heat dissipation body abuts against the heat dissipation component.

[0013] To solve the above-mentioned technical problems, another technical solution adopted by this utility model is to provide an electric motor, including the above-mentioned heat dissipation device.

[0014] To solve the above-mentioned technical problems, another technical solution adopted by this utility model is to provide an electronic device, including the above-mentioned motor.

[0015] The beneficial effects of this utility model embodiment are as follows: Unlike existing technologies, this utility model embodiment provides a heat dissipation device, a motor, and electronic equipment, including a heat dissipation body. The heat dissipation body is provided with a through cavity, a liquid inlet channel, and a liquid outlet channel, both of which are connected to the through cavity. The heat dissipation body has multiple baffles arranged at intervals, with a flow channel formed between any two adjacent baffles. The liquid inlet channel is connected to the flow channel at one end of the heat dissipation body, and the liquid outlet channel is connected to the flow channel at the other end of the heat dissipation body. A connecting groove is provided between any two adjacent flow channels. The through cavity is used to accommodate a component to be cooled, and the opening of the flow channel is used to close the component when it is accommodated in the through cavity. Through the above structure, this utility model embodiment can control the flow direction of the liquid cooling medium flowing into the flow channels through the multiple flow channels formed by the baffles and the connecting grooves between the multiple flow channels, thereby absorbing and transferring the heat generated by the motor, thus forming a heat dissipation device with a simple structure and high heat dissipation efficiency. Attached Figure Description

[0016] To more clearly illustrate the technical solutions of the embodiments of this utility model, the drawings used in the embodiments of this utility model will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this utility model. For those skilled in the art, other drawings can be obtained based on the drawings without creative effort.

[0017] Figure 1 This is an exploded view of the heat dissipation device and the component to be cooled provided in this embodiment of the utility model;

[0018] Figure 2 This is an assembly diagram of the heat dissipation device and the component to be cooled provided in this embodiment of the utility model;

[0019] Figure 3 This is a cross-sectional schematic diagram of the heat dissipation device and the component to be heatd provided in an embodiment of this utility model;

[0020] Figure 4 This is a schematic diagram of the structure of the heat dissipation body provided in an embodiment of the present invention. Detailed Implementation

[0021] To facilitate understanding of this utility model, a more detailed description is provided below with reference to the accompanying drawings and specific embodiments. It should be noted that when an element is described as being "fixed to" another element, it can be directly on the other element, or one or more intermediate elements may exist between them. When an element is described as being "connected" to another element, it can be directly connected to the other element, or one or more intermediate elements may exist between them. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this specification are for illustrative purposes only.

[0022] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the invention. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0023] Please see Figures 1 to 3The heat dissipation device 1000 includes a heat dissipation body 1, which has a through cavity 11, a liquid inlet channel 12, and a liquid outlet channel 13. Both the liquid inlet channel 12 and the liquid outlet channel 13 communicate with the through cavity 11. The liquid inlet channel 12 is connected to an external liquid supply device, which provides liquid cooling medium and power for its flow. The liquid outlet channel 13 is also connected to the external liquid supply device to recover the cooling medium flowing out of the outlet channel 13. The inner wall of the heat dissipation body 1 is provided with multiple baffles 14, which are spaced apart. A flow channel 15 is formed between any two adjacent baffles 14. The liquid inlet channel 12 is connected to the flow channel 15 at one end of the inner wall of the heat dissipation body 1, and the liquid outlet channel 13 is connected to the flow channel 15 at the other end of the inner wall of the heat dissipation body 1. A connecting groove 16 is provided between any two adjacent flow channels 15. The connecting groove 16 is located on the baffle 14 shared by the two adjacent flow channels 15. The cavity 11 is used to accommodate the heat dissipation component 100. The opening of the flow channel 15 is used to close the heat dissipation component 100 when it is accommodated in the cavity 11. Through the above structure, a heat dissipation device 1000 that can be fitted onto the heat dissipation component 100 is formed. Using the externally provided liquid cooling medium, it passes sequentially through the liquid inlet channel 12, the multiple flow channels 15 connected by the connecting groove 16 and closed by the heat dissipation component 100, and the liquid outlet channel 13. In this way, the heat on the surface of the heat dissipation component 100 can be removed in time by the liquid cooling medium, thereby rapidly reducing the temperature of the heat dissipation component 100. The heat dissipation device 1000 with this structure does not require hollow pipes. It only needs to rely on the flow channel 15 formed by two adjacent baffles 14 and the heat dissipation component 100 housed in the cavity 11 to form a pipe-like flow channel 15 structure for the liquid cooling medium to flow within the flow channel 15 structure. The heat dissipation device 1000 with this flow channel structure is simple to manufacture and can be realized by turning and milling. Moreover, since the liquid cooling medium can directly contact the heat dissipation component 100, compared with the existing heat dissipation devices that rely on pipes to indirectly contact the liquid cooling medium with the heat dissipation component 100, the heat dissipation efficiency of the heat dissipation device 1000 of this utility model is higher.

[0024] Understandably, the shape of the heat dissipation body 1 needs to be adapted to the heat dissipation component 100 so that the opening of the flow channel 15 can be properly sealed with the heat dissipation component 100, thereby ensuring the flow of the liquid cooling medium. Furthermore, to ensure the sealing conditions of the liquid cooling medium, the opening of the flow channel 15 at one end of the inner wall of the heat dissipation body 1 is interference-fitted with the heat dissipation component 100, i.e., the two adjacent baffles 14 forming the flow channel 15 or the baffle 14 at one end of the heat dissipation body 1 is interference-fitted with the heat dissipation component 100; the opening of the flow channel 15 at the other end of the inner wall of the heat dissipation body 1 is interference-fitted with the heat dissipation component 100, i.e., the two adjacent baffles 14 forming the flow channel 15 or the baffle 14 at the other end of the heat dissipation body 1 is interference-fitted with the heat dissipation component 1000; or, to ensure the sealing of both ends of the heat dissipation device 1000, sealing elements can be provided at both ends of the heat dissipation device 1000.

[0025] It should be noted that since the liquid cooling medium needs to flow on the outer surface of the component to be cooled 100, the outer surface of the component to be cooled 100 needs to be waterproof to prevent the liquid cooling medium from entering the interior of the component to be cooled 100 and causing damage.

[0026] The aforementioned heat-dissipating component 100 includes, but is not limited to, a motor, a servo motor, etc. In this embodiment, the preferred heat-dissipating component 100 is a motor.

[0027] In some embodiments, please refer to Figure 4 Along the axis A of the heat dissipation body 1, the projections of any two adjacent connecting slots 16 are misaligned so that the path for the liquid cooling medium to flow between two adjacent flow channels 15 is extended, avoiding the two connecting slots 16 being too close to each other, which would cause the liquid cooling medium to flow out directly through the connecting slots 16 without fully flowing in the flow channel 15, thus affecting the heat dissipation efficiency of the heat dissipation device 1000.

[0028] Understandably, along the axis A of the heat dissipation body 1, the projected misalignment angle of any two adjacent connecting slots 16 is between 0° and 180°. Different misalignment angles result in different flow directions and speeds of the liquid cooling medium within the flow channel 15. Therefore, the misalignment angle of the two connecting slots 16 can be adjusted according to the actual area where the heat generation of the heat-dissipating component 100 is concentrated, thereby changing the flow rate of the liquid cooling medium in the local area and thus accelerating the cooling of the heat-dissipating component 100 in a localized manner.

[0029] Furthermore, in this embodiment, preferably, the projections of any two adjacent connecting slots 16 are symmetrical along the axis A of the heat dissipation body 1, that is, the projection misalignment angle of any two adjacent connecting slots 16 is 180°. This makes the flow of the liquid cooling medium in the flow channel 15 of the heat dissipation device 1000 tend to be uniform under the driving force of the external liquid supply device, thereby improving the adaptability of the heat dissipation device 1000 to different heat dissipation components 100.

[0030] In some embodiments, please refer to Figure 2 and Figure 3 The heat dissipation device 1000 also includes a first sealing element 2 and a second sealing element 3. The first sealing element 2 is located at one end of the inner wall of the heat dissipation body 1, and the second sealing element 3 is located at the other end of the inner wall of the heat dissipation body 1. The liquid inlet channel 12 and the liquid outlet channel 13 are located between the second sealing element 3 and the first sealing element 2. The first sealing element 2 and the second sealing element 3 are used to cover both ends of the heat dissipation component 100, sealing both ends of the heat dissipation component 100 and the inner wall of the heat dissipation body 1. The specific working principle is that the first sealing element 2, under the joint clamping action of one end of the outer surface of the heat dissipation component 100 and the inner wall of the heat dissipation device 1000, seals the gap between one end of the heat dissipation component 100 and the heat dissipation body 1; the second sealing element 3, under the joint clamping action of the other end of the outer surface of the heat dissipation component 100 and the inner wall of the heat dissipation device 1000, seals the gap between the other end of the heat dissipation component 100 and the heat dissipation body 1; thereby sealing the liquid cooling medium that may seep out from the tiny gap between the baffle 14 and the heat dissipation component 100.

[0031] Furthermore, a first sealing groove 17 is provided at one end of the inner wall of the heat dissipation body 1. A portion of the first sealing member 2 is received in the first sealing groove 17, and a portion protrudes from the first sealing groove 17. The portion of the first sealing member 2 protruding from the first sealing groove 17 is used to abut against the heat dissipation member 100, so that the first sealing structure formed by the first sealing member 2 and the first sealing groove 17 seals the gap between one end of the heat dissipation member 100 and the inner wall of the heat dissipation body 1, preventing liquid cooling medium from seeping out from the gap; and / or a second sealing groove 18 is provided at the other end of the inner wall of the heat dissipation body 1. A portion of the second sealing member 3 is received in the second sealing groove 18, and a portion protrudes from the second sealing groove 18. The portion of the second sealing member 3 protruding from the second sealing groove 18 is used to abut against the heat dissipation member 100, so that the second sealing structure formed by the second sealing member 3 and the second sealing groove 18 seals the gap between the other end of the heat dissipation member 100 and the inner wall of the heat dissipation body 1, preventing liquid cooling medium from seeping out from the gap. The first sealing groove 17 and the second sealing groove 18 respectively serve to partially accommodate and limit the first sealing element 2 and the second sealing element 3. When the heat dissipation component 100 is installed in the through cavity 11, the first sealing element 2 and the second sealing element 3 can be limited by the first sealing groove 17 and the second sealing groove 18 respectively, thereby preventing the first sealing element 2 and the second sealing element 3 from rolling during the insertion of the heat dissipation component 100 into the through cavity 11, which would affect the installation of the heat dissipation component 100. Furthermore, the design of the first sealing groove 17 and the second sealing groove 18 extends the path for the liquid cooling medium to permeate out, improving the sealing performance of the heat dissipation device 1000.

[0032] In some embodiments, an annular groove 19 is provided on the outer wall of the heat dissipation body 1; the heat dissipation body 1 includes an annular groove segment 1a and a main body segment 1b, and along the radial direction of the heat dissipation body 1, the cross-sectional area of ​​the annular groove segment 1a is smaller than the transverse area of ​​the main body segment 1b. This reduces the wall thickness of the heat dissipation body 1, helps to increase the speed at which the liquid cooling medium transfers heat to the external environment, and thus improves the heat dissipation efficiency of the heat dissipation device 1000.

[0033] Furthermore, the bottom of the annular groove 19 extends in a direction away from the axis A of the heat dissipation body 1, forming a structure similar to heat dissipation fins, so as to increase the contact area between the heat dissipation body 1 and the external environment and improve the heat dissipation efficiency of the heat dissipation device 1000.

[0034] In some embodiments, please refer to Figure 4The liquid inlet channel 12 includes a liquid inlet 121 located on the inner wall of the heat dissipation body 1. A flow divider 1A is provided in the flow channel 15 at one end of the heat dissipation body 1. One end of the flow divider 1A is fixed to a baffle wall 14 of the flow channel 15 at one end of the heat dissipation body 1, and the other end of the flow divider 1A is fixed to another baffle wall 14 of the flow channel 15 at one end of the heat dissipation body 1. The flow divider 1A spans across the liquid inlet 121. By providing the flow divider 1A, the liquid cooling medium flowing through the liquid inlet 121 is divided into two streams. Under the driving force of the external liquid supply device, the two streams of liquid cooling medium flow fully in the flow channel 15 at one end of the heat dissipation body 1, avoiding the situation where the liquid cooling medium cannot flow fully in the flow channel 15 and flows out directly due to the close distance between the liquid inlet 121 and the connecting groove 16.

[0035] In some embodiments, please refer to Figure 4 Along axis A parallel to the heat dissipation body 1, a baffle 1B is provided at the bottom of the connecting groove 16. One end of the baffle 1B extends out of the connecting groove 16, and the other end of the baffle 1B extends out of the connecting groove 16. The end of the baffle 1B away from the inner wall of the heat dissipation body 1 abuts against the heat sink 100. By setting the baffle 1B, the flow direction of the liquid cooling medium through the connecting groove 16 is changed, thereby homogenizing the flow velocity of the liquid cooling medium in the flow channel 15. Furthermore, the flow velocity of the liquid cooling medium can be adjusted by adjusting the length of the baffle 1B extending out of the connecting groove 16 to accommodate liquid cooling media with different heat capacities, allowing the liquid cooling medium to fully absorb heat.

[0036] It should be noted that one end of the baffle plate 1B can be directly fixed to the baffle wall 14 on the side near the baffle wall 14 with the connecting groove 16, and the other end of the baffle plate 1B can be directly fixed to the baffle wall 14 on the other side near the baffle wall 14 with the connecting groove 16, thereby forming two independent flow channels 15, so that two liquid cooling media can be supplied in a heat dissipation device 1000, thereby forming two heat dissipation areas to meet the specific regional heat dissipation needs.

[0037] In this embodiment, the heat dissipation device 1000 includes a heat dissipation body 1, which is provided with a through cavity 11, an inlet channel 12, and an outlet channel 13. The inlet channel 12 and the outlet channel 13 are both connected to the through cavity 11. The interior of the heat dissipation body 1 is provided with a plurality of baffles 14, which are spaced apart. A flow channel 15 is formed between any two adjacent baffles 14. The inlet channel 12 is connected to the flow channel 15 located at one end of the heat dissipation body 1, and the outlet channel 13 is connected to the flow channel 15 located at the other end of the heat dissipation body 1. A connecting groove 16 is provided between any two adjacent flow channels 15. The through cavity 11 is used to accommodate the component 100 to be cooled, and the opening of the flow channel 15 is used to close the component 100 when it is accommodated in the through cavity 11. With the above structure, multiple flow channels 15 formed by the baffle 14 are used to supply the liquid cooling medium for flow, and the flow direction of the liquid cooling medium flowing into the flow channel 15 is controlled by the connecting groove 16 between the multiple flow channels 15. This changes the hollow tubular structure of the existing heat dissipation device 1000 that relies on the liquid cooling medium for heat dissipation, simplifies the structure of the heat dissipation device 1000, and makes it easier to process and manufacture, thereby reducing the production and manufacturing cost.

[0038] This utility model also provides an embodiment of a motor, which includes the heat dissipation device 1000 described above. For the function and structure of the heat dissipation device 1000, please refer to the above embodiment, which will not be repeated here.

[0039] This utility model provides another embodiment of an electronic device, which includes the motor described above. For the function and structure of the motor, please refer to the above embodiment, which will not be repeated here.

[0040] It should be noted that while the preferred embodiments of this utility model are provided in the specification and accompanying drawings, this utility model can be implemented in many different forms and is not limited to the embodiments described herein. These embodiments are not intended to impose additional limitations on the content of this utility model; their purpose is to provide a more thorough and comprehensive understanding of the disclosure of this utility model. Furthermore, the above-described technical features can be combined with each other to form various embodiments not listed above, all of which are considered to be within the scope of this utility model specification. Moreover, those skilled in the art can make improvements or modifications based on the above description, and all such improvements and modifications should fall within the protection scope of the appended claims.

Claims

1. A heat dissipation device, characterized in that, include: The heat dissipation body is provided with a through cavity, a liquid inlet channel and a liquid outlet channel, and the liquid inlet channel and the liquid outlet channel are both connected to the through cavity; The inner wall of the heat dissipation body is provided with multiple baffles, which are spaced apart. A flow channel is formed between any two adjacent baffles. The liquid inlet channel is connected to the flow channel at one end of the inner wall of the heat dissipation body, and the liquid outlet channel is connected to the flow channel at the other end of the inner wall of the heat dissipation body. A connecting groove is provided between any two adjacent flow channels. The cavity is used to accommodate the component to be scald. The opening of the flow channel is used to close the component when it is accommodated in the cavity.

2. The heat dissipation device according to claim 1, characterized in that, Along the axial direction of the heat dissipation body, the projections of any two adjacent connecting slots are misaligned, and along the axial direction of the heat dissipation body, the projections of any two adjacent connecting slots are symmetrical to each other.

3. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device further includes a first sealing element and a second sealing element. The first sealing element is located at one end of the inner wall of the heat dissipation body, and the second sealing element is located at the other end of the inner wall of the heat dissipation body. The liquid inlet channel and the liquid outlet channel are located between the second sealing element and the first sealing element. The first sealing element and the second sealing element are used to cover the two ends of the component to be dissipated, thereby sealing the two ends of the component to be dissipated and the inner wall of the heat dissipation body.

4. The heat dissipation device according to claim 3, characterized in that, One end of the inner wall of the heat dissipation body is provided with a first sealing groove. A portion of the first sealing member is received in the first sealing groove, and a portion protrudes from the first sealing groove. The portion of the first sealing member protruding from the first sealing groove is used to abut against the component to be cooled; and / or The other end of the inner wall of the heat dissipation body is provided with a second sealing groove. Part of the second sealing member is received in the second sealing groove, and part of it protrudes out of the second sealing groove. The part of the second sealing member protruding out of the second sealing groove is used to abut against the component to be dissipated.

5. The heat dissipation device according to claim 1, characterized in that, The outer wall of the heat dissipation body is provided with an annular groove; The heat dissipation body includes an annular groove section and a main body section. Along the radial direction of the heat dissipation body, the cross-sectional area of ​​the annular groove section is smaller than the transverse area of ​​the main body section.

6. The heat dissipation device according to claim 5, characterized in that, The bottom of the annular groove has multiple protrusions extending in a direction away from the axis of the heat dissipation body.

7. The heat dissipation device according to claim 1, characterized in that, The liquid inlet channel includes a liquid inlet, which is located on the inner wall of the heat dissipation body; A flow divider is provided in the flow channel at one end of the heat dissipation body. One end of the flow divider is fixed to a baffle wall of the flow channel at one end of the heat dissipation body, and the other end of the flow divider is fixed to another baffle wall of the flow channel at one end of the heat dissipation body. The flow divider also spans the liquid inlet.

8. The heat dissipation device according to claim 1, characterized in that, Along the axis parallel to the heat dissipation body, a baffle is provided at the bottom of the connecting groove. One end of the baffle extends out of the connecting groove, and the other end of the baffle extends out of the connecting groove. The end of the baffle away from the inner wall of the heat dissipation body abuts against the heat dissipation component.

9. An electric motor, characterized in that, Includes the heat dissipation device as described in any one of claims 1-8.

10. An electronic device, characterized in that, Includes the motor as described in claim 9.

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