Protective liquid coating device

Abstract

The utility model relates to a protective liquid coating device, in particular to the technical field of semiconductor laser grooving devices. A protective liquid coating device comprises an operation table, a coating assembly, a cleaning assembly and a placement assembly, the placement assembly is arranged on the operation table and used for fixing a wafer to be processed, the coating assembly comprises a liquid supply device and a coating spray head, the coating spray head is arranged on the operation table and located above the wafer to be processed, and the cleaning assembly is used for cleaning the wafer to be processed. The liquid supply device is connected with the coating nozzle, the cleaning assembly comprises a cleaning head, and a liquid outlet of the cleaning head corresponds to one side, coated with the protective liquid, of the wafer to be processed. According to the protective liquid coating device, the coating assembly and the cleaning assembly are arranged on the machine table, coating and cleaning operation can be conducted through single equipment, and the equipment cost is saved. And the wafer to be processed does not need to be transferred when the operation steps are switched, so that the risks of wafer damage and secondary pollution are reduced while the operation efficiency is improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor laser grooving apparatus technology, and more specifically, to a protective liquid coating apparatus. Background Technology

[0002] Semiconductor laser grooving equipment is a type of wafer grooving equipment commonly used in the packaging industry. It uses short-pulse lasers to perform surface etching and grooving within the wafer dicing channels. Currently, commonly used laser grooving equipment is mainly for processing wafers with borders, with less demand for grooving bare wafers. Therefore, the equipped coating and cleaning units are limited in function and cannot simultaneously handle the coating of protective solutions and cleaning. After wafer coating, a separate cleaning device is required, which not only increases equipment costs and processing steps but also may cause damage or secondary contamination to the wafer during transfer operations. Utility Model Content

[0003] The purpose of this application is to provide a protective liquid coating device to solve the above-mentioned technical problems.

[0004] This utility model provides a protective liquid coating device, which includes: an operating table, a coating component, a cleaning component, and a placement component. The placement component is disposed on the operating table and is used to fix the wafer to be processed. The coating component includes a liquid supply device and a coating nozzle. The coating nozzle is disposed on the operating table and is located above the wafer to be processed. The liquid supply device is connected to the coating nozzle. The cleaning component includes a cleaning head, and the outlet of the cleaning head corresponds to the side of the wafer to be processed coated with the protective liquid.

[0005] Furthermore, the coating assembly also includes a splash guard disposed on the worktable, which surrounds the periphery of the wafer to be processed and is used to block liquid splashed at the edge of the wafer to be processed.

[0006] Furthermore, the splash protection device includes a protective plate and a collection device. The protective plate is arranged around the periphery of the wafer to be processed. The protective plate is provided with at least one flow channel. The inlet end of the flow channel is located at the periphery of the wafer to be processed, and the outlet end of the flow channel is connected to the collection device.

[0007] Furthermore, the protective plate includes a base plate, a first guide plate, a second guide plate, and a third guide plate. The first guide plate, the second guide plate, and the third guide plate are spaced apart on the base plate, and a first flow channel is formed between the first guide plate and the second guide plate, and a second flow channel is formed between the second guide plate and the third guide plate. A collection port is provided on the base plate, and the collection port is connected to the flow channel.

[0008] Furthermore, the end of the flow channel closest to the wafer to be processed is inclined, and the end of the flow channel closest to the wafer to be processed is configured as a funnel-shaped structure.

[0009] Furthermore, the cleaning assembly also includes a bottom cleaning device, which is disposed at the bottom of the wafer to be processed and is used to clean the bottom of the wafer to be processed.

[0010] Furthermore, the bottom cleaning device includes a back cleaning nozzle and an edge cleaning nozzle, with the edge cleaning nozzle corresponding to the edge of the wafer to be processed and the back cleaning nozzle corresponding to the center of the wafer to be processed.

[0011] Furthermore, the liquid supply device includes a liquid transfer pump, a control valve, and at least two liquid storage tanks. The two liquid storage tanks are connected to the input end of the liquid transfer pump via the control valve, and the output end of the liquid transfer pump is connected to the coating nozzle.

[0012] Furthermore, a buffer tank is installed between the liquid transfer pump and the control valve, and a liquid level detection device is installed inside the buffer tank.

[0013] Furthermore, the placement assembly includes a drive motor, a rotating shaft, and a placement stage. The drive motor is connected to the placement stage via the rotating shaft. The wafer to be processed is fixed on the placement stage, and the drive motor drives the placement stage to rotate.

[0014] The protective liquid coating apparatus provided in this application allows for coating and cleaning operations to be performed using a single device by setting up coating and cleaning components on the machine, thus saving equipment costs. Switching between operation steps eliminates the need to transfer the wafer to be processed, improving operational efficiency while reducing the risk of wafer damage and secondary contamination. Attached Figure Description

[0015] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments of this application will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 One of the cross-sectional views of the protective liquid coating apparatus provided in the embodiments of this application;

[0017] Figure 2 Provided for the embodiments of this application Figure 1 Enlarged view of region A in the middle;

[0018] Figure 3 A second cross-sectional view of the protective liquid coating apparatus provided in the embodiments of this application;

[0019] Figure 4 A third cross-sectional view of the protective liquid coating apparatus provided in the embodiments of this application;

[0020] Figure 5 This is a structural diagram of the liquid supply device in the protective liquid coating apparatus provided in the embodiments of this application.

[0021] Icons: 100-Operating table; 300-Cleaning assembly; 400-Placement assembly; 500-Wafer to be processed; 201-Coating nozzle; 202-Liquid supply device; 600-Protective plate; 601-First guide channel; 602-Base plate; 603-First guide plate; 604-Second guide plate; 605-Third guide plate; 606-Collection port; 607-Second guide channel; 700-Bottom cleaning device; 701-Back cleaning nozzle; 702-Edge cleaning nozzle; 2021-Transfer pump; 2022-Control valve; 2023-Reservoir tank; 2024-Buffer tank; 401-Drive motor; 402-Rotating shaft; 403-Placement table. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0023] In the description of this application, it should be noted that the terms "inner" and "outer," etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship commonly used when the product is in use. They are used only for the convenience of describing this application and for simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this application. Furthermore, the terms "first," "second," etc., are used only to distinguish descriptions and should not be construed as indicating or implying relative importance.

[0024] In the description of this application, it should also be noted that, unless otherwise expressly specified and limited, the terms "setup" and "connection" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0025] This embodiment provides a protective liquid coating device, which includes: an operating table 100, a coating component, a cleaning component 300, and a placement component 400. The placement component 400 is disposed on the operating table 100 and is used to fix the wafer 500 to be processed. The coating component includes a liquid supply device 202 and a coating nozzle 201. The coating nozzle 201 is disposed on the operating table 100 and is located above the wafer 500 to be processed. The liquid supply device 202 is connected to the coating nozzle 201. The cleaning component 300 includes a cleaning head, and the outlet of the cleaning head corresponds to the side of the wafer 500 to be processed coated with the protective liquid.

[0026] Please refer to Figure 1 As shown, a placement assembly 400 is located at the center of the operating table 100, and the wafer 500 to be processed is horizontally fixed on the placement assembly 400. The operating table 100 is equipped with a coating assembly and a cleaning assembly 300. The coating assembly includes a coating nozzle 201 and a liquid supply device 202. The coating nozzle 201 is connected to the liquid supply device 202 via a liquid pipe, and the liquid supply device 202 is used to deliver a protective liquid. The outlet of the coating nozzle 201 is located directly above the wafer 500 to be processed, and the coating nozzle 201 is aligned with the center of the wafer 500. The coating nozzle 201 sprays the protective liquid onto the surface of the wafer 500 to be processed, and then rotates the wafer 500 to ensure the protective liquid evenly covers its surface. The cleaning assembly 300 and the coating assembly are located on opposite sides of the wafer 500 to be processed, and operate in opposition to each other. The cleaning assembly 300 includes a cleaning head for spraying cleaning fluid to clean the wafer surface. The protective liquid coating apparatus provided in this embodiment integrates the coating assembly and the cleaning assembly 300 on the operating table 100, enabling both coating and cleaning operations, saving equipment costs while improving equipment usability. Since wafers do not need to be transferred when changing operating steps, operational efficiency is improved, and secondary contamination or wafer damage is avoided.

[0027] Please refer to Figure 1 As shown, in some possible embodiments, the coating assembly also includes a splash protection device disposed on the worktable 100, the splash protection device being disposed around the periphery of the wafer 500 to be processed, the splash protection device being used to block liquid splashed at the edge of the wafer 500 to be processed.

[0028] It is understandable that during the protective coating process, the wafer rotates, using centrifugal force to evenly coat the surface of the wafer 500 to be processed. However, during the wafer's rotation, the protective liquid may splash from the edges. Splashed protective liquid falling onto the worktable 100 is not only difficult to clean, but may also splash back onto the back of the wafer 500, causing wafer contamination. Therefore, in this embodiment, the machine is equipped with a splash-proof protection device to block splashed protective liquid and collect it, preventing the protective liquid from splashing back onto the back of the wafer or onto the placement assembly 400, thus contaminating other wafers.

[0029] Please refer to Figure 1 As shown, in some possible embodiments, the splash protection device includes a protective plate 600 and a collection device. The protective plate 600 is arranged around the periphery of the wafer 500 to be processed. The protective plate 600 is provided with a flow guiding channel. The inlet end of the flow guiding channel is located at the periphery of the wafer 500 to be processed, and the outlet end of the flow guiding channel is connected to the collection device.

[0030] A protective plate 600 is mounted on the operating table 100, and the entire protective plate 600 surrounds the wafer 500 to be processed. The protective plate 600 has a flow channel, the inlet of which is aligned with the periphery of the wafer 500. During wafer rotation, excess protective fluid falls from the edge of the wafer 500 into the flow channel. Even in the event of splashing, the protective fluid will only flow within the flow channel, preventing it from splashing back onto the back of the wafer 500 or the operating table 100. The flow channel also collects excess protective fluid; fluid entering the channel flows into a collection device for easy cleaning by operators. The collected protective fluid can be treated and reused, thus saving resources.

[0031] Please refer to Figure 1 , Figure 2 and Figure 3 As shown, in some possible embodiments, the protective plate 600 includes a base plate 602, a first guide plate 603 and a second guide plate 604. The first guide plate 603 and the second guide plate 604 are spaced apart on the base plate 602, and a flow channel is formed between the first guide plate 603 and the second guide plate 604. A collection port 606 is provided on the base plate 602, and the collection port 606 is connected to the flow channel.

[0032] A base plate 602 is mounted on an operating table 100, and an annular bracket can be provided on the operating table 100 to fix the base plate 602. The first guide plate 603 and the second guide plate 604 are both annular structures, and are spaced apart on the base plate 602. A flow channel is formed between the first guide plate 603 and the second guide plate 604, with the inlet end of the flow channel located at the edge of the wafer 500 to be processed. A collection port 606 is provided on the base plate 602, communicating with the bottom of the flow channel. Protective liquid flows from the wafer 500 to the flow channel between the first guide plate 603 and the second guide plate 604, and flows along the first guide plate 603 or the second guide plate 604 to the collection port 606 on the base plate 602. Even if sputtering occurs, the protective liquid will not splash onto the back of the wafer 500 under the obstruction of the first guide plate 603 and the second guide plate 604. A cup-shaped collection tank connected to a collection port 606 can be installed on the operating table 100 to facilitate the collection and treatment of the protective liquid.

[0033] In some possible embodiments, the end of the flow channel near the wafer 500 to be processed is inclined, and the end of the flow channel near the wafer 500 to be processed is configured as a funnel-shaped structure.

[0034] Please refer to Figure 2 As shown, both the first guide plate 603 and the second guide plate 604 protect the lower vertical portion and the upper inclined portion, with the inclined portion tilted towards the wafer 500 to be processed. An inclined inlet is formed between the inclined portions of the first guide plate 603 and the second guide plate 604. It can be understood that after the protective liquid detaches from the edge of the wafer 500 to be processed, it will fall into the guide channel at an angle under the influence of gravity. Therefore, tilting the inlet end of the guide channel fully adapts to the movement path of the protective liquid, further preventing liquid splashing and improving the guiding effect. Please refer to... Figure 2 As shown, the tilt angle of the inclined portion of the second guide plate 604 is greater than that of the inclined portion of the first guide plate 603, thereby forming a funnel-shaped opening between the first guide plate 603 and the second guide plate 604, ensuring that the liquid can accurately enter the guide channel and further improving the anti-splashing effect.

[0035] Alternatively, please refer to Figure 4 As shown, the base plate 602 is inclined toward the collection port 606, thereby forming an inclined guiding slope at the base plate 602, guiding the liquid to flow toward the collection port 606, improving the drainage effect, and preventing liquid residue at the base plate 602.

[0036] In some possible embodiments, the cleaning assembly 300 further includes a bottom cleaning device 700 disposed at the bottom of the wafer 500 to be processed, the bottom cleaning device 700 being used to clean the bottom of the wafer 500 to be processed.

[0037] It is understandable that the protective fluid has a certain surface tension, and excess protective fluid may flow directly from the edge of the wafer 500 to the back of the wafer, potentially causing wafer contamination. Therefore, a bottom cleaning device 700 is installed below the wafer 500 to clean the back of the wafer 500, improving the cleaning effect, and also to clean the protective fluid that has flowed to the back of the wafer, preventing protective fluid residue from remaining on the back of the wafer or on the component placement 400.

[0038] Please refer to Figure 1 As shown, in some possible embodiments, the bottom cleaning device 700 includes a back cleaning nozzle 701 and an edge cleaning nozzle 702, the edge cleaning nozzle 702 corresponding to the edge position of the wafer 500 to be processed, and the back cleaning nozzle 701 corresponding to the center position of the wafer 500 to be processed.

[0039] The bottom cleaning device 700 includes two sets of cleaning nozzles: an edge cleaning nozzle 702 located at the edge of the wafer 500 to be processed, and a back cleaning nozzle 701 located near the center of the wafer 500. The two sets of cleaning nozzles can be connected to cleaning pipes simultaneously or separately. Cleaning fluid is sprayed from the two sets of nozzles to remove residual protective fluid from the center and edges of the back of the wafer 500, further preventing contamination during wafer transport.

[0040] Alternatively, please refer to Figure 4 As shown, in some possible embodiments, a third guide plate 605 is further provided at the lower end of the second guide plate 604. A first guide channel 601 is formed between the first guide plate 603 and the second guide plate 604, and a second guide channel 607 is formed between the third guide plate 605 and the second guide plate 604. The inlet end of the second guide channel 607 is located below the edge of the wafer 500 to be processed. The second guide channel 607 is used to collect the waste liquid generated during the cleaning of the cleaning nozzle, which facilitates the subsequent collection and treatment of the cleaning waste liquid and avoids splashing of waste liquid during cleaning.

[0041] In some possible embodiments, the liquid supply device 202 includes a liquid transfer pump 2021, a control valve 2022, and at least two liquid storage tanks 2023. The two liquid storage tanks 2023 are connected to the input end of the liquid transfer pump 2021 via the control valve 2022, and the output end of the liquid transfer pump 2021 is connected to the coating nozzle 201.

[0042] Please refer to Figure 5As shown, the liquid supply device 202 includes a liquid storage unit and a liquid delivery unit. Specifically, the liquid delivery unit includes at least two liquid storage tanks 2023, which store the protective liquid for coating. The liquid delivery unit includes a liquid delivery pump 2021, whose input end is connected to the liquid storage tank 2023 and whose output end is connected to the coating nozzle 201, thereby pumping the protective liquid in the liquid storage tank 2023 to the coating nozzle 201 for coating. The storage unit includes multiple liquid storage tanks 2023, which are connected to the liquid delivery pump 2021 through a multi-way valve. The multi-way valve allows any liquid storage tank 2023 to be connected to the delivery pump 2021, thereby drawing the protective liquid from the corresponding liquid storage tank 2023. When the protective fluid in one storage tank 2023 is used up, the liquid supply can be switched to different storage tanks 2023 through a multi-way valve, which greatly reduces or eliminates equipment downtime caused by replenishing protective fluid, enabling continuous operation and improving work efficiency.

[0043] It should be noted that, please refer to Figure 5 As shown, in some possible embodiments, the multi-way valve can be connected to multiple output pipelines simultaneously, and each output pipeline is equipped with a liquid delivery pump 2021, thereby realizing the liquid supply of multiple coating nozzles 201.

[0044] Please refer to Figure 5 As shown, in some possible embodiments, a buffer tank 2024 is provided between the liquid transfer pump 2021 and the control valve 2022, and a liquid level detection device is installed inside the buffer tank 2024. When delivering the protective liquid, the liquid in the storage tank first enters the buffer tank 2024, and the liquid level detection device in the buffer tank 2024 detects the liquid level. When the liquid level in the buffer tank 2024 is detected to be lower than a preset value, it is determined that the protective liquid in the current storage tank 2023 is used up, so that other storage tanks 2023 can be switched through the multi-way valve and the protective liquid can be replenished. The buffer tank 2024 enables the equipment to continue coating work normally when switching storage tanks, avoiding equipment downtime due to the inability to immediately replace the storage tank when it is empty.

[0045] In some possible embodiments, the placement assembly 400 includes a drive motor 401, a rotating shaft 402, and a placement stage 403. The drive motor 401 is connected to the placement stage 403 via the rotating shaft 402. The wafer 500 to be processed is fixed on the placement stage 403, and the drive motor 401 drives the placement stage 403 to rotate.

[0046] Please refer to Figure 4 As shown, the drive motor 401 drives the placement stage 403 and the wafer 500 to be processed fixed on the placement stage 403 to rotate through the rotating shaft 402, thereby cleaning and coating the wafer 500 to be processed. Centrifugal force is used to uniformly coat the protective liquid on the wafer surface, improving the uniformity of the protective liquid and thus improving product quality.

[0047] It should be noted that, where there is no conflict, the features in the embodiments of this application can be combined with each other.

[0048] The above are merely preferred embodiments of this application and are not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A protective liquid coating device, characterized in that, include: The assembly includes an operating table (100), a coating component, a cleaning component (300), and a placement component (400). The placement component (400) is disposed on the operating table (100) and is used to fix the wafer to be processed (500). The coating component includes a liquid supply device (202) and a coating nozzle (201). The coating nozzle (201) is disposed on the operating table (100) and is located above the wafer to be processed (500). The liquid supply device (202) is connected to the coating nozzle (201). The cleaning component (300) includes a cleaning head, and the outlet of the cleaning head corresponds to the side of the wafer to be processed (500) coated with protective liquid.

2. The protective liquid coating apparatus according to claim 1, characterized in that, The coating assembly also includes a splash protection device disposed on the worktable (100), the splash protection device being disposed around the periphery of the wafer to be processed (500), the splash protection device being used to block liquid splashed at the edge of the wafer to be processed (500).

3. The protective liquid coating apparatus according to claim 2, characterized in that, The splash protection device includes a protective plate (600) and a collection device. The protective plate (600) is arranged around the periphery of the wafer to be processed (500). The protective plate (600) is provided with at least one flow channel. The inlet end of the flow channel is located at the periphery of the wafer to be processed (500), and the outlet end of the flow channel is connected to the collection device.

4. The protective liquid coating apparatus according to claim 3, characterized in that, The protective plate (600) includes a base plate (602), a first guide plate (603), a second guide plate (604), and a third guide plate (605). The first guide plate (603), the second guide plate (604), and the third guide plate (605) are all spaced apart on the base plate (602). A first guide channel (601) is formed between the first guide plate (603) and the second guide plate (604), and a second guide channel (607) is formed between the second guide plate (604) and the third guide plate (605). A collection port (606) is provided on the base plate (602), and the collection port (606) is connected to the guide channel.

5. The protective liquid coating apparatus according to claim 4, characterized in that, The flow channel is inclined at one end near the wafer (500) to be processed, and the end of the flow channel near the wafer (500) to be processed is configured as a funnel-shaped structure.

6. The protective liquid coating apparatus according to claim 1, characterized in that, The cleaning assembly (300) further includes a bottom cleaning device (700), which is disposed at the bottom of the wafer to be processed (500) and is used to clean the bottom of the wafer to be processed (500).

7. The protective liquid coating apparatus according to claim 6, characterized in that, The bottom cleaning device (700) includes a back cleaning nozzle (701) and an edge cleaning nozzle (702). The edge cleaning nozzle (702) corresponds to the edge position of the wafer to be processed (500), and the back cleaning nozzle (701) corresponds to the center position of the wafer to be processed (500).

8. The protective liquid coating apparatus according to claim 7, characterized in that, The liquid supply device (202) includes a liquid transfer pump (2021), a control valve (2022), and at least two liquid storage tanks (2023). The two liquid storage tanks (2023) are connected to the input end of the liquid transfer pump (2021) via the control valve (2022), and the output end of the liquid transfer pump (2021) is connected to the coating nozzle (201).

9. The protective liquid coating apparatus according to claim 8, characterized in that, A buffer tank (2024) is provided between the liquid transfer pump (2021) and the control valve (2022), and a liquid level detection device is provided inside the buffer tank (2024).

10. The protective liquid coating apparatus according to any one of claims 1-9, characterized in that, The placement assembly (400) includes a drive motor (401), a rotating shaft (402), and a placement stage (403). The drive motor (401) is connected to the placement stage (403) via the rotating shaft (402). The wafer to be processed (500) is fixed on the placement stage (403), and the drive motor (401) drives the placement stage (403) to rotate.

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