Double-shaft swing type polishing machine

Abstract

The utility model discloses a double-shaft swing type polishing machine. The double-shaft swing type polishing machine comprises a device body and a rotatable polishing disc. The device body comprises a workbench arranged at the bottom and a shell arranged on the top of the workbench. The polishing disc is arranged on the top of the workbench. A first feeding assembly and a second feeding assembly are symmetrically arranged on the top of the workbench and located on the two sides of the polishing disc, and the first feeding assembly and the second feeding assembly are both used for wafer feeding. A first polishing assembly and a second polishing assembly are arranged on the workbench in parallel, and the first polishing assembly and the second polishing assembly are both used for grabbing a wafer and pressing the wafer downwards to be attached to the top of the polishing disc; by arranging the first polishing assembly and the second polishing assembly in parallel, two sets of wafers are polished at the same time, and the polishing efficiency is improved.

Description

Technical Field

[0001] This utility model relates to the field of wafer polishing technology, and more specifically, to a dual-axis oscillating polishing machine. Background Technology

[0002] The manufacturing process of silicon wafers includes: a single crystal growth process for manufacturing single crystal ingots; a slicing process for obtaining thin disk-shaped wafers by slicing the single crystal ingots; an edge grinding process for machining the outer periphery of the wafer to prevent cracking and deformation of the wafer obtained by the slicing process; a fine grinding process for removing damage remaining on the wafer due to machining; and a polishing process for mirror polishing the wafer. Existing polishing equipment does not have dual-axis linkage, cannot achieve oscillating polishing, has poor polishing effect, and does not have dual polishing components, resulting in low polishing efficiency. Utility Model Content

[0003] To solve at least one of the above-mentioned technical problems, this utility model proposes a dual-axis oscillating polishing machine.

[0004] The first aspect of this utility model provides a dual-axis oscillating polishing machine, comprising: a device body and a rotatable polishing disc;

[0005] The device body includes a worktable at the bottom and a housing at the top of the worktable;

[0006] The polishing disc is disposed on top of the worktable;

[0007] A first feeding component and a second feeding component are symmetrically arranged on the top of the workbench and on both sides of the polishing disk. Both the first feeding component and the second feeding component are used for feeding ceramic disks (with wafers).

[0008] The worktable is provided with a first polishing component and a second polishing component arranged side by side. Both the first polishing component and the second polishing component are used to grip the wafer and press it down to adhere to the top of the polishing pad.

[0009] In a preferred embodiment of the present invention, the first feeding component includes a first Y slide rail mounted on a workbench, and a first Y slider is connected to the top of the first Y slide rail, the first Y slider being able to slide along the Y direction.

[0010] In a preferred embodiment of the present invention, the second feeding component includes a second Y slide rail mounted on a workbench, and a second Y slider is connected to the top of the second Y slide rail, the second Y slider being able to slide along the Y direction.

[0011] In a preferred embodiment of this utility model, a platform is connected to one side of both the first Y slider and the second Y slider, and the ceramic disk (with wafer) is placed on the platform.

[0012] In a preferred embodiment of the present invention, an X-direction sliding module is further included. The X-direction sliding module is fixedly installed on the top of the worktable and located on one side of the polishing disk. The first polishing component and the second polishing component are connected to one side of the X-direction sliding module. The X-direction sliding module is used to control the first polishing component and the second polishing component to slide along the X direction.

[0013] In a preferred embodiment of the present invention, the first polishing component includes a first Z-direction module that is connected to one side of the X-direction sliding module. A first pressing module is provided on one side of the first Z-direction module, and a first gripping disk is provided at the bottom of the first pressing module.

[0014] In a preferred embodiment of the present invention, the second polishing component includes a second Z-direction module, which is connected to one side of the X-direction sliding module. A second pressing module that can slide along the Z-direction is provided on one side of the second Z-direction module, and a second gripping disk is provided at the bottom of the second pressing module.

[0015] In a preferred embodiment of this utility model, two double cabinet doors are provided on one side of the device body.

[0016] In a preferred embodiment of this utility model, the bottom of the device body is provided with a support leg.

[0017] The above-mentioned technical solution of this utility model has the following advantages compared with the prior art:

[0018] This application achieves simultaneous polishing of two sets of wafers by arranging a first polishing component and a second polishing component in parallel, thereby improving polishing efficiency. In addition, by setting an X-direction sliding module to cooperate with the first Z-direction module and the second Z-direction module, the horizontal and vertical movements of the first polishing component and the second polishing component are realized, thereby realizing dual-axis oscillating polishing of the polishing machine and improving polishing accuracy. Attached Figure Description

[0019] To more clearly illustrate the specific embodiments of this utility model or the technical solutions in the prior art, the drawings used in the description of the specific embodiments or the prior art will be briefly introduced below. Obviously, some of the drawings in the following description are some embodiments of this utility model. For those skilled in the art, other drawings can be obtained from these drawings without creative effort.

[0020] Figure 1This is a front view of a dual-axis oscillating polishing machine according to an embodiment of this utility model;

[0021] Figure 2 This is a top view of a dual-axis oscillating polishing machine according to an embodiment of this utility model;

[0022] Figure 3 This is a side view of a dual-axis oscillating polishing machine according to an embodiment of the present invention;

[0023] Figure 4 This is a schematic diagram of the internal structure of the device body according to an embodiment of the present utility model;

[0024] Figure 5 This is a top view of the internal structure of the device body in an embodiment of this utility model.

[0025] In the diagram: 1. Device body; 2. Cabinet door; 3. Support leg; 4. Operating computer; 5. First polishing component; 501. First pressing module; 502. First Z-direction module; 503. First Z-direction motor; 504. First gripping disc; 7. Air source mechanism; 8. Second polishing component; 801. Second pressing module; 802. Second Z-direction motor; 803. Second Z-direction module; 804. Second gripping disc; 9. X-direction sliding module; 10. First Y slider; 11. First Y slide rail; 13. Polishing disc; 14. Stage; 15. Wafer; 16. Second Y slider; 17. Second Y slide rail. Detailed Implementation

[0026] To better understand the above-mentioned objectives, features, and advantages of this utility model, the present utility model will be further described in detail below with reference to specific embodiments. It should be noted that, unless otherwise specified, the embodiments and features described in these embodiments can be combined with each other.

[0027] Many specific details are set forth in the following description in order to provide a full understanding of the present invention. However, the present invention may also be implemented in other ways different from those described herein. Therefore, the scope of protection of the present invention is not limited to the specific embodiments disclosed below.

[0028] Example 1

[0029] See Figures 1-5As shown, this utility model proposes a dual-axis oscillating polishing machine, including: a device body 1 and a rotatable polishing disc 13; the device body 1 includes a worktable disposed at the bottom and a housing disposed at the top of the worktable; the polishing disc 13 is disposed at the top of the worktable; a first feeding component and a second feeding component are symmetrically disposed on the top of the worktable and on both sides of the polishing disc, both of which are used for feeding wafers 15; a first polishing component 5 and a second polishing component 8 are arranged side by side on the worktable, both of which are used for gripping wafers 15 and pressing them down to adhere to the top of the polishing disc 13.

[0030] According to an embodiment of the present invention, the first feeding component includes a first Y slide rail 11 mounted on the workbench, and a first Y slider 10 is connected to the top of the first Y slide rail 11. The first Y slider 10 can slide along the Y direction. Similarly, the second feeding component includes a second Y slide rail 17 mounted on the workbench, and a second Y slider 16 is connected to the top of the second Y slide rail 17. The second Y slider 16 can slide along the Y direction.

[0031] Furthermore, both the first Y slider 10 and the second Y slider 16 are connected to a stage 14 on one side, and the wafer 15 is placed on the stage 14.

[0032] According to an embodiment of the present invention, it further includes an X-direction sliding module 9, which is fixedly installed on the top of the workbench and located on one side of the polishing disk 13. The first polishing component 5 and the second polishing component 8 are connected to one side of the X-direction sliding module 9. The X-direction sliding module 9 is used to control the first polishing component 5 and the second polishing component 8 to slide along the X direction.

[0033] According to an embodiment of the present invention, the first polishing component 5 includes a first Z-direction module 502 that is connected to one side of the X-direction sliding module 9. A first pressing module 501 is provided on one side of the first Z-direction module 502, and a first gripping disk 504 is provided at the bottom of the first pressing module 501.

[0034] According to an embodiment of the present invention, the second polishing component 8 includes a second Z-direction module 803, which is connected to one side of the X-direction sliding module 9. A second pressing module that can slide along the Z-direction is provided on one side of the second Z-direction module 803, and a second gripping disk 804 is provided at the bottom of the second pressing module.

[0035] Specifically, a first Z-direction motor 503 is provided on the top of the first Z-direction module 502. The first Z-direction motor 503 is used to control the first pressing module 501 to slide along the Z-direction. Similarly, a second Z-direction motor 802 is provided on the top of the second Z-direction module 803. The second Z-direction motor 802 is used to control the second pressing module 801 to slide along the Z-direction. In addition, polishing fluid is provided inside both the first pressing module 501 and the second pressing module 801. Polishing fluid is precisely added during the polishing process of the wafer 15 to improve the polishing effect.

[0036] According to an embodiment of the present invention, the device body 1 has two double-opening cabinet doors 2 on one side, and an operating computer 4 on the other side of the device body 1. The operating computer 4 is equipped with a display screen and operating buttons.

[0037] Furthermore, an air source mechanism 7 is provided on one side of the workbench. The air source mechanism 7 is used to control the negative pressure of the first gripping disk 504 and the second gripping disk 804, so as to firmly grip the chip 15.

[0038] According to an embodiment of the present invention, a support leg 3 is provided at the bottom of the device body 1.

[0039] In summary, this application achieves simultaneous polishing of two sets of wafers 15 by arranging the first polishing component 5 and the second polishing component 8 in parallel, thereby improving polishing efficiency. In addition, by setting the X-direction sliding module 9 to cooperate with the first Z-direction module 502 and the second Z-direction module 803, the horizontal and vertical movements of the first polishing component 5 and the second polishing component 8 are realized, thereby achieving dual-axis oscillating polishing of the polishing machine and improving polishing accuracy.

[0040] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0041] The above description of the disclosed embodiments enables those skilled in the art to make or use the present invention. Various modifications to the above embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Therefore, the present invention is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

[0042] The above are merely specific embodiments of this utility model, but the protection scope of this utility model is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this utility model should be included within the protection scope of this utility model. Therefore, the protection scope of this utility model should be determined by the protection scope of the claims.

Claims

1. A dual-axis oscillating polishing machine, comprising: The device body and the rotatable polishing disc; characterized in that, The device body includes a worktable at the bottom and a housing at the top of the worktable; The polishing disc is disposed on top of the worktable; A first feeding component and a second feeding component are symmetrically arranged on the top of the workbench and on both sides of the polishing disc. Both the first feeding component and the second feeding component are used for feeding ceramic discs. The worktable is provided with a first polishing component and a second polishing component arranged side by side. Both the first polishing component and the second polishing component are used to adsorb the ceramic disc and press it down to adhere to the top of the polishing disc.

2. The dual-axis oscillating polishing machine according to claim 1, characterized in that, The first feeding component includes a first Y slide rail mounted on the workbench, and a first Y slider is connected to the top of the first Y slide rail. The first Y slider can slide along the Y direction.

3. A dual-axis oscillating polishing machine according to claim 2, characterized in that, The second feeding assembly includes a second Y slide rail mounted on the workbench, and a second Y slider is connected to the top of the second Y slide rail. The second Y slider can slide along the Y direction.

4. A dual-axis oscillating polishing machine according to claim 3, characterized in that, Both the first Y-slider and the second Y-slider are connected to a platform on one side, and the ceramic disk is placed on the platform.

5. A dual-axis oscillating polishing machine according to claim 1, characterized in that, It also includes an X-direction sliding module, which is fixedly installed on the top of the worktable and located on one side of the polishing disk. The first polishing component and the second polishing component are connected to one side of the X-direction sliding module. The X-direction sliding module is used to control the first polishing component and the second polishing component to slide along the X direction.

6. A dual-axis oscillating polishing machine according to claim 5, characterized in that, The first polishing component includes a first Z-direction module that is connected to one side of the X-direction sliding module. A first pressing module is provided on one side of the first Z-direction module, and a first gripping disk is provided at the bottom of the first pressing module.

7. A dual-axis oscillating polishing machine according to claim 5, characterized in that, The second polishing component includes a second Z-direction module, which is connected to one side of the X-direction sliding module. A second pressing module that can slide along the Z-direction is provided on one side of the second Z-direction module, and a second gripping disk is provided at the bottom of the second pressing module.

8. A dual-axis oscillating polishing machine according to claim 1, characterized in that, The device body has two double-opening cabinet doors on one side.

9. A dual-axis oscillating polishing machine according to claim 1, characterized in that, The device body is provided with support legs at the bottom.

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