Substrate for processing semiconductor wafer

Abstract

The utility model discloses a base for processing a semiconductor wafer, which belongs to the technical field of semiconductor wafer processing, and comprises a mounting disc serving as a mounting carrier, the top of the mounting disc is provided with a containing groove for placing a wafer, the top of the mounting disc is provided with a gas collecting bin, and the gas collecting bin is provided with a gas inlet and a gas outlet. A water collecting bin is installed at the edge position of the bottom of the installation disc and arranged on the outer side of the gas collecting bin in a sleeving mode. A plurality of groups of drainage grooves are longitudinally and transversely formed in the inner bottom of the containing groove, cleaning water and chippings located at the inner bottom of the containing groove are conveyed into the annular bin and then enter the water collecting bin through the water outlet holes, and then the cleaning water mixed with the chippings in the water collecting bin is pumped away together through an external water suction pump matched with the drainage pipes. And the chips in the containing groove can be quickly washed away only by continuously washing the interior of the containing groove, so that the chips are prevented from staying at the inner bottom of the containing groove and scratching the bottom of the next group of wafers.

Description

TECHNICAL FIELD

[0001] The utility model relates to the technical field of semiconductor wafer processing, particularly to a base for processing semiconductor wafer. BACKGROUND

[0002] The semiconductor industry uses various methods and equipment to manufacture semiconductor wafers, such as manufacturing circuits on semiconductor wafers. During the manufacturing process, the silicon ingot is usually cut into a small notch or a small plane to show the crystal direction. Once checked, the silicon ingot is cut into wafer pieces, and then the grinding process begins, and the semi-finished semiconductor wafer is manufactured through etching and cleaning.

[0003] Currently, when cutting wafer pieces into square semiconductor wafers, it is often necessary to flush and cut at the same time. However, the fine debris generated during the cutting process often remains in the interior of the semiconductor wafer processing base. Even after a large amount of water flushing, some fine debris remains in the interior of the base, which can easily scratch the bottom of the wafer piece used for the next group of semiconductor wafer manufacturing. At the same time, during the processing of semiconductor wafer cutting, the limiting effect provided by the groove of the base for the semiconductor wafer is very limited, and cannot effectively ensure the stability during the manufacturing process of the semiconductor wafer.

[0004] Therefore, it is urgent to provide a base for processing semiconductor wafers to solve the above problems. SUMMARY

[0005] The technical problem to be solved by the utility model is to overcome the shortcomings of the prior art and provide a base for processing semiconductor wafers.

[0006] To solve the above technical problems, one technical scheme adopted by the utility model is to provide a base for processing semiconductor wafers, which comprises a mounting disc serving as a mounting carrier. A containing groove for placing a wafer piece is formed in the top of the mounting disc. A gas collection bin is mounted on the top of the mounting disc. A water collection bin is mounted at the edge position of the bottom of the mounting disc. The water collection bin is sleeved on the outer side of the gas collection bin. A driving shaft for driving the mounting disc to rotate is mounted at the center position of the bottom of the water collection bin. A fixing mechanism that cooperates with the gas collection bin is arranged on the inner bottom of the containing groove. A drainage mechanism that cooperates with the water collection bin is arranged on the inner bottom of the containing groove.

[0007] The utility model is further provided as follows: the fixing mechanism comprises a plurality of groups of connection through holes distributed longitudinally and transversely on the inner bottom of the containing groove. A trapezoidal table is mounted on the top of the connection through hole. A rubber hollow circular table that communicates with the inner top of the connection through hole is mounted on the top of the trapezoidal table. The bottom end of the connection through hole communicates with the inner top of the gas collection bin. A gas outlet connector and an electromagnetic air inlet valve are symmetrically arranged below the water collection bin. The top ends of the gas outlet connector and the electromagnetic air inlet valve both communicate with the inner bottom of the gas collection bin.

[0008] By the above technical scheme, when the gas collecting bin is in a negative pressure state, the rubber hollow circular table in the trapezoidal table is forced to be tightly adsorbed on the bottom of the wafer, thereby assisting in fixing the wafer, and if the electromagnetic air inlet valve is controlled to be opened, external air can enter the gas collecting bin, so that the rubber hollow circular tables no longer adsorb on the bottom of the wafer, thereby releasing the assistance in fixing the wafer.

[0009] The utility model discloses further set up as: the drainage mechanism includes the annular bin of the outer ring of mounting disc, the inside bottom of holding groove is provided with a plurality of groups of drainage groove, and both ends of drainage groove are communicated with the inside of annular bin, the inside bottom of annular bin evenly is provided with ten groups and the water outlet hole of gas collecting bin inner top communication, the inside bottom of gas collecting bin is installed with the drain pipe, and the bottom end of drain pipe extends to the below of water collecting bin.

[0010] Through the above technical scheme, in the cutting and flushing process, the cleaning water mixed with the debris falls into the gap between the adjacent trapezoidal tables, and then enters the inside of the drainage groove, and then enters the inside of the annular bin through the drainage groove, and then enters the inside of the water collecting bin through the water outlet hole, and then is sucked away through the drain pipe, so that the debris in the holding groove is washed clean.

[0011] The utility model discloses further set up as: the annular bin includes the annular recess of the outer ring of mounting disc, the annular recess is located the top of mounting disc outside, both ends of drainage groove are communicated with the inside of annular recess, the outer ring of the inside of annular recess is installed with the protection ring that annular recess is closed, and the top of water outlet hole is communicated with the inside bottom of annular recess.

[0012] Through the above technical scheme, the cleaning water mixed with the debris in the drainage groove can stably enter the inside of the annular recess, and the protection ring can close the annular recess into a complete annular cavity, so that the cleaning water in the annular recess can stably enter the inside of the water collecting bin through the water outlet hole.

[0013] The utility model discloses further set up as: the output of air outlet is communicated with the input of external suction pump through exhaust duct.

[0014] Through the above technical scheme, the external suction pump is controlled to cooperate with the exhaust duct and the air outlet to suck the air in the gas collecting bin, so that the gas collecting bin is in a negative pressure state.

[0015] The utility model discloses further set up as: the input of electromagnetic air inlet valve is installed with the silo, and the inside of silo is provided with filter screen.

[0016] Through the technical scheme, the outside air can enter the inside of the gas collecting bin through the electromagnetic air inlet valve after being filtered by the filter screen, so that pollution to the gas collecting bin and the bottom of the wafer is avoided.

[0017] The utility model further provides: the bottom end of the drain pipe is communicated with the input end of the external water pump through the drain pipe.

[0018] Through the technical scheme, the external water pump cooperated with the drain pipe can continuously pump water in the water collecting bin.

[0019] The utility model has the advantages of the following:

[0020] 1. The utility model discloses a plurality of drain grooves are longitudinally and transversely arranged in the inner bottom of the containing groove, the cleaning water and chippings in the inner bottom of the containing groove are transported to the annular bin, then enter the inside of the water collecting bin through the water outlet, and then the cleaning water and chippings in the water collecting bin are pumped away through the external water pump cooperated with the drain pipe, so that the chippings in the containing groove can be quickly cleaned by continuously flushing the inside of the containing groove, and the chippings are prevented from remaining in the inner bottom of the containing groove and scratching the bottom of the next wafer.

[0021] 2. The utility model discloses a negative pressure state in the inside of the gas collecting bin is formed by controlling the external air pump, so that the hollow rubber circular table in the trapezoidal table is tightly adsorbed on the bottom of the wafer, and then the containing groove is cooperated with the wafer to limit the wafer, so that the stability of the wafer in the process of being processed into a semiconductor wafer is effectively improved. DRAWINGS

[0022] Figure 1 It is the first perspective structural drawing of the utility model;

[0023] Figure 2 It is the second perspective structural drawing of the utility model;

[0024] Figure 3 It is the explosion schematic view of the utility model;

[0025] Figure 4 It is the first perspective structural drawing of the mounting disc of the utility model;

[0026] Figure 5 It is the second perspective structural drawing of the mounting disc of the utility model;

[0027] Figure 6 It is the three-dimensional schematic view of the mounting disc of the trapezoidal table of the utility model;

[0028] Figure 7 It is the three-dimensional schematic view of the gas collecting bin of the utility model;

[0029] Figure 8It is the three-dimensional schematic view of the water collecting bin of the utility model;

[0030] Figure 9 It is the three-dimensional schematic view of the longitudinal section of the utility model;

[0031] Figure 10 It is the three-dimensional schematic view of the trapezoidal table of the utility model;

[0032] Figure 11 It is the three-dimensional schematic view of the utility model Figure 9 The enlarged schematic view of A place of the utility model;

[0033] In the drawing: 1, installation disc; 2, holding groove; 3, fixed mechanism; 301, trapezoidal table; 302, rubber hollow circular table; 303, connecting through hole; 304, gas outlet joint; 305, electromagnetic air inlet valve; 4, water collecting bin; 5, drainage mechanism; 501, drainage groove; 502, annular bin; 5021, annular groove; 5022, protection ring; 503, water outlet hole; 504, drain pipe; 6, gas collecting bin; 7, driving shaft; 8, wafer. DETAILED DESCRIPTION

[0034] The preferred embodiments of the utility model are described in detail below in combination with the drawings, so that the advantages and features of the utility model can be more easily understood by the person skilled in the art, and the protection scope of the utility model can be more clearly and explicitly defined.

[0035] As shown in Figure 1 - Figure 11 The top of the installation disc 1 is provided with the gas collecting bin 6, the inner bottom of the holding groove 2 is provided with the fixed mechanism 3 matched with the gas collecting bin 6, the fixed mechanism 3 includes a plurality of groups of connecting through holes 303 distributed longitudinally and transversely in the inner bottom of the holding groove 2, the top of the connecting through hole 303 is provided with the trapezoidal table 301, and the top of the trapezoidal table 301 is provided with the rubber hollow circular table 302 communicated with the inner top of the connecting through hole 303, the bottom end of the connecting through hole 303 is communicated with the inner top of the gas collecting bin 6, the lower part of the water collecting bin 4 is symmetrically provided with the gas outlet joint 304 and the electromagnetic air inlet valve 305, and the top end of the gas outlet joint 304 and the electromagnetic air inlet valve 305 is communicated with the inner bottom of the gas collecting bin 6, the output end of the gas outlet joint 304 is communicated with the input end of the external air suction pump through the exhaust guide pipe, the external air suction pump is controlled to cooperate with the exhaust guide pipe and the gas outlet joint 304 to suck the air in the gas collecting bin 6, so that the inside of the gas collecting bin 6 is in a negative pressure state, and then the rubber hollow circular table 302 in the trapezoidal table 301 is forced to tightly adsorb on the bottom of the wafer 8 to assist in fixing the wafer 8, and if the electromagnetic air inlet valve 305 is controlled to be opened, the external air can enter the inside of the gas collecting bin 6, so that the plurality of groups of rubber hollow circular tables 302 are no longer adsorbed on the bottom of the wafer 8, and the auxiliary fixing of the wafer 8 is released.

[0036] AsFigure 1 Figure 6 Figure 8 Figure 9 Figure 11 As shown in the figure, the water collecting bin 4 is installed at the edge position of the bottom of the mounting disc 1, the inner bottom of the containing groove 2 is provided with a drainage mechanism 5 matched with the water collecting bin 4, the drainage mechanism 5 comprises an annular bin 502 located at the outer circle of the mounting disc 1, the inner bottom of the containing groove 2 is longitudinally and transversely provided with a plurality of groups of drainage grooves 501, both ends of the drainage grooves 501 are communicated with the inside of the annular bin 502, the inner bottom of the annular bin 502 is uniformly provided with ten groups of water outlet holes 503 communicated with the inner top of the gas collecting bin 6, the inner bottom of the gas collecting bin 6 is installed with a drainage pipe 504, and the bottom end of the drainage pipe 504 extends to the lower side of the water collecting bin 4, the annular bin 502 comprises an annular groove 5021 located at the outer circle of the mounting disc 1, the annular groove 5021 is located at the top end of the outer side of the mounting disc 1, both ends of the drainage groove 501 are communicated with the inside of the annular groove 5021, the outer circle of the inside of the annular groove 5021 is installed with a protection ring 5022 for sealing the annular groove 5021, the top end of the water outlet hole 503 is communicated with the inner bottom of the annular groove 5021, the bottom end of the drainage pipe 504 is communicated with the input end of the external water pump through a drainage guide pipe, the external water pump matched with the drainage pipe 504 can continuously pump water in the water collecting bin 4, so that the inside of the annular bin 502 is in a negative pressure state, and then the washing water mixed with the chippings in the containing groove 2 enters the annular bin 502 through the drainage groove 501, and then enters the inside of the water collecting bin 4 through the water outlet hole 503 and is pumped away, so that the chippings in the containing groove 2 are quickly washed away.

[0037] In use, the wafer 8 is first placed in the containing groove 2 and placed on the top of the plurality of groups of trapezoidal tables 301, then the external air pump matched with the air outlet joint 304 is controlled to pump air in the gas collecting bin 6, so that the inside of the gas collecting bin 6 is in a negative pressure state, and the rubber hollow circular table 302 in the trapezoidal table 301 is tightly adsorbed on the bottom of the wafer 8, then in the process of cutting the wafer 8 into semiconductor wafers, the wafer 8 surface is washed, the chippings generated in the cutting process are washed away and fall into the gap between the adjacent trapezoidal tables 301, then enter the inside of the drainage groove 501, and the external water pump matched with the drainage pipe 504 is controlled to pump water in the water collecting bin 4, so that the inside of the annular bin 502 is in a negative pressure state, and then the washing water mixed with the chippings in the containing groove 2 enters the annular bin 502 through the drainage groove 501, and then enters the inside of the water collecting bin 4 through the water outlet hole 503 and is pumped away, after the wafer 8 is processed, the electromagnetic air inlet valve 305 is controlled to be opened, and the outside air enters the inside of the gas collecting bin 6, so that the plurality of groups of rubber hollow circular tables 302 are not adsorbed on the bottom of the wafer 8.

[0038] ​​​​The above merely illustrates the embodiments of the present application, and does not limit the patent scope of the present application, and any equivalent structure or equivalent process transformation, or direct or indirect application in other related technical fields, which are made according to the content of the present application specification and drawings, are also included in the patent protection scope of the present application.

Claims

1. A pedestal for processing semiconductor wafers, comprising a mounting plate (1) as mounting carrier, characterized in that: The top of the installation disc (1) is provided with a containing groove (2) for placing a wafer (8), the top of the installation disc (1) is provided with a gas collection bin (6), the edge of the bottom of the installation disc (1) is provided with a water collection bin (4), the water collection bin (4) is sleeved outside the gas collection bin (6), the center of the bottom of the water collection bin (4) is provided with a driving rotating shaft (7) for driving the installation disc (1) to rotate, the inner bottom of the containing groove (2) is provided with a fixing mechanism (3) matched with the gas collection bin (6), and the inner bottom of the containing groove (2) is provided with a drainage mechanism (5) matched with the water collection bin (4).

2. The pedestal for processing semiconductor wafers of claim 1, wherein: The fixing mechanism (3) comprises a plurality of groups of connecting through holes (303) longitudinally and transversely distributed on the inner bottom of the containing groove (2), the top of the connecting through hole (303) is provided with a trapezoidal table (301), the top of the trapezoidal table (301) is provided with a rubber hollow circular table (302) communicated with the inner top of the connecting through hole (303), the bottom end of the connecting through hole (303) is communicated with the inner top of the gas collection bin (6), and the lower part of the water collection bin (4) is symmetrically provided with a gas outlet joint (304) and an electromagnetic air inlet valve (305), and the top ends of the gas outlet joint (304) and the electromagnetic air inlet valve (305) are communicated with the inner bottom of the gas collection bin (6).

3. The pedestal for processing semiconductor wafers of claim 1, wherein: The drainage mechanism (5) comprises an annular bin (502) located at the outer ring of the installation disc (1), a plurality of groups of drainage grooves (501) are longitudinally and transversely formed on the inner bottom of the containing groove (2), and the two ends of the drainage groove (501) are communicated with the inside of the annular bin (502), ten groups of water outlet holes (503) are uniformly formed on the inner bottom of the annular bin (502) and communicated with the inner top of the gas collection bin (6), and a drainage pipe (504) is arranged on the inner bottom of the gas collection bin (6) and extends to the lower part of the water collection bin (4).

4. The pedestal for processing semiconductor wafers of claim 3, wherein: The annular bin (502) comprises an annular groove (5021) located at the outer ring of the installation disc (1), the annular groove (5021) is located at the top of the outer side of the installation disc (1), the two ends of the drainage groove (501) are communicated with the inside of the annular groove (5021), and a protection ring (5022) is arranged on the outer ring in the inside of the annular groove (5021) to seal the annular groove (5021), and the top end of the water outlet hole (503) is communicated with the inner bottom of the annular groove (5021).

5. The pedestal for processing semiconductor wafers of claim 2, wherein: The output end of the gas outlet joint (304) is communicated with the input end of an external air suction pump through an air outlet guide pipe.

6. The pedestal for processing semiconductor wafers of claim 2, wherein: The input end of the electromagnetic air inlet valve (305) is provided with a cylindrical bin, and a filter screen is arranged in the inside of the cylindrical bin.

7. The pedestal for processing semiconductor wafers of claim 3, wherein: The bottom end of the drainage pipe (504) is communicated with the input end of an external water suction pump through a water outlet guide pipe.

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