High-toughness electronic packaging non-woven fabric composite layer structure

Abstract

The utility model discloses a high-toughness electronic packaging non-woven fabric composite layer structure, which belongs to the technical field of packaging non-woven fabrics, and adopts the technical scheme that the high-toughness electronic packaging non-woven fabric composite layer structure comprises a composite non-woven fabric, the composite non-woven fabric comprises a base layer non-woven fabric, and a buffer layer is arranged at the top of the base layer non-woven fabric. A protective layer is arranged on the side, away from the base layer non-woven fabric layer, of the buffer layer, and a protective layer is arranged at the bottom of the base layer non-woven fabric layer. The base layer non-woven fabric comprises a non-woven fabric main body layer, reinforcing layers are arranged at the top and the bottom of the non-woven fabric main body layer, connecting layers are arranged between the opposite sides of the reinforcing layers and the non-woven fabric main body layer, and aramid fibers and carbon fibers are arranged in the reinforcing layers. The base layer non-woven fabric has excellent tensile strength and tear resistance in all directions, and the overall toughness of the composite non-woven fabric can be remarkably improved, so that the stability and integrity of the composite non-woven fabric are improved.

Description

TECHNICAL FIELD

[0001] The utility model relates to the packaging non -woven cloth technical field especially relates to a high tenacity electronic packaging non -woven cloth composite layer structure. BACKGROUND

[0002] With the rapid development of electronic technology, various electronic equipment such as smart mobile phone, tablet computer, notebook computer etc. have been widely used in people's life and work, in the production, transportation and sales process of electronic equipment, packaging material plays a vital role, it not only protects electronic equipment from the damage of external physical impact, static, humidity and other factors, but also meets the requirements of environmental protection, cost control and other aspects.

[0003] However, the existing non -woven cloth material for electronic packaging has some shortcomings, although it has certain air permeability and softness, but when it is used as electronic packaging material alone, its tenacity, puncture resistance and comprehensive protection performance to electronic equipment still need to be improved.

[0004] Therefore, a high tenacity electronic packaging non -woven cloth composite layer structure is provided. UTILITY MODEL CONTENT

[0005] The utility model discloses a kind of high tenacity electronic packaging non -woven cloth composite layer structure, can solve the existing non -woven cloth material for electronic packaging Some shortcomings, although it has certain air permeability and softness, but when it is used as electronic packaging material alone, its tenacity, puncture resistance and comprehensive protection performance to electronic equipment still need to be improved.

[0006] To achieve the above object, the utility model provides the following technical scheme: a kind of high tenacity electronic packaging non -woven cloth composite layer structure, including composite non -woven cloth, the composite non -woven cloth includes base layer non -woven cloth, the top of the base layer non -woven cloth is provided with buffer layer, and buffer layer is provided with protective layer on the side away from base layer non -woven cloth layer, the bottom of the base layer non -woven cloth layer is provided with protective layer;

[0007] The base layer non -woven cloth includes non -woven cloth main body layer, the top and bottom of the non -woven cloth main body layer are provided with reinforcing layer, the side between the reinforcing layer and non -woven cloth main body layer is provided with connecting layer, the inside of the reinforcing layer is provided with aramid fiber and carbon fiber;

[0008] The protective layer includes anti -static layer and waterproof layer, the anti -static layer is arranged on the side close to buffer layer, and the waterproof layer is arranged on the side close to anti -static layer.

[0009] Preferably, the number of aramid fiber and carbon fiber is several, and several aramid fiber and carbon fiber are arranged in vertical direction in cross, and the aramid fiber and carbon fiber constitute fiber grid as a whole.

[0010] Preferably, the buffer layer is made of polyurethane foam and is bonded between the protective layer and the side of the base layer opposite the non-woven fabric.

[0011] Preferably, the buffer layer has cavities inside, and the number of cavities is several, which are equidistantly distributed inside the buffer layer, and the several cavities form a honeycomb structure.

[0012] Preferably, the connecting layer is made of hot melt adhesive, and the reinforcing layer, the connecting layer and the non-woven fabric main layer are formed into a whole by hot pressing.

[0013] Preferably, the anti-static layer is made of an anti-static agent and is uniformly coated on the side close to the buffer.

[0014] Preferably, the waterproof layer is made of melt-blown non-woven fabric and is bonded on one side of the anti-static layer.

[0015] Preferably, the protective layer is made of needle-punched non-woven fabric and is bonded on the side close to the base layer non-woven fabric.

[0016] Compared with the prior art, the utility model has the advantages that:

[0017] 1. The base layer non-woven fabric is provided in a composite manner, so that the base layer non-woven fabric has excellent tensile strength and tear resistance in all directions, the overall toughness of the composite non-woven fabric is significantly improved, and the stability and integrity of the composite non-woven fabric are improved.

[0018] 2. The buffer layer and the protective layer are provided, under the action of the buffer layer, the impact force can be effectively absorbed and dispersed when the electronic device is subjected to external force impact, the direct effect of the impact force on the electronic device is reduced, the electronic device is protected from physical damage, and the protective layer can make the composite non-woven fabric have good protection performance, effectively protecting the electronic device from various potential hazards during transportation, storage and the like. BRIEF DESCRIPTION OF DRAWINGS

[0019] Figure 1 It is a whole structure diagram of the high-toughness electronic packaging non-woven fabric composite layer structure of the utility model.

[0020] Figure 2 It is an exploded schematic view of the composite non-woven fabric of the utility model.

[0021] Figure 3 It is an exploded schematic view of the base layer non-woven fabric of the utility model.

[0022] Figure 4 It is an exploded schematic view of the protective layer of the utility model.

[0023] Figure 5This is a schematic diagram of the structure of the buffer layer of this utility model;

[0024] Figure 6 This is a schematic diagram showing the connection between aramid fiber and carbon fiber of this utility model.

[0025] In the diagram, 1. Composite nonwoven fabric; 2. Base nonwoven fabric; 21. Nonwoven fabric main layer; 22. Reinforcing layer; 23. Connecting layer; 24. Aramid fiber; 25. Carbon fiber; 3. Buffer layer; 4. Protective layer; 41. Antistatic layer; 42. Waterproof layer; 5. Protective layer; 6. Cavity. Detailed Implementation

[0026] The technical solutions of the present utility model will be clearly and completely described below with reference to the accompanying drawings of the embodiments. Obviously, the described embodiments are only some embodiments of the present utility model, and not all embodiments. Based on the embodiments of the present utility model, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the protection scope of the present utility model.

[0027] Please see Figures 1-6 The present invention provides the following technical solution:

[0028] A high-toughness electronic packaging nonwoven fabric composite layer structure includes a composite nonwoven fabric 1, which includes a base nonwoven fabric 2. A buffer layer 3 is provided on the top of the base nonwoven fabric 2, and a protective layer 4 is provided on the side of the buffer layer 3 away from the base nonwoven fabric 2. A protective layer 5 is provided at the bottom of the base nonwoven fabric 2.

[0029] The base nonwoven fabric 2 includes a nonwoven fabric main layer 21, and a reinforcing layer 22 is provided at the top and bottom of the nonwoven fabric main layer 21. A connecting layer 23 is provided between the reinforcing layer 22 and the side opposite to the nonwoven fabric main layer 21. Aramid fiber 24 and carbon fiber 25 are provided inside the reinforcing layer 22.

[0030] The protective layer 4 includes an antistatic layer 41 and a waterproof layer 42. The antistatic layer 41 is disposed on the side close to the buffer layer 3, and the waterproof layer 42 is disposed on the side close to the antistatic layer 41.

[0031] In this embodiment: by setting the base nonwoven fabric 2 to consist of a nonwoven fabric main layer 21, a reinforcing layer 22, a connecting layer 23, aramid fibers 24 and carbon fibers 25, the nonwoven fabric main layer 21 can provide basic support and a flexible foundation for the entire nonwoven composite layer structure. In conjunction with the aramid fibers 24 and carbon fibers 25 set in the reinforcing layer 22, the reinforcing layer 22 has excellent tensile strength and tear resistance in all directions, thereby significantly improving the overall toughness of the composite nonwoven fabric 1.

[0032] Specifically, such as Figure 6As shown, there are several aramid fibers 24 and carbon fibers 25, and these several aramid fibers 24 and carbon fibers 25 are arranged in a cross pattern in the vertical direction, forming a fiber mesh.

[0033] Specifically, such as Figure 3 As shown, the connecting layer 23 is made of hot melt adhesive, and the reinforcing layer 22, the connecting layer 23, and the nonwoven fabric main body layer 21 are integrally formed by hot pressing.

[0034] In this embodiment, a multi-layered nested fiber network is formed by cross-weaving high-strength aramid fibers 24 and carbon fibers 25 at a specific angle. This cross-weaving method enables the reinforcing layer 22 to have excellent tensile strength and tear resistance in all directions, which can significantly improve the overall toughness of the composite layer structure. Furthermore, the connecting layer 23 further optimizes the arrangement structure between fibers and enhances the interaction force between fibers, thereby improving the stability and integrity of the composite layer structure.

[0035] Specifically, such as Figure 5 As shown, the buffer layer 3 is made of polyurethane foam and is bonded between the protective layer 4 and the base non-woven fabric 2 on the opposite side.

[0036] Specifically, such as Figure 5 As shown, the buffer layer 3 has several cavities 6 inside, which are evenly distributed inside the buffer layer 3, forming a honeycomb structure.

[0037] In this embodiment: by setting a buffer layer 3, and the buffer layer 3 having a honeycomb-shaped cavity 6, the impact force can be effectively absorbed and dispersed when the electronic device is subjected to external impact, reducing the direct effect of the impact force on the electronic device and protecting the electronic device from physical damage. When the cavity 6 is squeezed by external force, it will undergo elastic deformation, increasing the deformation space and energy absorption capacity of the buffer layer 3, so that the buffer layer 3 can better cope with external impacts of different intensities and directions.

[0038] Specifically, such as Figure 4 As shown, the antistatic layer 41 is composed of an antistatic agent and is uniformly coated on the side near the buffer.

[0039] Specifically, such as Figure 4 As shown, the waterproof layer 42 is made of meltblown nonwoven fabric and is bonded to one side of the antistatic layer 41.

[0040] In this embodiment: by setting an antistatic layer 41 composed of an antistatic agent, when the electronic device moves inside the packaging or generates static electricity due to friction, the antistatic layer 41 can conduct away the static electricity in time, preventing the accumulation of static electricity from damaging the electronic device, such as electrostatic breakdown of electronic components. By setting a waterproof layer 42 composed of meltblown nonwoven fabric, moisture from the external environment can be effectively blocked from entering the packaging, protecting the electronic device from the influence of a humid environment and avoiding problems such as short circuits and rust caused by moisture.

[0041] Specifically, such as Figure 2 As shown, the protective layer 5 is made of needle-punched nonwoven fabric and is bonded to the side near the base nonwoven fabric 2.

[0042] In this embodiment: by setting a protective layer 5 made of needle-punched nonwoven fabric, its softness allows the base nonwoven fabric 2 to have good contact with the contact parts of the electronic device, while avoiding damage to the surface of the electronic device.

[0043] Working principle: When the composite nonwoven fabric 1 is used, the nonwoven fabric main layer 21 provides basic support and flexibility for the entire nonwoven composite layer structure. In conjunction with the aramid fiber 24 and carbon fiber 25 set in the reinforcing layer 22, the reinforcing layer 22 has excellent tensile strength and tear resistance in all directions, thereby significantly improving the overall toughness of the composite nonwoven fabric 1. Through the antistatic layer 41, when the electronic device moves in the packaging or generates static electricity due to friction, the antistatic layer 41 can conduct away the static electricity in time, preventing the accumulation of static electricity from damaging the electronic device. Furthermore, through the waterproof layer 42, it can effectively block moisture from the external environment from entering the packaging, protecting the electronic device from the influence of the humid environment and avoiding problems such as short circuits and rust caused by moisture. When the electronic device is subjected to external impact, the buffer layer 3 and the cavity 6 will undergo elastic deformation when squeezed by external force, effectively absorbing and dispersing the impact force and reducing the direct impact force on the electronic device.

[0044] The above are merely preferred embodiments of the present utility model and are not intended to limit the present utility model. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present utility model should be included within the protection scope of the present utility model.

Claims

1. A high-toughness electronic packaging nonwoven composite layer structure, comprising a composite nonwoven fabric (1), characterized in that: The composite nonwoven fabric (1) includes a base nonwoven fabric (2), a buffer layer (3) is provided on the top of the base nonwoven fabric (2), and a protective layer (4) is provided on the side of the buffer layer (3) away from the base nonwoven fabric (2), and a protective layer (5) is provided at the bottom of the base nonwoven fabric (2). The base nonwoven fabric (2) includes a nonwoven fabric main layer (21), and a reinforcing layer (22) is provided at the top and bottom of the nonwoven fabric main layer (21). A connecting layer (23) is provided between the reinforcing layer (22) and the side opposite to the nonwoven fabric main layer (21). Aramid fiber (24) and carbon fiber (25) are provided inside the reinforcing layer (22). The protective layer (4) includes an antistatic layer (41) and a waterproof layer (42). The antistatic layer (41) is disposed on the side close to the buffer layer (3), and the waterproof layer (42) is disposed on the side close to the antistatic layer (41).

2. The high-toughness electronic packaging nonwoven composite layer structure according to claim 1, characterized in that: The number of aramid fibers (24) and carbon fibers (25) is several, and the several aramid fibers (24) and carbon fibers (25) are arranged in a cross direction in the vertical direction. The aramid fibers (24) and carbon fibers (25) together form a fiber mesh.

3. The high-toughness electronic packaging nonwoven composite layer structure according to claim 1, characterized in that: The buffer layer (3) is made of polyurethane foam and is bonded between the protective layer (4) and the base nonwoven fabric (2) on the opposite side.

4. The high-toughness electronic packaging nonwoven composite layer structure according to claim 1, characterized in that: The buffer layer (3) has several cavities (6) inside, which are evenly distributed inside the buffer layer (3) to form a honeycomb structure.

5. The high-toughness electronic packaging nonwoven composite layer structure according to claim 1, characterized in that: The connecting layer (23) is made of hot melt adhesive, and the reinforcing layer (22), the connecting layer (23) and the non-woven fabric main body layer (21) are formed as a whole by hot pressing.

6. The high-toughness electronic packaging nonwoven composite layer structure according to claim 1, characterized in that: The antistatic layer (41) is composed of an antistatic agent and is uniformly coated on the side near the buffer.

7. The high-toughness electronic packaging nonwoven composite layer structure according to claim 1, characterized in that: The waterproof layer (42) is made of meltblown nonwoven fabric and is bonded to one side of the antistatic layer (41).

8. The high-toughness electronic packaging nonwoven composite layer structure according to claim 1, characterized in that: The protective layer (5) is made of needle-punched nonwoven fabric and is bonded to the side near the base nonwoven fabric (2).

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