Semiconductor wafer visual inspection lamp

Abstract

The utility model relates to the technical field of semiconductor wafer visual inspection lamps, in particular to a semiconductor wafer visual inspection lamp. Comprising a base, a visual inspection lamp body and an adjusting mechanism, a supporting rod is fixedly connected to one side of the upper surface of the base, a mounting frame is arranged on the arc surface of the upper end of the supporting rod, the visual inspection lamp body is arranged at the end, away from the supporting rod, of the mounting frame, and a wafer is arranged at the position, corresponding to the visual inspection lamp body, of the upper end surface of the base; the adjusting mechanism is arranged at the position, corresponding to the visual inspection lamp body, of the upper surface of the base and comprises a rotating plate, the lower surface of the rotating plate is rotationally connected with the surface of the base, a gear ring is fixedly connected to the arc face of the rotating plate, and a gear is fixedly connected to the position, corresponding to the rotating plate, of the upper surface of the base. And the tooth surface of the gear is meshed with the tooth surface of the gear ring. The visual inspection lamp for the semiconductor wafer provided by the utility model has the advantage of being convenient for clamping, limiting and regulating the semiconductor wafer.

Description

Technical Field

[0001] This utility model relates to the field of semiconductor wafer inspection lamp technology, and in particular to a semiconductor wafer inspection lamp. Background Technology

[0002] Semiconductor wafer inspection lamps are devices used to detect defects on the surface of semiconductor wafers. They typically feature high brightness, uniform illumination, and specific spectral characteristics to help inspection personnel or automated equipment find minute defects or flaws on the wafer surface. They are commonly seen in daily life.

[0003] Existing technologies, such as the utility model patent with publication number CN209102622U, disclose a semiconductor wafer visual inspection lamp. This patent includes a base plate, a hinge fixedly mounted on one side of the base plate, and a top cover fixedly mounted on the top of the hinge. A handle is fixedly mounted on one side of the top of the top cover, and a female locking buckle is fixedly mounted on one side of the top of the top cover, located on the side of the handle. A male locking buckle is fixedly mounted on the other side of the base plate, and a power supply device is fixedly mounted on one side of the top of the base plate. Both sides of the top of the power supply device are fixedly mounted with fastening devices. This semiconductor wafer visual inspection lamp, with the base plate connected to the top cover by a hinge on one side, and the power supply device and support plate located on the top of the base plate, enhances the overall integrity of the lamp. When the base plate and top cover are fastened together, the female and male locking buckles lock them securely. The handle on the top of the top cover allows for hand carrying, effectively improving the portability of the semiconductor wafer visual inspection lamp.

[0004] In daily use, it has been found that during the process of irradiating and inspecting semiconductor wafers, the semiconductor wafers are usually placed on the platform surface for irradiation. When irradiating different positions of the semiconductor wafer, the operator needs to hold and place it by hand, which makes it inconvenient to clamp and limit the semiconductor wafer when visually inspecting it. Utility Model Content

[0005] The purpose of this invention is to solve the problem in the existing technology that, during the process of irradiating and inspecting semiconductor wafers, the semiconductor wafer is usually placed on a platform surface for irradiation. When irradiating different positions of the semiconductor wafer, the operator needs to hold and place it by hand, which makes it inconvenient to clamp and limit the semiconductor wafer during visual inspection.

[0006] To solve the above technical problems, this utility model provides a semiconductor wafer inspection lamp, including: a base, an inspection lamp body, and an adjustment mechanism. A support rod is fixedly connected to one side of the upper surface of the base, and a mounting bracket is provided on the upper arc surface of the support rod. The inspection lamp body is disposed at the end of the mounting bracket away from the support rod. A wafer is disposed on the upper surface of the base corresponding to the position of the inspection lamp body. The adjustment mechanism is disposed on the upper surface of the base corresponding to the position of the inspection lamp body. The adjustment mechanism includes a rotating plate, and the lower surface of the rotating plate rotates relative to the surface of the base. The rotating plate is connected to a rotating plate with a toothed ring fixedly attached to its arc surface. A gear is fixedly attached to the upper surface of the base at a position corresponding to the rotating plate. The tooth surface of the gear meshes with the tooth surface of the toothed ring. A rotating rod is fixedly attached to the surface of the gear. A support frame is fixedly attached to the upper surface of the rotating plate. The support frame has a U-shaped cross-section. A rotating frame is rotatably connected to the upper inner wall of the support frame. The rotating frame has a T-shaped cross-section. The inner wall of the rotating frame abuts against the surface of the wafer. Several extrusion shafts are threaded through the arc surface of the rotating frame.

[0007] The effect achieved by the above components is as follows: during the inspection of semiconductor wafers, the entire wafer needs to be placed on the surface of the base and then observed by the visual inspection lamp body set on the upper end of the base. At this time, in order to facilitate the flipping of the wafer position and the rotation of the angle, the adjustment mechanism can be used for auxiliary operation.

[0008] Preferably, an extrusion pad is fixedly connected to one end of the extrusion shaft near the wafer. The extrusion pad has a pointed conical cross-section and is a rubber pad.

[0009] The effect achieved by the above components is that when the wafer in the rotating frame is squeezed and limited, the squeezing pad made of rubber material at one end of the squeezing shaft can be used to assist in squeezing and limiting.

[0010] Preferably, a groove is provided on one side surface of the support frame, and a movable frame slides through the inner wall of the groove. The movable frame has a "J" shaped cross section, and a fixing rod is threaded through the short arm end surface of the movable frame. One end of the fixing rod is rotatably connected to the surface of the support frame, and the upper surface of the long arm end of the movable frame abuts against the lower surface of the rotating frame.

[0011] The effect achieved by the above components is that during the flipping of the rotating frame, the movable frame on one side of the support frame can be used to abut against it, so as to quickly and easily support and limit one side of the lower surface of the rotating frame.

[0012] Preferably, the rotating frame is a hard alloy frame, and the cross-sectional dimensions of the rotating frame are adapted to the cross-sectional dimensions of the wafer.

[0013] The effect achieved by the above components is that when using a rotating frame to support and limit the wafer, a rotating frame made of hard alloy material can be used as an auxiliary tool.

[0014] Preferably, a positioning mechanism is provided at a position corresponding to the arc surface of the support rod and the mounting bracket. The positioning mechanism includes a rack, one side of which is fixedly connected to the arc surface of the support rod. A through hole is opened on the arc surface of the mounting bracket at a position corresponding to the rack. A connecting frame is fixedly connected to the surface of the mounting bracket. The cross-section of the connecting frame is "U". A slide rod slides through the surface of the connecting frame. A retaining plate is fixedly connected to one end of the slide rod near the through hole. The cross-section of the retaining plate is conical. A spring is sleeved on the arc surface of the slide rod. The two ends of the spring are fixedly connected to the connecting frame and the slide rod, respectively.

[0015] The effect achieved by the above components is that when adjusting the position of the inspection lamp body at one end of the mounting bracket, the positioning mechanism set near the support rod end of the mounting bracket can be used for auxiliary operation. The positioning mechanism facilitates the sliding fixation between the mounting bracket and the support rod, which helps to better adjust the lifting and lowering operation of the inspection lamp body.

[0016] Preferably, one end of the slide bar is rotatably connected to a pull ring, and the pull ring has a vertical cross-section.

[0017] The effect achieved by the above components is that when the position of the slide bar is stretched and moved, the pull ring at one end of the slide bar can be used for auxiliary operation.

[0018] Preferably, a friction pad, which is a rubber pad, is fixedly connected to the tooth surface of the rack.

[0019] The effect achieved by the above components is that the friction pad made of rubber can effectively increase friction, making it easier for the rack and the clamp to engage and be fixed.

[0020] Compared with related technologies, the semiconductor wafer inspection lamp provided by this utility model has the following beneficial effects:

[0021] This utility model provides a semiconductor wafer inspection lamp. By operating the adjustment mechanism, the position of the wafer can be rotated and flipped, enabling omnidirectional illumination and inspection of the entire wafer. The wafer is supported and fixed by the rotating frame on the inner wall of the upper end of the support frame. Then, the position of the rotating plate at the bottom end of the support frame is rotated, and the rotating frame at the upper end of the support frame is flipped. Finally, the movable frame on one side of the support frame is used for support and protection, which facilitates better positioning of the wafer.

[0022] By operating the positioning mechanism, the position between the support rod and the mounting frame is limited, allowing for convenient and quick adjustment of the position of the inspection lamp body at one end of the mounting frame. By using the connecting frame on one side of the mounting frame, the sliding rod on the surface of the connecting frame is pulled, allowing the locking plate at one end of the sliding rod to engage and fix with the toothed plate on the surface of the support rod, effectively and conveniently enabling the inspection lamp body to move and be protected. Attached Figure Description

[0023] Figure 1 A schematic diagram of the structure of a semiconductor wafer inspection lamp provided by this utility model;

[0024] Figure 2 for Figure 1 The diagram shown illustrates the structure of the mediation organization.

[0025] Figure 3 for Figure 2 A schematic diagram of the disassembled structure of the adjustment mechanism shown;

[0026] Figure 4 for Figure 1 The diagram shows the disassembled structure of the positioning mechanism.

[0027] The following are the labeling elements in the diagram: 1. Base; 2. Support rod; 3. Mounting frame; 4. Adjustment mechanism; 401. Rotating plate; 402. Gear; 403. Gear ring; 404. Rotating rod; 405. Support frame; 406. Rotating frame; 407. Moving frame; 408. Fixed rod; 409. Slide groove; 410. Extrusion shaft; 411. Extrusion pad; 5. Positioning mechanism; 51. Rack; 52. Friction pad; 53. Connecting frame; 54. Through hole; 55. Clamping plate; 56. Spring; 57. Slide rod; 58. Pull ring; 6. Inspection lamp body; 7. Chip. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present utility model and are not intended to limit the present utility model.

[0029] The specific implementation of this utility model will be described in detail below with reference to specific embodiments.

[0030] Please see Figures 1 to 4This utility model provides a semiconductor wafer inspection lamp, including: a base 1, an inspection lamp body 6, and an adjustment mechanism 4. A support rod 2 is fixedly connected to one side of the upper surface of the base 1. A mounting frame 3 is provided on the upper arc surface of the support rod 2. The inspection lamp body 6 is located at the end of the mounting frame 3 away from the support rod 2. A wafer 7 is provided on the upper surface of the base 1 corresponding to the position of the inspection lamp body 6. The adjustment mechanism 4 is located on the upper surface of the base 1 corresponding to the position of the inspection lamp body 6. A positioning mechanism 5 is provided at the corresponding positions of the arc surface of the support rod 2 and the mounting frame 3.

[0031] In the embodiments of this utility model, please refer to Figure 2 and Figure 3 The adjustment mechanism 4 includes a rotating plate 401, the lower surface of which is rotatably connected to the surface of the base 1. A gear ring 403 is fixedly connected to the arc surface of the rotating plate 401. A gear 402 is fixedly connected to the upper surface of the base 1 at a position corresponding to the rotating plate 401. The tooth surface of the gear 402 meshes with the tooth surface of the gear ring 403. A rotating rod 404 is fixedly connected to the surface of the gear 402. A support frame 405 is fixedly connected to the upper surface of the rotating plate 401. The cross-section of the support frame 405 is U-shaped. A rotating frame 406 is rotatably connected to the inner wall of the upper end of the support frame 405. The cross-section of the rotating frame 406 is T-shaped. The inner wall of the rotating frame 406 abuts against the surface of the wafer 7. The arc surface of the rotating frame 406... Several extrusion shafts 410 are threaded through the support frame 405. An extrusion pad 411 is fixedly connected to one end of the extrusion shaft 410 near the wafer 7. The extrusion pad 411 has a pointed conical cross section and is made of rubber. A groove 409 is provided on one side surface of the support frame 405. A movable frame 407 slides through the inner wall of the groove 409. The movable frame 407 has a "J" shaped cross section. A fixing rod 408 is threaded through the short arm end of the movable frame 407. One end of the fixing rod 408 is rotatably connected to the surface of the support frame 405. The upper surface of the long arm end of the movable frame 407 abuts against the lower surface of the rotating frame 406. The rotating frame 406 is made of hard alloy and its cross-sectional dimensions are adapted to the cross-sectional dimensions of the wafer 7.

[0032] In the embodiments of this utility model, please refer to Figure 4The positioning mechanism 5 includes a rack 51, one side of which is fixedly connected to the arc surface of the support rod 2. The arc surface of the mounting frame 3 is provided with a through hole 54 corresponding to the position of the rack 51. A connecting frame 53 is fixedly connected to the surface of the mounting frame 3. The cross section of the connecting frame 53 is "U". A slide rod 57 slides through the surface of the connecting frame 53. A retaining plate 55 is fixedly connected to one end of the slide rod 57 near the through hole 54. The cross section of the retaining plate 55 is conical. A spring 56 is sleeved on the arc surface of the slide rod 57. The two ends of the spring 56 are fixedly connected to the connecting frame 53 and the slide rod 57 respectively. A pull ring 58 is rotatably connected to one end of the slide rod 57. The cross section of the pull ring 58 is vertical. A friction pad 52 is fixedly connected to the tooth surface of the rack 51. The friction pad 52 is a rubber pad.

[0033] The working principle of the semiconductor wafer inspection lamp provided by this utility model is as follows: During the inspection of semiconductor wafers, the inspection lamp body 6 is used to irradiate and inspect the wafer 7. At this time, the position of the wafer 7 can be adjusted by the adjustment mechanism 4. First, the wafer 7 is placed in the rotating frame 406 at the upper end of the support frame 405. Then, the extrusion shaft 410 on the arc surface of the rotating frame 406 is rotated, so that the extrusion pad 411 fixed at one end of the extrusion shaft 410 extrudes the arc surface of the wafer 7. Then, the entire rotating frame 406 is flipped and irradiated. During this process, the rotating rod 404 is rotated, so that the rotating rod 404 drives the gear 402 and the rotating plate 401 at the bottom of the support frame 405 to rotate, thereby allowing the position of the entire wafer 7 to be adjusted in all directions, which helps to better support and limit the position. At the same time, the sliding frame 407 on one side of the support frame 405 supports and protects the lower surface of the rotating frame 406.

[0034] When illuminating the object with the inspection lamp body 6 at one end of the mounting bracket 3 on the support rod 2, the position of the inspection lamp body 6 needs to be adjusted by raising and lowering. First, pull the slide rod 57 on the surface of the connecting frame 53, so that the slide rod 57 drives the locking plate 55 to disengage from the rack 51 on the surface of the support rod 2. At this time, the entire mounting bracket 3 can slide along the support rod 2. After reaching the designated position, pull the slide rod 57 again, so that the locking plate 55 fixed at one end of the slide rod 57 engages with the tooth surface of the rack 51 for limiting. At the same time, the squeezing force generated by the spring 56 squeezes and limits the position of the locking plate 55.

[0035] The circuits and controls involved in this utility model are all existing technologies, and will not be described in detail here.

[0036] The above description is merely an embodiment of this utility model and does not limit the patent scope of this utility model. Any equivalent structural or procedural transformations made based on the description and drawings of this utility model, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this utility model.

Claims

1. A semiconductor wafer inspection lamp, characterized in that, include: The base (1), the inspection lamp body (6), and the adjustment mechanism (4) are provided. A support rod (2) is fixedly connected to one side of the upper surface of the base (1). A mounting bracket (3) is provided on the upper arc surface of the support rod (2). The inspection lamp body (6) is located at the end of the mounting bracket (3) away from the support rod (2). A chip (7) is provided on the upper surface of the base (1) corresponding to the position of the inspection lamp body (6). The adjustment mechanism (4) is located on the upper surface of the base (1) corresponding to the position of the inspection lamp body (6). The adjustment mechanism (4) includes a rotating plate (401). The lower surface of the rotating plate (401) is rotatably connected to the surface of the base (1). A toothed ring (403) is fixedly connected to the arc surface of the rotating plate (401). A gear (402) is fixedly connected to the upper surface of the base (1) at the position corresponding to the rotating plate (401). The tooth surface of the gear (402) meshes with the tooth surface of the gear ring (403). A rotating rod (404) is fixedly connected to the surface of the gear (402). A support frame (405) is fixedly connected to the upper surface of the rotating plate (401). The cross-section of the support frame (405) is "U". A rotating frame (406) is rotatably connected to the upper inner wall of the support frame (405). The cross-section of the rotating frame (406) is "T". The inner wall of the rotating frame (406) abuts against the surface of the wafer (7). Several extrusion shafts (410) are threaded through the arc surface of the rotating frame (406).

2. The semiconductor wafer inspection lamp according to claim 1, characterized in that, The extrusion shaft (410) is fixedly connected to an extrusion pad (411) at one end near the wafer (7). The extrusion pad (411) has a pointed cone-shaped cross section and is a rubber pad.

3. A semiconductor wafer inspection lamp according to claim 1, characterized in that, A groove (409) is provided on one side surface of the support frame (405). A movable frame (407) slides through the inner wall of the groove (409). The movable frame (407) has a "J" shaped cross section. A fixed rod (408) is threaded through the short arm end surface of the movable frame (407). One end of the fixed rod (408) is rotatably connected to the surface of the support frame (405). The upper surface of the long arm end of the movable frame (407) abuts against the lower surface of the rotating frame (406).

4. A semiconductor wafer inspection lamp according to claim 1, characterized in that, The rotating frame (406) is a hard alloy frame, and the cross-sectional dimensions of the rotating frame (406) are adapted to the cross-sectional dimensions of the wafer (7).

5. A semiconductor wafer inspection lamp according to claim 1, characterized in that, The support rod (2) has a positioning mechanism (5) at a position corresponding to the arc surface of the mounting frame (3). The positioning mechanism (5) includes a rack (51). One side of the rack (51) is fixedly connected to the arc surface of the support rod (2). The mounting frame (3) has a through hole (54) at a position corresponding to the rack (51). A connecting frame (53) is fixedly connected to the surface of the mounting frame (3). The cross-section of the connecting frame (53) is U-shaped. A sliding rod (57) slides through the surface of the connecting frame (53). A clamping plate (55) is fixedly connected to one end of the sliding rod (57) near the through hole (54). The cross-section of the clamping plate (55) is conical. A spring (56) is sleeved on the arc surface of the sliding rod (57). The two ends of the spring (56) are fixedly connected to the connecting frame (53) and the sliding rod (57) respectively.

6. A semiconductor wafer inspection lamp according to claim 5, characterized in that, One end of the slide rod (57) is rotatably connected to a pull ring (58), and the cross section of the pull ring (58) is vertical.

7. A semiconductor wafer inspection lamp according to claim 5, characterized in that, The tooth surface of the rack (51) is fixedly connected to a friction pad (52), which is a rubber pad.

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