Chip heat dissipation rack and electronic equipment

Abstract

The utility model relates to a chip heat dissipation frame and electronic equipment. The chip radiating rack comprises a bracket, a radiator, a fastener and a separating unit, wherein the bracket is provided with a positioning column. The radiator is arranged towards the side, provided with the positioning columns, of the bracket. The fastener penetrates through the radiator, and the part, penetrating through the bracket, of the fastener is used for being connected with the positioning column. The separating unit is arranged between the bracket and the radiator, and the separating unit is connected with the fastener and used for abutting against the radiator. Based on the arrangement, in the process that the chip heat dissipation rack is switched from the fixed state to the release state, the separation unit drives the radiator to move in the direction away from the bracket, so that the bracket and the radiator are at least partially separated, and the bracket and the radiator can be conveniently and completely separated on the basis.

Description

Technical Field

[0001] This application relates to the field of heat dissipation, and more particularly to a chip heat sink and electronic device. Background Technology

[0002] With the development of technology, heat dissipation of chips has become increasingly important, and its development has evolved from the initial fan-based cooling to the use of dedicated heat sinks. When assembling heat sinks for heat dissipation, it is often necessary to first apply thermal paste or phase change materials to the chip for better heat dissipation.

[0003] However, when the chip temperature is high, the adhesion of the thermal paste or phase change material between the heat sink and the chip is strong, making it difficult to disassemble the heat sink. It is necessary to wait for the chip to cool down or use tools such as pry bars to help separate the two, which poses safety risks and affects the efficiency of research and development testing or maintenance. Utility Model Content

[0004] The purpose of this application is to provide a chip heat sink and an electronic device.

[0005] According to a first aspect of the embodiments of this application, a chip heat sink is provided, the chip heat sink comprising:

[0006] bracket;

[0007] The radiator is positioned toward the bracket;

[0008] Fasteners, which pass through the radiator and whose portion extends through the radiator, are used to connect to the bracket;

[0009] A separation unit is connected to the fastener and is used to abut against the heat sink;

[0010] The chip heat sink includes a fixed state and a loosened state; when the chip heat sink is in the fixed state, the bracket abuts against the heat sink; when the chip heat sink is in the loosened state, the bracket and the heat sink are at least partially separated; during the process of the chip heat sink switching from the fixed state to the loosened state, the fastener and the bracket move relative to each other, and the fastener drives the heat sink to move away from the bracket through the separation unit.

[0011] In some embodiments, the fastener has an inwardly recessed retaining groove on its periphery;

[0012] During the process of the chip heat sink switching from the fixed state to the loosened state, part of the separation unit is engaged in the fixing slot, and another part of the separation unit is positioned in contact with the heat sink.

[0013] In some embodiments, during the process of the chip heat sink switching from the fixed state to the loosened state, a portion of the separation unit abuts against the lower end face of the fixing groove, and another portion of the separation unit abuts against the lower surface of the heat sink.

[0014] In some embodiments, the separation unit includes a claw portion and a support portion connected to each other;

[0015] The support portion is configured to abut against the heat sink. The support portion has a through hole. The claw portion extends from the side wall of the through hole toward the center of the support portion, and the end of the claw portion opposite to the support portion is engaged in the fixing groove.

[0016] In some embodiments, the fastener includes a positioning portion and a guide portion connected along its extending direction, the positioning portion being threaded to a bracket, the fixing groove being disposed in the guide portion, and the cross-sectional area of ​​the guide portion being larger than the cross-sectional area of ​​the positioning portion;

[0017] When the chip heat sink is in the fixed state, the surface of the guide portion facing the bracket abuts against the upper surface of the bracket.

[0018] In some embodiments, the separating unit has a through hole, and the fastener is located in the through hole; the separating unit also has a notch that communicates with the through hole, and the fastener is used to enter the through hole through the notch; or...

[0019] The separation unit includes a first separation part and a second separation part that are detachably connected, and the first separation part and the second separation part are fastened to the periphery of the fastener.

[0020] In some embodiments, the depth of the fixing groove is greater than or equal to 0.5 mm and less than or equal to 3 mm.

[0021] In some embodiments, the chip heat sink further includes a compression unit, one end of which abuts against the end of the fastener away from the bracket, and the other end of which abuts against the surface of the heat sink away from the bracket.

[0022] In some embodiments, when the chip heat sink is in a loosened state, the plane where the heat sink is located is set at an angle to the plane where the bracket is located.

[0023] In some embodiments, the number of fasteners is multiple;

[0024] During the process of the chip heat sink switching from the fixed state to the loosened state, the strokes of multiple fasteners are the same, or the stroke of at least one fastener relative to the bracket is greater than the strokes of other fasteners relative to the bracket.

[0025] In some embodiments, when the travel of one fastener relative to the bracket is greater than the travel of other fasteners relative to the bracket, the fastener with the largest travel is designated as the first fastener, and the other fasteners are designated as the second fasteners. The travel of the first fastener is designated as the first travel, and the travel of the second fastener is designated as the second travel.

[0026] The difference between the first stroke and the second stroke is greater than or equal to 0.5 mm and less than or equal to 1.5 mm.

[0027] In some embodiments, the bracket is provided with positioning posts, the radiator is disposed on the side of the bracket where the positioning posts are provided, the number of fasteners is the same as the number of positioning posts, and the fasteners are configured to cooperate with the positioning posts.

[0028] In some embodiments, the fastener and the bracket are threaded together.

[0029] The positioning post adapted to the first fastener is used as the first positioning post, and the positioning post adapted to the second fastener is used as the second positioning post.

[0030] When the chip heat sink is in a fixed state, and when the first fastener and the second fastener have the same size, the minimum distance between the thread closest to the heat sink in the first positioning post and the plane where the heat sink is located is the first distance; the minimum distance between the thread closest to the heat sink in the second positioning post and the plane where the heat sink is located is the second distance.

[0031] The second distance is greater than the first distance, and the difference between the two is greater than or equal to 0.5 mm and less than or equal to 1.5 mm.

[0032] In some embodiments, the fastener and the bracket are threaded together.

[0033] The positioning post adapted to the first fastener is used as the first positioning post, and the positioning post adapted to the second fastener is used as the second positioning post.

[0034] When the chip heat sink is in a fixed state, and when the dimensions of the first positioning post and the first positioning post are the same, the minimum distance between the thread closest to the bracket in the first fastener and the plane where the bracket is located is the third distance; the minimum distance between the thread closest to the bracket in the second fastener and the plane where the bracket is located is the fourth distance.

[0035] The fourth distance is greater than the third distance, and the difference between the two is greater than or equal to 0.5 mm and less than or equal to 1.5 mm.

[0036] According to a second aspect of the present application, an electronic device is provided, the electronic device including the chip heat sink described in any of the above embodiments.

[0037] The beneficial technical effects of the technical solutions provided in this application are:

[0038] This application includes a bracket, a heat sink, fasteners, and a separation unit. The bracket has a positioning post. The heat sink is positioned facing the side of the bracket with the positioning post. The fastener passes through the heat sink, and the portion passing through the bracket is used to connect with the positioning post. The separation unit is positioned between the bracket and the heat sink, and is connected to the fastener and abuts against the heat sink. The chip heat sink has a fixed state and a loosened state; when the chip heat sink is in the fixed state, the bracket abuts against the heat sink; when the chip heat sink is in the loosened state, the bracket and the heat sink are at least partially separated; during the transition from the fixed state to the loosened state, the fastener and the positioning post move relative to each other, and the fastener, through the separation unit, moves the heat sink away from the bracket.

[0039] As can be seen, during the process of the chip heat sink switching from a fixed state to a detached state, the separation unit moves the heat sink away from the bracket, thereby separating the bracket and the heat sink at least partially, and then facilitating the complete separation of the bracket and the heat sink. This avoids the need to use tools such as rods to assist in the separation, avoids potential safety risks, and improves the efficiency of research and development testing or maintenance. Attached Figure Description

[0040] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0041] Figure 1 This is a schematic diagram of a chip heat sink according to an embodiment of this application;

[0042] Figure 2 This is an exploded view of a chip heat sink according to an embodiment of this application;

[0043] Figure 3 This is a schematic diagram of the bracket structure from one perspective according to an embodiment of this application;

[0044] Figure 4 This is a schematic diagram of the bracket structure from another perspective, according to an embodiment of this application;

[0045] Figure 5 This is a schematic diagram of the structure of a heat sink according to an embodiment of this application;

[0046] Figure 6 This is a schematic diagram of a chip heat sink in a fixed state according to an embodiment of this application;

[0047] Figure 7 This is a schematic diagram of the chip heat sink in an exploded state according to an embodiment of this application;

[0048] Figure 8 This is a schematic diagram of another chip heat sink in a fixed state according to an embodiment of this application;

[0049] Figure 9 This is a schematic diagram of the structure of another chip heat sink in an disassembled state according to an embodiment of this application;

[0050] Figure 10 This is a schematic diagram of another chip heat sink in a fixed state according to an embodiment of this application;

[0051] Figure 11 This is a schematic diagram of the structure of another chip heat sink in an disassembled state according to an embodiment of this application;

[0052] Figure 12 This is a schematic diagram of the bracket structure according to an embodiment of this application;

[0053] Figure 13 This is a schematic diagram of the structure of a fastener according to an embodiment of this application;

[0054] Figure 14 This is a schematic diagram illustrating the cooperation of a fastener, a separation unit, and a compression unit according to an embodiment of this application;

[0055] Figure 15 This is a schematic diagram of the structure of a separation unit according to an embodiment of this application;

[0056] Figure 16 This is a schematic diagram of the structure of a separation unit according to an embodiment of this application;

[0057] Figure 17 This is a schematic diagram illustrating the fit between a fastener and a separation unit according to an embodiment of this application;

[0058] Figure 18 This is a schematic diagram illustrating the engagement of another fastener and separation unit according to an embodiment of this application.

[0059] Explanation of reference numerals in the attached figures:

[0060] Chip heat sink 10

[0061] Chip 20

[0062] Bracket 100

[0063] Positioning post 110

[0064] First positioning post 110A

[0065] Second positioning post 110B

[0066] 120 Container

[0067] Radiator 200

[0068] Heatsink 210

[0069] Fasteners 300

[0070] First fastener 300A

[0071] Second fastener 300B

[0072] Fixed slot 310

[0073] Positioning Unit 320

[0074] Guidance Department 330

[0075] Head 340

[0076] Separation unit 400

[0077] 410 chuck

[0078] Support section 420

[0079] Through hole 421

[0080] 430 piercing

[0081] Gap 440

[0082] Compression unit 500

[0083] Fixed state A1

[0084] Loosening state A2 Detailed Implementation

[0085] The technical solutions in the embodiments (or "implementations") of this application will be clearly and completely described herein with reference to the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements.

[0086] If the embodiments of this application contain terms relating to directional indications or positional relationships (such as up, down, left, right, front, back, inside, outside, top, bottom, center, vertical, horizontal, longitudinal, transverse, length, width, counterclockwise, clockwise, axial, radial, circumferential, etc.), such terms are only used to explain the relative positional relationships and movements between components in a specific posture (as shown in the attached figures); if the specific posture changes, the directional indications or positional relationships will also change accordingly. Furthermore, the terms "first" and "second" used in the embodiments of this application are only for descriptive convenience and should not be construed as indicating or implying relative importance.

[0087] This application discloses an electronic device including a chip 20 for intelligent control and a chip heat sink 10. The chip heat sink 10 includes a bracket 100 and a heat sink 200. The bracket 100 is provided with a receiving groove 120, in which the chip 20 is placed. The heat sink 200 is positioned towards the bracket 100 for fixed connection with the bracket 100, and the chip 20 is sandwiched between the heat sink 200 and the bracket 100 to achieve a fixed connection of the chip 20. Simultaneously, when the heat sink 200 and the bracket 100 are fixedly connected, the heat dissipation surface of the heat sink 200 is in contact with the surface of the chip 20 to receive the heat generated by the chip 20, thereby achieving heat dissipation for the chip 20.

[0088] It should be noted that the electronic devices mentioned above can be computer hosts, cloud servers, or other devices that require chip 20. Chip 20 can be a CPU, GPU, etc.

[0089] In the actual assembly process, the chip 20 is first placed in the receiving slot 120, and then thermal paste or phase change material is applied to the chip 20 for better heat conduction. Afterwards, the heat sink 200 is fixed to the bracket 100. The heat sink 200 has a surface facing the chip 20, on which a heat sink 210 is fixed. The heat sink 210 can be made of a metal with good heat dissipation performance (e.g., silver, copper). During the process of fixing the heat sink 200 to the bracket 100, the heat sink 210 needs to be in contact with the thermal paste or phase change material on the chip 20 to achieve better heat conduction. The thermal paste or phase change material can improve the surface flatness of the chip 20 and the heat sink 210, ensuring better contact between them.

[0090] However, in actual use, when the chip 20 is at a high temperature, the adhesion of the thermal paste or phase change material between the heat sink 200 and the chip 20 is relatively strong. Forcibly disassembling the heat sink 200 and the bracket 100 is difficult. Disassembly must be performed after the chip 20 has cooled down, which is time-consuming. Alternatively, tools such as pry bars can be used to assist in separation, but this carries the risk of damaging the chip 20 and the heat sink 200.

[0091] To solve the above problems, the inventors improved the chip heat sink 10.

[0092] like Figures 1-5 As shown, the chip heat sink 10 also includes a fastener 300. The fastener 300 is used to securely connect the heat sink 200 and the bracket 100. The heat sink 200 is positioned facing the bracket 100, and the fastener 300 passes through the heat sink 200, with the portion passing through the heat sink 200 used for connection with the bracket 100. When the heat sink 200 and the bracket 100 are secured to each other by the fastener 300, the chip 20 is sandwiched between the heat sink 200 and the bracket 100. It should be noted that the bracket 100 may be provided with a positioning post 110 for engaging with the fastener 300, and the fastener 300 secures the heat sink 200 and the bracket 100 by engaging with the positioning post 110. Alternatively, the bracket 100 itself may have a connection hole, and the fastener 300 engages with the connection hole to secure the heat sink 200 and the bracket 100. Anything that can secure the radiator 200 and the bracket 100 to each other using fasteners 300 should be within the scope of protection of this application.

[0093] refer to Figures 6-12 As shown, the chip heat sink 10 also includes a separation unit 400, which is disposed between the bracket 100 and the heat sink 200. The separation unit 400 is connected to the fastener 300 and is used to abut against the heat sink 200.

[0094] In addition, continue to refer to Figures 6-9 As shown, the chip heat sink 10 includes a fixed state A1 and a loosened state A2. (Reference) Figure 6 and Figure 8 As shown, when the chip heat sink 10 is in fixed state A1, the bracket 100 abuts against the heat sink 200. That is, the bracket 100 and the heat sink 200 are in normal working condition, and the heat sink 200 can provide normal heat dissipation for the chip 20. (Reference) Figure 7 and Figure 9 As shown, when the chip heat sink 10 is in the loosened state A2, the bracket 100 and the heat sink 200 are at least partially separated. This partial separation of the bracket 100 and the heat sink 200 can be understood as follows: when the chip heat sink 10 is in the loosened state A2, the plane containing the heat sink 200 forms an angle with the plane containing the bracket 100. That is, referring to... Figure 9 As shown, the heat sink 200 has one corner raised and is separated from the bracket 100. The included angle here can be set according to the deformation degree of the silicone grease or phase change material, and is generally set to greater than 1° and less than 10°. For example, the angle between the plane of the heat sink 200 and the plane of the bracket 100 can be set to 1°, 2°, 3°, 4°, 5°, 6°, 7°, 8°, 9°, or 10°. Furthermore, the fact that the bracket 100 and the heat sink 200 are at least partially separated can also be understood as the distance between the plane of the heat sink 200 and the plane of the bracket 100 increasing when the chip heat sink 10 is in the loosened state A2. That is, referring to... Figure 7 As shown, all parts of the radiator 200 are far from the bracket 100 and are separated from the bracket 100.

[0095] During the process of the chip heat sink 10 switching from the fixed state A1 to the loosened state A2, the fastener 300 and the bracket 100 move relative to each other, and the fastener 300 drives the heat sink 200 to move away from the bracket 100 through the separation unit 400.

[0096] Based on the above configuration, it can be seen that during the process of the chip heat sink 10 switching from the fixed state A1 to the loosened state A2, the separation unit 400 drives the heat sink 200 to move away from the bracket 100, thereby causing the bracket 100 and the heat sink 200 to separate at least partially, and then the bracket 100 and the heat sink 200 can be easily separated completely. This avoids the need to use tools such as rods to assist in the separation, and eliminates the need to wait for cooling, saving time and improving disassembly efficiency.

[0097] In this embodiment, reference Figures 8-11 As shown in the diagram, the gray area represents the location of the radiator 200. The fastener 300 and the bracket 100 are connected by a threaded connection. This threaded connection converts rotational power into a vertical force, causing the fastener 300 to move vertically during rotation. The separation unit 400 is connected to the fastener 300 and abuts against the radiator 200. During the transition from the fixed state A1 to the loosened state A2, only the fastener 300 needs to be rotated relative to the bracket 100. At this time, the fastener 300 will cause the separation unit 400 to move away from the bracket 100. Furthermore, the separation unit 400 will cause the radiator 200 to move away from the bracket 100, thus separating the bracket 100 and the radiator 200.

[0098] In one embodiment, reference Figure 13 and Figure 14As shown, the fastener 300 has an inwardly recessed fixing groove 310 on its periphery. Part of the structure of the separation unit 400 is locked in the fixing groove 310. During the process of the chip heat sink 10 switching from the fixed state A1 to the loosened state A2, another part of the structure is set to abut against the heat sink 200.

[0099] In this embodiment, a fixing groove 310 is provided, and part of the structure of the separation unit 400 is clamped in the fixing groove 310 for support, so that the separation unit 400 has enough supporting force to separate the bracket 100 and the heat sink 200.

[0100] In this embodiment, the separation unit 400 may always be in contact with the heat sink 200. Alternatively, it may only be in contact with the heat sink 200 during the transition from the fixed state A1 to the loosened state A2, so as to move the heat sink 200 away from the bracket 100.

[0101] Continue to refer to Figure 13 and Figure 14 As shown, when the depth of the fixing groove 310 is too small, the fixing groove 310 cannot completely lock the separating unit 400, which can easily cause the separating unit 400 to detach from the fixing groove 310. Simultaneously, when the depth of the fixing groove 310 is too large, the diameter of the fastener 300 at that location is too small, resulting in lower strength of the fastener 300 and making it prone to breakage. In this embodiment, the depth of the fixing groove 310 is set to be greater than or equal to 0.5 mm and less than or equal to 3 mm. This ensures that the separating unit 400 is completely fixed while maintaining appropriate strength for the fastener 300, making it less prone to breakage. For example, the depth of the fixing groove 310 can be set to 0.5 mm, 1 mm, 1.5 mm, 2 mm, 2.5 mm, or 3 mm.

[0102] In one embodiment, reference Figure 15 As shown, the separation unit 400 includes a claw portion 410 and a support portion 420 connected to each other. The support portion 420 is configured to abut against the heat sink 200. The support portion 420 is provided with a through hole 421. The claw portion 410 extends from the side wall of the through hole 421 toward the center of the support portion 420, and the end of the claw portion 410 away from the support portion 420 is engaged in the fixing groove 310. The free end of the claw portion 410 away from the side wall of the through hole 421 can move within a certain range.

[0103] Based on the above configuration, during actual assembly, the separation unit 400 can move upward from the positioning part 320 end of the fastener 300 until the claw part 410 is engaged in the fixing groove 310. The upper end face of the fixing groove 310 can restrict the position of the separation unit 400 during installation. It should be noted that when using the separation unit 400, the fastener 300 and the heat sink 200 need to be assembled first, that is, after the fastener 300 passes through the heat sink 200, the separation unit 400 is installed on the fastener 300 to fix the fastener 300 and the heat sink 200 to each other.

[0104] like Figure 16 As shown, in another embodiment, the separating unit 400 is provided with a through hole 430, and the fastener 300 is located in the through hole. The separating unit 400 also includes a notch 440, which communicates with the through hole 430, and the fastener 300 is used to enter the through hole through the notch 440.

[0105] It should be noted that the notch 440 can be set to have a diameter slightly smaller than the diameter of the fixing groove 310 of the fastener 300. This makes it difficult for the separation unit 400 to be thrown off due to inertia after it is engaged with the fastener 300. Furthermore, the separation unit 400 can transfer the force of the fastener 300 to the heat sink 200, so that the bracket 100 and the heat sink 200 are at least partially separated. Moreover, this structure only has a through hole 430 and a notch 440, making it simple, inexpensive, and suitable for large-scale application.

[0106] In other embodiments, the separation unit 400 may further include a first separation portion and a second separation portion that are detachably connected, the first separation portion and the second separation portion being engaged with the periphery of the fastener 300 to transmit the force of the fastener 300 to the radiator 200 so that the bracket 100 and the radiator 200 are at least partially separated.

[0107] In this embodiment, reference Figure 8 , Figure 9 as well as Figure 14 As shown, the fastener 300 includes a positioning part 320 and a guide part 330 connected along its extension direction. The positioning part 320 is used for threaded connection with the bracket 100. The fixing groove 310 is provided in the guide part 330. The cross-sectional area of ​​the guide part 330 is larger than the cross-sectional area of ​​the positioning part 320. When the chip heat sink 10 is in the fixed state A1, the surface 331 of the guide part 330 facing the bracket 100 abuts against the upper surface of the bracket 100 to achieve limiting.

[0108] In this embodiment, the fastener 300 is provided with a positioning part 320 for threaded connection with the bracket 100. The fastener 300 is also provided with a guide part 330. Because the cross-sectional area of ​​the guide part 330 is larger than that of the positioning part 320, it abuts against the upper surface of the bracket 100 after the positioning part 320 is fully inserted into the bracket 100 to achieve positioning. That is, the distance between the bracket 100 and the heat sink 200 when the chip heat sink 10 is in the fixed state A1 can be determined by providing the guide part 330.

[0109] Furthermore, during the process of switching the chip heat sink 10 from the fixed state A1 to the loosened state A2, a portion of the separation unit 400 abuts against the lower end face of the fixing groove 310, and another portion abuts against the lower surface of the heat sink 200. Abutting against the lower surface can provide sufficient support force to separate the bracket 100 and the heat sink 200, thereby increasing the stability of the chip heat sink 10.

[0110] In one embodiment, reference Figure 5 , Figure 6 as well as Figure 14 As shown, the chip heat sink 10 also includes a compression unit 500. One end of the compression unit 500 abuts against the end of the fastener 300 away from the bracket 100, and the other end of the compression unit 500 abuts against the surface of the heat sink 200 away from the bracket 100. It should be noted that the compression unit 500 can be an elastic component such as a spring or rubber. In this embodiment, the fastener 300 also includes a head 340, which is located at the end of the guide portion 330 away from the positioning portion 320. The diameter of the head 340 is larger than the diameter of the positioning portion 320. The compression unit 500 is sleeved on the fastener 300, and one end of it abuts against the end face of the head 340 facing the positioning portion 320.

[0111] The compression unit 500 is used to apply a force toward the bracket 100 to the heat sink 200 so that the heat sink 200 and the bracket 100 clamp the chip 20, while ensuring close contact between the heat sink 200 and the chip 20, and ensuring stable and continuous heat dissipation performance.

[0112] In this embodiment, the compression unit 500 is first fitted onto the fastener 300, and then the compression unit 500 and the fastener 300 are connected to the heat sink 200 as a whole. The positioning part 320 of the fastener 300 passes through the heat sink 200, while the compression unit 500 is confined between the head 340 and the heat sink 200. At this time, the separation unit 400 can be installed onto the fastener 300 from the positioning part 320. After the separation unit 400 is installed, the separation unit 400 and the compression unit 500 fix the fastener 300 to the heat sink 200, thereby integrating the heat sink 200, the fastener 300, the separation unit 400, and the compression unit 500 into a whole.

[0113] The assembly can mate with the bracket 100, and by rotating the fastener 300, the positioning part 320 is threadedly connected to the bracket 100. At this time, one end of the compression unit 500 is limited by the head 340, and the other end abuts against the heat sink 200. As the fastener 300 rotates downwards, the compression unit 500 is compressed, and the pressure is transmitted to the heat sink 200, thereby bringing the assembly closer to the bracket 100. The compression unit 500 can provide appropriate pressure, thus preventing damage to the chip from excessive pressure on the heat sink 200 and the bracket 100. The compression unit 500 can prevent direct hard contact between the head 340 and the heat sink 200, thus protecting both the heat sink 200 and the chip 20. Furthermore, the compression unit 500 can also help absorb vibration and shock, preventing the fastener 300 from loosening due to vibration, thereby maintaining the safety and reliability of the connector.

[0114] When the bracket 100 and the radiator 200 are fixed in place, the positional relationship between the separation unit 400 and the fastener 300 is as follows: Figure 17 As shown. Of course, before both are installed in place, the positional relationship between the separation unit 400 and the fastener 300 can also be as shown. Figure 18 As shown.

[0115] In one embodiment, reference Figures 6-11 As shown, there are multiple fasteners 300. During the process of the chip heat sink 10 switching from the fixed state A1 to the loosened state A2, the travel of at least one fastener 300 relative to the bracket 100 is greater than the travel of other fasteners 300 relative to the bracket 100.

[0116] In this embodiment, reference Figure 8 and Figure 9 As shown, the fastener 300 with the longer stroke is designated as the first fastener 300A, and the other fasteners 300 are designated as the second fasteners 300B. In the actual disassembly process, the second fastener 300B with the shorter stroke is first unscrewed from the bracket 100, and then the first fastener 300A is unscrewed from the bracket 100. Of course, in actual operation, the first fastener 300A and the second fastener 300B can be tightened alternately. Since the first fastener 300A has a longer stroke, it will separate from the corresponding bracket 100 later than the second fastener 300B.

[0117] Because the second fastener 300B has a short stroke, the portion of the heat sink 200 located near the second fastener 300B moves a shorter distance away from the bracket 100 under the action of the separation unit 400. Furthermore, due to the presence of a highly adhesive silicone grease or phase change material between the heat sink 200 and the bracket 100, this portion of the bracket 100 and the heat sink 200 remain bonded. Meanwhile, because the first fastener 300A has a long stroke, the portion of the heat sink 200 located near the first fastener 300A moves a longer distance away from the bracket 100 under the action of the separation unit 400. Although a highly adhesive silicone grease or phase change material exists between the heat sink 200 and the bracket 100, the longer stroke can break the bond between the silicone grease or phase change material, creating a gap between them. In other words, during the process of the chip heat sink 10 switching from the fixed state A1 to the loosened state A2, the heat sink 200 moves different distances relative to the bracket 100 at different positions, resulting in the plane where the heat sink 200 is located forming an angle with the plane where the bracket 100 is located. At this time, the bracket 100 and the heat sink 200 located near the first fastener 300A are separated, and thus the bracket 100 and the heat sink 200 can be completely separated directly based on the gap.

[0118] refer to Figure 8 and Figure 9 As shown, the stroke of the first fastener 300A is considered the first stroke, and the stroke of the second fastener 300B is considered the second stroke. The first stroke is greater than the second stroke. When the difference between the first and second strokes is too small, the silicone grease or phase change material will deform to adapt to the change, thus preventing the bracket 100 and the heat sink 200 from being effectively separated. When the difference between the first and second strokes is too large, sufficient space needs to be left for the fastener 300 and the bracket 100 to be installed, resulting in the chip heat sink 10 being too large overall. In this embodiment, the difference between the first and second strokes is set to be greater than or equal to 0.5 mm and less than or equal to 1.5 mm. Within this range, on the one hand, the bracket 100 and the heat sink 200 can be separated, and on the other hand, the chip heat sink 10 can be kept at a suitable size. For example, the difference between the first stroke and the second stroke can be set to 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1.0mm, 1.1mm, 1.2mm, 1.3mm, 1.4mm, or 1.5mm.

[0119] like Figure 6 and Figure 7As shown, in other embodiments, the strokes of the multiple fasteners 300 can also be the same, and the stroke of each fastener 300 can be set to a relatively long stroke. In this case, the fasteners 300 need to be rotated one by one. This ensures that the strokes of the multiple fasteners 300 are not significantly different, so as to avoid damage to the bracket 100 and the fasteners 300. In this embodiment, the multiple fasteners 300 can push each part of the heat sink 200 away from the bracket 100. The longer stroke can break the adhesive relationship between the silicone grease or phase change material and create a gap between them, thereby completely separating the bracket 100 and the heat sink 200.

[0120] In one embodiment, when the bracket 100 is provided with positioning posts 110, the radiator 200 is positioned facing the side of the bracket 100 where the positioning posts 110 are provided. The number of fasteners 300 is the same as the number of positioning posts 110, and the fasteners 300 are configured to cooperate with the positioning posts 110. The bracket 100 is provided with positioning posts 110, meaning that the part that cooperates with the fasteners 300 protrudes outward, thereby facilitating the positioning of the fasteners 300 and the positioning posts 110 during installation.

[0121] In this embodiment, reference Figure 10 and Figure 11 As shown, fastener 300 and positioning post 110 are threadedly connected. Positioning post 110 adapted to the first fastener 300A is designated as the first positioning post 110A, and positioning post 110 adapted to the second fastener 300B is designated as the second positioning post 110B. When the chip heat sink 10 is in fixed state A1, and when the dimensions of the first fastener 300A and the second fastener 300B are the same, the minimum distance between the thread closest to the heat sink 200 in the first positioning post 110A and the plane containing the heat sink 200 is the first distance, and the minimum distance between the thread closest to the heat sink 200 in the second positioning post 110B and the plane containing the heat sink 200 is the second distance. The second distance is set to be greater than the first distance, and the difference between the two is greater than or equal to 0.5 mm and less than or equal to 1.5 mm. Of course, in other embodiments, the first positioning post 110A can also be raised to achieve a second distance greater than the first distance.

[0122] In this embodiment, by simply changing the difference between the first positioning post 110A and the second positioning post 110B, the fastener 300 can move the heat sink 200 away from the bracket 100 via the separation unit 400. That is, simply lengthening the second positioning post 110B is sufficient to achieve at least partial separation between the bracket 100 and the heat sink 200. This setup is simple, convenient, and easy to operate, making it suitable for a wide range of applications.

[0123] In other embodiments, reference is made to Figure 8 and Figure 9 As shown, when the chip heat sink 10 is in fixed state A1, and when the dimensions of the first positioning post 110A and the first positioning post 110A are the same, the first fastener 300A and the second fastener 300B are both limited by the guide portion 330. The minimum distance between the thread of the first fastener 300A closest to the bracket 100 and the plane where the bracket 100 is located is the third distance, and the minimum distance between the thread of the second fastener 300B closest to the bracket 100 and the plane 101 where the bracket 100 is located is the fourth distance. The fourth distance is set to be greater than the third distance, and the difference between the two is greater than or equal to 0.5mm and less than or equal to 1.5mm.

[0124] Similarly, in this embodiment, only the difference between the first fastener 300A and the second fastener 300B needs to be changed to allow the fastener 300 to move the heat sink 200 away from the bracket 100 via the separation unit 400. That is, only the length of the second fastener 300B needs to be increased to achieve at least partial separation between the bracket 100 and the heat sink 200. This setup is simple, convenient, and easy to operate, making it suitable for a wide range of applications.

[0125] It should be noted that the technical solutions or features described in the above embodiments can be combined or supplemented with each other without conflict. The scope of protection of this application is not limited to the precise structures described in the above embodiments and shown in the accompanying drawings; all modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the scope of protection of this application.

Claims

1. A chip heat sink, characterized in that, The chip heat sink includes: bracket; The radiator is positioned toward the bracket; Fasteners, which pass through the radiator and whose portion extends through the radiator, are used to connect to the bracket; A separation unit is connected to the fastener and is used to abut against the heat sink; The chip heat sink includes a fixed state and a loosened state; when the chip heat sink is in the fixed state, the bracket abuts against the heat sink; when the chip heat sink is in the loosened state, the bracket and the heat sink are at least partially separated; during the process of the chip heat sink switching from the fixed state to the loosened state, the fastener and the bracket move relative to each other, and the fastener drives the heat sink to move away from the bracket through the separation unit.

2. The chip heat sink as described in claim 1, characterized in that, The fastener has an inwardly recessed fixing groove on its periphery. During the process of the chip heat sink switching from the fixed state to the loosened state, part of the separation unit is engaged in the fixing slot, and another part of the separation unit is positioned in contact with the heat sink.

3. The chip heat sink as described in claim 2, characterized in that, During the process of the chip heat sink switching from the fixed state to the loosened state, a part of the separation unit abuts against the lower end face of the fixing groove, and another part of the separation unit abuts against the lower surface of the heat sink.

4. The chip heat sink as described in claim 2, characterized in that, The separation unit includes a claw portion and a support portion that are connected to each other; The support portion is configured to abut against the heat sink. The support portion has a through hole. The claw portion extends from the side wall of the through hole toward the center of the support portion, and the end of the claw portion opposite to the support portion is engaged in the fixing groove.

5. The chip heat sink as described in claim 2, characterized in that, The fastener includes a positioning portion and a guide portion connected along its extending direction. The positioning portion is used for threaded connection with a bracket. The fixing groove is disposed in the guide portion. The cross-sectional area of ​​the guide portion is larger than the cross-sectional area of ​​the positioning portion. When the chip heat sink is in the fixed state, the surface of the guide portion facing the bracket abuts against the upper surface of the bracket.

6. The chip heat sink as described in claim 1, characterized in that, The separation unit has a through hole, and the fastener is located in the through hole; the separation unit also has a notch that communicates with the through hole, and the fastener is used to enter the through hole through the notch; or... The separation unit includes a first separation part and a second separation part that are detachably connected, and the first separation part and the second separation part are fastened to the periphery of the fastener.

7. The chip heat sink as described in claim 2, characterized in that, The depth of the fixing groove is greater than or equal to 0.5 mm and less than or equal to 3 mm.

8. The chip heat sink as described in claim 1, characterized in that, The chip heat sink also includes a compression unit, one end of which abuts against the end of the fastener away from the bracket, and the other end of the compression unit abuts against the surface of the heat sink away from the bracket.

9. The chip heat sink as described in claim 1, characterized in that, When the chip heat sink is in a loosened state, the plane where the heat sink is located is set at an angle to the plane where the bracket is located.

10. The chip heat sink as described in any one of claims 1 to 9, characterized in that, The number of fasteners is multiple; During the process of the chip heat sink switching from the fixed state to the loosened state, the strokes of multiple fasteners are the same, or the stroke of at least one fastener relative to the bracket is greater than the strokes of other fasteners relative to the bracket.

11. The chip heat sink as described in claim 10, characterized in that, When the travel of one fastener relative to the bracket is greater than the travel of other fasteners relative to the bracket, the fastener with the largest travel is designated as the first fastener, and the other fasteners are designated as the second fasteners. The travel of the first fastener is designated as the first travel, and the travel of the second fastener is designated as the second travel. The difference between the first stroke and the second stroke is greater than or equal to 0.5 mm and less than or equal to 1.5 mm.

12. The chip heat sink as described in any one of claims 1 to 9, characterized in that, The bracket is provided with positioning posts, and the radiator is positioned facing the side of the bracket where the positioning posts are provided. The number of fasteners is the same as the number of positioning posts, and the fasteners are configured to cooperate with the positioning posts.

13. The chip heat sink as described in claim 12, characterized in that, The fastener and the bracket are threaded together; When the travel of one fastener relative to the bracket is greater than the travel of the other fasteners relative to the bracket, the fastener with the largest travel is designated as the first fastener, and the other fasteners are designated as the second fasteners. The positioning post adapted to the first fastener is used as the first positioning post, and the positioning post adapted to the second fastener is used as the second positioning post. When the chip heat sink is in a fixed state, and when the first fastener and the second fastener have the same size, the minimum distance between the thread closest to the heat sink in the first positioning post and the plane where the heat sink is located is the first distance; the minimum distance between the thread closest to the heat sink in the second positioning post and the plane where the heat sink is located is the second distance. The second distance is greater than the first distance, and the difference between the two is greater than or equal to 0.5 mm and less than or equal to 1.5 mm.

14. The chip heat sink as described in claim 12, characterized in that, The fastener and the bracket are threaded together; When the travel of one fastener relative to the bracket is greater than the travel of the other fasteners relative to the bracket, the fastener with the largest travel is designated as the first fastener, and the other fasteners are designated as the second fasteners. The positioning post adapted to the first fastener is used as the first positioning post, and the positioning post adapted to the second fastener is used as the second positioning post. When the chip heat sink is in a fixed state, and when the dimensions of the first positioning post and the first positioning post are the same, the minimum distance between the thread closest to the bracket in the first fastener and the plane where the bracket is located is the third distance; the minimum distance between the thread closest to the bracket in the second fastener and the plane where the bracket is located is the fourth distance. The fourth distance is greater than the third distance, and the difference between the two is greater than or equal to 0.5 mm and less than or equal to 1.5 mm.

15. An electronic device, characterized in that, The electronic device includes a chip heat sink as described in any one of claims 1-14.

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