Hot-pressing chip mounting device and wafer chip mounter with same

Abstract

The utility model provides a hot-pressing chip mounting device and a wafer chip mounter with the same, the hot-pressing chip mounting device comprises a base, a lifting sliding seat, a lifting driving mechanism, an air guide rotating main shaft, a rotating driving mechanism, a suction mechanism and a pressure monitoring mechanism, the lifting sliding seat vertically moves on the base, the lifting driving mechanism is arranged on the base, and the suction mechanism is arranged on the air guide rotating main shaft. The lifting sliding seat is in transmission connection with the lifting driving mechanism; the air guide rotating main shaft is pivoted to the lifting sliding seat, and a through first air guide channel is formed in the air guide rotating main shaft; the rotary driving mechanism is arranged on the base, and the air guide rotating main shaft is in transmission connection with the rotary driving mechanism; the suction mechanism is elastically arranged at the lower end of the air guide rotating main shaft in a floating manner, and the suction mechanism is inserted into the lower end of the first air guide channel; the pressure monitoring mechanism is arranged on the lifting sliding base, the detection end of the pressure monitoring mechanism abuts against the suction mechanism, and the pressure monitoring mechanism is electrically connected to the lifting driving mechanism.

Description

Technical Field

[0001] This application relates to the technical field of wafer mounting, and more particularly to a hot press mounting apparatus and a wafer mounting machine having the apparatus. Background Technology

[0002] A wafer mounter is a device used to achieve high-speed, high-precision placement of components. Currently, the actual working process of existing wafer mounters is as follows: The XY-axis platform of the wafer mounter drives the ZR-axis nozzle mechanism to move above the wafer disk in the XY-axis direction. Then, the ZR-axis nozzle mechanism drives the nozzle to descend onto the wafer disk to pick up the wafer. Next, the XY-Z axes carry the ZR-axis nozzle mechanism and the wafer picked up by the nozzle to the CCD camera. The CCD camera takes a picture for inspection and sends an angle position signal to the rotary motor on the ZR-axis to correct the angle of the wafer on the nozzle in the XY-axis direction, aligning the long and short sides of the wafer with the long and short sides of the target placement area on the DBC board. Then, the XY-axis platform drives the ZR-axis nozzle mechanism to move above the target placement area on the DBC board in the XY-axis direction. The motor of the ZR-axis nozzle mechanism then drives the nozzle to descend, controlling the wafer at the nozzle end to descend and be placed onto the target placement area on the DBC board.

[0003] However, existing ZR-axis suction nozzle mechanisms are not only complex in structure and expensive to manufacture, but also rely on controlling the downward stroke of the motor-driven ZR-axis suction nozzle mechanism to control the force applied to the wafer during the wafer bonding process. However, once the PLC program is set, this downward stroke is a fixed value and cannot adapt to changes in the height of the bonding plane, the thickness of the DBC board, etc. This leads to excessive force during the suction nozzle descent process, which can crush the precious wafer, resulting in a large number of defective products and greatly increasing production costs.

[0004] Therefore, there is an urgent need for a hot press bonding device and a wafer bonding machine equipped with such a device to overcome the aforementioned problems. Utility Model Content

[0005] The purpose of this application is to provide a hot-press bonding device, which has the advantages of simple structure, low manufacturing cost, and the ability to adaptively adjust the descent stroke during the pressing and bonding process of components to prevent damage to the components.

[0006] Another objective of this application is to provide a wafer placement machine that has the advantages of simple structure, low manufacturing cost, and the ability to adaptively adjust the descent stroke during the pressing and bonding of components to prevent damage to the components.

[0007] To achieve the above objectives, a first aspect of this application provides a hot-press patching device, comprising: a base, a lifting slide, a lifting drive mechanism, an air-guiding rotating main shaft, a rotary drive mechanism, a suction mechanism, and a pressure monitoring mechanism. The lifting slide is vertically movable on the base, the lifting drive mechanism is disposed on the base, and the lifting slide is throttlely connected to the lifting drive mechanism. The air-guiding rotating main shaft is pivotally connected to the lifting slide, and a first through-flow air-guiding channel is formed within the air-guiding rotating main shaft. The rotary drive mechanism is disposed on the base, and the air-guiding rotating main shaft is throttlely connected to the rotary drive mechanism. The suction mechanism is elastically floating at the lower end of the air-guiding rotating main shaft, and the suction mechanism is inserted into the lower end of the first air-guiding channel. The pressure monitoring mechanism is disposed on the lifting slide, the detection end of the pressure monitoring mechanism abuts against the suction mechanism, and the pressure monitoring mechanism is electrically connected to the lifting drive mechanism.

[0008] Optionally, the suction mechanism includes: a floating mounting base and a suction nozzle. The floating mounting base includes a chassis and a connecting tube extending vertically upward from the chassis. A second air guide channel is also formed within the floating mounting base, the second air guide channel passing through the connecting tube and the chassis. The chassis is elastically floating at the lower end of the air guide rotating main shaft, and the connecting tube is inserted into the lower end of the first air guide channel. The suction nozzle is detachably mounted on the bottom of the chassis, and the suction nozzle is sealed and connected to the lower end of the first air guide channel.

[0009] Optionally, the hot-press patch device further includes a heating mechanism, which includes a heater and a temperature sensor. The heater is fixed to the top of the chassis, and the temperature sensor is fixed to the heater.

[0010] Optionally, the heating mechanism further includes: a heat insulation cover and a heat insulation ring, both of which are fixed to the top of the chassis, and the heater is fixed between the heat insulation cover and the bottom of the chassis, with the heat insulation cover installed inside the heat insulation ring.

[0011] Optionally, the hot-press patching device further includes: a conductive slip ring, the stator of which is fixed on the lifting slide, and the rotor of which is fixedly sleeved on the air-guiding rotating main shaft, wherein the heater and the temperature sensor are both electrically connected to the rotor of the conductive slip ring.

[0012] Optionally, the hot-press patch device further includes: a plurality of connecting bolts and elastic elements corresponding to each connecting bolt; the lower end of the air-guiding rotating main shaft protrudes to form an annular boss; the upper end of the connecting bolt slides through the annular boss; the nut of the connecting bolt abuts against the top of the annular boss; the lower end of the connecting bolt is fixedly connected to the chassis; the connecting bolts are distributed in a ring along the circumference of the air-guiding rotating main shaft; the upper end of the elastic element abuts against the bottom of the annular boss; the lower end of the elastic element abuts against the chassis or the top of the heat insulation cover; the elastic element constantly drives the floating mounting seat to move away from the annular boss.

[0013] Optionally, the pressure monitoring mechanism includes: a plurality of pressure monitoring sensors, the pressure monitoring sensors being vertically fixed on the lifting slide, the detection end of the pressure monitoring sensors being vertically in contact with the chassis, and the pressure monitoring sensors being electrically connected to the lifting drive mechanism.

[0014] Optionally, the hot-press patching device further includes: an air guide shaft, which is slidable in the vertical direction and rotatable in the axial direction on the base, and a vertically penetrating third air guide channel is formed inside the air guide shaft. The lower end of the air guide shaft is fixedly connected to the upper end of the air guide rotating main shaft, and the upper end of the first air guide channel is connected to the lower end of the third air guide channel.

[0015] The rotary drive mechanism includes a rotary driver, a drive pulley, a transmission belt, and a driven pulley. The rotary driver is fixed on the base, the drive pulley is fixedly connected to the rotary driver, the driven pulley is pivotally connected to the base, and the air guide shaft slides through the driven pulley. The transmission belt drives between the drive pulley and the driven pulley.

[0016] Optionally, the hot-press patching device further includes: a first origin sensor, a first trigger, a second origin sensor, a second trigger, a limiting post, and a limiting block. The first origin sensor is fixed on the base, and the first trigger is pivotally connected to the base around the axis of the air-guiding linkage shaft. The first trigger is circumferentially positioned and sleeved on the air-guiding linkage shaft. The air-guiding linkage shaft can drive the first trigger to rotate to the position that triggers the first origin sensor.

[0017] The second origin sensor is fixed on the base, and the second trigger is fixed on the lifting slide. The lifting slide can drive the second trigger to rotate to the position that triggers the second origin sensor.

[0018] The limiting post is vertically fixed to the base, and the limiting block is fixed to the lifting slide. The limiting post is vertically positioned directly opposite the top of the limiting block.

[0019] A second aspect of this application provides a wafer placement machine, wherein the wafer placement machine includes the hot press placement device described in any of the preceding claims.

[0020] Because the lifting slide of the hot-pressing patch device of this application moves vertically on the base, and the lifting drive mechanism is located on the base, with the lifting slide being driven by the lifting drive mechanism; the air guide rotating main shaft is vertically pivotally connected to the lifting slide, and a vertically penetrating first air guide channel is formed inside the air guide rotating main shaft; the rotation drive mechanism is located on the base, with the air guide rotating main shaft being driven by the rotation drive mechanism; the suction mechanism is vertically elastically floating at the lower end of the air guide rotating main shaft, and the suction mechanism is vertically slidably inserted into the lower end of the first air guide channel; the pressure monitoring mechanism is located on the lifting slide, and the detection end of the pressure monitoring mechanism vertically abuts against the suction mechanism. Thus, by connecting the air guide rotating main shaft to the suction mechanism, the suction structure is connected to the external positive and negative pressure air sources, thereby realizing the adsorption mechanism's pick-and-place action on the components. The lifting drive mechanism then drives the lifting slide to move the air guide rotating shaft and the suction mechanism vertically up and down. The rotation drive mechanism also drives the air guide rotating shaft to rotate the suction mechanism. This allows the suction mechanism to move the suctioned components up and down and rotate, thereby achieving rotation and alignment of the components in their length and width directions. This makes the structure of the hot-press bonding device of this application simpler and reduces manufacturing costs. Furthermore, the suction mechanism is vertically and elastically floating at the lower end of the air-guiding rotating main shaft. This prevents rigid collisions between the components sucked up by the suction mechanism and the target bonding area, thus avoiding damage to the components. The pressure monitoring mechanism's detection end is vertically pressed against the suction mechanism. During the downward pressing process of the lifting drive mechanism driving the lifting slide to move the air-guiding rotating main shaft and the suction mechanism, the contact and compression between the detection end of the pressure monitoring mechanism and the suction mechanism allows for real-time monitoring of the pressure exerted on the components as they are pressed and bonded to the target bonding area. This real-time monitoring of the pressure magnitude is converted into an electrical signal and fed back to the lifting drive mechanism. The lifting drive mechanism then controls the lifting stroke of the lifting slide based on the feedback electrical signal, creating a closed loop between the downward pressure of the suction mechanism on the components and the lifting stroke. This allows for controllable adjustment of the downward pressure exerted by the suction nozzle on the components, enabling adaptive adjustment of the descent stroke during component bonding to prevent damage and the generation of defective products, thereby significantly reducing production costs. Since the wafer placement machine of this application has the hot press placement device described above, the wafer placement machine of this application also has the advantages of simple structure, low manufacturing cost, and the ability to adaptively adjust the descent stroke during the pressing and bonding of components to prevent damage to the components. Attached Figure Description

[0021] Figure 1 This is a three-dimensional schematic diagram of one embodiment of the hot-press patch device in this application.

[0022] Figure 2 This is a three-dimensional schematic diagram of a combination of a lifting slide, an air-guiding rotating main shaft, a suction mechanism, a pressure monitoring mechanism, a heating mechanism, a conductive slip ring, connecting bolts, and elastic elements in one embodiment of the hot-press patch device of this application.

[0023] Figure 3 for Figure 2 A schematic diagram of its breakdown.

[0024] Figure 4 This is a three-dimensional schematic diagram of the combination of the rotary drive mechanism, the air guide shaft, and the rotary bushing in one embodiment of the hot-press patch device of this application. Detailed Implementation

[0025] The present application will be further described below with reference to the accompanying drawings and preferred embodiments, but the implementation of the present application is not limited thereto.

[0026] Please see Figures 1 to 4The hot press mounting apparatus 100 of this application is suitable for picking up and mounting components to be mounted onto the target mounting area of ​​a DBC board. The components to be mounted can be wafers, but are not limited thereto. Specifically, the hot press mounting apparatus 100 of this application includes: a base 11, a lifting slide 12, a lifting drive mechanism 13, an air-guiding rotating spindle 14, a rotation drive mechanism 15, a suction mechanism 16, and a pressure monitoring mechanism 17. The lifting slide 12 moves vertically on the base 11, and the lifting drive mechanism 13 is mounted on the base 11. The lifting slide 12 is driveably connected to the lifting drive mechanism 13, thereby driving the lifting slide 12 to move vertically up and down through the lifting drive mechanism 13. The air-guiding rotating main shaft 14 is vertically pivotally connected to the lifting slide 12. That is, the air-guiding rotating main shaft 14 is vertically rotatable on the lifting slide 12 and is fixed in the vertical direction. A vertically penetrating first air-guiding channel 141 is formed within the air-guiding rotating main shaft 14. A rotary drive mechanism 15 is mounted on the base 11, and the air-guiding rotating main shaft 14 is driven by the rotary drive mechanism 15 to rotate. The suction mechanism 16 is vertically elastically floating at the lower end of the air-guiding rotating main shaft 14, and is vertically and slidably inserted into the lower end of the first air-guiding channel 141 in a sealed manner. This not only does not hinder the vertical elastic floating of the suction mechanism 16, but also allows the suction structure to connect with external positive and negative pressure air sources through the first air-guiding channel 141 of the air-guiding rotating main shaft 14, thereby realizing the suction and release of the components to be transferred. A pressure monitoring mechanism 17 is mounted on the lifting slide 12. The detection end of the pressure monitoring mechanism 17 vertically contacts the suction mechanism 16. The pressure monitoring mechanism 17 is electrically connected to the lifting drive mechanism 13 to convert the monitored pressure data into an electrical signal and feed it back to the lifting drive mechanism 13. The lifting drive mechanism 13 then controls the lifting stroke of the lifting slide 12 based on the feedback electrical signal. The air guide rotating shaft 14 is connected to the suction mechanism 16, allowing the suction structure to connect with external positive and negative pressure air sources, thereby enabling the suction mechanism to pick up and place components. The lifting drive mechanism 13 drives the lifting slide 12 to move the air guide rotating shaft 14 and the suction mechanism 16 vertically up and down. The rotation drive mechanism 15 drives the air guide rotating shaft 14 to rotate the suction mechanism 16, enabling the suction mechanism 16 to move the picked-up components up and down and rotate, thus achieving rotation and correction operations in the length and width directions of the components. This makes the structure of the hot-press patch device 100 of this application simpler and reduces manufacturing costs.Furthermore, the suction mechanism 16 is vertically and elastically floating at the lower end of the air-guiding rotating main shaft 14, which can prevent the components sucked by the suction mechanism 16 from rigidly colliding with the target bonding area on the DBC board, thus avoiding damage to the components. Additionally, the detection end of the pressure monitoring mechanism 17 is vertically in contact with the suction mechanism 16. During the process of the lifting drive mechanism 13 driving the lifting slide 12 to move the air-guiding rotating main shaft 14 and the suction mechanism 16 downwards, the contact and compression between the detection end of the pressure monitoring mechanism 17 and the suction mechanism 16 allows for real-time monitoring of the components sucked by the suction mechanism 16 being pressed and bonded to the DBC board. The pressure exerted on the component in the target bonding area is monitored in real time and converted into an electrical signal, which is then fed back to the lifting drive mechanism 13. The lifting drive mechanism 13 then controls the lifting stroke of the lifting slide 12 based on the feedback electrical signal, creating a closed loop between the downward pressure of the suction mechanism 16 on the component and the lifting stroke. This allows the downward pressure exerted by the suction nozzle 162 on the component to be controlled and adjusted, thus enabling adaptive adjustment of the descent stroke during the component bonding process to prevent damage to the component and the generation of defective products, thereby significantly reducing production costs. Specifically, as follows:

[0027] Please see Figures 1 to 3 The suction mechanism 16 includes a floating mounting base 161 and a suction nozzle 162. The floating mounting base 161 includes a chassis 1611 and a connecting tube 1612 extending vertically upward from the chassis 1611. A second air guide channel is also formed within the floating mounting base 161, vertically penetrating the connecting tube 1612 and the chassis 1611. The chassis 1611 is vertically and elastically floating at the lower end of the air guide rotating main shaft 14, and the connecting tube 1612 is vertically and slidably inserted into the lower end of the first air guide channel 141, thereby achieving communication between the first air guide channel 141 and the second air guide channel. The suction nozzle 162 is detachably mounted on the bottom of the chassis 1611, and the suction nozzle 162 is sealed and connected to the lower end of the first air guide channel 141, thus achieving communication between the suction nozzle 162, the second air guide channel, and the first air guide channel 141. In an even better configuration, a high-temperature resistant sealing ring 163 is provided between the connecting tube 1612 and the first air guide channel 141, thereby achieving a sealed connection between the nozzle 162 and the first air guide channel 141 to prevent air leakage. Furthermore, the sealing ring 163 can maintain its sealing function under high-temperature conditions to prevent the sealing effect from failing, resulting in a more reasonable structure.

[0028] Preferably, in this embodiment, the hot-press patch device 100 of this application further includes: a plurality of magnet blocks (not shown in the figure), the magnet blocks being embedded in the bottom of the chassis 1611, and the suction nozzle 162 being made of a magnetically attractable metal material, thereby being attracted and fixed by the magnet blocks, facilitating the installation, disassembly, and replacement of the suction nozzle 162. Of course, the suction nozzle 162 can also be selected from other detachable mounting and disassembly structures mounted on the bottom of the chassis 1611, such as mounting and disassembly structures fastened by bolts, etc., and is not limited thereto. Those skilled in the art can flexibly choose, so it will not be described in detail here.

[0029] Please continue reading. Figures 1 to 3Currently, to ensure components are securely mounted on the target mounting area of ​​a DBC board, a soldering agent such as silver paste is pre-applied to the area. This soldering agent is solid at room temperature and lacks adhesive power, but it melts rapidly upon heating and solidifies quickly after heating stops, allowing the components to be quickly soldered and fixed to the target mounting area on the DBC board. However, current processing methods typically involve the mounting platform, which positions and fixes the DBC boards, first activating a heating system to heat all DBC boards on the platform as a whole. To improve production efficiency, multiple DBC boards are usually mounted on the platform simultaneously, with each DBC board containing various electrical components, both heat-sensitive and heat-sensitive. Throughout the entire surface mount technology (SMT) process, all DBC boards and other mounted electronic components on the SMT platform are under continuous high-temperature heating, which significantly increases the probability of damage to the DBC boards and their components. To overcome this problem, the hot press surface mount device 100 of this application further includes a heating mechanism 18, which includes a heater 181 and a temperature sensor (not shown). The heater 181 is fixedly mounted on the top of the chassis 1611, and the temperature sensor is fixed to the heater 181. The heater 181 heats the chassis 1611, which then conducts heat to the suction nozzle 162. The suction nozzle 162 then conducts heat to the picked-up components, which in turn heat the soldering flux they are in contact with. This allows for the rapid melting of the soldering flux through individual heating, followed by rapid solidification after heating is stopped, thus bonding the components to the target mounting area. Heating is applied only to the components mounted at nozzle 162, eliminating the need for continuous heating of the entire surface mount platform and all DBC boards on it. This avoids damaging the DBC boards and other electronic components due to heat, thus providing excellent protection for the DBC boards and other electronic devices, resulting in a more rational structure. Furthermore, the temperature sensor is fixed to heater 181, with the base 1611 in direct contact with heater 181 and nozzle 162 in direct contact with the base 1611. This allows the temperature sensor to monitor the temperature of nozzle 162. When the temperature of nozzle 162 is lower or higher than the set temperature, it immediately sends feedback to the temperature controller of heater 181. The temperature controller of heater 181 then controls whether heater 181 heats up, maintaining a constant heating temperature for nozzle 162, further enhancing the rational structure.

[0030] In this embodiment, the heater 181 can be a ceramic heating element, which can better fit the heating base 1611 to heat the nozzle 162. Of course, the specific type of heater 181 is not limited to this. Those skilled in the art can flexibly choose other types of heaters 181, so they will not be described in detail here.

[0031] In a preferred embodiment, the heating mechanism 18 further includes a heat insulation cover 182 and a heat insulation ring 183. Both the heat insulation cover 182 and the heat insulation ring 183 are fixed to the top of the chassis 1611, and the heater 181 is fixed between the heat insulation cover 182 and the bottom of the chassis 1611. The heat insulation cover 182 is installed inside the heat insulation ring 183. This isolates the heat emitted from the top and circumference of the heater 181 from the outside environment, preventing surrounding components from overheating and causing damage or affecting their service life, resulting in a more rational structure.

[0032] Furthermore, the hot-press patching device 100 of this application also includes: a conductive slip ring 19, the stator of which is fixed on the lifting slide 12, and the rotor of which is fixedly sleeved on the air-guiding rotating main shaft 14. The heater 181 and the temperature sensor are electrically connected to the rotor terminal of the conductive slip ring 19. This prevents the conductive connection wires of the heater 181 and the temperature sensor at the top of the nozzle 162 from getting tangled or broken due to the continuous rotation of the air-guiding rotating main shaft 14, resulting in a more reasonable structure.

[0033] Please see Figure 3The hot-press patch device 100 of this application further includes: a plurality of connecting bolts 21 and elastic elements 22 corresponding to each connecting bolt 21. An annular boss 142 is formed on the lower end of the air-guiding rotating main shaft 14. The upper end of each connecting bolt 21 slides vertically through the annular boss 142. The nut of the connecting bolt is detachably abutted against the top of the annular boss 142. The lower end of each connecting bolt 21 is fixedly connected to the base 1611. The connecting bolts 21 are distributed annularly along the circumference of the air-guiding rotating main shaft 14. The upper end of each elastic element 22 abuts against the bottom of the annular boss 142, and the lower end of each elastic element 22 abuts against the top of the heat insulation cover 182. Alternatively, in other embodiments, the lower end of each elastic element 22 may abut against the top of the base 1611. The elastic element 22 constantly drives the floating mounting base 161 to move away from the annular boss 142. This allows the floating mounting base 161 to float up and down under the limiting action of the connecting bolts 21. In detail, in this embodiment, the elastic element 22 can be selected as a spring. The spring is movably sleeved on the corresponding connecting bolt 21, and the spring is compressed and abuts against the bottom of the annular boss 142 and the top of the heat insulation cover 182, thereby realizing constant drive to move the floating mounting seat 161 away from the annular boss 142. When the component picked up by the suction nozzle 162 comes into contact with the target bonding area, elastic floating occurs to avoid rigid collision and damage to the component.

[0034] Please see Figures 1 to 3 The pressure monitoring mechanism 17 includes several pressure monitoring sensors 171, which are vertically fixed on the lifting slide 12. The detection end of the pressure monitoring sensor 171 is vertically in contact with the chassis 1611, and the pressure monitoring sensor 171 is electrically connected to the lifting drive mechanism 13. Through the contact and compression between the detection end of the pressure monitoring sensor 171 and the chassis 1611, the pressure on the component when it is pressed down and attached to the target bonding area on the DBC board by the nozzle 162 can be monitored in real time. This allows for real-time monitoring of the pressure magnitude, which is converted into an electrical signal and fed back to the lifting drive mechanism 13. The lifting drive mechanism 13 then controls the lifting stroke of the lifting slide 12 based on the feedback electrical signal, thereby preventing damage to the component.

[0035] Please see Figure 1 and Figure 4The hot-press patch device 100 of this application further includes: a gas guide shaft 23, which is mounted on the base 11 and slides vertically and can rotate axially. A vertically penetrating third gas guide channel 231 is formed inside the gas guide shaft 23. The lower end of the gas guide shaft 23 is fixedly connected to the upper end of the gas guide rotating main shaft 14. The upper end of the first gas guide channel 141 is connected to the lower end of the third gas guide channel 231, so that the gas guide shaft 23 and the gas guide rotating main shaft 14 are fixedly connected. The gas guide shaft 23 and the gas guide rotating main shaft 14 can move vertically up and down synchronously and rotate axially synchronously.

[0036] Alternatively, in this embodiment, the upper end of the air guide shaft 23 is also connected to a universal air connector 233 to facilitate connection with an external air pipe, thereby connecting to a positive and negative pressure air source that provides positive and negative pressure to the suction nozzle 162, and thus realizing the picking and placing of components.

[0037] Furthermore, the rotary drive mechanism 15 includes: a rotary driver 151, a drive pulley 152, a transmission belt 153, and a driven pulley 154. The rotary driver 151 can be a motor, but is not limited to it. The rotary driver 151 is fixed on the base 11. The drive pulley 152 is fixedly connected to the drive end of the rotary driver 151. The driven pulley 154 is pivotally connected to the base 11 around a vertical axis. The air guide shaft 23 is vertically slidably inserted through the driven pulley in a circumferentially positioned manner. Inside the pulley 154, the transmission belt 153 is connected between the driving pulley 152 and the driven pulley 154. The driving pulley 152 is driven to rotate by the rotary driver 151, and then the transmission belt 153 drives the transmission belt 153 pulley and the air guide shaft 23 to rotate synchronously. The air guide shaft 23 then drives the air guide rotating main shaft 14 and the suction nozzle 162 to rotate synchronously, so that the suction nozzle 162 can drive the sucked component to rotate, thereby realizing the rotation and correction operation of the component in the length and width directions.

[0038] In this embodiment, the specific implementation structure of the air guide shaft 23, which slides vertically and can rotate axially on the base 11, can be selected as follows: a rotating bushing 31 is vertically slidably sleeved on the outer sidewall of the air guide shaft 23, a vertically arranged first guide groove 232 is provided on the outer circumferential sidewall of the air guide shaft 23, and a vertically arranged second guide groove (not shown in the figure) is provided on the inner circumferential sidewall of the rotating bushing 31. The first guide groove 232 is directly opposite the second guide groove, and a number of balls (not shown in the figure) are also provided between the first guide groove 232 and the second guide groove, so that the air guide shaft 23 and the rotating bushing 31 are circumferentially positioned and can move vertically relative to each other. The rotating bushing 31 is vertically mounted on the base 11, and the driven pulley 154 is specifically fixedly mounted on the rotating bushing 31. This allows the air guide shaft 23 to slide up and down in the vertical direction and to rotate axially synchronously with the driven pulley 154 and the rotating bushing 31, making the structure simpler and more reasonable.

[0039] Please see Figure 1 The hot-press patch device 100 of this application further includes: a first origin sensor 24, a first trigger 25, a second origin sensor 26, a second trigger 27, a limiting post 28, and a limiting block 29. The first origin sensor 24 can be selected as a photoelectric sensor. The first origin sensor 24 is fixed on the base 11. The first trigger 25 is pivotally connected to the base 11 around the axis of the air guide shaft 23, and the first trigger 25 is circumferentially positioned on the air guide shaft 23, so that the first trigger 25 can rotate synchronously with the air guide shaft 23. The air guide shaft 23 can drive the first trigger 25 to rotate to the position of triggering the first origin sensor 24. Therefore, when the air guide shaft 23 drives the first trigger 25 to rotate to the position that triggers the first origin sensor 24, it can be set as the circumferential origin position of the nozzle 162. By sensing the first trigger 25 through the first origin sensor 24, it is possible to detect whether the nozzle 162 has rotated to the circumferential origin position, making the operation more convenient.

[0040] Furthermore, the second origin sensor 26 can be selected as a photoelectric sensor. The second origin sensor 26 is fixed on the base 11, and the second trigger 27 is fixed on the lifting slide 12. The lifting slide 12 can drive the second trigger 27 to rotate to the position that triggers the second origin sensor 26. When the lifting slide 12 drives the second trigger 27 to rotate to the position that triggers the second origin sensor 26, it can be set as the vertical origin position of the suction nozzle 162. By sensing the second trigger 27 through the second origin sensor 26, it is possible to detect whether the suction nozzle 162 has moved to the vertical origin position, making the operation more convenient.

[0041] Furthermore, the limiting post 28 is vertically fixed to the base 11, and the limiting block 29 is fixed to the lifting slide 12, with the limiting post 28 vertically aligned with the top of the limiting block 29. Through the limiting cooperation between the limiting post 28 and the limiting block 29, the risk of collision damage caused by excessive vertical movement of the lifting slide 12 is prevented, making the structure safer and more reasonable.

[0042] For example, in this embodiment, the lifting drive mechanism 13 can be selected as a motor-controlled screw drive lifting mechanism to drive the lifting slide 12 to move vertically up and down, thereby driving the suction nozzle 162 and the components to move up and down. Of course, the specific implementation structure of the lifting drive mechanism 13 is not limited to this, and those skilled in the art can choose flexibly, so it will not be described in detail here.

[0043] The working principle of the hot-press patch device 100 of this application will be described in detail with reference to the accompanying drawings:

[0044] The suction nozzle 162 is connected to external positive and negative pressure air sources via the air guide rotating shaft 14 and the air guide connecting shaft 23, thereby enabling the suction and release of components by the suction nozzle 162. The lifting drive mechanism 13 drives the lifting slide 12 to move the air guide rotating shaft 14 and the suction nozzle 162 vertically up and down, and the selector driver drives the air guide connecting shaft 23 to rotate the air guide rotating shaft 14 and the suction nozzle 162, thus enabling the suction nozzle 162 to move and rotate the sucked components, achieving rotation and correction operations in the length and width directions of the components. Through the contact and compression between the detection end of the pressure monitoring sensor 171 and the chassis 1611, the pressure on the components sucked by the suction nozzle 162 when pressed against the target bonding area on the DBC board can be monitored in real time. This allows for real-time monitoring of the pressure magnitude, which is converted into an electrical signal and fed back to the lifting drive mechanism 13. The lifting drive mechanism 13 then controls the lifting stroke of the lifting slide 12 based on the feedback electrical signal, thereby preventing damage to the components. Heater 181 heats the chassis 1611, which then conducts heat to the nozzle 162. The nozzle 162 then conducts heat to the component being picked up, which in turn heats the soldering flux it contacts. This allows the soldering flux to melt rapidly and solidify quickly after heating stops, ensuring the component is soldered and bonded to the target mounting area. Furthermore, a temperature sensor is fixed to the heater 181, with the chassis 1611 in direct contact and the nozzle 162 in direct contact with the chassis 1611. The temperature sensor monitors the temperature of the nozzle 162, and when it falls below or exceeds a set temperature, it immediately sends feedback to the temperature controller of the heater 181. The temperature controller then controls whether the heater 181 heats, maintaining a constant heating temperature for the nozzle 162.

[0045] For example, in this embodiment, the hot press mounting device 100 of this application can be applied within a wafer mounter (not shown in the figure). That is, the component to be mounted on the target mounting area of ​​the DBC board is selected as a wafer, thereby realizing the step of mounting the component to be mounted onto the target mounting area of ​​the DBC board within the wafer mounter of this application. Of course, the specific application of the hot press mounting device 100 of this application is not limited to this, and those skilled in the art can flexibly choose, so it will not be described in detail here.

[0046] Since the lifting slide 12 of the hot press patch device 100 of this application moves vertically on the base 11, the lifting drive mechanism 13 is provided on the base 11, and the lifting slide 12 is drivenly connected to the lifting drive mechanism 13; the air guide rotating main shaft 14 is vertically pivotally connected to the lifting slide 12, and a vertically penetrating first air guide channel 141 is formed inside the air guide rotating main shaft 14; the rotation drive mechanism 15 is provided on the base 11, and the air guide rotating main shaft 14 is drivenly connected to the rotation drive mechanism 15; the suction mechanism 16 is vertically elastically floating at the lower end of the air guide rotating main shaft 14, and the suction mechanism 16 is vertically slidably inserted into the lower end of the first air guide channel 141 in a closed manner; the pressure monitoring mechanism 17 is provided on the lifting slide 12, and the detection end of the pressure monitoring mechanism 17 vertically abuts against the suction mechanism 16. The air-guiding rotating main shaft 14 is connected to the suction mechanism 16, allowing the suction structure to connect with external positive and negative pressure air sources, thereby enabling the suction mechanism to pick up and place components. The lifting drive mechanism 13 drives the lifting slide 12 to move the air-guiding rotating main shaft 14 and the suction mechanism 16 vertically up and down, and the rotation drive mechanism 15 drives the air-guiding rotating main shaft 14 to rotate the suction mechanism 16. This allows the suction mechanism 16 to move the picked-up components up and down and rotate, thus achieving rotation and correction operations in the length and width directions of the components. This makes the structure of the hot-press patch device 100 of this application simpler and reduces manufacturing costs. Furthermore, the suction mechanism 16 is vertically and elastically floating at the lower end of the air-guiding rotating main shaft 14, which can prevent the components sucked by the suction mechanism 16 from rigidly colliding with the target bonding area and avoid damaging the components. Additionally, the detection end of the pressure monitoring mechanism 17 is vertically in contact with the suction mechanism 16. During the process of the lifting drive mechanism 13 driving the lifting slide 12 to move the air-guiding rotating main shaft 14 and the suction mechanism 16 downwards, the contact and compression between the detection end of the pressure monitoring mechanism 17 and the suction mechanism 16 allows for real-time monitoring of the components sucked by the suction mechanism 16 being pressed and bonded to the target bonding area. The pressure exerted on the components in the zone is monitored in real time and converted into an electrical signal, which is then fed back to the lifting drive mechanism 13. The lifting drive mechanism 13 then controls the lifting stroke of the lifting slide 12 based on the feedback electrical signal, forming a closed loop between the downward pressure of the suction mechanism 16 on the components and the lifting stroke. This allows the downward pressure exerted by the suction nozzle 162 on the components to be controlled and adjusted, thereby enabling adaptive adjustment of the descent stroke during the component bonding process to prevent damage to the components and thus prevent the generation of defective products, significantly reducing production costs. Since the wafer mounter of this application has the aforementioned hot press mounting device 100, the wafer mounter of this application also has the advantages of simple structure, low manufacturing cost, and adaptive adjustment of the descent stroke during the component bonding process to prevent damage to the components.

[0047] The present application has been described above with reference to the embodiments, but the present application is not limited to the embodiments disclosed above, but should cover various modifications and equivalent combinations made in accordance with the nature of the present application.

Claims

1. A hot-press patch applicator, characterized in that, include: The system comprises a base, a lifting slide, a lifting drive mechanism, an air-guiding rotating main shaft, a rotary drive mechanism, a suction mechanism, and a pressure monitoring mechanism. The lifting slide moves vertically on the base. The lifting drive mechanism is mounted on the base, and the lifting slide is driven to the lifting drive mechanism. The air-guiding rotating main shaft is pivotally connected to the lifting slide, and a first through-flow air-guiding channel is formed within the air-guiding rotating main shaft. The rotary drive mechanism is mounted on the base, and the air-guiding rotating main shaft is driven to the rotary drive mechanism. The suction mechanism is elastically floating at the lower end of the air-guiding rotating main shaft, and the suction mechanism is inserted into the lower end of the first air-guiding channel. The pressure monitoring mechanism is mounted on the lifting slide, and its detection end abuts against the suction mechanism. The pressure monitoring mechanism is electrically connected to the lifting drive mechanism.

2. The hot-press patch device as described in claim 1, characterized in that, The suction mechanism includes a floating mounting base and a suction nozzle. The floating mounting base includes a chassis and a connecting tube extending vertically upward from the chassis. A second air guide channel is also formed inside the floating mounting base, and the second air guide channel passes through the connecting tube and the chassis. The chassis is elastically floating at the lower end of the air guide rotating main shaft, and the connecting tube is inserted into the lower end of the first air guide channel. The suction nozzle is detachably mounted on the bottom of the chassis, and the suction nozzle is sealed and connected to the lower end of the first air guide channel.

3. The hot-press patch device as described in claim 2, characterized in that, Also includes: A heating mechanism, comprising a heater and a temperature sensor, wherein the heater is fixed to the top of the chassis and the temperature sensor is fixed to the heater.

4. The hot-press patch device as described in claim 3, characterized in that, The heating mechanism further includes a heat insulation cover and a heat insulation ring, both of which are fixed to the top of the chassis, and the heater is fixed between the heat insulation cover and the bottom of the chassis, with the heat insulation cover installed inside the heat insulation ring.

5. The hot-press patch device as described in claim 4, characterized in that, It also includes: a conductive slip ring, the stator of which is fixed on the lifting slide, and the rotor of which is fixedly sleeved on the air guide rotating main shaft, and the heater and the temperature sensor are both electrically connected to the rotor of the conductive slip ring.

6. The hot-press patch applicator as described in claim 4, characterized in that, Also includes: The system includes several connecting bolts and corresponding elastic elements. The lower end of the air-guiding rotating main shaft protrudes to form an annular boss. The upper end of each connecting bolt slides through the annular boss. The nut of the connecting bolt abuts against the top of the annular boss. The lower end of each connecting bolt is fixedly connected to the chassis. The connecting bolts are distributed in a ring along the circumference of the air-guiding rotating main shaft. The upper end of each elastic element abuts against the bottom of the annular boss, and the lower end of each elastic element abuts against the top of the chassis or the heat insulation cover. The elastic element constantly drives the floating mounting base to move away from the annular boss.

7. The hot-press patch applicator as described in claim 2, characterized in that, The pressure monitoring mechanism includes: a plurality of pressure monitoring sensors, which are vertically fixed on the lifting slide, with the detection end of the pressure monitoring sensor vertically abutting the chassis, and the pressure monitoring sensor electrically connected to the lifting drive mechanism.

8. The hot-press patch applicator as described in claim 1, characterized in that, Also includes: An air guide shaft is mounted on the base and is slidable in the vertical direction and rotatable in the axial direction. A third air guide channel is formed inside the air guide shaft. The lower end of the air guide shaft is fixedly connected to the upper end of the air guide rotating main shaft. The upper end of the first air guide channel is connected to the lower end of the third air guide channel. The rotary drive mechanism includes a rotary driver, a drive pulley, a transmission belt, and a driven pulley. The rotary driver is fixed on the base, the drive pulley is fixedly connected to the rotary driver, the driven pulley is pivotally connected to the base, and the air guide shaft slides through the driven pulley. The transmission belt drives between the drive pulley and the driven pulley.

9. The hot-press patch applicator as described in claim 8, characterized in that, Also includes: The system comprises a first origin sensor, a first trigger, a second origin sensor, a second trigger, a limiting post, and a limiting block. The first origin sensor is fixed on the base. The first trigger is pivotally connected to the base around the axis of the air guide shaft, and the first trigger is circumferentially positioned on the air guide shaft. The air guide shaft can drive the first trigger to rotate to the position that triggers the first origin sensor. The second origin sensor is fixed on the base, and the second trigger is fixed on the lifting slide. The lifting slide can drive the second trigger to rotate to the position that triggers the second origin sensor. The limiting post is vertically fixed to the base, and the limiting block is fixed to the lifting slide. The limiting post is vertically positioned directly opposite the top of the limiting block.

10. A wafer placement machine, characterized in that, The wafer mounter includes the hot press mounter as described in any one of claims 1 to 9.

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