Package substrate capable of preventing chip from being broken

Abstract

The utility model discloses a packaging substrate for preventing chip fracture, which comprises a substrate main body, a semiconductor chip, a golden finger, a circuit module and a reinforcing assembly, the semiconductor chip and the golden finger are respectively welded at the upper end and the lower end of the substrate main body, the circuit module is arranged on the periphery of the golden finger, and the reinforcing assembly is arranged on the substrate main body. The golden finger is connected with the semiconductor chip through the circuit module, and the reinforcing assembly is arranged at the edge of the golden finger. According to the packaging substrate provided by the utility model, a bonding pad compensation mode is adopted, so that the reduction of structural rigidity, the damage to linear shearing force and the dispersion of acting points at high temperature are reduced, and the fracture and dark crack of the semiconductor chip are avoided or reduced.

Description

TECHNICAL FIELD

[0001] The utility model relates to chip packaging technical field, concretely relates to a kind of packaging substrates for preventing chip breakage. BACKGROUND

[0002] The surface of the packaging substrate of prior art is composed of circuit and pad, the circuit is covered by solder resist ink, and the pad is exposed (commonly known as solder resist windowing). The position covered by solder resist ink has height difference with the pad. When plastic packaging, the substrate is in high temperature environment, the rigidity of the ink decreases, and the position covered by solder resist ink is extruded due to the height difference with the pad under the pressure of glue injection and mold, causing the semiconductor chip on the top surface to be subjected to shearing force and break or crack.

[0003] Therefore, it is necessary to provide a packaging substrate for preventing chip breakage to solve the above problems. SUMMARY

[0004] In order to overcome the shortcomings of the prior art, the utility model provides a packaging substrate for preventing chip breakage, which adopts a pad compensation method to reduce the decrease in structural rigidity at high temperatures, destroy straight-line shearing force, disperse force points, and avoid or reduce the breakage and cracking of semiconductor chips.

[0005] The utility model solves the technical problems by adopting the following technical scheme:

[0006] A packaging substrate for preventing chip breakage includes a substrate main body, a semiconductor chip, a gold finger, a circuit module, and a reinforcement assembly. The semiconductor chip and the gold finger are respectively soldered to the upper end and the lower end of the substrate main body. The circuit module is arranged around the gold finger, and the gold finger is connected to the semiconductor chip through the circuit module. The reinforcement assembly is arranged at the edge of the gold finger.

[0007] As a further improvement of the above technical solution, the gold finger is provided with a plurality of gold fingers, and the plurality of gold fingers are uniformly and spacedly arranged.

[0008] As a further improvement of the above technical solution, the circuit module is provided with a plurality of circuit modules, and the plurality of circuit modules are inclined based on the gold finger.

[0009] As a further improvement of the above technical solution, the lower end of the substrate main body is provided with a solder resist ink layer, and the solder resist ink layer is arranged outside the gold finger and the circuit module.

[0010] As a further improvement of the above technical solution, the solder resist ink layer is provided with a solder resist ink window, and the solder resist ink window is used to expose the gold finger outside the solder resist ink layer.

[0011] As a further improvement of the above technical solution, the gold finger and the circuit module are made of copper or gold.

[0012] As a further improvement of the above technical solution, the reinforcing assembly is arranged as a plurality of curved copper cladding, and the plurality of curved copper cladding is arranged around the gold finger.

[0013] As a further improvement of the above technical solution, the reinforcing assembly is arranged as a transverse copper cladding, and the transverse copper cladding is arranged at the outer end of the gold finger.

[0014] The beneficial effects of the present application are as follows:

[0015] The present application adopts the solder pad compensation mode to avoid forming a straight line, reduce the rigidity drop under high temperature, damage the straight line shear force, disperse the force point, avoid or reduce the rupture and hidden crack of the semiconductor chip, adjust the wiring angle of the circuit module, avoid using the gold finger with the same direction as the straight line characteristics, further damage the straight line shear force, and also retain the standard solder resist ink window, without affecting the appearance and function. BRIEF DESCRIPTION OF DRAWINGS

[0016] The present application will be further described below in combination with the drawings and examples.

[0017] Fig. 1 is a side view structure diagram of the packaging substrate of the present application;

[0018] Fig. 2 is a structure schematic diagram of the first embodiment of the present application;

[0019] Fig. 3 is a structure schematic diagram of the second embodiment of the present application.

[0020] Reference signs: 1, substrate main body; 2, semiconductor chip; 3, gold finger; 4, circuit module; 5, reinforcing assembly; 6, solder resist ink; 7, solder resist ink window. DETAILED DESCRIPTION

[0021] The utility model discloses a concept, specific structure and the technical effect produced of the utility model will be clearly and completely described in the following combining with the embodiment and the drawing, to fully understand the purpose, features and effects of the utility model. Obviously, the described embodiment is only a part of the embodiment of the utility model, and not all embodiments, based on the embodiment of the utility model, other embodiments obtained by the person skilled in the art without creative labor all belong to the protection scope of the utility model. In addition, all the connection / connection relations involved in the patent are not single component direct interface, but can be composed of better connection structure by adding or reducing connection auxiliary parts according to the specific implementation situation, for example, fixed connection / fixed installation can be selected according to the need screw connection, bolt connection, pin connection, key connection, bonding, mortise and tenon connection, welding, riveting and the like, for example, detachable connection can be selected according to the need screw connection, bolt connection, threaded connection, buckle connection, mortise and tenon connection, magic tape connection and the like. The various technical features in the utility model creation can be interactively combined under the premise of not mutually contradictory conflict.

[0022] Reference Figs. 1 to 3 A packaging substrate for preventing chip cracking, comprising a substrate body 1, a semiconductor chip 2, a golden finger 3, a circuit module 4 and a reinforcing assembly 5, wherein the semiconductor chip 2 is welded on the upper end of the substrate body 1 due to the large size of the semiconductor chip 2, the golden finger 2, the circuit module 4 and the reinforcing assembly 5 are welded on the lower end of the substrate body, the circuit module 4 is arranged at the periphery of the golden finger 3, and the golden finger 3 is connected with the semiconductor chip 2 through the circuit module 4, so as to ensure the structural integrity of the substrate and enable normal use, and the reinforcing assembly 5 is arranged at the edge of the golden finger 3, so as to disperse the linear shear force suffered by the semiconductor chip 2 and the golden finger 3 and destroy the linear force, thereby avoiding or reducing the cracking and dark cracking of the semiconductor chip during packaging.

[0023] Specifically, the golden finger 3 is provided in plurality, and the plurality of golden fingers 3 are uniformly and spacedly arranged, so that the connection is more firm and the signal transmission is more stable.

[0024] Specifically, the circuit module 4 is provided in plurality, and the plurality of circuit modules 4 are all arranged obliquely based on the golden finger 3, so that, except for the upper and lower overlapping area of the edge of the semiconductor chip 2 and the front end of the golden finger 3 with linear characteristics, the wiring of the other circuit modules 4 also partially overlaps with the golden finger 4 with linear characteristics, the wiring adjustment angle of the area avoids using the same direction wiring as the golden finger 3 with linear characteristics, so as to disperse the linear force.

[0025] Specifically, the lower end of the substrate body 1 is provided with a solder resist ink layer 6, and the solder resist ink layer 6 is arranged outside the gold finger 3 and the circuit module 4, so that the gold finger 3 and the circuit module 4 are more firmly connected on the substrate body 1, the solder resist ink layer 6 is provided with a solder resist ink window 7, the solder resist ink window 7 exposes the gold finger 3 outside the solder resist ink layer 6, forms a contact end of the substrate, and is connected with other devices.

[0026] Specifically, the gold finger 3 and the circuit module 4 are both made of copper or gold material, and the rigidity change is small in a high-temperature environment, and the deformation of high-temperature injection molding is also greatly reduced.

[0027] Embodiment one

[0028] With reference to Fig. 2 The reinforcing assembly 5 is arranged as a plurality of curved copper cladding pieces, and the plurality of curved copper cladding pieces are arranged around the gold finger 3. The curved copper cladding pieces in "S" shape or "arch" shape form compensation for the gold finger pad, so that the straight line characteristic gold finger pad and the copper cladding cannot form a large straight line, thereby reducing the problem of cracking during packaging; copper and gold material can also be used to replace part of the solder resist ink 6, thereby indirectly reducing the thickness; and the "S" shape structure can disperse the stress compared with the straight line structure, and damage the straight line shear force. The solder resist ink window 7 remains the original straight line, and does not affect the appearance and function of the product, and the "S" shape copper pad partially covers the solder resist ink, which is equivalent to directly reducing the thickness of the solder resist ink.

[0029] Embodiment two

[0030] With reference to Fig. 3 The reinforcing assembly 5 is arranged as a horizontal copper cladding, and the horizontal copper cladding is arranged at the outer end of the gold finger 3. The edge of the semiconductor chip 2 overlaps the front end of the straight line characteristic gold finger 3 up and down, and this structure is more prone to shear force, and the closer to the edge, the greater the risk. Due to the size of the semiconductor chip 2 and other reasons, the position cannot be moved to avoid overlapping, and the top layer of the straight line characteristic gold finger 3 adopts horizontal copper cladding to cover the overlapping area, and the horizontal copper cladding and the straight line characteristic gold finger 3 form an interlaced relationship, not only to damage the shear force, but also to play a role in isolation and buffering between the semiconductor chip 2 and the straight line characteristic gold finger 3, thereby avoiding the problems of cracking and dark cracking of the semiconductor chip 2 during packaging.

[0031] The above is a specific description of the preferred embodiment of the utility model, but the utility model creation is not limited to the embodiments, and those skilled in the art can make various equivalent modifications or replacements without departing from the spirit of the utility model, and these equivalent modifications or replacements are all included in the range defined by the claims of the present application.

Claims

1. A packaging substrate for preventing chip breakage, characterized in that: The device includes a substrate body, a semiconductor chip, gold fingers, a circuit module, and a reinforcement component. The semiconductor chip and gold fingers are respectively soldered to the upper and lower ends of the substrate body. The circuit module is disposed around the gold fingers, and the gold fingers are connected to the semiconductor chip through the circuit module. The reinforcement component is disposed at the edge of the gold fingers.

2. The packaging substrate for preventing chip breakage according to claim 1, characterized in that: The gold fingers are provided in multiple ways, and the multiple gold fingers are evenly spaced apart.

3. The packaging substrate for preventing chip breakage according to claim 1, characterized in that: The circuit module is provided in multiple ways, and all multiple circuit modules are tilted based on the gold finger.

4. The packaging substrate for preventing chip breakage according to claim 1, characterized in that: A solder resist ink layer is provided at the lower end of the substrate body, and the solder resist ink layer is disposed on the outside of the gold fingers and circuit modules.

5. A packaging substrate for preventing chip breakage according to claim 4, characterized in that: The solder resist ink layer is provided with solder resist ink windows, which are used to expose the gold fingers on the outside of the solder resist ink layer.

6. The packaging substrate for preventing chip breakage according to claim 1, characterized in that: The gold fingers and circuit modules are all made of copper or gold.

7. The packaging substrate for preventing chip breakage according to claim 1, characterized in that: The reinforcement component is configured as multiple bent copper-clad parts, and the multiple bent copper-clad parts are disposed around the gold finger.

8. The packaging substrate for preventing chip breakage according to claim 1, characterized in that: The reinforcement component is configured with lateral copper plating, which is located at the outer end of the gold finger.

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