Air fryer

By incorporating circuit board mounting brackets and baffle structures within the air fryer, the airflow residence time is extended and motor heat is isolated, thus solving the problem of poor circuit board heat dissipation, improving circuit board lifespan, and reducing manufacturing costs.

CN223516183UActive Publication Date: 2025-11-07HONGYANG HOME APPLIANCES
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Patent Information

Application Number
CN202422809125.0
Authority / Receiving Office
CN · China
Patent Type
Utility models(China)
Current Assignee / Owner
Filing Date
2024-11-18
Publication Date
2025-11-07
Estimated Expiration
2034-11-18

AI Technical Summary

Technical Problem

In existing air fryers, the circuit board has poor heat dissipation, which leads to abnormal electrical control and reduced lifespan of the entire machine. At the same time, the lack of heat insulation between the circuit board and the motor affects the heat dissipation effect and increases manufacturing costs.

Method used

A circuit board mounting bracket, including a first baffle and a second baffle, is installed in the air fryer to extend the residence time of airflow on the circuit board and isolate the motor from the circuit board, and to effectively dissipate heat through a cooling fan.

Benefits of technology

It improves the heat dissipation of the circuit board, extends its service life, reduces the temperature resistance requirements of the circuit board, and lowers the manufacturing cost.

✦ Generated by Eureka AI based on patent content.

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Abstract

The utility model relates to the technical field of kitchen appliances, in particular to an air fryer which comprises a shell, a top cover and a reflecting cover, a top plate is arranged at the top of the shell, a motor and a cooling fan driven by the motor are arranged in a containing space formed between the top plate and the reflecting cover, and a ventilation opening is formed in the top plate. A circuit board installation support used for containing a circuit board and provided with an opening in the upper end is arranged in the containing space, located under the ventilation opening and comprises a first baffle extending vertically, the first baffle is located between the motor and the circuit board, and the upper end of the first baffle extends to the top plate. The ventilation opening is located in the side, facing the circuit board, of the first baffle, and air flowing in through the ventilation opening bypasses the first baffle and then flows to the cooling fan. According to the invention, through the first baffle plate, air firstly enters the circuit board mounting bracket to dissipate heat of the circuit board in the circuit board mounting bracket and then flows to the heat dissipation fan, so that the air continuously passes through the circuit board, and the heat dissipation effect on the circuit board is improved.
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Description

Technical Field

[0001] This application relates to the field of kitchen appliance technology, and more particularly to an air fryer. Background Technology

[0002] An air fryer is a cooking appliance that uses air to "fry" food. It primarily utilizes high-speed air circulation, where air replaces the hot oil in a frying pan to cook the food. Simultaneously, the hot air removes surface moisture, achieving a similar effect to deep-frying. Currently, the circuit board in most air fryers is located in the main unit, resulting in generally high temperatures for the components on the board during operation. The components themselves also generate heat, and if heat cannot be dissipated effectively, it can lead to electrical control malfunctions and reduced lifespan of the entire appliance. Furthermore, to prevent the circuit board from overheating, air fryers typically limit their maximum operating temperature to below 200℃, which affects cooking speed and results.

[0003] To address the aforementioned issues, prior art CN202321675838.1 discloses an air fryer with a circuit board mounting bracket. The bracket is positioned between the air inlet and outlet, near the side wall of the housing where the outlet is located. The mounting bracket includes a heat dissipation space, allowing cold air to enter the housing through the air inlet, flow through the heat dissipation space, carry away heat from the circuit board components, and then exit through the outlet, thus forming the shortest possible heat dissipation path for the circuit board. However, this structure has the following problems: 1) The heat dissipation space of the mounting bracket is a straight-through structure. Air entering through the air inlet flows rapidly into the heat dissipation space without any obstruction before exiting through the outlet. This results in a short airflow path within the heat dissipation space and a short residence time of the air at the circuit board, leading to poor heat dissipation. 2) The circuit board and motor ( Figure 3 The lack of heat insulation components between the middle section (the cross-sectional section) means that the heat generated during motor operation is directly transferred to the circuit board. This weakens the heat dissipation effect of the air flowing into the heat dissipation space and also reduces the lifespan of the circuit board, making it less heat-resistant. This necessitates the use of circuit board components with higher temperature resistance, increasing the manufacturing cost of the circuit board and the entire machine. Utility Model Content

[0004] This application provides an air fryer that effectively solves the technical problem of poor heat dissipation of the circuit board caused by the short residence time of airflow on the circuit board in existing air fryers.

[0005] The application provides an air fryer, which comprises a shell and a top cover connected above the shell, a reflecting cover is arranged in the shell, a top plate is arranged at the top of the shell, a containing space is formed between the top plate and the reflecting cover, a motor and a heat dissipation fan driven by the motor are arranged in the containing space, a gap is arranged between the top plate and the top cover, a vent is arranged on the top plate, air enters the vent through the gap, and flows to the heat dissipation fan,

[0006] A circuit board mounting bracket for accommodating a circuit board and open at the upper end is arranged in the containing space, the circuit board mounting bracket is located directly below the vent, the circuit board mounting bracket comprises a first baffle extending vertically, the first baffle is located between the motor and the circuit board and extends to the top plate at the upper end, the vent is located on the side of the first baffle facing the circuit board, and the air flowing in through the vent flows to the heat dissipation fan after bypassing the first baffle.

[0007] The application is arranged directly below the vent through the circuit board mounting bracket, and the circuit board mounting bracket comprises the first baffle located between the motor and the circuit board, air entering the vent through the gap bypasses the first baffle and then flows to the heat dissipation fan. Through the arrangement of the first baffle, on the one hand, the air is blocked, so that the air first enters the circuit board mounting bracket to heat the circuit board inside and then flows to the heat dissipation fan, and the arrangement of the first baffle can prolong the circulation path of the air and prolong the time of the air staying on the circuit board, thereby effectively solving the problem that the heat dissipation effect of the circuit board is poor due to the short time of the air flow on the circuit board in the existing air fryer; on the other hand, the first baffle isolates the motor and the circuit board, which can effectively solve the problem that the heat generated during the operation of the motor is transferred to the circuit board and affects the heat dissipation of the circuit board due to the absence of a heat insulation component between the motor and the circuit board. Moreover, through the above structure, the service life of the circuit board is improved, the temperature resistance requirement of the circuit board is reduced, and a circuit board with higher temperature resistance does not need to be configured, thereby reducing the manufacturing cost of the circuit board and the whole machine.

[0008] As a preferred technical solution, the circuit board mounting bracket further comprises a second baffle extending vertically and located adjacent to one side of the first baffle, and the second baffle is arranged close to the air inlet of the gap.

[0009] In order to avoid the problem that the heat dissipation effect of the circuit board is poor due to the small amount of air flowing through the circuit board, the second baffle close to the air inlet is arranged, so that the air entering through the air inlet does not directly flow to the heat dissipation fan from the position adjacent to the air inlet, thereby ensuring that the air bypassing the first baffle and the second baffle can flow through the circuit board, heat the circuit board and then flow to the heat dissipation fan, further prolonging the circulation path of the air, improving the heat dissipation air volume flowing through the circuit board, and achieving better heat dissipation effect.

[0010] As a preferred technical solution, the circuit board mounting bracket has a first air outlet, and the first air outlet is arranged opposite to the air inlet.

[0011] The first air outlet is arranged opposite to the air inlet, so that the air flow direction in the circuit board mounting bracket is from the air inlet to the air outlet, thereby ensuring that the air can flow to the heat dissipation fan through the circuit board after bypassing the first baffle. Moreover, the first air outlet is arranged opposite to the air inlet, which prolongs the air flow path in the circuit board mounting bracket, thereby prolonging the heat dissipation time of the circuit board and improving the heat dissipation effect.

[0012] As a preferred technical solution, the circuit board mounting bracket has a first side wall opposite to the second baffle, and a notch is formed downward at the top of the first side wall, and the notch constitutes the first air outlet.

[0013] As a preferred technical solution, the circuit board mounting bracket further comprises a second air outlet opposite to the first baffle.

[0014] By arranging the second air outlet, the second air outlet is arranged opposite to the first baffle, so that the air entering the circuit board mounting bracket flows out of the circuit board mounting bracket from two directions, thereby enabling the air to fully contact the circuit board to dissipate heat from the circuit board.

[0015] As a preferred technical solution, the circuit board mounting bracket further comprises a second side wall opposite to the first baffle, and the second air outlet is arranged on the second side wall, and an air duct is formed between the second side wall and the shell, and the air flowing out of the second air outlet flows to the heat dissipation fan through the air duct.

[0016] As a preferred technical solution, the circuit board mounting bracket is mounted on the reflector;

[0017] Alternatively, the air fryer further comprises a motor bracket above the reflector, and the circuit board mounting bracket is mounted on the motor bracket.

[0018] Alternatively, the circuit board mounting bracket is integrally formed with the top plate.

[0019] As a preferred technical solution, the top plate is provided with a through communication port, the communication port is located on the side of the first baffle facing the motor, and the communication port communicates the gap and the accommodation space.

[0020] By arranging the communication port, in addition to part of the air entering the circuit board mounting bracket to dissipate heat from the circuit board, another part of the air can directly enter the accommodation space through the communication port to rapidly dissipate heat from the motor and other elements.

[0021] Preferably, the communication port and the ventilation port are arranged on two sides of the central axis of the heat dissipation fan.

[0022] Preferably, the top plate edge is provided with a plurality of spaced apart rib plates, and adjacent two rib plates and the top cover form an air inlet therebetween, and air enters the gap through the air inlet. BRIEF DESCRIPTION OF DRAWINGS

[0023] The accompanying drawings, which are incorporated herein and constitute part of the specification, illustrate embodiments consistent with the application and, together with the description, serve to explain the principles of the application.

[0024] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the drawings required to be used in the embodiments or prior art description will be briefly introduced below. Obviously, for those skilled in the art, other drawings can also be obtained based on these drawings without creative labor.

[0025] Figure 1 A perspective view of an air fryer (without a top cover) according to an embodiment of the present application;

[0026] Figure 2 An exploded view of an air fryer according to an embodiment of the present application;

[0027] Figure 3 A semi-sectional view of an air fryer according to an embodiment of the present application, showing air flow direction;

[0028] Figure 4 A structural view of a circuit board mounting bracket of an air fryer according to an embodiment of the present application;

[0029] Figure 5 An enlarged view of A according to an embodiment of the present application. Figure 3

[0030] Among them:

[0031] 1, housing; 11, top plate; 111, communication port; 112, ventilation port; 12, rib plate; 2, top cover; 3, reflector; 4, heat dissipation fan; 5, circuit board; 6, circuit board mounting bracket; 61, first baffle; 62, first air outlet; 63, second baffle; 64, second air outlet; 65, mounting groove; 7, motor; 8, pot body; 9, motor support; 91, heat dissipation fan communication hole. DETAILED DESCRIPTION

[0032] ​In order to enable a more clear understanding of the above-mentioned objects, features and advantages of the present application, the following will further describe the schemes of the present application. It should be noted that the embodiments of the present application and the features in the embodiments can be combined with each other without conflict.

[0033] In the following description, a large number of specific details are set forth in order to facilitate a thorough understanding of the present application, but the present application can also be implemented in other manners different from those described herein; obviously, the embodiments described in the specification are only a part of the embodiments of the present application, and not all the embodiments.

[0034] The circuit board of the existing air fryer is generally placed in the head part, and the circuit board is close to the heat source. When the whole machine is working, the temperature of the components on the circuit board is generally high. At present, the heat dissipation effect of the circuit board is poor, which leads to the abnormality of the electric control, the reduction of the service life of the whole machine and other adverse phenomena. For example, the structure disclosed in the prior art CN202321675838.1 has a circuit board mounting bracket for mounting the circuit board. The circuit board mounting bracket is provided with a heat dissipation space. After the cold air enters the shell from the air inlet hole on the shell, it flows through the heat dissipation space and carries away the heat of the components on the circuit board. However, in this structure, the residence time of the air at the circuit board is too short, and the heat dissipation effect is poor. Moreover, there is no component for isolating heat transfer between the circuit board and the motor, so that the heat generated during the operation of the motor will be directly transferred to the circuit board, affecting the heat dissipation effect of the circuit board.

[0035] In view of the above problems, the present embodiment provides an air fryer (hereinafter referred to as air fryer), as shown in Figures 1-3 Figure 1 is a schematic diagram of the three-dimensional structure of the air fryer of the present embodiment, Figure 2 is a schematic diagram of the exploded structure of the air fryer of the present embodiment, Figure 3 is a semi-section view of the air fryer of the present embodiment showing the direction of air flow. The air fryer of the present embodiment comprises a shell 1, a top cover 2, a reflector 3, a heat dissipation fan 4, a circuit board 5, a circuit board mounting bracket 6 and a motor 7, wherein:

[0036] The shell 1 is a whole shell structure, which has a mounting cavity and a cooking cavity. The reflector 3, the motor 7, the heat dissipation fan 4, the circuit board 5 and the circuit board mounting bracket 6 are all placed in the mounting cavity, and the pot body 8 is placed in the cooking cavity.

[0037] ​A top plate 11 is arranged on the top of the housing 1, and the top cover 2 is arranged on the top plate 11, and a gap is formed between the top cover 2 and the top plate 11, and the gap is communicated with the outside, so that the outside air can enter the gap. Preferably, a plurality of spaced apart rib plates 12 can be arranged on the edge of the top plate 11, and the gap between the adjacent two rib plates 12 and the top cover 2 forms an air inlet, and the outside air can enter the gap through the air inlet. More preferably, the rib plate 12 is arranged at the rear position of the top plate 11, so that the air enters the gap from the rear side of the air fryer, which does not interfere with the user and improves the user experience.

[0038] In the embodiment, a containing space is formed between the top plate 11 and the reflector 3, and the motor 7 and the cooling fan 4 are arranged in the containing space, and the motor 7 is drivingly connected to the cooling fan 4 to drive the cooling fan 4 to rotate to drive the air circulation and cool the motor 7 and other elements in the containing space.

[0039] It should be noted that the gap formed between the top cover 2 and the top plate 11 can be communicated with the containing space, for example, a through communication port 111 can be formed on the top plate 11, which is communicated with the gap and the containing space, so that when the outside air enters the gap through the air inlet, it can enter the containing space through the communication port 111, and then cool the motor 7 and other elements in the containing space.

[0040] In the embodiment, as shown in Figure 2 A ventilation port 112 is arranged on the top plate 11, which is preferably arranged on both sides of the central axis of the cooling fan 4. The circuit board mounting bracket 6 is arranged in the containing space and is mounted at the ventilation port 112, and the circuit board 5 is arranged in the circuit board mounting bracket 6. Optionally, the top edge of the circuit board mounting bracket 6 abuts the bottom of the top plate 11, and the circuit board mounting bracket 6 is located directly below the ventilation port 112. Preferably, the top edge of the circuit board mounting bracket 6 is flush with the edge of the ventilation port 112, so that when the outside air enters the gap through the air inlet, part of the air will enter the circuit board mounting bracket 6 through the ventilation port 112, and cool the circuit board 5 in the circuit board mounting bracket 6. Moreover, due to the arrangement of the communication port 111, part of the air entering the gap will directly flow to the cooling fan 4 through the communication port 111, and then be quickly driven by the cooling fan 4 to the motor 7 and other elements for cooling. Another part of the air enters the circuit board mounting bracket 6 through the ventilation port 112, and then flows to the cooling fan 4 after cooling the circuit board 5. On the basis of ensuring timely cooling of the motor 7 and other elements, the cooling of the circuit board 5 is also realized. It should be noted that the circuit board 5 in the embodiment can be a power board, a control board or a touch panel, which is not limited in the embodiment.

[0041] In order to solve the problem of poor heat dissipation effect of the circuit board caused by short residence time of air flow on the circuit board in the existing air fryer, preferably, the structure of the air fryer can be referred to Figure 4 and Figure 5 wherein Figure 4 is a schematic view of the structure of the circuit board mounting bracket 6 of the air fryer, Figure 5 is Figure 3 enlarged view of A. The circuit board mounting bracket 6 of the embodiment comprises a first baffle 61 extending vertically, the upper end of the first baffle 61 abutting against the top plate 11, and the ventilation opening 112 being located on the side of the first baffle 61 facing the circuit board 5. The air flowing in through the ventilation opening 112 enters the circuit board mounting bracket 6 and flows towards the heat dissipation fan 4 after bypassing the first baffle 61. In the process of bypassing the first baffle 61 and flowing towards the heat dissipation fan 4, the air performs heat dissipation on the circuit board 5 in the circuit board mounting bracket 6. Moreover, the arrangement of the first baffle 61 can prolong the flow path of the air and increase the residence time of the air on the circuit board 5, so that the air continuously performs heat dissipation on the circuit board 5, effectively improving the heat dissipation effect. It should be noted that the above-mentioned communication opening 111 is located on the side of the first baffle 61 facing the motor 7, so that the through opening and the ventilation opening 112 are arranged on the two sides of the central axis of the heat dissipation fan 4.

[0042] In addition, in order to solve the problem that the heat generated during the operation of the motor 7 is transferred to the circuit board 5 due to the absence of heat insulation components between the circuit board 5 and the motor 7, affecting the heat dissipation of the circuit board 5, the first baffle 61 of the embodiment is located between the motor 7 and the circuit board 5, so that the first baffle 61 can isolate the motor 7 and the circuit board 5, effectively preventing the heat generated during the operation of the motor 7 from being transferred to the circuit board 5. The heat generated during the operation of the motor 7 will not affect the heat dissipation of the circuit board 5 by the air, ensuring the heat dissipation effect of the air in the circuit board mounting bracket 6 on the circuit board 5. Moreover, this structure further improves the service life of the circuit board 5, reduces the temperature resistance requirement of the circuit board 5, and thus does not need to configure a circuit board 5 with higher temperature resistance, thereby reducing the manufacturing cost of the circuit board 5 and the entire machine.

[0043] In the embodiment, as Figure 4 and Figure 5As shown, the circuit board mounting bracket 6 further comprises a first air outlet 62 which is arranged opposite to the air inlet. The first baffle 61 is arranged adjacent to the first air outlet 62. Through the first air outlet 62, the circuit board mounting bracket 6 is communicated with the accommodating space, and then the air can flow to the heat dissipation fan 4. In addition, the first air outlet 62 is arranged opposite to the air inlet, so that the flow direction of the air in the circuit board mounting bracket 6 is from the position close to the air inlet to the position far away from the air inlet, and then the air can flow to the heat dissipation fan 4 through the circuit board 5 after bypassing the first baffle 61 through the first air outlet 62, so as to achieve the purpose of heat dissipation of the circuit board 5. Moreover, the first air outlet 62 is arranged opposite to the air inlet, which also prolongs the flow path of the air in the circuit board mounting bracket 6, and then prolongs the heat dissipation time of the circuit board 5, and improves the heat dissipation effect.

[0044] Referring to Figure 4 The circuit board mounting bracket 6 of the embodiment has a first side wall, and a notch is formed at the top of the first side wall downward, which constitutes the first air outlet 62. The first air outlet 62 formed by the structure can reduce the wind resistance and facilitate the flow of air after heat dissipation of the circuit board 5.

[0045] Optionally, in order to avoid the problem that the heat dissipation effect of the circuit board 5 is poor due to the small amount of air flowing through the circuit board 5, the circuit board mounting bracket 6 of the embodiment can further comprise a second baffle 63 which is arranged opposite to the first side wall, the second baffle 63 extends vertically and is arranged adjacent to the first baffle 61, and the second baffle 63 is arranged close to the air inlet, so that the air entering through the air inlet will not directly flow to the heat dissipation fan 4 from the position close to the air inlet, and it is ensured that the air bypassing the first baffle 61 and the second baffle 63 can flow through the circuit board 5 to heat the circuit board 5, further improving the amount of heat dissipation air flowing through the circuit board 5, and achieving better heat dissipation effect.

[0046] It should be pointed out that the second baffle 63 is arranged opposite to the first air outlet 62, so that the air bypassing the first baffle 61 and the second baffle 63 and heat dissipated from the circuit board 5 flows into the accommodating space through the first air outlet 62.

[0047] As Figure 4As shown, the circuit board mounting bracket 6 can also be provided with a second air outlet 64 opposite to the first baffle 61 and in communication with the accommodating space. When the air enters the circuit board mounting bracket 6, it will contact and bypass the first baffle 61 and the second baffle 63 respectively, and be divided into two parts to flow to the cooling fan 4 through the first air outlet 62 and the second air outlet 64. Through the arrangement of the second air outlet 64, the air can pass through the circuit board 5 from two directions, thereby comprehensively contacting the circuit board 5 to cool the circuit board 5. Preferably, the circuit board mounting bracket 6 can also include a second side wall opposite to the first baffle 61, and the second air outlet 64 is arranged on the second side wall. Specifically, a notch can be formed downward from the top of the second side wall, and the notch constitutes the second air outlet 64. More preferably, an air duct is formed between the second side wall and the housing 1, and the second air outlet 64 is in communication with the accommodating space through the air duct. The air flowing out of the second air outlet 64 flows to the cooling fan 4 through the air duct.

[0048] In the embodiment, the circuit board mounting bracket 6 can be mounted on the reflector 3. For example, a mounting groove 65 can be arranged on one side of the first side wall of the circuit board mounting bracket 6 (as shown in Figure 2 and Figure 5 ), a through hole is formed in the mounting groove 65, a threaded hole corresponding to the through hole is arranged on the reflector 3, and a screw is threadedly connected to the threaded hole after passing through the through hole to fix the reflector 3 and the circuit board mounting bracket 6. Of course, it can be understood that the circuit board mounting bracket 6 can also be integrally formed at the bottom of the top plate 11 to fix the circuit board mounting bracket 6.

[0049] As shown in Figure 2 and Figure 5 , the air fryer of the embodiment further includes a motor bracket 9 above the reflector 3, the motor 7 is fixed on the motor bracket 9, and the cooling fan 4 is located between the motor bracket 9 and the reflector 3. At this time, the circuit board mounting bracket 6 can also be mounted on the motor bracket 9. The motor bracket 9 is provided with a cooling fan communication hole 91, and the air flowing out of the circuit board mounting bracket 6 flows to the cooling fan through the cooling fan communication hole 91. The air fryer of the embodiment can effectively solve the technical problem of poor heat dissipation effect of the circuit board of the existing air fryer, and does not need to configure a circuit board 5 with higher temperature resistance, thereby reducing the manufacturing cost of the circuit board 5 and the whole machine.

[0050] It has to be noted that, in the present document, relational terms are intended only to convey a possible relationship between elements or

[0051] The above description is merely that of the specific embodiments of the application and therefore is not intended to limit the application. Many modifications are possible in the specific implementation of the application. The general principles defined herein can be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not to be limited to the embodiments described herein but is to be accorded the full scope of the claims, the full scope being defined in the language of the claims.

Claims

1. An air fryer, comprising a housing and a top cover connected above the housing, a reflector is arranged in the housing, a top plate is arranged at the top of the housing, a containing space is formed between the top plate and the reflector, a motor and a cooling fan driven by the motor are arranged in the containing space, a gap is arranged between the top plate and the top cover, the top plate is provided with a vent, air enters the vent through the gap and flows to the cooling fan, characterized in that, a circuit board mounting bracket for accommodating a circuit board and open at the upper end is arranged in the containing space, the circuit board mounting bracket is located directly below the vent, the circuit board mounting bracket comprises a first baffle extending vertically, the first baffle is located between the motor and the circuit board and extends to the top plate at the upper end, the vent is located on the side of the first baffle facing the circuit board, and the air flowing in through the vent flows to the cooling fan after bypassing the first baffle. The circuit board mounting bracket further comprises a second baffle extending vertically and located adjacent to one side of the first baffle, and the second baffle is arranged close to the air inlet of the gap.

2. The air fryer according to claim 1, characterized in that, The circuit board mounting bracket has a first air outlet, and the first air outlet is arranged opposite to the air inlet.

3. The air fryer according to claim 2, characterized in that, The circuit board mounting bracket has a first side wall opposite to the second baffle, and a notch is formed downward at the top of the first side wall, and the notch constitutes the first air outlet.

4. The air fryer according to claim 3, characterized in that, The circuit board mounting bracket further comprises a second air outlet opposite to the first baffle.

5. The air fryer according to claim 3, characterized in that, The circuit board mounting bracket further comprises a second side wall opposite to the first baffle, and the second air outlet is arranged on the second side wall, and an air duct is formed between the second side wall and the housing, and the air flowing out through the second air outlet flows to the cooling fan through the air duct.

6. The air fryer of claim 5, wherein, The circuit board mounting bracket is mounted on the reflector.

7. The air fryer according to any one of claims 1-6, wherein, Alternatively, the air fryer further comprises a motor bracket arranged above the reflector, and the circuit board mounting bracket is mounted on the motor bracket. Alternatively, the circuit board mounting bracket is integrally formed on the top plate. The top plate is provided with a through communication port, and the communication port is located on the side of the first baffle facing the motor.

8. The air fryer according to any one of claims 1-6, wherein, The communication port and the vent are arranged on both sides of the central axis of the cooling fan.

9. The air fryer of claim 8, wherein, The edge of the top plate is provided with a plurality of spaced apart rib plates, and an air inlet is formed between adjacent two rib plates and the top cover, and air enters the gap through the air inlet.

10. The air fryer according to any one of claims 1-6, wherein, ​

Citation Information

Patent Citations

  • Cooking utensil provided with circuit board waterproof device

    CN220308981U