Tin slag cleaning mechanism of wave soldering equipment

Abstract

The utility model discloses a tin slag cleaning mechanism of wave soldering equipment, and relates to the field of tin slag cleaning. The tin slag cleaning mechanism of the wave soldering equipment comprises a tin slag collecting tank and a tin slag guiding assembly capable of guiding tin slag to enter the tin slag collecting tank. The tin slag cleaning mechanism of the wave-soldering equipment further comprises a tin slag cleaning opening formed in the wave-soldering equipment body and a tin slag filtering and cleaning assembly penetrating through the tin slag cleaning opening to be movably connected with the tin slag collecting tank, and the tin slag filtering and cleaning assembly is detachably connected with the wave-soldering equipment body. The tin slag filtering and cleaning assembly can filter fallen tin slag. Large tin slag can be filtered to avoid blockage of dust collection equipment, and the state of the tin slag can be conveniently checked while the large tin slag is cleaned.

Description

TECHNICAL FIELD

[0001] The present application relates to the field of tin slag cleaning, in particular to a tin slag cleaning mechanism of a wave soldering equipment. BACKGROUND

[0002] In the process of wave soldering, tin slag is generated in the wave soldering equipment due to the reaction of high-temperature tin and oxygen or improper temperature control. The tin slag varies in shape and size, and the environment of generation is also different. For example, the powder-shaped tin slag is generated by the reaction of solder alloy exposed in the air and oxygen at normal working temperature; the bean curd slag-shaped tin slag is Cu6Sn5 intermetallic compound formed by copper and tin, and the melting point of the compound is above 500°C. Since the density of the compound is 8.28 g / cm3, and the density of Sn63Pb37 solder strip is 8.80 g / cm3, the compound generally appears as bean curd slag and floats on the surface of liquid solder. In summary, the wave soldering equipment generates tin slag with different shapes and sizes in the process of wave soldering, and the tin slag may exist in various places in the wave soldering equipment, so it needs to be cleaned regularly to ensure the normal operation of the wave soldering equipment. In the cleaning process, the tin slag is prone to fall downward due to gravity, so using a tin slag guiding assembly to guide the tin slag into the tin slag collecting groove is a simple and efficient method for collecting tin slag. Since the tin slag is generally powder-shaped under normal circumstances, using an industrial dust collector or other dust collection equipment to suck out the tin slag from the tin slag collecting groove has high efficiency, and can also suck out the tin slag dust generated during cleaning, so that the cleaning is thorough. However, if there is larger tin slag such as block-shaped tin slag, the industrial dust collector is prone to be blocked, which affects the cleaning efficiency. At the same time, larger tin slag is usually bean curd slag-shaped or block-shaped abnormal shape, which indicates that there is an abnormality in the operation of the wave soldering equipment, and the specific shape of the tin slag can be used to adjust and correct the problem. Therefore, filtering out larger tin slag is beneficial to the judgment of the running state of the wave soldering equipment. However, in the actual process of cleaning tin slag, various tin slag is mixed after cleaning, which is difficult to observe, which leads to the fact that the abnormal-shaped tin slag cannot be observed conveniently, so that the problem of the wave soldering equipment cannot be found and corrected in time. CONTENT OF THE UTILITY MODEL

[0003] In order to solve the problems of easy blockage of the dust collection equipment and inconvenient inspection of the state of the tin slag in the prior art, the present application provides a tin slag cleaning mechanism of a wave soldering equipment, and the specific scheme is as follows:

[0004] The tin slag cleaning mechanism of the wave soldering equipment includes a tin slag collecting groove and a tin slag guiding assembly capable of guiding the tin slag into the tin slag collecting groove. The tin slag cleaning mechanism of the wave soldering equipment further includes a tin slag cleaning port arranged on the body of the wave soldering equipment and a tin slag filtering and cleaning assembly movably connected with the tin slag collecting groove through the tin slag cleaning port. The tin slag filtering and cleaning assembly is detachably connected with the body of the wave soldering equipment, and the tin slag filtering and cleaning assembly can filter the falling tin slag.

[0005] The tin residue filtering and cleaning assembly comprises a first baffle, a second baffle, a connecting rod, a filtering baffle group and a fixing component, the first baffle is parallel to the second baffle, the first baffle is fixedly connected with the second baffle through two connecting rods, the filtering baffle group is arranged below the connecting rod, the filtering baffle group is fixedly connected with the first baffle and the second baffle respectively, the filtering baffle group comprises a plurality of filtering baffles arranged at equal intervals, at least two fixing components are fixedly arranged on the side of the first baffle away from the second baffle, the first baffle is detachably connected with the body of the wave soldering equipment through the fixing components, a plurality of grooves arranged at equal intervals are arranged at the lower end of the second baffle, and the grooves arranged at equal intervals are formed at the lower end of the second baffle.

[0006] Preferably, the fixing component comprises a containing cylinder provided with a sliding groove, a fixing pin arranged in the containing cylinder, a pull rod fixedly connected with the fixing pin through a sliding block and a fixing block provided with a clamping hole, the fixing pin is fixedly connected with the bottom of the cylinder through a spring, the fixing block is fixedly arranged on the outside of the body of the wave soldering equipment, and the fixing pin is driven by the spring to be inserted into the clamping hole.

[0007] Preferably, the two connecting rods are fixedly connected with the filtering baffle group through baffle plates respectively.

[0008] Preferably, the distance between the connecting rod and the filtering baffle group is equal to the distance between adjacent filtering baffles of the filtering baffle group.

[0009] Preferably, the filtering baffles are arranged at equal intervals along a circular arc.

[0010] Preferably, the center of the circular arc is collinear with the axis of the first baffle.

[0011] Preferably, the distance between adjacent cleaning teeth is smaller than the distance between adjacent filtering baffles.

[0012] One or more technical solutions provided in the present application have at least the following technical effects or advantages:

[0013] By arranging the tin residue filtering and cleaning assembly, on the one hand, larger filter residues can be filtered, specifically, the filtering baffle group performs primary filtering and the cleaning teeth perform secondary filtering, so as to avoid blocking the dust collection equipment; on the other hand, the tin residue filtering and cleaning assembly can be pulled out from the tin residue collecting groove, and larger abnormal tin residues can be observed, so that the state of the tin residues can be conveniently checked.

[0014] In summary, the present application can filter larger tin residues to avoid blocking the dust collection equipment, and can conveniently check the state of the tin residues while cleaning the larger tin residues. BRIEF DESCRIPTION OF DRAWINGS

[0015] In order to more clearly illustrate the technical solutions in the application or the prior art, the accompanying drawings needed to be used in the embodiments or prior art description will be briefly introduced. Obviously, the accompanying drawings in the following description are only exemplary, and other drawings can be obtained by those skilled in the art without creative effort on the basis of the provided drawings.

[0016] Figure 1 is a structural schematic view of a tin slag filtering and cleaning assembly provided by an embodiment of the application;

[0017] Figure 2 is a structural schematic view of a tin slag cleaning mechanism of a wave soldering device provided by an embodiment of the application;

[0018] Figure 3 is a schematic view of a connecting rod and a filter pole group provided with a baffle;

[0019] Figure 4 is a schematic view of a connecting rod and a filter pole group distributed at equal intervals.

[0020] In the drawings: 100-wave soldering device body; 200-tin slag filtering and cleaning assembly; 300-tin slag collecting groove; 400-tin slag guiding assembly; 1-first baffle; 2-second baffle; 21-cleaning tooth; 3-connecting rod; 31-baffle; 4-filter pole group; 5-fixing component; 51-fixing pin; 52-pull rod. DETAILED DESCRIPTION

[0021] The technical solutions in the embodiments of the application will be described clearly and completely below with reference to the accompanying drawings of the application. Obviously, the embodiments described in the application are only part of the embodiments of the application, rather than all the embodiments. Based on the embodiments in the application, all other embodiments obtained by those skilled in the art without creative effort belong to the scope of protection of the application.

[0022] Please refer to Figure 2 , a tin slag cleaning mechanism of a wave soldering device, comprising a tin slag collecting groove 300 and a tin slag guiding assembly 400 capable of guiding tin slag into the tin slag collecting groove 300, the tin slag cleaning mechanism of the wave soldering device further comprises a tin slag cleaning port provided on a wave soldering device body 100 and a tin slag filtering and cleaning assembly 200 movably connected with the tin slag collecting groove 300 through the tin slag cleaning port, the tin slag filtering and cleaning assembly 200 is detachably connected with the wave soldering device body 100, and the tin slag filtering and cleaning assembly 200 is capable of filtering the falling tin slag.

[0023] Please refer to Figure 1The tin residue filtering and cleaning assembly 200 comprises a first baffle 1, a second baffle 2, a connecting rod 3, a filtering baffle group 4 and a fixing component 5, the first baffle 1 is parallel to the second baffle 2, the first baffle 1 is fixedly connected with the second baffle 2 through two connecting rods 3, the filtering baffle group 4 is arranged below the connecting rod 3, the filtering baffle group 4 is fixedly connected with the first baffle 1 and the second baffle 2 respectively, the filtering baffle group 4 comprises a plurality of filtering baffles arranged at equal intervals, at least two fixing components 5 are fixedly arranged on the side of the first baffle 1 away from the second baffle 2, the first baffle 1 is detachably connected with the body 100 of the wave soldering equipment through the fixing components 5, a plurality of grooves arranged at equal intervals are arranged at the lower end of the second baffle 2, and the grooves arranged at equal intervals are formed at the lower end of the second baffle 2.

[0024] Specifically, please refer to Figure 1 The fixing component 5 comprises a containing cylinder provided with a sliding groove, a fixing pin 51 arranged in the containing cylinder, a pull rod 52 fixedly connected with the fixing pin 51 through a sliding block and a fixing block provided with a clamping hole, the fixing pin 51 is fixedly connected with the bottom of the cylinder through a spring, the fixing block is fixedly arranged on the outer side of the body 100 of the wave soldering equipment, the fixing pin 51 is driven by the spring to be inserted into the clamping hole, and the fixing component 5 can avoid the tin residue filtering and cleaning assembly 200 from being deviated; in the embodiment, two symmetrical fixing components 5 are arranged, so that the tin residue filtering and cleaning assembly 200 can be prevented from being deviated when the wave soldering equipment is running, especially when the wave soldering equipment is running with great vibration; when the tin residue filtering and cleaning assembly 200 needs to be pulled out, the pull rods 52 of the two fixing components 5 are pulled, so that the two pull rods are close to the symmetrical center of the two fixing components 5, and the tin residue filtering and cleaning assembly 200 is pulled out after the fixing pin 51 is separated from the fixing block.

[0025] Specifically, please refer to Figure 3 The two connecting rods 3 are fixedly connected with the filtering baffle group 4 through baffle plates 31 respectively, and the baffle plates 31 can block larger tin residues from entering the tin residue collecting groove 300.

[0026] Specifically, please refer to Figure 4 The distance between the connecting rod 3 and the filtering baffle group 4 is equal to the distance between adjacent filtering baffles of the filtering baffle group 4.

[0027] Specifically, please refer to Figure 4 The filtering baffles are arranged at equal intervals along a circular arc.

[0028] Specifically, please refer to Figure 4 The center of the circular arc is collinear with the axis of the first baffle 1.

[0029] In particular, please refer to Figure 1 The interval between adjacent cleaning teeth 21 is smaller than the interval between adjacent filter bars.

[0030] Please refer to Figure 1 The tin slag guiding assembly 400 can be a guiding plate arranged obliquely close to the bottom of the wave soldering equipment, and the tin slag collecting groove 300 is generally a square groove or an arc-shaped groove. The tin slag guiding plate receives the tin slag falling during the operation or cleaning of the wave soldering equipment and guides the tin slag to fall into the tin slag guiding assembly 400. After the tin slag falls into the tin slag guiding assembly 400, the larger tin slag is blocked by the filter bar group 4 to achieve primary filtration of the tin slag. After the primary filtration, the tin slag not filtered falls into the tin slag collecting groove 300. When the dust collection equipment is needed to clean the tin slag, the tin slag filtering and cleaning assembly 200 is pulled out of the tin slag collecting groove 300. At this time, the cleaning teeth 21 perform secondary filtration of the tin slag in the tin slag collecting groove 300 to take out the larger or clustered tin slag from the tin slag collecting groove 300. Then, the dust collection equipment is connected to the tin slag cleaning port to fully suck out the remaining tin slag and floating tin slag dust in the tin slag collecting groove 300. Since the tin slag is filtered twice by the tin slag filtering and cleaning assembly 200, the blockage of the dust collection equipment is avoided. Meanwhile, the two times of filtration of the tin slag filtering and cleaning assembly 200 are easy to implement and can facilitate the observation of the larger tin slag, so that the wave soldering equipment can be adjusted in time according to the shape of the tin slag.

[0031] In summary, the present application can filter the larger tin slag to avoid the blockage of the dust collection equipment and can facilitate the checking of the tin slag state while cleaning the larger tin slag.

[0032] The above description of disclosed embodiments enables a person skilled in the art to implement or use the present application. Various modifications to these embodiments will be apparent to those skilled in the art, and the general principles defined herein can be implemented in other embodiments without departing from the spirit or scope of the present application. Therefore, the present application will not be limited to the embodiments shown herein, but will conform to the widest scope consistent with the principles and novel features disclosed herein.

[0033] Obviously, those skilled in the art can make various modifications and variations to the present application without departing from the spirit and scope of the present application. Thus, if these modifications and variations of the present application belong to the scope of the present application and its equivalents, the present application also intends to include these modifications and variations.

Claims

1. A tin dross cleaning mechanism for a wave soldering apparatus, comprising a tin dross collection tank and a tin dross guiding assembly capable of guiding tin dross into the tin dross collection tank, characterized in that, The tin dross cleaning mechanism of the wave soldering equipment further comprises a tin dross cleaning port arranged on the wave soldering equipment body and a tin dross filtering and cleaning assembly movably connected with the tin dross collecting groove through the tin dross cleaning port, and the tin dross filtering and cleaning assembly is detachably connected with the wave soldering equipment body. The tin dross filtering and cleaning assembly comprises a first baffle, a second baffle, connecting rods, a filtering baffle group and fixing members, the first baffle is parallel to the second baffle, the first baffle is fixedly connected with the second baffle through two connecting rods, the filtering baffle group is arranged below the connecting rods, the filtering baffle group is fixedly connected with the first baffle and the second baffle respectively, the filtering baffle group comprises a plurality of filtering baffles arranged at equal intervals, at least two fixing members are fixedly arranged on the side of the first baffle away from the second baffle, the first baffle is detachably connected with the wave soldering equipment body through the fixing members, the lower end of the second baffle is provided with a plurality of grooves arranged at equal intervals, and the lower end of the second baffle is formed with cleaning teeth arranged at equal intervals.

2. The peak weld apparatus dross cleaning mechanism of claim 1, wherein, The fixing member comprises a containing cylinder provided with a sliding groove, a fixing pin arranged in the containing cylinder, a pull rod fixedly connected with the fixing pin through a sliding block and a fixing block provided with a clamping hole, the fixing pin is fixedly connected with the bottom of the containing cylinder through a spring, the fixing block is fixedly arranged on the outer side of the wave soldering equipment body, and the fixing pin is driven by the spring to be inserted into the clamping hole.

3. The peak weld apparatus dross cleaning mechanism of claim 1, wherein, The two connecting rods are fixedly connected with the filtering baffle group through baffle plates respectively.

4. The peak weld apparatus dross cleaning mechanism of claim 1, wherein, The distance between the connecting rods and the filtering baffle group is equal to the distance between adjacent filtering baffles of the filtering baffle group.

5. The peak-welding apparatus dross removing mechanism according to claim 1 or 4, wherein The filtering baffles are arranged at equal intervals along a circular arc.

6. The peak weld apparatus dross cleaning mechanism of claim 5, wherein, The center of the circular arc is collinear with the axis of the first baffle.

7. The peak weld apparatus dross cleaning mechanism of claim 1, wherein, The distance between adjacent cleaning teeth is smaller than the distance between adjacent filtering baffles.

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