Polishing device

Abstract

The utility model provides a polishing device which comprises a polishing disc, a first pipeline, a second pipeline and a controller, the polishing disc can rotate, and a liquid groove is concavely formed in the polishing surface of the circumferential side of the polishing disc in the rotating direction; the first pipeline communicates with the liquid tank and is used for conveying polishing liquid to the liquid tank; the second pipeline is communicated with the liquid tank and is used for conveying cleaning liquid to the liquid tank; the controller is connected with the first pipeline and the second pipeline so as to control one of the first pipeline and the second pipeline to work and convey corresponding liquid, and the controller controls the first pipeline not to work and the second pipeline to work under the condition that the rotating speed of the polishing disc changes. In the process that the polishing procedure is finished (namely, the driving structure for driving the polishing disc to rotate stops driving), the cleaning liquid is provided for the polishing disc through the second pipeline so as to clean the polishing liquid remaining on the polishing surface of the polishing disc, the liquid tank and the machined part, and therefore the probability that stains exist on the surface of the machined part can be reduced, and the bad part rate can be reduced.

Description

TECHNICAL FIELD

[0001] The present disclosure relates to the polishing technical field, and in particular, to a polishing device. BACKGROUND

[0002] In a chemical mechanical polishing (CMP) process, a workpiece (such as a semiconductor wafer) is fixed on a ceramic carrier by wax, and then the ceramic carrier is inverted on a polishing machine so that the workpiece is located on the polishing machine. An upper head of the polishing machine presses the ceramic carrier and applies a certain pressure to the ceramic carrier. At this time, the polishing disc on the polishing machine is driven to rotate to polish the workpiece under the mechanical force of the polishing disc and the chemical action of the polishing liquid on the polishing disc.

[0003] However, during the process of ending the polishing program (i.e., the force driving the polishing disc to rotate is removed and the polishing liquid is stopped being delivered), the speed of the polishing disc will gradually decrease to zero due to inertia, but the polishing liquid remaining on the polishing disc is still in contact with the surface of the workpiece, which will have a great impact on the surface of the workpiece, such as stains, excessive polishing, etc. CONTENT OF THE UTILITY MODEL

[0004] The present disclosure provides a polishing device, which solves one technical problem that the impact of the remaining polishing liquid on the workpiece during the process of ending the polishing program is reduced.

[0005] To solve the above technical problem, the present disclosure provides a polishing device, which can include a polishing disc, a first pipeline, a second pipeline, and a controller. The polishing disc is rotatable, and the polishing surface around the rotating direction of the polishing disc is recessed with a liquid groove. The first pipeline is in communication with the liquid groove and is used to deliver the polishing liquid to the liquid groove. The second pipeline is in communication with the liquid groove and is used to deliver the cleaning liquid to the liquid groove. The controller is connected with the first pipeline and the second pipeline respectively to control one of the first pipeline and the second pipeline to work and deliver the corresponding liquid, and the controller controls the first pipeline not to work and the second pipeline to work in the case that the rotating speed of the polishing disc changes.

[0006] In some embodiments, the polishing disc includes a continuous first rotation period and a second rotation period. In the first rotation period, the polishing disc rotates at a constant speed, the first pipeline works, and the second pipeline does not work. In the second rotation period, the rotating speed of the polishing disc gradually decreases, the first pipeline does not work, and the second pipeline works.

[0007] In some embodiments, the polishing device can further include a third pipeline and a tee joint. The output end of the third pipeline is connected with the liquid groove. The three openings of the tee joint in mutual communication are connected with the output end of the first pipeline, the output end of the second pipeline, and the input end of the third pipeline, respectively.

[0008] In some embodiments, the first pipeline is equipped with a water pump and a first electromagnetic valve; the water pump has an inlet and an outlet; the first electromagnetic valve is equipped between the outlet of the water pump and an opening of the three-way pipe, and the first electromagnetic valve is electrically connected with the controller.

[0009] In some embodiments, the second pipeline is equipped with a second electromagnetic valve, and the second electromagnetic valve is electrically connected with the controller.

[0010] In some embodiments, the controller comprises a touch display screen, and the touch display screen has at least a first touch area and a second touch area; the first touch area is used for controlling the working of the first electromagnetic valve, and the second touch area is used for controlling the working of the second electromagnetic valve.

[0011] In some embodiments, the controller is further signal-connected with a driving structure for driving the polishing disc to rotate, and in the case that the driving structure stops driving and sends a stop signal of stopping driving to the controller, the controller controls the first pipeline to be inoperative and the second pipeline to be operative.

[0012] In some embodiments, the inner diameter of the pipeline of the second pipeline is smaller than the inner diameter of the pipeline of the first pipeline; and the liquid pressure of the second pipeline is smaller than or equal to the liquid pressure of the first pipeline.

[0013] In some embodiments, the polishing disc is a circular plate, and a liquid inlet is recessed in the center of a circular surface of one side of the polishing disc and is in communication with the first pipeline and the second pipeline; and the liquid inlet is in communication with different positions of the liquid groove through a plurality of liquid passages extending from the liquid inlet to a circle of polishing surface in the thickness direction of the polishing disc in a diverging manner.

[0014] In some embodiments, a polyurethane polishing pad is laid on a circle of circumferential surface in the thickness direction of the polishing disc to form a polishing surface of the polishing disc.

[0015] Through the above technical solution, the polishing device provided by the present disclosure is not only provided with the first pipeline for providing the polishing liquid to the liquid groove of the polishing disc, but also provided with the second pipeline for providing the cleaning liquid to the liquid groove of the polishing disc, so that the polishing liquid can be provided to the polishing disc through the first pipeline during the polishing process, and the cleaning liquid can be provided to the polishing disc through the second pipeline during the process of ending the polishing program (i.e. stopping the driving of the driving structure for driving the polishing disc to rotate), so as to clean the polishing liquid remaining on the polishing surface of the polishing disc, the liquid groove and the workpiece, thereby reducing the probability of stains existing on the surface of the workpiece, and further reducing the defective rate.

[0016] The above description is only a summary of the technical solutions of the present disclosure, in order to more clearly understand the technical means of the present disclosure, and the contents of the description can be implemented. The following describes the preferred embodiments of the present disclosure in detail with reference to the accompanying drawings. BRIEF DESCRIPTION OF DRAWINGS

[0017] In order to more clearly illustrate the technical solutions of the present disclosure or the prior art, the following will briefly introduce the drawings needed to be used in the embodiments or prior art description. Obviously, the drawings in the following description are only some embodiments of the present disclosure, and for those skilled in the art, other drawings can also be obtained from these drawings without creative labor.

[0018] Figure 1 Structure diagram of the polishing device provided by the present disclosure

[0019] Figure 2 Structure diagram of the polishing disc of the polishing device provided by the present disclosure Figure 1 ;

[0020] Figure 3 Structure diagram of the polishing disc of the polishing device provided by the present disclosure Figure 2 .

[0021] Explanation of reference signs:

[0022] 10, polishing device; 1, polishing disc; 11, polishing surface; 12, liquid tank; 13, liquid inlet; 14, liquid channel; 2, first pipeline; 21, water pump; 22, first electromagnetic valve; 3, second pipeline; 31, second electromagnetic valve; 4, third pipeline; 5, three-way pipe DETAILED DESCRIPTION

[0023] The embodiments of the present disclosure will be further described in detail below in combination with the drawings and examples. The detailed description of the following examples and the drawings are used to exemplarily illustrate the principles of the present disclosure, but cannot be used to limit the scope of the present disclosure, and the present disclosure can be implemented in many different forms, and is not limited to the specific examples disclosed herein, but includes all technical solutions falling within the scope of the claims.

[0024] The present disclosure provides these embodiments in order to make the present disclosure thorough and complete, and fully express the scope of the present disclosure to those skilled in the art. It should be noted that: unless otherwise specified, the relative arrangement of components and steps, the composition of materials, numerical expressions and values set forth in these embodiments should be interpreted as merely exemplary, and not as a limitation.

[0025] It should be noted that, in the description of the present disclosure, unless otherwise specified, the meaning of "a plurality of" is greater than or equal to two; the orientations or positional relationships indicated by the terms "upper", "lower", "left", "right", "inner", "outer" and the like are merely for the purpose of facilitating the description of the present disclosure and simplifying the description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore cannot be understood as a limitation to the present disclosure. When the absolute position of the described object changes, the relative positional relationship may also change accordingly.

[0026] In addition, the "first", "second", and similar words used in the present disclosure do not represent any order, number or importance, but are only used to distinguish different parts. "Vertical" is not strictly vertical, but within the allowable range of error. "Parallel" is not strictly parallel, but within the allowable range of error. "Include" or "contain" and similar words mean that the elements before the word cover the elements listed after the word, and do not exclude the possibility of also covering other elements.

[0027] It should also be noted that in the description of the present disclosure, unless otherwise explicitly specified and limited, the terms "mount", "connect", "connection" should be understood in a broad sense, for example, can be fixedly connected, can be detachably connected, or integrally connected; can be directly connected, or indirectly connected through an intermediate medium. For those skilled in the art, the specific meaning of the above terms in the present disclosure can be understood according to the specific circumstances. When it is described that a specific device is located between a first device and a second device, there can be or can not be an intermediate device between the specific device and the first device or the second device.

[0028] All terms used in the present disclosure have the same meaning as understood by those skilled in the art to which the present disclosure belongs, unless otherwise specifically defined. It should also be understood that terms defined in general dictionaries should be interpreted to have meanings consistent with their meanings in the context of the relevant art, and should not be interpreted in an idealized or excessively formalized sense, unless specifically defined here.

[0029] Techniques, methods, and equipment known to those skilled in the relevant art can not be discussed in detail, but in appropriate cases, the techniques, methods, and equipment should be considered as part of the specification.

[0030] In the chemical mechanical polishing (CMP) process, the workpiece (such as a semiconductor wafer) is fixed on a ceramic carrier by wax, and then the ceramic carrier is inverted on a polishing machine so that the workpiece is located on the polishing machine. The upper head of the polishing machine presses the ceramic carrier and applies a certain pressure to the ceramic carrier. At this time, the polishing disc on the polishing machine is driven to rotate to polish the workpiece under the mechanical force of the polishing disc and the chemical action of the polishing liquid on the polishing disc.

[0031] However, during the polishing process (i.e., when the force driving the polishing disc to rotate is removed and the polishing fluid supply stops), the speed of the polishing disc gradually decreases to zero due to inertia. However, residual polishing fluid remains on the disc and continues to contact the workpiece surface, significantly impacting it, such as causing stains or over-polishing. Furthermore, if stains on the workpiece surface are not removed promptly, they will not be effectively removed during subsequent ultrasonic cleaning, leading to a high rate of defective parts.

[0032] In view of the above-mentioned technical problems, the polishing apparatus 10 provided in this disclosure adds a cleaning fluid supply pipeline (the second pipeline 3 below). During the end of the polishing process, the cleaning fluid is supplied to the liquid tank 12 for flowing polishing fluid through the cleaning fluid supply pipeline. By utilizing the rotational inertia of the polishing disc 1, the polishing surface 11 of the polishing disc 1, the liquid tank 12 and the workpiece are cleaned as the speed of the polishing disc 1 gradually decreases to zero. This reduces the probability of dirt on the workpiece and reduces the defect rate.

[0033] See Figures 1 to 3 As shown, the polishing device 10 may include: a polishing disc 1, a first conduit 2, a second conduit 3, and a controller (not shown in the figure). The polishing disc 1 is rotatable, and the polishing disc 1 rotates around the direction of rotation (e.g., ...). Figure 2 The polished surface 11 on the periphery (in the direction indicated by the middle arrow) has a recessed liquid tank 12; the first pipe 2 is connected to the liquid tank 12 and is used to deliver polishing liquid to the liquid tank 12; the second pipe 3 is connected to the liquid tank 12 and is used to deliver cleaning liquid to the liquid tank 12; the controller is connected to the first pipe 2 and the second pipe 3 respectively to control one of the first pipe 2 and the second pipe 3 to work and deliver the corresponding liquid, and the controller controls the first pipe 2 to not work and the second pipe 3 to work when the speed of the polishing disc 1 changes.

[0034] Polishing disc 1 is used to polish the surfaces of materials such as metal, wood, and stone to achieve a smooth and shiny finish. Polishing disc 1 can be a circular plate, with a circumference along its thickness serving as a polishing surface 11. The polishing surface 11 has a recessed liquid tank 12 within which liquids, such as polishing fluid provided by the first pipe 2 or cleaning fluid (e.g., purified water) provided by the second pipe 3, can flow. Polishing disc 1 can rotate under the drive of a drive structure, so that the mechanical action of the polishing surface 11 and the chemical action of the polishing fluid on the polishing surface 11 work together to polish the area to be polished on the work surface.

[0035] The first pipe 2 is used to supply polishing fluid to the liquid tank 12 of the polishing disc 1. It can be directly connected to the liquid tank 12 or connected via other pipe fittings (such as the third pipe 4 and the tee pipe 5 described below). The first pipe 2 can be a circular pipe, a rectangular pipe, or other similar shaped fitting; the inlet of the first pipe 2 can be connected to...Figure 1 The first temporary tank is connected to provide polishing liquid. The outlet of the first pipe 2 is connected to the liquid tank 12, so that the polishing liquid in the first temporary tank can enter the first pipe 2 through the inlet of the first pipe 2 and be delivered to the liquid tank 12 through the outlet of the first pipe 2.

[0036] The second pipe 3 is used to provide cleaning liquid to the liquid tank 12 of the polishing disc 1. The second pipe 3 can be directly connected to the liquid tank 12 to provide cleaning liquid, or can be connected to provide cleaning liquid through other pipes (such as the third pipe 4 and the tee pipe 5 described below). The second pipe 3 can be a pipe with a circular shape, a rectangular shape, or the like. The inlet of the second pipe 3 can be connected to a second temporary tank for providing cleaning liquid. The outlet of the second pipe 3 is connected to the liquid tank 12, so that the cleaning liquid in the second temporary tank can enter the second pipe 3 through the inlet of the second pipe 3 and be delivered to the liquid tank 12 through the outlet of the second pipe 3.

[0037] A controller is used to control at least the working states of the first pipe 2 and the second pipe 3. The working states include starting to deliver corresponding liquid and stopping to deliver corresponding liquid. When the controller controls one of the first pipe 2 and the second pipe 3 to work (such as to deliver corresponding liquid), the other pipe does not work (such as does not deliver corresponding liquid). When the rotation speed of the polishing disc 1 changes (such as increases or decreases), the controller controls the first pipe 2 not to work and controls the second pipe 3 to work, so as to clean the workpiece, the polishing surface 11, and the liquid tank 12 of the polishing surface 11 by using cleaning liquid. For example, when the driving structure that drives the polishing disc 1 fails to suddenly increase the speed of the polishing disc 1 or the polishing program ends to stop the driving of the driving structure and gradually decrease the speed of the polishing disc 1, the controller controls the first pipe 2 not to work and controls the second pipe 3 to work, so as to clean the workpiece, the polishing surface 11, and the liquid tank 12 of the polishing surface 11 by using cleaning liquid. It can be understood that, whether the cleaning is performed when the driving structure fails or the cleaning is performed during the polishing program ends, the residual polishing liquid can be reduced. In particular, when the polishing surface 11 of the polishing disc 1 is made of wool, nylon, sponge, microfiber, or the like, the residual polishing liquid can be reduced to stay in the pores of the polishing surface 11 and then solidify into particles to damage the workpiece in the next polishing process.

[0038] In an example, the polishing device 10 can include a polishing disc 1, a first pipe 2, a second pipe 3 and a controller. The polishing disc 1 is rotatable, and the polishing disc 1 is concave with a liquid groove 12 around the polishing surface 11 of the polishing disc 1 in the circumferential direction of the rotation direction. The first pipe 2 is directly communicated with the liquid groove 12, and is used to deliver polishing liquid to the liquid groove 12. The second pipe 3 is directly communicated with the liquid groove 12, and is used to deliver cleaning liquid to the liquid groove 12. The controller is connected with the first pipe 2 and the second pipe 3 respectively, so as to control one of the first pipe 2 and the second pipe 3 to work and deliver corresponding liquid. In the case that the speed of the polishing disc 1 changes, the controller controls the first pipe 2 not to work and the second pipe 3 to work.

[0039] In the embodiment, the polishing device 10 is not only provided with the first pipe 2 for providing polishing liquid to the liquid groove 12 of the polishing disc 1, but also provided with the second pipe 3 for providing cleaning liquid to the liquid groove 12 of the polishing disc 1. Therefore, the polishing liquid can be provided to the polishing disc 1 through the first pipe 2 during the polishing process, and the cleaning liquid can be provided to the polishing disc 1 through the second pipe 3 during the process that the polishing program ends (i.e. the driving structure for driving the polishing disc 1 to rotate stops driving), so as to clean the polishing liquid remaining on the polishing surface 11 of the polishing disc 1, the liquid groove 12 and the workpiece. Therefore, the probability of stains existing on the surface of the workpiece can be reduced, and the defective rate can be reduced. In addition, the cleaning liquid flows in the polishing disc 1 during the process that the polishing disc 1 rotates by inertia. The existence of the cleaning liquid reduces the idle rotation of the polishing disc 1 after losing the gravity of the polishing liquid, so as to reduce the abnormal vibration, noise and other problems generated by the polishing disc 1.

[0040] In some embodiments, the polishing disc 1 includes a first rotation period and a second rotation period. In the first rotation period, the polishing disc 1 rotates at a constant speed, the first pipe 2 works, and the second pipe 3 does not work. In the second rotation period, the rotation speed of the polishing disc 1 gradually decreases, the first pipe 2 does not work, and the second pipe 3 works.

[0041] That is, the first rotation period and the second rotation period are combined as a polishing procedure, the first rotation period is a period in which the driving structure actively drives the polishing disc 1 to rotate in the polishing procedure, and the second rotation period is a period in which the driving structure stops driving the polishing disc 1 to rotate but the polishing disc 1 still rotates under the action of inertia; in the first rotation period, the driving structure drives the polishing disc 1 to rotate, the first pipeline 2 works to provide polishing liquid, and the second pipeline 3 does not work, so that the polishing disc 1 and the polishing liquid perform chemical mechanical polishing on the workpiece, and the second pipeline 3 does not interfere with the polishing quality of the chemical mechanical polishing; in the second rotation period, the driving structure stops driving the polishing disc 1 to rotate, but the polishing disc 1 still rotates under the action of inertia and the rotation speed gradually decreases, and the second pipeline 3 works to provide cleaning liquid at this period, so that the polishing surface 11, the liquid tank 12 and the polishing liquid remaining on the workpiece are cleaned by the cleaning liquid, and since the first pipeline 2 does not work at this period, it will not affect the cleaning quality.

[0042] In some embodiments, referring to Figure 1 The polishing device 10 can further include a third pipeline 4 and a tee 5, the output end of the third pipeline 4 is connected with the liquid tank 12, and the three openings of the tee 5 are respectively connected with the output end of the first pipeline 2, the output end of the second pipeline 3 and the input end of the third pipeline 4.

[0043] That is, the output end of the first pipeline 2 can deliver polishing liquid to the liquid tank 12 through the tee 5 and the third pipeline 4, the output end of the second pipeline 3 can deliver cleaning liquid to the liquid tank 12 through the tee 5 and the third pipeline 4, and the arrangement of the tee 5 and the third pipeline 4 can shorten the lengths of the first pipeline 2 and the second pipeline 3, and share the third pipeline 4 and the tee 5, so as to reduce the material consumption of the polishing device 10 and reduce the manufacturing cost of the polishing device 10.

[0044] In some embodiments, referring to Figure 1 The first pipeline 2 is provided with a water pump 21 and a first electromagnetic valve 22, the water pump 21 has an inlet and an outlet, and the first electromagnetic valve 22 is arranged between the outlet of the water pump 21 and one opening of the tee 5, and the first electromagnetic valve 22 is electrically connected with the controller.

[0045] The water pump 21 is used to provide power to make the polishing liquid flow from the inlet of the water pump 21 to the outlet of the water pump 21. The first electromagnetic valve 22, which is arranged between the outlet of the water pump 21 and the tee pipe 5, can control the opening and closing of the liquid in the first pipeline 2 to realize the delivery of the polishing liquid to the liquid tank 12 or not. That is, the first electromagnetic valve 22 can control the polishing liquid pumped by the water pump 21 to be delivered to the tee pipe 5 through the outlet of the water pump 21 or can prevent the polishing liquid pumped by the water pump 21 from being delivered to the tee pipe 5 through the outlet of the water pump 21. The first electromagnetic valve 22 can be operated by the controller to control the opening and closing of the liquid in the first pipeline 2.

[0046] In the embodiment, the water pump 21 and the first electromagnetic valve 22 are both existing structures, and the manufacturing process is mature to realize the batch production of the polishing device 10.

[0047] In some embodiments, referring to FIG. 1, Figure 1 As shown in FIG. 1, the second pipeline 3 is provided with a second electromagnetic valve 31, which is electrically connected with the controller. The second electromagnetic valve 31 can control the opening and closing of the second pipeline 3 to realize the delivery of the cleaning liquid to the liquid tank 12 or not. Since the second electromagnetic valve 31 is an existing structure, the manufacturing process is mature to realize the batch production of the polishing device 10.

[0048] Here, the power of the cleaning liquid flowing in the second pipeline 3 can be that the position of the second temporary storage barrel providing the cleaning liquid is higher than the position of the second pipeline 3, so that the power of the cleaning liquid flowing in the second pipeline 3 is the gravity of the cleaning liquid in the second temporary storage barrel; or the liquid pump arranged on the second pipeline 3, which can refer to the arrangement of the water pump 21, and will not be described here.

[0049] In some embodiments, the controller includes a touch display screen, which has at least a first touch area and a second touch area. The first touch area is used to control the work of the first electromagnetic valve 22, and the second touch area is used to control the work of the second electromagnetic valve 31. In this way, when the first pipeline 2 and the second pipeline 3 are controlled to work or not, the worker can control the first electromagnetic valve 22 to start working (for example, the first pipeline 2 starts to deliver the polishing liquid or the first pipeline 2 stops to deliver the polishing liquid) by touching the first touch area, and control the second electromagnetic valve 31 to start working (for example, the second pipeline 3 starts to deliver the cleaning liquid or the second pipeline 3 stops to deliver the cleaning liquid) by touching the second touch area.

[0050] The controller can be wirelessly connected with the first electromagnetic valve 22 and the second electromagnetic valve 31 through wireless devices, so that the worker can remotely operate the controller to control the first electromagnetic valve 22 and the second electromagnetic valve 31, and ensure the work safety of the worker.

[0051] In some embodiments, the controller is also connected with a driving structure for driving the polishing disc 1 to rotate, and in the case that the driving structure stops driving and sends a stop signal to the controller, the controller controls the first pipe 2 to be inoperable and the second pipe 3 to be operable. In this way, at the end of the first rotation period and the beginning of the second rotation period, the controller can automatically control the first pipe 2 to be inoperable and the second pipe 3 to be operable, so that the cleaning work can be performed more timely, and the workload of the staff can be reduced.

[0052] In some embodiments, the inner diameter of the second pipe 3 is smaller than the inner diameter of the first pipe 2, and the liquid pressure of the second pipe 3 is less than or equal to the liquid pressure of the first pipe 2. In this way, the unit flow and unit pressure of the cleaning liquid are less than those of the polishing liquid, so that the impact of the cleaning liquid on the workpiece can be reduced, thereby reducing the damage to the workpiece or the over-polishing of the workpiece.

[0053] In some embodiments, as shown in Figure 2 and Figure 3 , the polishing disc 1 is a circular plate, and the center of one side of the polishing disc 1 is recessed to form a liquid inlet 13 which is connected with the first pipe 2 and the second pipe 3, and the liquid inlet 13 is connected with different positions of the liquid groove 12 through a plurality of liquid passages 14 which extend from the liquid inlet 13 to the polishing surface 11 in the thickness direction of the polishing disc 1. In this way, the polishing liquid of the first pipe 2 or the cleaning liquid of the second pipe 3 can flow into the liquid groove 12 through the liquid inlet 13 and the plurality of liquid passages 14 to different positions, so that the workpiece can be polished or cleaned more uniformly, thereby improving the polishing effect and the cleaning effect.

[0054] In some embodiments, the polishing surface 11 of the polishing disc 1 is formed by laying polyurethane polishing pads on the circumference of the polishing disc 1 in the thickness direction.

[0055] The polyurethane polishing pad has high elasticity, so that it can adapt to the polishing of the surface of the workpiece with different shapes and curvatures, and can ensure uniform contact during polishing. The polyurethane polishing pad also has wear resistance, so that the polishing disc 1 has strong wear resistance, long service life, and can withstand long-time polishing operation. The polyurethane polishing pad also has softness, so that it can reduce the probability of damage to the surface of the workpiece. The polyurethane polishing pad also has chemical resistance, so that it can resist the erosion of various chemicals (such as polishing liquid). The polyurethane polishing pad also has easy cleanability, so that it can be repeatedly used after cleaning, thereby reducing the use cost of the polishing device 10.

[0056] In an example, referring to Figures 1 to 3 , the polishing device 10 can include:

[0057] The polishing disc 1 is a circular plate, and a polyurethane polishing pad is laid on the circumferential surface of the polishing disc 1 in the thickness direction to form a polishing surface 11 of the polishing disc 1. A liquid inlet 13 is recessed in the center of one side of the circular surface of the polishing disc 1, and the liquid inlet 13 is in communication with different positions of a liquid groove 12 of the polishing surface 11 through a plurality of liquid passages 14 extending from the liquid inlet 13 to the polishing surface 11 in the thickness direction of the polishing disc 1.

[0058] The first pipeline 2 is provided with a water pump 21 and a first electromagnetic valve 22. The water pump 21 has an inlet and an outlet. One end of the first pipeline 2 corresponding to the inlet of the water pump 21 is located in a first temporary storage barrel containing polishing liquid. The first electromagnetic valve 22 is arranged at the outlet of the water pump 21.

[0059] The second pipeline 3 is provided with a second electromagnetic valve 31. The inlet of the second pipeline 3 is located in a second temporary storage barrel containing cleaning liquid.

[0060] The third pipeline 4 is connected to the liquid inlet 13.

[0061] The three-way pipe 5 has three openings in communication with each other, which are connected to the output end of the first pipeline 2 (i.e. the end of the first electromagnetic valve 22 away from the outlet of the water pump 21), the output end of the second pipeline 3 (i.e. the end of the second electromagnetic valve 31 away from the inlet of the second pipeline 3), and the input end of the third pipeline 4.

[0062] A controller is electrically connected to the first electromagnetic valve 22 and the second electromagnetic valve 31.

[0063] The polishing disc 1 includes a first rotation period and a second rotation period. In the first rotation period, the polishing disc 1 rotates at a constant speed, the first pipeline 2 works, and the second pipeline 3 does not work. In the second rotation period, the rotation speed of the polishing disc 1 gradually decreases, the first pipeline 2 does not work, and the second pipeline 3 works.

[0064] In the first rotation period, the water pump 21 and the first electromagnetic valve 22 are powered, the water pump 21 draws the polishing liquid in the first temporary storage barrel, the first electromagnetic valve 22 is opened, so that the first pipeline 2 can deliver the polishing liquid in the first temporary storage barrel to the liquid groove 12 for polishing work, and the second electromagnetic valve 31 is not powered to be closed, so that the second pipeline 3 cannot deliver the cleaning liquid to the liquid groove 12.

[0065] In the second rotation period, the water pump 21 and the first electromagnetic valve 22 are not powered, so that the first pipeline 2 cannot deliver the polishing liquid in the first temporary storage barrel to the liquid groove 12, and the second electromagnetic valve 31 is powered to be opened, so that the second pipeline 3 can deliver the cleaning liquid to the liquid groove 12 for cleaning work.

[0066] So far, the embodiments of the present disclosure have been described in detail. In order to avoid obscuring the concept of the present disclosure, some details known in the art are not described. Those skilled in the art can fully understand how to implement the technical solutions disclosed herein according to the above description.

[0067] Although some specific embodiments of the present disclosure have been described in detail through examples, those skilled in the art should understand that the above examples are only for illustration, not for limiting the scope of the present disclosure. Those skilled in the art should understand that the above embodiments can be modified or some technical features can be replaced equivalently without departing from the scope and spirit of the present disclosure. In particular, as long as there is no structural conflict, the technical features mentioned in each embodiment can be combined in any way.

Claims

1. A polishing apparatus characterized by comprising: The polishing device comprises: a polishing disc (1) capable of rotating, and a polishing surface (11) recessed with a liquid groove (12) around the circumferential side of the polishing disc (1) in the rotating direction; a first pipeline (2) in communication with the liquid groove (12) for delivering polishing liquid to the liquid groove (12); a second pipeline (3) in communication with the liquid groove (12) for delivering cleaning liquid to the liquid groove (12); a controller connected with the first pipeline (2) and the second pipeline (3) respectively to control one of the first pipeline (2) and the second pipeline (3) to work and deliver corresponding liquid, and the controller controls the first pipeline (2) not to work and the second pipeline (3) to work in the case that the rotating speed of the polishing disc (1) changes.

2. The polishing device according to claim 1, wherein: the polishing disc (1) comprises a first rotating period and a second rotating period in succession; in the first rotating period, the polishing disc (1) rotates at a constant speed, the first pipeline (2) works, and the second pipeline (3) does not work; in the second rotating period, the rotating speed of the polishing disc (1) gradually decreases, the first pipeline (2) does not work, and the second pipeline (3) works.

3. The polishing apparatus according to claim 1 or 2, characterized by Further comprising: a third pipeline (4) with an output end connected with the liquid groove (12); a three-way pipe (5) with three openings in mutual communication connected with the output end of the first pipeline (2), the output end of the second pipeline (3), and the input end of the third pipeline (4) respectively.

4. The polishing device according to claim 3, wherein: the first pipeline (2) is equipped with a water pump (21) and a first electromagnetic valve (22); the water pump (21) has an inlet and an outlet; the first electromagnetic valve (22) is equipped between the outlet of the water pump (21) and one opening of the three-way pipe (5), and the first electromagnetic valve (22) is electrically connected with the controller.

5. The polishing device according to claim 4, wherein: the second pipeline (3) is equipped with a second electromagnetic valve (31) electrically connected with the controller.

6. The polishing device according to claim 5, wherein: the controller comprises a touch display screen having at least a first touch area and a second touch area, the first touch area is used to control the working of the first electromagnetic valve (22), and the second touch area is used to control the working of the second electromagnetic valve (31).

7. The polishing device according to claim 1, wherein: the controller is further signal-connected with a driving structure for driving the polishing disc (1) to rotate, and in the case that the driving structure stops driving and sends a stop signal to the controller, the controller controls the first pipeline (2) not to work and the second pipeline (3) to work.

8. The polishing device according to claim 1, wherein: The inner diameter of the second pipe (3) is smaller than that of the first pipe (2); The liquid pressure of the second pipe (3) is smaller than or equal to that of the first pipe (2).

9. The polishing device according to claim 1, wherein The polishing disc (1) is a circular plate, and a liquid inlet (13) is recessed in the center of one side of the circular surface of the polishing disc (1) and communicates with the first pipe (2) and the second pipe (3), and the liquid inlet (13) is in communication with different positions of the liquid tank (12) through a plurality of liquid passages (14) that extend from the liquid inlet (13) to one circle of polishing surfaces (11) in the thickness direction of the polishing disc (1) and diverge in the polishing disc (1).

10. The polishing device according to claim 9, wherein A polyurethane polishing pad is laid on one circle of the circumferential surface in the thickness direction of the polishing disc (1) to form the polishing surface (11) of the polishing disc (1).

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