Dip plating tank structure capable of saving liquid medicine

Abstract

The embodiment of the utility model provides a dip plating tank structure capable of saving liquid medicine, which comprises an electroplating box and a dip plating tank arranged in the electroplating box, a filter is arranged outside the electroplating box, one end of the filter is connected with a liquid medicine pump, a liquid inlet pipe is arranged between the other end of the filter and the dip plating tank, and the dip plating tank is communicated with the liquid inlet pipe. The electroplating box is internally provided with a bottom tank, the upper end of the bottom tank is provided with an immersion plating tank, the immersion plating tank is internally provided with a baffle plate, and the baffle plate is provided with a spraying hole, and the electroplating device has the beneficial effects that liquid medicine is directly conveyed into the immersion plating tank through the liquid inlet pipe, and the immersion plating tank is directly matched with the liquid inlet pipe to convey the liquid medicine to carry out electroplating treatment on a workpiece; the liquid medicine does not need to be stored in the mother tank and then supplied to the immersion plating tank, so that redundant liquid medicine cannot be generated, the liquid medicine pump is matched with the liquid inlet pipe to carry out electroplating work on the immersion plating tank, the dosage of the liquid medicine can be better controlled, the liquid medicine is saved, and the production cost is reduced to a certain extent.

Description

TECHNICAL FIELD

[0001] The embodiment of the utility model relates to but is not limited to the electroplating equipment field, and particularly relates to a plating bath structure saving plating solution. BACKGROUND

[0002] In the surface treatment field, electroplating is a technology capable of improving the surface performance of products, and in the electroplating equipment field, an electroplating tank usually comprises a mother tank and a plating bath, the mother tank is used for containing plating solution, and the plating bath is used for electroplating operation.

[0003] When electroplating is performed, a certain amount of plating solution needs to be injected into the mother tank to perform subsequent electroplating work, the volume of the mother tank is relatively large, and the plating solution loaded is relatively increased, and the amount of plating solution for each electroplating cannot be accurately controlled, so that part of the plating solution injected into the mother tank after electroplating is excessive plating solution that is not used through the plating bath, but this part of plating solution also needs to be recycled, causing unnecessary resource waste and increasing production cost. UTILITY MODEL CONTENT

[0004] (I) Technical problem to be solved

[0005] In view of the above-mentioned defects and deficiencies of the prior art, the utility model provides a plating bath structure saving plating solution, which solves the technical problem that the excessive plating solution in the mother tank during electroplating cannot be fully utilized, causing unnecessary resource waste.

[0006] (II) Technical scheme

[0007] The utility model discloses a kind of plating bath structures saving plating solution, it includes electroplating tank and the plating bath being set in electroplating tank, the filter is set to the outside of electroplating tank, one end of the filter is connected with plating solution pump, liquid inlet pipe is set between the other end of the filter and plating bath, the plating bath is communicated with liquid inlet pipe, bottom groove is provided in the electroplating tank, wherein, the upper end of the bottom groove is set plating bath, baffle is provided in the plating bath, the baffle is provided with injection hole.

[0008] Preferably, heater and liquid level tube are further provided in the interior of the electroplating tank, the heater is set to the adjacent place of liquid level tube, and the heater and liquid level tube are located on the side opposite to the plating bath.

[0009] Preferably, the plating bath includes a bottom plate, the bottom plate is provided with a conductive seat, the number of the conductive seat is two, and the two conductive seats are located on the two sides of the plating bath, respectively.

[0010] Preferably, a limiting lug is provided on one side of the plating bath.

[0011] Preferably, the outer side of the immersion tank is provided with a limiting seat, and the number of the limiting seat is two.

[0012] Preferably, the upper end face of the baffle is provided with a limiting block on both sides, and a limiting gap is formed between the limiting block and the inner wall of the immersion tank.

[0013] Preferably, an electrode sheet is placed in the limiting gap.

[0014] Preferably, the immersion tank is provided with an overflow port at both ends.

[0015] Preferably, the bottom tank is provided with a concave port at both ends, and the concave port is provided with a protruding limiting block at both ends.

[0016] (Three) beneficial effects

[0017] The liquid inlet pipe directly delivers the medicine solution into the immersion tank, directly uses the immersion tank to cooperate with the liquid inlet pipe to deliver the medicine solution for electroplating treatment of the workpiece, does not need to store the medicine solution in the mother tank and then supply the medicine solution to the immersion tank, so that no extra medicine solution is generated, and the use amount of the medicine solution can be better controlled through cooperation of the medicine solution pump and the liquid inlet pipe for electroplating work of the immersion tank, the medicine solution is saved, and the production cost is reduced to a certain extent. BRIEF DESCRIPTION OF DRAWINGS

[0018] The drawings are used to provide a further understanding of the technical scheme of the utility model, and constitute a part of the specification, and are used together with the embodiments of the utility model to explain the technical scheme of the utility model, and do not constitute a limitation on the technical scheme of the utility model.

[0019] Fig. 1 It is the overall structure perspective view of the immersion tank structure saving medicine solution;

[0020] Fig. 2 It is the overall structure explosion view of the immersion tank structure saving medicine solution;

[0021] MARKED FOR EXPLANATION:

[0022] 1, electroplating box; 2, immersion tank; 21, bottom plate; 22, limiting protruding block; 23, overflow port; 3, filter; 4, liquid inlet pipe; 5, bottom tank; 51, concave port; 52, limiting block; 6, baffle; 61, limiting block; 7, injection hole; 8, heater; 9, liquid level pipe; 10, conductive seat; 11, limiting seat; 12, electrode sheet; 13, feeding port; 14, liquid delivery pipe; 15, liquid inlet switch. DETAILED DESCRIPTION

[0023] To make the objectives, technical solutions, and advantages of this utility model clearer, the present utility model will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain this utility model and are not intended to limit this utility model.

[0024] The following is in conjunction with the appendix Figs. 1-2 To further describe, this utility model discloses a chemical-saving immersion plating tank structure, including an electroplating tank 1 and an immersion plating tank 2 disposed within the electroplating tank 1. The electroplating tank 1 also has inlets 13 on both sides. A filter 3 is disposed outside the electroplating tank 1. One end of the filter 3 is connected to a chemical pump (not shown) via a liquid delivery pipe 14. An inlet pipe 4 is disposed between the other end of the filter 3 and the immersion plating tank 2. An inlet switch 15 for control is disposed on the inlet pipe 4. The immersion plating tank 2 is connected to the inlet pipe 4. Chemicals are delivered to the workpiece for electroplating through the immersion plating tank 2 in conjunction with the inlet pipe 4. A bottom tank 5 is disposed inside the electroplating tank 1, wherein the immersion plating tank 2 is disposed at the upper end of the bottom tank 5. A baffle 6 is disposed inside the immersion plating tank 2, and the baffle 6 is provided with several spray holes 7.

[0025] In a preferred embodiment, the electroplating tank 1 is further provided with a heater 8 and a liquid level pipe 9. The heater 8 is located adjacent to the liquid level pipe 9, and the heater 8 and the liquid level pipe 9 are located on the opposite side of the immersion plating tank 2.

[0026] In a preferred embodiment, the immersion plating tank 2 includes a base plate 21, on which a conductive seat 10 is provided. There are two conductive seats 10, which are located on both sides of the immersion plating tank 2.

[0027] In a preferred embodiment, a limiting protrusion 22 is provided on one side of the immersion tank 2, and the limiting protrusion 22 is provided with a through hole.

[0028] In a preferred embodiment, a limiting seat 11 is provided on the outer side of the immersion plating tank 2. There are two limiting seats 11. A bolt is provided inside the limiting seat 11. During installation, the bolt is inserted into the through hole of the limiting protrusion 22 to fix the immersion plating tank 2.

[0029] In a preferred embodiment, limit blocks 61 are provided on both sides of the upper end face of the baffle 6, and a limit gap is formed between the limit blocks 61 and the inner wall of the immersion tank 2. Electrode plates 12 are placed inside the limit gaps on both sides, and the electrode plates 12 are divided into anode and cathode.

[0030] In a preferred embodiment, overflow ports 23 are provided at both ends of the immersion plating tank 2 to maintain a relatively stable liquid level in the immersion plating tank 2.

[0031] In the preferred embodiment, the bottom groove 5 is provided with a concave mouth 51 at both ends, and the concave mouth 51 is provided with a protruding limiting block 52 at both ends; wherein the bottom plate 21 is placed in the concave mouth 51 and is limited by the limiting block 52.

[0032] The liquid inlet pipe directly delivers the chemical liquid into the immersion plating tank, directly uses the immersion plating tank to cooperate with the liquid inlet pipe to deliver the chemical liquid to the workpiece for electroplating treatment, does not need to store the chemical liquid in the mother tank and then supply the chemical liquid to the immersion plating tank, so that no extra chemical liquid is generated, the use amount of the chemical liquid can be better controlled through the cooperation of the chemical liquid pump and the liquid inlet pipe for the electroplating work of the immersion plating tank, the chemical liquid is saved, and the production cost is reduced to a certain extent.

[0033] Although the technical solutions according to the present application have been described with reference to a plurality of different embodiments, aspects and features, it is not intended to limit the scope of the present application, but modifications thereof are included within the broad scope of the foregoing disclosure, drawings and claims.

Claims

1. A plating bath structure for saving plating solution, comprising a plating tank and a plating bath provided in the plating tank, characterized in that: The electroplating box is externally provided with a filter, one end of the filter is connected with a chemical pump, the other end of the filter is provided with a liquid inlet pipe between the filter and an immersion plating tank, the immersion plating tank is communicated with the liquid inlet pipe, the electroplating box is internally provided with a bottom groove, wherein the upper end of the bottom groove is provided with the immersion plating tank, the immersion plating tank is internally provided with a baffle, and the baffle is provided with a spraying hole. ​ 2. The economizing bath structure according to claim 1, wherein: The interior of the electroplating box is further provided with a heater and a liquid level pipe, the heater is arranged adjacent to the liquid level pipe, and the heater and the liquid level pipe are located on the side opposite to the immersion plating tank.

3. The economizing bath structure according to claim 1, wherein: The immersion plating tank comprises a bottom plate, and the bottom plate is provided with two conductive seats located on the two sides of the immersion plating tank.

4. The economizing bath structure according to claim 1, wherein: One side of the immersion plating tank is provided with a limiting protruding block.

5. The economizing bath structure according to claim 1, wherein: The outer side of the immersion plating tank is provided with two limiting seats.

6. The economizing bath structure according to claim 1, wherein: The upper end surface of the baffle is provided with limiting blocks on the two sides, and a limiting gap is formed between the limiting blocks and the inner wall of the immersion plating tank.

7. The economizing dip tank structure according to claim 6, wherein: An electrode sheet is arranged in the limiting gap.

8. The economizing bath structure according to claim 1, wherein: The two ends of the immersion plating tank are provided with overflow ports.

9. The economizing bath structure according to claim 1, wherein: The two ends of the bottom groove are provided with concave ports, and the two ends of the concave ports are provided with protruding limiting blocks.

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