Semiconductor chip packaging and welding mechanism

Abstract

The utility model relates to the technical field of semiconductor packaging, and discloses a semiconductor chip packaging and welding mechanism which comprises a box body, cavities are formed in the upper side and the lower side in the box body, lower heating discs are installed on the inner walls of the bottom ends of the cavities, substrates are placed on the lower heating discs, chips are embedded in the upper sides of the substrates, and the upper sides of the lower heating discs are provided with upper heating discs. A chip is arranged in the cavity, a voltage stabilizing piece is arranged on the upper side of the chip, a pressing block is arranged at the top of the voltage stabilizing piece, a plurality of lifting push rods are fixedly installed on the top wall of the cavity, an upper heating disc is fixedly installed between the lifting push rods, and a control panel is installed in the middle of the front end face of the box body. The lower heating disc is installed on the bottom wall of the cavity, the upper heating disc, the base plate, the pressure stabilizing piece and the pressing block are arranged in a matched mode, the upper heating disc and the lower heating disc are started, the vertical heating and heat preservation functions are achieved, heating is more uniform and faster compared with single bottom heating, and therefore the welding efficiency and quality of the device are improved.

Description

Technical Field

[0001] This application relates to the field of semiconductor packaging technology, and in particular to a semiconductor chip packaging welding mechanism. Background Technology

[0002] Semiconductor packaging mainly involves electrically connecting the chip to its pins via wires. In this process, the electrical connection between the chip's contacts and the pins is an extremely important step. The common connection method is wire bonding, which is mainly a wire bonding process. The quality of the wire bonding is one of the important indicators that determines the quality of the chip. Since wire bonding is a relatively micro-operation, the width of the wire is at the micrometer level, and the wire bonding device is a miniature bonding pin structure.

[0003] Existing semiconductor chip packaging and welding mechanisms mostly use a single bottom heating method for chip welding and packaging, which results in uneven heating of the welded chip and affects the welding quality.

[0004] The information disclosed in this background section is only intended to enhance the understanding of the background technology of this application, and therefore may include prior art that is not known to those skilled in the art. Utility Model Content

[0005] To address the problem that existing semiconductor chip packaging welding mechanisms mostly employ a single bottom heating method for chip welding, resulting in uneven heating of the welded chip and thus affecting the welding quality, this application provides a semiconductor chip packaging welding mechanism.

[0006] The semiconductor chip packaging and welding mechanism provided in this application adopts the following technical solution:

[0007] A semiconductor chip packaging and welding mechanism includes a housing with cavities on both the upper and lower sides. A lower heating plate is installed on the inner wall of the bottom of the cavity, a substrate is placed on the lower heating plate, a chip is embedded on the upper side of the substrate, a voltage regulator is placed on the upper side of the chip, a pressure block is placed on top of the voltage regulator, multiple lifting push rods are fixedly installed on the top wall of the cavity, an upper heating plate is fixedly installed between the multiple lifting push rods, and a control panel is installed in the middle of the front face of the housing.

[0008] Preferably, a contact piece is fixedly installed at the bottom of the pressure block, and three contact pieces are provided, which are arranged in a triangular pattern.

[0009] Preferably, one side of the cavity is connected to an air inlet, and the other side is connected to an air outlet.

[0010] Preferably, the front end of the enclosure has a visualization window, and high-temperature resistant glass is installed in the visualization window.

[0011] Preferably, two handles are symmetrically installed on the top of the box, and support legs are fixedly installed at the four corners of the bottom of the box.

[0012] In summary, this application includes the following beneficial technical effects:

[0013] 1. This application installs a lower heating plate on the bottom wall of the cavity, and provides an upper heating plate, a base plate, a voltage stabilizer plate, and a pressure block. By activating the upper and lower heating plates, the upper and lower heating and heat preservation functions are realized. This results in more uniform and faster heating than single bottom heating, thereby improving the welding efficiency and quality of the device.

[0014] 2. This application improves the welding quality of the device by installing contact pieces at the bottom of the pressure block in a triangular arrangement, which allows the pressure of the pressure block to be evenly transmitted to the chip, ensuring sufficient welding of the molten solder contact surface. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of an embodiment of the application;

[0016] Figure 2 This is a schematic diagram of the tilted overall structure of the application embodiment;

[0017] Figure 3 This is an example of an application. Figure 1 A cross-sectional structural diagram.

[0018] Explanation of reference numerals in the attached drawings: 1. Housing; 11. Cavity; 12. Visual window; 13. Control panel; 14. Air inlet; 15. Air outlet; 16. Handle; 2. Lower heating plate; 3. Substrate; 31. Chip; 32. Voltage regulator; 4. Pressure block; 41. Contact plate; 5. Lifting push rod; 6. Upper heating plate; 7. Support leg. Detailed Implementation

[0019] The following is in conjunction with the appendix Figures 1-3 This application will be described in further detail.

[0020] This application discloses a semiconductor chip packaging welding mechanism, referring to... Figures 1-3, including the box 1, the cavity 11 is set up in the box 1 upper and lower two sides, the bottom end inner wall of cavity 11 is installed with the lower heating disc 2, the lower heating disc 2 is placed with the base plate 3, the base plate 3 upside is embedded with the chip 31, the chip 31 upside is placed with the voltage stabilizing piece 32, the top of voltage stabilizing piece 32 is placed with the pressing block 4, the top wall of cavity 11 is fixedly installed with multiple lifting push rods 5, multiple lifting push rods 5 are fixedly installed with the upper heating disc 6, and the front end face of box 1 is installed with the control panel 13 in the middle.

[0021] Here by placing the to-be-welded base plate 3 on the bottom wall of the cavity 11, embedding the to-be-welded chip 31 inside the base plate 3, then placing the voltage stabilizing piece 32 on the chip 31, placing the pressing block 4 on the voltage stabilizing piece 32, and controlling the lifting push rod 5 through the control panel 13, so that the upper heating disc 6 can press the pressing block 4, then starting the upper heating disc 6 and the lower heating disc 2, so that the cavity 11 can be quickly heated, the base plate 3 can be quickly heated to the overall welding temperature, and the chip 31 can be welded, avoiding that the welding is uneven due to too large temperature difference, and improving the welding quality.

[0022] Referring to Figure 1 , the bottom of the pressing block 4 is fixedly installed with the contact piece 41, the contact piece 41 is provided with three, and the three contact pieces 41 are triangularly arranged.

[0023] Here, the contact piece 41 is triangularly arranged on the bottom of the pressing block 4, so that the pressure of the pressing block 4 can be uniformly transmitted to the chip 31, so that the molten solder contact surface can be fully welded.

[0024] Referring to Figure 3 , the cavity 11 is communicated with the air inlet 14 on one side, and the air outlet 15 on the other side.

[0025] Here, the air inlet 14 and the air outlet 15 are provided, so that the gas in the cavity 11 can be circulated, and the air outlet 15 is communicated with the external purification device, avoiding that the harmful gas generated during welding is directly discharged into the air.

[0026] Referring to Figure 1 , the front end face of the box 1 is provided with a visual window 12, and the visual window 12 is provided with high-temperature-resistant glass.

[0027] Here, the visual window 12 is provided, so that the welding condition inside the box 1 can be observed.

[0028] Referring to Figure 1 , two handles 16 are symmetrically installed on the top of the box 1, and support legs 7 are fixedly installed at the four corners of the bottom of the box 1.

[0029] Hereby, the handle 16 is arranged to facilitate the carrying of the box 1, and the supporting legs 7 are arranged to stably support the box 1.

[0030] The implementation principle of the semiconductor chip packaging welding mechanism is as follows: in use, the device is placed at a designated position and connected to a power supply, the to-be-welded substrate 3 is placed on the bottom wall of the cavity 11, the to-be-welded chip 31 is buried in the substrate 3, then the voltage stabilizing piece 32 is placed on the chip 31, the pressing block 4 is placed on the voltage stabilizing piece 32, the lifting push rod 5 of the control panel 13 is controlled, so that the upper heating disc 6 can press the pressing block 4, then the upper heating disc 6 and the lower heating disc 2 are started, so that the cavity 11 can be rapidly heated, the substrate 3 can be rapidly heated to the overall welding temperature, the chip 31 is welded, the welding unevenness caused by a large temperature difference is avoided, and the welding quality is improved.

[0031] Finally, it should be pointed out that: first, in the description of the application, it should be pointed out that, unless otherwise specified and limited, the terms "mounting", "connection", "connection" should be understood broadly, which can be mechanical connection or electrical connection, or the communication between two elements, or direct connection, "up", "down", "left", "right" and the like are only used to indicate the relative positional relationship, when the absolute position of the described object changes, the relative positional relationship may change;

[0032] Secondly: the utility model discloses the embodiment of the drawings, only relate to the structure involved in the embodiment of the present disclosure, other structures can refer to the usual design, under the condition of no conflict, the same embodiment and different embodiments of the utility model can be combined with each other;

[0033] Finally: the above only for the preferred embodiment of the utility model, and does not limit the utility model, any modification, equivalent replacement, improvement etc.

[0034] The above are the preferred embodiments of the present application, and do not limit the protection scope of the present application, therefore: any equivalent changes made according to the structure, shape, principle of the present application should be covered within the protection scope of the present application.

Claims

1. A semiconductor chip package soldering mechanism comprising a housing (1), characterized in that: The cavity (11) is provided on both upper and lower sides of the box (1), a lower heating disc (2) is installed on the bottom end inner wall of the cavity (11), a substrate (3) is placed on the lower heating disc (2), a chip (31) is embedded on the upper side of the substrate (3), a voltage stabilizing sheet (32) is placed on the upper side of the chip (31), a pressing block (4) is placed on the top of the voltage stabilizing sheet (32), a plurality of lifting push rods (5) are fixedly installed on the top wall of the cavity (11), an upper heating disc (6) is fixedly installed between the plurality of lifting push rods (5), and a control panel (13) is installed on the middle of the front end face of the box (1).

2. The semiconductor chip package soldering mechanism of claim 1, wherein: The bottom of the pressing block (4) is fixedly installed with a contact sheet (41), the contact sheet (41) is provided with three, and the three contact sheets (41) are triangularly arranged.

3. The semiconductor chip package soldering mechanism of claim 1, wherein: One side of the cavity (11) is communicated with an air inlet (14), and the other side is communicated with an air outlet (15).

4. The semiconductor chip package solder mechanism of claim 1, wherein: The front end face of the box (1) is provided with a visual window (12), and the visual window (12) is installed with high-temperature-resistant glass.

5. The semiconductor chip package solder mechanism of claim 1, wherein: Two handles (16) are symmetrically installed on the top of the box (1), and support legs (7) are fixedly installed at the four corners of the bottom of the box (1).

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